TWM286954U - Protection structure for heat-conduction medium of heat sink - Google Patents

Protection structure for heat-conduction medium of heat sink Download PDF

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Publication number
TWM286954U
TWM286954U TW94215102U TW94215102U TWM286954U TW M286954 U TWM286954 U TW M286954U TW 94215102 U TW94215102 U TW 94215102U TW 94215102 U TW94215102 U TW 94215102U TW M286954 U TWM286954 U TW M286954U
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Taiwan
Prior art keywords
heat
medium
heat sink
protection structure
transfer medium
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TW94215102U
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Chinese (zh)
Inventor
Guo-Shing Chen
Shiuan-Jr Lin
Ching-Hung Chen
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Hoff Thermal Technology Co Ltd
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Priority to TW94215102U priority Critical patent/TWM286954U/en
Publication of TWM286954U publication Critical patent/TWM286954U/en

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Description

M286954M286954

四、創作說明(1) 【新型所屬之技術領域] 本創作係有關於一種散熱器導熱介質保護結構,尤指 一種配合套設於散熱器塗佈有熱傳介質之散熱底板上,藉 以保護其熱傳介質之護體結構。 【先前技術】 按,一般常見之散熱器,如鋁擠型等,其係用以貼附 於一中央處理Is ( CPU )上,並幫助中央處理器於運作時 進行散熱,以維持中央處理器可在其所許可之工作溫度下 _持績運作。然而,欲將散熱器貼附於中央處理器之前,必 須先於散熱器上塗佈適量之導熱介質,如導熱膏等,俾透 過該導熱介質而使散熱器與中央處理器之接觸可更為密合 惟,一般之導熱介質皆呈稠狀物,故塗抹於散熱器上 後,若不立即將該散熱器與中央處理器作貼附,則&易°使 灰塵沾著於其上、或因外物觸及而掉落,以致影響熱傳效 果。更甚之,由於塗佈導熱介質之量的多募及均佈與否, 亦會影響散熱器與中央處理器之熱傳效果,因此導熱介質 多由散熱器出廠前即事先塗佈,但此作法即有前述問 《考1,以致產品在包裝、運送等的過程相當不便。 、 有鑑於此,本創作人係為改善並解決上述之缺失, 特潛心研究並配合學理之運用,終於提出一種設計合理且 有效改善上述缺失之本創作。 σ 【新型内容】4. Description of creation (1) [Technical field of new type] This creation is about a heat-conducting medium protection structure for a heat sink, especially a type of heat-dissipating base plate coated with a heat transfer medium on a heat sink to protect it. The body structure of the heat transfer medium. [Prior Art] Press, a common heat sink, such as aluminum extrusion type, is attached to a central processing Is (CPU) and helps the central processor to dissipate heat during operation to maintain the central processing unit. It can operate at its licensed operating temperature. However, before attaching the heat sink to the central processing unit, it is necessary to apply a proper amount of heat-conducting medium, such as a thermal conductive paste, to the heat sink, and the heat-radiating medium can be used to make the heat sink contact with the central processing unit. In close contact, the general heat-conducting medium is thick, so if it is not attached to the central processor immediately after being applied to the heat sink, the dust is applied to the heat sink. Or it may fall due to the touch of foreign objects, which may affect the heat transfer effect. What's more, because the amount of heat transfer medium applied and evenly distributed, it will also affect the heat transfer effect of the heat sink and the central processor. Therefore, the heat transfer medium is coated beforehand before the factory is shipped, but this The practice is that the above question "Test 1, so that the process of packaging, transportation, etc. is quite inconvenient. In view of this, the creator has finally proposed a design that is reasonable in design and effective in improving the above-mentioned shortcomings in order to improve and solve the above-mentioned shortcomings, and to study and cooperate with the use of academics. σ [new content]

