200950683 、’ .九、發明說明： 嫌 【發明所屬之技術領域】 本發明涉及一種熱傳介質保護裝置，特別係一種用於 保護散熱器的熱傳介質不受污染的保護裝置。 【先前技術】 目前在電子元件的散熱領域，通常在電子元件表面加 裝一散熱器，以便將其所產生的熱量及時排出，為使散熱 © 器與電子元件表面緊密接觸從而減小介面熱阻，業者通常 在散熱器與電子元件的接觸表面之間塗佈一層具有較好的 粘性和較高熱傳導率的熱傳介質，使得散熱器與發熱電子 元件的表面接觸更加緊密，從而增強熱傳導效果。然而， 由於熱傳介質為一種膏狀易污染性化學物質，因此有必要 對熱傳介質進行保護。 習知的熱傳介質保護裝置通常包括一散熱器和一保護 膜，該散熱器具有一平滑的頂面，該頂面上用來與發熱元 ® 件接觸的部位塗敷一定量的熱傳介質，在該熱傳介質上覆 蓋保護膜加以保護，使用時將保護膜從熱傳介質上揭下即 可。然而，該種保護裝置在使用時容易將熱傳介質連同保 護膜一起被揭下，導致熱傳介質損壞。 【發明内容】 有鑒於此，有必要提供一種能夠有效保護熱傳介質且 不會損壞其構造的熱傳介質保護裝置。 一種熱傳介質保護裝置，包括一散熱器及一蓋體，該 200950683 • 散熱器包括一基座和位於基座其中一表面上的複數散熱轉 . 片，该基座相對的另一表面向内凹陷形成一凹槽，該凹样 具有一頂壁及圍繞該頂壁所形成的至少一側壁，該頂壁上 設有熱傳介質，該蓋體與該凹槽對應並罩設於基座上。 與習知技術相比，本發明的熱傳介質保護裝置在散熱 器的基座上形成凹槽，在凹槽内設置熱傳介質，同時配合 蓋體一起將熱傳介質封閉在凹槽内部可以避免受到污染， 使用時只需將蓋體揭下，熱傳介質不會受到任何的損壞， ❹方便簡單。 【實施方式】 下面參照圖示，結合實施例詳細說明本發明之熱傳介 質保護裝置。 請參閱圖1及圖2，為本發明熱傳介質保護裝置1〇的 一實施例。該熱傳介質保護裝置10包括一散熱器2〇以及 一蓋體30。 ❹ 該散熱器20用於吸收、散發一發熱電子元件如中央處 理器（圖未示）所產生的熱量。該散熱器20包括一基座22 和延設於基座22的底面上的複數散熱鰭片24。該基座22 由導熱性良好的金屬材料如鋁、銅等製成，其頂面的中& 向内凹陷形成一方形的凹槽220。該凹槽220由一頂壁 和圍繞該頂壁222周緣的四個侧壁224所圍成。當然 # 凹槽220的整體形狀並不局限於方形，可根據實際需要^ 整為圓形、菱形等其他形狀。 ° 200950683 該頂壁222上塗佈有一定量的熱傳介 等’根據凹槽220的大小及需求，亦可以於^熱膠 部侧壁224上塗佈熱傳介質4〇,且塗佈的入哲Ρ；7或王 度小於凹槽220的深度。 、；丨質40的厚 散熱器20的散熱鰭片24可以以任何方式如 接、播入及鉚接等方式設置於基座22上，接、枯 體成型，亦可通過設置熱管將基座22與散熱韓片 ❹ Ο 在本實施例中，該蓋體30包括—本體部％及稀 部34。該本體部32大致呈方形，該延伸部％由方形本體 部32的一邊沿基座22的頂面向外漸縮延伸形成，’ 部34突設於散熱器20的一側，以方便將蓋體從=== 20上取下。該蓋體30可以為膠帶，亦可以由不具粘性的其 他材料製成，同時於蓋體30上對應凹槽22〇的周邊位置處 塗覆粘膠，以將蓋體30罩設於凹槽220上，這樣，在凹^ 2功與蓋體30間便形成一將熱傳介質40封閉其内的封閉= 間（圖未示）°該種設置對熱傳介質40起到有效地保護作 用，且組裝方便，不易碰觸。此外，該凹槽22〇的設置， 將熱傳介質40封閉其中，蓋體30可直接貼設於基座22的 頂面上，節約空間。在使用該散熱器20時，可直接將蓋體 30通過延伸部34從基座22上揭下，熱傳介質4〇仍安好锞 存於凹槽220内，同時該凹槽220的設置可以增大散熱器 的傳熱接觸面積，凹槽220的側壁224可以與發熱電子 元件的側邊熱接觸，從而提升散熱效果。 當然，該蓋體30的形狀和結構亦不僅限於上述實施例 200950683 «200950683, '. IX. OBJECT DESCRIPTION: TECHNICAL FIELD The present invention relates to a heat transfer medium protection device, and more particularly to a protection device for protecting a heat transfer medium of a heat sink from contamination. [Prior Art] At present, in the field of heat dissipation of electronic components, a heat sink is usually added to the surface of the electronic component to discharge the heat generated in time to reduce the thermal resistance of the interface by bringing the heat sink into close contact with the surface of the electronic component. The manufacturer usually coats a heat transfer medium having a good viscosity and a high thermal conductivity between the contact surface of the heat sink and the electronic component, so that the surface of the heat sink is more closely contacted with the surface of the heat-generating electronic component, thereby enhancing the heat conduction effect. However, since the heat transfer medium is a paste-like and easily contaminating chemical, it is necessary to protect the heat transfer medium. Conventional heat transfer medium protection devices generally include a heat sink and a protective film having a smooth top surface on which a portion of the heat transfer medium is applied to the portion in contact with the heat generating element. The heat transfer medium is covered with a protective film for protection, and the protective film is removed from the heat transfer medium during use. However, such a protective device tends to remove the heat transfer medium together with the protective film during use, resulting in damage to the heat transfer medium. