1327270 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別涉及一種帶有導熱介 質保護蓋之散熱裝置。 【先前技術】 應用散熱器給電子元件散熱時，爲提高散熱器和電子 元件間之傳熱此力，通常在散熱器底面塗布導熱介質（如 導熱膠），但是，由於導熱介質易污染周邊元件及受到灰 塵和其他微粒之污染而不能提前塗布於散熱器上。通常， 在散熱器安裝於中央處理器時，才將導熱介質塗布於散轨 器上。 … 爲克服上述問題，出現了多種導熱介質保護裝置，如 美國專利第US 6,049,458號即公開了 一種導熱介質保護裝 置，其罩設于塗布有導熱介質之散熱器底面上，避免導熱 ;ι質在散熱器搬運及安裝過程中污染其他元件及被污染， 通過該導熱介質保護裝置，導熱介質可提前塗布於散熱器 上’簡化散熱器安裝至中央處理器上之步驟，然而，該導 熱介質保護裝置是通過粘膠粘貼於散熱器底面，在散熱器 安裝至中央處理器時需做除膠工作，較爲不便，且粘膠在 夕久使用過後容易失去枯性。 【發明内容】 有鑒於此，有必要提供一種散熱裝置，其導熱介質保 護蓋可以被方便地安裝和拆卸。 1327270 一種散熱裝置，包括一散熱器、一塗覆於該散熱器上 =導熱介質以及一過盈配合於該散熱器上之導熱介質保護 蓋’該導熱介質保護蓋包括一形成有導熱介質保護空間之 本體及一與該本體相連並包覆於所述散熱器之一角端之第 角部，該第一角部具有兩鄰邊以及一連接該兩鄰邊之對 邊」每一鄰邊均延伸出一與所述散熱器一角端之側壁配合 之第一固定側緣；所述第一角部以其對邊轉動連接於所述 本體上，使該第一角部可相對所述本體翻轉。 上述導熱介質保護蓋由於通過過盈配合之方式裝配於 散熱器上，與現有粘膠粘合方式相比，操作更加便捷，並 可以重復多次裝配。另外，由於導熱介質保護蓋之第一角 部活動連接於本體上，使得拆卸過程中很容易去掉導熱介 質保護蓋與散熱器間之過盈力，使拆卸更加便捷、安全。 【實施方式】1327270 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink, and more particularly to a heat sink with a heat shield. [Prior Art] When applying heat sink to heat the electronic components, in order to improve the heat transfer between the heat sink and the electronic components, a heat transfer medium (such as a thermal conductive adhesive) is usually applied on the bottom surface of the heat sink, but the heat conductive medium is likely to contaminate the peripheral components. It is not contaminated by dust and other particles and cannot be applied to the radiator in advance. Typically, the heat transfer medium is applied to the diffuser when the heat sink is mounted to the central processor. In order to overcome the above problems, a variety of heat-conducting medium protection devices have been proposed. For example, U.S. Patent No. 6,049,458 discloses a heat-conducting medium protection device which is disposed on the bottom surface of a heat sink coated with a heat-conducting medium to prevent heat conduction; During the handling and installation of the radiator, other components are contaminated and contaminated. Through the thermal medium protection device, the heat transfer medium can be applied to the heat sink in advance, which simplifies the step of mounting the heat sink to the central processor. However, the heat medium protection device It is glued to the bottom surface of the heat sink. When the heat sink is mounted to the central processor, it needs to be done with glue removal, which is inconvenient, and the glue is easy to lose the dryness after being used for a long time. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device whose heat conducting medium protection cover can be conveniently mounted and detached. 1327270 A heat dissipating device comprising a heat sink, a heat-dissipating medium coated on the heat sink, and a heat-conducting medium protective cover that is interference-fitted on the heat sink. The heat-conductive medium protective cover comprises a heat-protecting medium protection space. a body and a corner portion connected to the body and covering a corner end of the heat sink, the first corner portion having two adjacent sides and a pair of opposite sides connecting the two adjacent sides, each of which extends And a first fixed side edge that cooperates with a sidewall of the corner end of the heat sink; the first corner portion is rotatably coupled to the body with opposite sides thereof, so that the first corner portion can be inverted relative to the body. The above-mentioned heat-conductive medium protective cover is assembled on the heat sink by an interference fit, which is more convenient in operation than the existing adhesive bonding method, and can be repeatedly assembled. In addition, since the first corner of the heat-transitive medium protection cover is movably connected to the body, the interference between the heat-conductive medium protection cover and the heat sink is easily removed during the disassembly process, which makes the disassembly easier and safer. [Embodiment]