第5頁 M286954Page 5 M286954

保護結構, 保護結構卡 及有效保護 觸及而掉落 為了達 介質保護結 之散熱底板 於該遮板二 丨佈有導熱介 設有扣持部 板邊緣處後 其係配合散 合於散熱底 導熱介質, 寻之目的。 成上述之目 構,其係用 上;該保護 側處上之側 質之一側外 :據此,當 ’即可使遮 熱器底部之散熱底板,而能便於該 板邊緣處,以達產品快速包裝、以 並避免其為灰塵所沾著、或因外物 之該處相隔以預留間隙,以令遮板無法觸及導熱介質,同 時提供保護作用。 【實施方式】 的,本創作係提供一種散熱器導熱 以設置於一散熱器塗佈有導熱介質 結構包括一遮板、以及二分別形成 壁’且遮板係位於上述散熱底板塗 ’而二側壁彼此相對之内側面上則 二側壁之扣持部卡持於上述散熱底 板與上述政熱底板塗佈有導熱介質 為了使貴審查委員能更進一步瞭解本創作之特徵及 技術内容,請參閱以下有關本創作之詳細說明舆附圖,然 而所附圖式僅提供參考與說明用’並非用來對本創作加以 限制者。 請參閱第一圖、第二圖及第二圖’係分別為本創作與 散熱器之立體分解圖、立體錐合圖及組合剖視圖。本創作 係提供一種散熱器導熱介質保護結構,該保護結構2係用 以設置於一散熱器1塗佈有導熱介質3 (如第三圖所示)之 該處上,以使散熱器1可於出廠前即事先將適量的導熱介 質3塗佈於其底面處,並藉由該保護結構2作為導熱介質3The protection structure, the protection structure card and the effective protection touch and fall. In order to achieve the dielectric protection, the heat dissipation bottom plate has a heat conduction layer on the edge of the buckle plate, and the system is matched with the heat dissipation medium at the bottom of the heat dissipation medium. , looking for the purpose. In the above-mentioned configuration, it is used; one side of the side material on the side of the protection side: according to this, when the bottom of the heat shield can be made to dissipate the bottom plate, the edge of the plate can be easily The product is quickly packaged to prevent it from being stained by dust, or because the foreign object is separated by a gap to prevent the shutter from touching the heat transfer medium and providing protection. [Embodiment] The present invention provides a heat sink for heat conduction to be disposed on a heat sink coated with a heat conductive medium structure including a shutter, and two respectively forming a wall 'and a shutter is located on the heat sink base plate' and two side walls On the inner side opposite to each other, the holding portions of the two side walls are held by the heat dissipating bottom plate and the thermal insulation substrate is coated with a heat transfer medium. In order to enable the examiner to further understand the features and technical contents of the creation, please refer to the following related The detailed description of the present invention is in the accompanying drawings, and the drawings are merely for the purpose of illustration and description. Please refer to the first figure, the second figure and the second figure for the three-dimensional exploded view, the three-dimensional cone view and the combined sectional view of the creation and the heat sink respectively. The present invention provides a heat dissipating medium protection structure for a heat sink. The protection structure 2 is disposed on a heat sink 1 coated with a heat conductive medium 3 (as shown in the third figure), so that the heat sink 1 can be An appropriate amount of the heat conductive medium 3 is applied to the bottom surface thereof before leaving the factory, and the protective structure 2 is used as the heat transfer medium 3