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat transfer medium protection device capable of effectively protecting a heat transfer medium without damaging its configuration. A heat transfer medium protection device comprising a heat sink and a cover, the 200950683 • the heat sink comprises a base and a plurality of heat-dissipating plates on one surface of the base, the opposite surface of the base is inward The recess defines a recess, the recess has a top wall and at least one sidewall formed around the top wall, the top wall is provided with a heat transfer medium, and the cover body corresponds to the recess and is disposed on the base . Compared with the prior art, the heat transfer medium protection device of the present invention forms a groove on the base of the heat sink, and provides a heat transfer medium in the groove, and at the same time, the heat transfer medium is enclosed in the groove together with the cover body. Avoid contamination, only need to remove the cover when using, the heat transfer medium will not be damaged, it is convenient and simple. [Embodiment] Hereinafter, a heat transfer medium protection device of the present invention will be described in detail with reference to the accompanying drawings. Referring to Figures 1 and 2, an embodiment of a heat transfer medium protection device 1A of the present invention is shown. The heat transfer medium protection device 10 includes a heat sink 2A and a cover 30.散热器 The heat sink 20 is used to absorb and dissipate heat generated by a heat-generating electronic component such as a central processing unit (not shown). The heat sink 20 includes a base 22 and a plurality of heat dissipation fins 24 extending from a bottom surface of the base 22 . The susceptor 22 is made of a metal material having good thermal conductivity such as aluminum, copper, or the like, and the center of the top surface is recessed inward to form a square groove 220. The recess 220 is surrounded by a top wall and four side walls 224 surrounding the perimeter of the top wall 222. Of course, the overall shape of the groove 220 is not limited to a square shape, and may be rounded, rhombic or the like according to actual needs. ° 200950683 The top wall 222 is coated with a certain amount of heat transfer, etc. 'According to the size and requirements of the groove 220, the heat transfer medium 4 涂布 can also be coated on the hot glue side wall 224, and the coated ZheΡ; 7 or Wang is smaller than the depth of the groove 220. The heat sink fins 24 of the thick heat sink 20 of the enamel 40 may be disposed on the base 22 in any manner such as pick-up, play-in, and riveting, and may be formed by picking up or drying the body, or by placing a heat pipe to set the base 22 In the present embodiment, the cover 30 includes a body portion % and a thin portion 34. The body portion 32 is substantially square. The extension portion is formed by a side of the square body portion 32 extending outwardly along the top surface of the base 22, and the portion 34 is protruded from one side of the heat sink 20 to facilitate the cover body. Remove from === 20. The cover body 30 may be an adhesive tape or may be made of other materials that are not viscous, and at the same time, a glue is applied to the peripheral position of the cover body 