圖1至圖3示出了本發明散熱裝置之一個實施例該 散熱裝置可用於散發電子元件（例如，電腦cpu)産生之 熱量，其包括一散熱器10、一塗覆在散熱器1〇上之導熱介 質30以及一裝配在散熱器1〇上之導熱介質保護蓋2〇γ 散熱器10採用諸如銅、链等導熱性能良好之材料製 成’其包括-基座11及若干散熱鰭片13。該基座u在本 實施例中大體呈-矩形平板狀’其具有一用於與電子元件 貼合之底面（未標號）及一與該底面相對之頂面（未標號）。 散熱鰭片13呈片狀，並平行間隔排列於基座u之^^， 8 (S ) 1327270 以增加與空氣之接觸面積。導熱介質30 (例如導熱膠）均 勻塗布於基座11之底面，用來將基座u底面與電子元件 導熱連接’以提尚基座11與電子元件間之導熱率。 導熱介質保護蓋20裝配在散熱器1〇之基座11上，並 覆蓋導熱介質30,以避免導熱介質3〇受到外界之污染或破 壞。導熱介質保護蓋20—般採用塑膠材料一體製成，其包 括一平板狀本體21以及與該本體21相連之一第一角部21〇 籲和一第二角部212,第二角部212與第一角部210分佈於導 熱介質保護蓋20之對角位置。本體21朝一側凸出有一蓋 體214，該蓋體214形成一導熱介質保護空間，可以抵禦外 力外物對導熱介質30之破壞，該導熱介質保護空間之大小 視導熱介質30之大小而定。 第一角部210具有兩鄰邊（未標號）及一連接該兩鄰 邊之對邊（未標號），該兩鄰邊相互垂直且長度相等並 为別朝與上述蓋體214凸出方向相反之方向垂直延伸出第 # 一固定侧緣240、250，用以與散熱器1〇之基座u侧壁配 合，第一固定側緣240、250於相鄰端緣彼此相連。第二角 部212與本體21 —體成型並也具有兩鄰邊，每一鄰邊均與 上述第一固定側緣24〇、25〇同向延伸出一用於與散熱器1〇 配合之第二固定側緣22、23。第二固定側緣22、23彼此垂 直，並分別與第一固定侧緣25〇、24〇平行，第二固定側緣 22、23相鄰端緣也彼此相連。第一固定侧緣24〇、25〇與第 一固定侧緣22、23 —道界定出一用於容納散熱器1〇基座 11之配合空間’該配合空間之尺寸稍小於散熱器10基座 1327270 11之尺寸，從而使導熱介質保護蓋20可通過過盈配合之方 式裝配於散熱器10之基座11上。 本實施例中，爲方便導熱介質保護蓋20之拆卸，令第 一角部210以對邊活動連接於本體21上，從而使第一角部 210可繞其對邊相對本體21翻轉。另外，爲使導熱介質保 濩蓋20在安裝時實現預先定位，還於本體21上與上述第 一固定側緣240、250同向延伸出兩擋板24、25,該兩擋板 24、25分別與上述第二固定侧緣22、23平行，從而第二固 定側緣22、23界定出一預配合空間，可將導熱介質保護蓋 20預定位到散熱器1〇基座u上。擋板24與第二固定侧緣 23相鄰之端緣相距一定間隔，擋板25與第二固定側緣u 相鄰之端緣也相隔一定間距，以在導熱介質保護蓋2〇之另 兩對角位置形成缺口，從而當導熱介質保護蓋2〇覆蓋在散 熱器10基座11上時，基们〇另兩對角之角端暴露在外， 即可方便將導熱介質保護蓋2〇預定位在基座1〇上。1 to 3 illustrate an embodiment of a heat dissipating device of the present invention. The heat dissipating device can be used to dissipate heat generated by an electronic component (for example, a computer cpu), and includes a heat sink 10 coated on the heat sink 1 The heat conductive medium 30 and a heat conductive medium protection cover 2 〇 γ heat sink 10 mounted on the heat sink 1 are made of a material having good thermal conductivity such as copper or chain, and include a base 11 and a plurality of heat dissipation fins 13 . The susceptor u is generally in the form of a rectangular-shaped flat plate having a bottom surface (not labeled) for bonding to an electronic component and a top surface (not labeled) opposite to the bottom surface. The heat dissipating fins 13 are in the form of a sheet and are arranged in parallel at intervals of the ^u, 8 (S) 1327270 of the pedestal u to increase the contact area with the air. A heat transfer medium 30 (e.g., a thermal conductive adhesive) is uniformly applied to the bottom surface of the susceptor 11 for thermally connecting the bottom surface of the susceptor u to the electronic component to improve the thermal conductivity between the susceptor 11 and the electronic component. The heat transfer medium protection cover 20 is mounted on the base 11 of the heat sink 1 and covers the heat transfer medium 30 to prevent the heat transfer medium 3 from being contaminated or damaged by the outside. The heat conductive medium protection cover 20 is generally made of a plastic material, and includes a flat body 21 and a first corner portion 21 and a second corner portion 212 connected to the body 21, and the second corner portion 212 is The first corner portion 210 is distributed at a diagonal position of the heat transfer medium protection cover 20. The body 21 protrudes toward a side of a cover body 214. The cover body 214 forms a heat-conducting medium protection space for resisting damage to the heat-conductive medium 30 by an external force. The size of the heat-conductive medium protection space depends on the size of the heat-conductive medium 30. The first corner portion 210 has two adjacent sides (not labeled) and a pair of opposite sides (not labeled) connecting the two adjacent sides, the two adjacent sides being perpendicular to each other and equal in length and opposite to the convex direction of the cover body 214 The direction extends perpendicularly to the first fixed side edges 240, 250 for mating with the sidewalls of the base u