M286954 3、創作說明(3) 之保護,以避免導熱介質3為灰塵所沾著、或因外物觸及 而掉落等。 +邊散熱益1在組裝完成後,大致可包括一散熱底板J 〇 4數豆立5又置於该散熱底板1Q上之「II」形熱管11、複 數串接於该等熱官1 1上之散熱鰭片丨2、一罩設於該等散熱 鰭片!2上之風罩13、一設於該風罩13一側之散熱風扇14、 =及^置於该散熱底板1 〇上之扣具1 5所構成;本創作即 =1用忒散熱态1底部之散熱底板丨〇,以便於將保護結 鲁與该散熱器1相結合。 以 該保護結構2 T為塑膠模殼所製者,並包括一遮板2〇 一側壁2 1所構成;其中: 位結構2結合於上述散熱器1上時,該遮板20即 r 佈有導熱介質3之—側外(如第三圖所示 二二成保匕釔構2保護導熱介質3之主要部位。 此相板2〇二側處上,且該二側壁彼 :欠 係設有彼此呈對稱「〔」字型之扣持 邛210,各扣持部21()呈「匸 持 散熱底板之邊緣厚产,值^開口處係略小於上述 丨如第三圖所示,當二側壁2 拄,散熱底板1〇邊緣處; 底板10邊緣處後:由心扣持;21 Γ二:::持於散熱 於二側壁21間之一宁仞罢μ门U 了將放熱底板10卡持 2〇與散埶哭丨$埤舶Λ 4 因此能使保護結構2之遮板 舣…、的1之散熱底板1 〇間相隔而 傲 令遮板20無法觸及導熱介質3。藉此員省有—間隙16,以 護導熱介質3作用之保護結構2。3卩可獲得一具有保 M286954 四、創作說明(4) "一"一 --—-- ^再者,該遮板20上亦可凸設有複數用以平穩擺置之支 撐部,另於二側壁21頂端處亦可分別凸設有一突部2 11 ’二突部211並分別對應於上述扣具15之二端處,且扣具 15二端處更分別設有一扣孔15〇,俾可利於突部2ιι由扣^ 一 4孔1 5 0下方穿入後,使扣具之二扣孔丨5 〇分別卡固於 :::2。1之突部211上,以供散熱器1與保護結構2組裝時 續保併參閱第四圖所示’Α 了便於使用者拆卸 丨-頂d ϊ可於該保護結構2之遮板20 一側上凸設有 方m〇1,该頂持部201可相對於散熱器1之風扇14下 下拉iir散熱器1上將保護結構2折卸下來時,只需向 10邊緣脫離/Η ’以令扣持部21G與散熱底板 確可之irn為不可多得之新型創作產品,其 新穎性及進步性,完全符合新以;:=’又因極具 S出申請,敬請詳查並賜准本案專障 拘限本創作之;:j j可行實施例,非因此即 内容所為之等效結構變化,作說明書及圖式 内,合予陳明。 理白包含於本創作之範圍 M286954 圖式簡單說明 【圖式簡單說明】 第一圖 係本創作與散熱器之立體分解圖。 第二圖 係本創作與散熱器之立體組合圖。 第三圖 係本創作與散熱器之組合剖視圖。 第四圖 係本創作與散熱器另一視角之組合部視圖。 〔元件代表符號〕 <本創作> 散熱器 1 散熱底板 10 熱管 11 散熱鰭片 12 風罩 13 散熱風扇 14 扣具 15 扣孑L 150 間隙 16 保護結構 2 遮板 20 支撐部 200 頂持部 201 側壁 21 扣持部 210 突部 211 導熱介質 3M286954 3. Protection of creation instructions (3) to prevent the heat transfer medium 3 from being stained by dust or falling due to foreign objects. After the assembly is completed, the heat dissipation substrate 1 may include a heat dissipation substrate J 〇 4 and a "II" shaped heat pipe 11 placed on the heat dissipation substrate 1Q, and a plurality of heat pipes 11 are connected in series to the heat officials 1 1 . The heat sink fins 2, one cover is set on the heat sink fins! The windshield 13 on the side of the windshield 13 is formed by a heat dissipating fan 14 disposed on the side of the windshield 13 and a clip 15 disposed on the heat dissipating bottom plate 1; The heat sink bottom plate at the bottom is used to combine the protective knot with the heat sink 1. The protective structure 2 T is made of a plastic mold shell, and comprises a shutter 2 〇 a side wall 21 1; wherein: when the bit structure 2 is coupled to the heat sink 1, the shutter 20 is provided with r The outer side of the heat-conducting medium 3 (as shown in the third figure, the two-two-dimensional structure 2 protects the main part of the heat-conducting medium 3. The two sides of the phase plate are located on the two sides, and the two side walls are: Symmetrical "["-shaped buckles 邛210, each holding part 21() is "small-edge of the edge of the heat-dissipating bottom plate, and the value of the opening is slightly smaller than the above, as shown in the third figure. Side wall 2 拄, the edge of the heat sink base plate 1 ;; the edge of the bottom plate 10 at the back: by the heart buckle; 21 Γ 2::: Hold the heat between the two side walls 21 Ning 仞 μ μ door U will heat the bottom plate 10 card Holding 2 〇 and 埶 埶 丨 埤 埤 埤 埤 埤 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护 保护There is a gap 16 to protect the heat-conducting medium 3 from the protective structure 2. 3 卩 can obtain a guaranteed M286954 IV, creation instructions (4) "one" one----- Further, the shutter 20 may also be provided with a plurality of support portions for smooth placement, and a protrusion 2 11 'two protrusions 211 may be respectively protruded from the top ends of the two side walls 21 and respectively correspond to The two ends of the buckle 15 are respectively provided with a button hole 15 二 at the two ends of the buckle 15 , which can facilitate the protrusion of the protrusion 2 ιιι by a 4 hole 1 5 0, and then the buckle 2 The buttonholes 〇5 卡 are respectively fastened on the protrusions 211 of the :::2.1 for renewing when the heat sink 1 and the protection structure 2 are assembled, and refer to the figure 4 in the figure to facilitate the user to disassemble the 丨- The top d 凸 can be convexly disposed on the side of the shutter 20 of the protection structure 2, and the top portion 201 can be folded down relative to the fan 14 of the heat sink 1 to fold the protective structure 20 When it is unloaded, it is only necessary to remove the 10 向 10 10 以 以 以 以 以 以 以 以 以 以 以 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 21 Since there is a very large S application, please check and grant the case to cover the creation of this case;: jj feasible embodiment, not the equivalent structural change of the content In the manual and the drawings, it is combined with Chen Ming. Li Bai is included in the scope of this creation. M286954 Simple description of the drawing [Simple description of the drawing] The first picture is the exploded view of the creation and the radiator. The second picture is the creation. The three-dimensional combination diagram of the heat sink and the heat sink. The third picture is a combination view of the combination of the creation and the heat sink. The fourth picture is a combination view of the other perspective of the creation and the heat sink. [Component symbol] <This creation> 1 heat sink base plate 10 heat pipe 11 heat sink fin 12 windshield 13 heat sink fan 14 clip 15 buckle 150 L 150 gap 16 protection structure 2 shutter 20 support portion 200 top portion 201 side wall 21 button portion 210 protrusion 211 heat transfer medium 3