30 corresponding to the groove 22〇 to cover the cover body 30 in the groove 220. In this way, a gap between the recess 2 and the cover 30 is formed by enclosing the heat transfer medium 40 (not shown). This arrangement effectively protects the heat transfer medium 40. It is easy to assemble and difficult to touch. In addition, the recess 22 is disposed to enclose the heat transfer medium 40, and the cover 30 can be directly attached to the top surface of the base 22 to save space. When the heat sink 20 is used, the cover 30 can be directly removed from the base 22 through the extending portion 34, and the heat transfer medium 4 is still stored in the groove 220, and the groove 220 can be disposed. Increasing the heat transfer contact area of the heat sink, the sidewall 224 of the recess 220 can be in thermal contact with the sides of the heat-generating electronic component to enhance the heat dissipation effect. Of course, the shape and structure of the cover 30 are not limited to the above embodiment 200950683 «
的狀況’亦可根據凹槽220的形狀對應的變更。除粘貼外 亦可藉由扣合的方式罩設於凹槽220上，如圖3所示，為 本發明熱傳介質保護裝置的第二實施例，本實施例與前一 實施例的區別係該蓋體30a的大小與基座22的大小相當， 該蓋體30a包括一板狀體36及由該板狀體36的周邊向下 垂直延伸形成的多個折邊38。該蓋體30a通過折邊38和基 座22外周緊配合將其固定於散熱器2〇上，該板狀體 設基座22的整個頂面，將熱傳介質4〇封閉於凹槽22〇内— 綜讀述，本發明符合發明專利之要件，妥依法提出 專=申π °㈣上料者僅為本發明之較佳實施例，舉凡 ί變：f在麦依本發明精神所作之等效健 " 白應涵羞於以下之申請專利範圍内。 【圖式簡單說明】 圖 解圖。 為本發明-實施_熱傳介#保魏置的立體分The condition ' can also be changed according to the shape of the groove 220. The second embodiment of the heat transfer medium protection device of the present invention is shown in FIG. 3, and the difference between the present embodiment and the previous embodiment is shown in FIG. The cover 30a has a size corresponding to the size of the base 22, and the cover 30a includes a plate-like body 36 and a plurality of flanges 38 extending vertically downward from the periphery of the plate-like body 36. The cover body 30a is fastened to the heat sink 2 by a tight fit of the flange 38 and the outer circumference of the base 22. The plate body is provided with the entire top surface of the base 22, and the heat transfer medium 4 is closed in the recess 22〇. Internal - comprehensive reading, the present invention meets the requirements of the invention patent, and it is only a preferred embodiment of the present invention to properly apply the π ° (4) loading, which is only a preferred embodiment of the present invention: f is made in the spirit of the invention of Mai Yi. "Healthy" " Bai Yinghan is ashamed of the following patent application. [Simple diagram of the diagram] Figure solution. For the present invention-implementation_热传介# Bao Wei set three-dimensional points
圖2為圖1的立體組裝圖。 組裝Ξ。3為本發明又—實施例的熱傳介質保護裝置的立體 【主要元件符號說明】 熱傳介質保護裝置 10 基座 22 蓋體 30、30a 延伸部 34 折邊 38 散熱器 散熱鳍片 本體部 板狀體 熱傳介質 20 24 32 36 40 222 200950683 .凹槽 220 頂壁 側壁 224 ❹FIG. 2 is an assembled, isometric view of FIG. 1. FIG. Assembly Ξ. 3 is a stereoscopic heat transfer medium protection device according to another embodiment of the present invention. [Main component symbol description] Heat transfer medium protection device 10 Base 22 Cover body 30, 30a Extension portion 34 Fold 38 Heat sink heat sink fin body plate Shape heat transfer medium 20 24 32 36 40 222 200950683 . Groove 220 top wall side wall 224 ❹
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