of the heat sink 1 , and the first fixed side edges 240, 250 are connected to each other at adjacent end edges. The second corner portion 212 is integrally formed with the body 21 and also has two adjacent sides, and each of the adjacent sides extends in the same direction as the first fixed side edges 24 〇 and 25 出 to cooperate with the heat sink 1 Two fixed side edges 22, 23. The second fixed side edges 22, 23 are perpendicular to each other and are parallel to the first fixed side edges 25, 24, respectively, and the adjacent end edges of the second fixed side edges 22, 23 are also connected to each other. The first fixed side edges 24〇, 25〇 and the first fixed side edges 22, 23 define a mating space for accommodating the heat sink 1 〇 base 11 'the size of the mating space is slightly smaller than the base of the heat sink 10 The dimensions of 1327270 11 are such that the thermally conductive medium protective cover 20 can be assembled to the base 11 of the heat sink 10 by an interference fit. In this embodiment, in order to facilitate the disassembly of the heat-conducting medium protection cover 20, the first corner portion 210 is movably connected to the body 21 with the opposite sides, so that the first corner portion 210 can be turned around the opposite side 21 with respect to the opposite side. In addition, in order to realize the pre-positioning of the heat-conducting material protection cover 20 during installation, two baffles 24 and 25 are also extended on the main body 21 in the same direction as the first fixed side edges 240 and 250. The two baffles 24 and 25 Parallel to the second fixed side edges 22, 23, respectively, such that the second fixed side edges 22, 23 define a pre-mating space for pre-positioning the heat transfer medium protection cover 20 onto the base plate u of the heat sink 1. The end edge of the baffle 24 adjacent to the second fixed side edge 23 is spaced apart from each other, and the edge of the baffle 25 adjacent to the second fixed side edge u is also spaced apart to the other two of the heat-transfer protective cover 2 The diagonal position is notched, so that when the heat conductive medium protection cover 2 is covered on the base 11 of the heat sink 10, the corner ends of the other two diagonal corners are exposed, and the heat medium protection cover 2 can be conveniently pre-positioned. On the base 1〇.
組裝時’先將導熱介質保護蓋2〇之第一角部21〇翻 起，再將導熱介質保護蓋2〇套接在散熱器1〇基座n上， 並使本體21之第二角部加覆蓋在基座U之-角端，翻 折起之第-角冑210對應佈置在與上述一角端對角之另一 角端處，第二角部212之第二固定側緣㈣及本體Μ 二分別抵擋在基座11之四側壁上，實現了 導熱”貝保〇蒦盖20之預定你。县✓么 . 翻㈣最後，施力對第-角部210 朝散熱器10擠壓，將第一菡邱 η之另-角端上，散:器10:二套接在散熱器10基座 散”，、器10基座11之上述兩對角位置之 角端與導熱介質保護蓋20之第一 〇 之間形成過盈力，使得第一角° 1〇和第二角部212 说及第二角部加之第m之第一固定侧緣24〇、 A ^ 固疋側緣22、23與散熱器1() :11側壁之間産生較大之摩擦力，從而 盖二牢固之褒配到散熱器1〇上。拆却時，首先用力：第蒦 翻起’即可去掉導熱介質保護蓋2〇與散熱㈣ 二 間之過盈力’進而去掉或降低導熱介㈣護蓋2〇 Ά座11之間摩擦力’拆卸起來非常容易。 上述帶有可翻折第-角部210之過盈配合式導執介質 保護蓋20,與普通之過盈配合式導熱介f保護蓋相比，具 有如下優點··普通過盈配合式導熱介質保護蓋拆卸時必須 整體拆卸，並由於拆却保護蓋與散熱器接觸面積較大，而 ，致保護蓋與散熱器間之摩擦力較大，拆卸比較困難，且 容易由於力道使用不當而刮擦到導熱介質；而帶有可翻折 第一角部210之保護蓋2〇則可通過翻起第一角部21〇去掉 保護蓋20與散熱器1〇間之過盈力之後，再輕鬆地將保護 蓋20取下，在翻折第一角端210之過程中，本體21之位 置基本不發生變化，從而不會由於力道使用不當而導致導 熱介質被刮擦。 另外，本發明於第一角部21〇設置成可翻轉式結構還 有其獨特之優勢，例如，單手即可將其翻折起，而不受散 熱器10基座11尺寸大小之限制，而其他位置設置成可翻 折結構對那些尺寸較大之散熱器基座10基座11用保護蓋 來說翻折相對較困難。 11 1327270 可以理解的疋’雖然、上述實施例令保護蓋僅包括— 第一角部210及-第二角部212，且僅第一角部21〇可翻 轉，而在其他實施例中，也可以包括其他角部，且第 部212及其他角部也可設置成可翻轉式結構。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟’以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾 春或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1是本發明散熱裝置之組合圖。 圖2是圖1所示散熱裝置之局部分解圖。 圖3是圖1所示散熱裝置之分解圖。 【主要元件符號說明】 10 基座 11 13 導熱介質保護蓋 20 21 第一角部 210 212 蓋體 214 240 、 250 第二固定側緣 22、23 22 ' 23 導熱介質 30 散熱器 散熱鰭片 本體 第二角部 第一固定侧緣 擋板 12 S )When assembling, the first corner portion 21 of the heat-conducting medium protection cover 2 is turned up, and then the heat-transfer protective cover 2 is sleeved on the base 1 of the heat sink 1 and the second corner of the body 21 is made. Covering the corner end of the base U, the folded-up corner-angle 210 is correspondingly disposed at the other corner end opposite to the corner end, and the second fixed side edge (4) of the second corner portion 212 and the body Μ The two are respectively resisted on the four side walls of the base 11, respectively, to achieve the heat conduction "Beacon cover 20 is scheduled for you. County ✓ What. Turn (four) Finally, the force on the first-corner 210 is pressed toward the radiator 10, will On the other end of the first 菡 η η, the scatterer: the dam is attached to the pedestal of the heat sink 10, and the angular ends of the two diagonal positions of the base 11 of the device 10 and the heat transfer medium protection cover 20 An interference force is formed between the first corners such that the first corner 1 〇 and the second corner 212 refer to the second corner plus the first fixed side edge 24 第, A ^ 疋 side edge 22 of the mth, 23 and the radiator 1 (): 11 side wall to create a large friction, so that the cover is firmly attached to the radiator 1 。. When dismantling, first force: first turn up 'can remove the thermal media protection cover 2 〇 and heat dissipation (4) the interference between the two 'and then remove or reduce the thermal conductivity (4) the friction between the cover 2 〇Ά seat 11 ' It is very easy to disassemble. The interference fit type dielectric protection cover 20 with the foldable first corner portion 210 has the following advantages compared with the conventional interference fit type thermal conductive material f protective cover. When the protective cover is removed, it must be disassembled as a whole, and because the contact area between the protective cover and the heat sink is large, the friction between the protective cover and the heat sink is large, the disassembly is difficult, and it is easy to scratch due to improper use of the force channel. To the heat transfer medium; and the protective cover 2 with the foldable first corner 210 can be easily removed by lifting the first corner 21 to remove the interference between the cover 20 and the heat sink 1 The protective cover 20 is removed, and the position of the body 21 does not substantially change during the folding of the first corner end 210, so that the heat conductive medium is not scratched due to improper use of the force. In addition, the present invention has the unique advantage of being provided in the first corner portion 21〇 as a reversible structure, for example, it can be folded up by one hand without being limited by the size of the base 11 of the heat sink 10. The other positions are set to a foldable structure. It is relatively difficult for the base 11 of the heat sink base 10 which is relatively large to be folded with a protective cover. 11 1327270 It is to be understood that although the above embodiment allows the protective cover to include only the first corner portion 210 and the second corner portion 212, and only the first corner portion 21 is reversible, and in other embodiments, Other corners may be included, and the first portion 212 and other corners may also be provided in a reversible configuration. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and those skilled in the art will be able to cover the equivalent modifications of the present invention within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a combination diagram of a heat sink of the present invention. Figure 2 is a partially exploded view of the heat sink of Figure 1. Figure 3 is an exploded view of the heat sink shown in Figure 1. [Main component symbol description] 10 Base 11 13 Thermal medium protection cover 20 21 First corner 210 212 Cover 214 240, 250 Second fixed side edge 22, 23 22 ' 23 Heat transfer medium 30 Heat sink fin body The first fixed side edge baffle of the two corners 12 S )