第9頁Page 9

Claims (1)

M286954 五、申請專利範圍 1、一種散熱器導熱介質保護結構,其係用以設置於 一散熱器塗佈有導熱介質之散熱底板上;該保護結構包括 遮板’位於上述散熱底板塗佈有導熱介質之一側外 ;及 對之内 其 k,並使 成於該遮板二側處上,且該二側壁彼此相 設有扣持部; 扣持部係用以卡持於上述散熱底板邊緣處 上述散熱底板相隔以預留間隙。 護結構 3 護結構 4 護結構 型者。 5 一散熱 1跨置一 包括: ;及 對之内 侧壁,形 側面上皆 中,各該 该遮板與 、如申請 ,其中該 、如申請 ,其中該 、如申請 ,其中該 、一種散 器塗佈有 扣具’該 專利範圍第1項所述之散熱器導熱介質保 遮板上係凸設有複數支撐部。 專利範圍第1項所述之散熱器導熱介質保 遮板上係凸設有一頂持部。 專利範圍第1項所述之散熱器導熱介質保 二側壁之扣持部係呈彼此對稱之「c」字 熱器導熱介質保護結構,其係用以設置於 導熱介質之散熱底板上’且於該散熱器上 扣具二端處分別設有一扣孔;該保護結構 遮板’位於上述散熱底板塗佈有導熱介質之一側外 側壁,形 側面上皆 成於該遮板二側處上,且該二側壁彼此相 設有扣持部’而該二側壁了員端處則分別凸M286954 V. Patent application scope 1. A heat-conducting medium heat-protecting medium protection structure is disposed on a heat-dissipating base plate coated with a heat-conducting medium; the protective structure includes a shielding plate One side of the medium is outside; and k is disposed therein, and is formed on both sides of the shutter, and the two side walls are provided with a fastening portion; the fastening portion is for holding on the edge of the heat dissipation bottom plate The above heat dissipation bottom plates are spaced apart to reserve a gap. Guard structure 3 Guard structure 4 Guard structure type. 5 a heat dissipation 1 span includes: and a pair of inner side walls, a shape side surface, each of the shutters and, as for the application, wherein the application, wherein the application, wherein the application, wherein the device A plurality of support portions are provided on the heat-conducting heat-preserving medium of the heat sink according to the first aspect of the patent. The heat transfer medium of the heat sink of the first aspect of the patent is provided with a top portion. The heat-dissipating medium of the heat-transfer medium of the first aspect of the patent scope is a "c" heat-transfer medium protection structure symmetrically symmetrical with each other, and is disposed on the heat-dissipating base plate of the heat-conductive medium. A fastening hole is respectively disposed at two ends of the fastening device on the heat sink; the protective structure shielding plate is located on the outer side wall of the heat dissipation substrate coated with one side of the heat conductive medium, and the side surfaces are formed on two sides of the shielding plate. And the two side walls are respectively provided with a fastening portion', and the two side walls are respectively convex at the end 第10頁 M286954 五、申請專利範圍 設有一突部; 其中,各該扣持部係用以卡持於上述散熱底板邊緣處 ,並使該遮板與上述散熱底板相隔以預留間隙,且該二突 部則分別對應於上述扣具二端處之扣孔。 6、 如申請專利範圍第5項所述之散熱器導熱介質保 護結構,其中該遮板上係凸設有複數支撐部。 7、 如申請專利範圍第5項所述之散熱器導熱介質保 護結構,其中該遮板上係凸設有一頂持部。 | 8、如申請專利範圍第5項所述之散熱器導熱介質保 護結構,其中該二側壁之扣持部係呈彼此對稱之「c」字 型者。Page 10 M286954 5. The patent application scope has a protrusion; wherein each of the fastening portions is used to be held at the edge of the heat dissipation substrate, and the shutter is separated from the heat dissipation substrate to reserve a gap, and The two protrusions respectively correspond to the button holes at the two ends of the buckle. 6. The heat-transfer medium protection structure of the heat sink of claim 5, wherein the shutter is provided with a plurality of support portions. 7. The heat transfer medium protection structure of the heat sink of claim 5, wherein the cover has a top portion. 8. The heat-transfer medium protection structure of the heat sink of claim 5, wherein the fastening portions of the two side walls are "c" shaped symmetrically with each other. 第11頁Page 11
TW94215102U 2005-09-02 2005-09-02 Protection structure for heat-conduction medium of heat sink TWM286954U (en)

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees