200949513 九、發明說明： .【發明所屬之技術領域】 本發明涉及一種保護蓋，尤指一種用於保護散 熱器之導熱膠不受污染之保護蓋。 【先前技術】 目前在電子元件散熱領域，通常在電子元件表 面加裝一散熱器，以便將其所產生之熱量及時排 出，為使散熱器與電子元件表面緊密接觸從而減小 介面熱阻，業者通常在散熱器與電子元件之接觸表 .面之間塗佈一層具有較好粘性和較高熱傳導率之 ’導熱膠，使得散熱器與發熱電子元件之表面接觸更 加緊密，從而增強熱傳導效果。然，由於導熱膠是 一種膏狀易污染性化學物質，是故有必要對導熱膠 進行保護。 習知保瘦蓋通常在散熱器頂部畫敷之k熱膠 ❹上對應具有一矩形之蓋體罩設該導熱膠。在〆定程 度上，習知技術可以有效地保護導熱膠。然而，當 導熱膠之面積接近甚至等於散熱器頂部之面積 時’習知之保δ蒦蓋結構一方面會刮傷並污染導熱 膠’另一方面由於蓋體面積過大造成受力時容易變 形，不能有效地保護導熱膠。 【發明内容】 一種保護蓋，用以保護一散熱器上之導熱膠， 該保護蓋與塗有導埶腹夕私& gg # / 守熟膠之散熱盗頂部對應並罩設 6 200949513 •:膠上方’其包括一樞體及由該框體延伸而 之蓋體，該框體貼合於該散熱器頂部周圍，誃 體與散熱器頂部之間形成一封閉之保護空間，： ί體包括一蓋板及複數由該蓋板之周緣傾斜向； ρ夕延伸並連接於該框體頂端緣之傾斜壁。 與S知技術相比，本發明之保護蓋之保護空間 由該框體頂端緣傾斜向上向内併攏延伸而成，即使 ❹該導熱膠塗敷於該散熱器整個頂面，也可以避免受 到污染，且，該保護蓋之整體結構可以承受較大之 壓力，從而有效地保護該導熱膠。 【實施方式】 請參閱圖1，為本發明一較佳實施例之保護蓋 10與一散熱器20及一扣具4〇之立體圖。該散熱 器20用於吸收、散發一發熱電子元件如中央處理 器（圖未示）所產生之熱量，該散熱器2〇之頂部與 ©該發熱電子元件接觸，一層導熱膠3〇塗敷在該散 熱器20之頂部，該保護蓋1〇罩設在該散熱器2〇 頂部以保護導熱膠30，該扣具4〇加設於該散熱器 20上，用以固定該散熱器2〇使其與該發熱電子元 件緊密接觸。 請一併參閱圖2，該保護蓋1〇整體上為一中 空殼體，採用塑膠或金屬材料等一體形成。該保護 蓋10包括一框體12、由該框體12底部水平向兩 侧延伸而出之二容置部14及從該框體12頂部向内 7 200949513 延伸而出之一蓋體16，該蓋體16包括一矩形蓋板 164及由該蓋板164四邊（未標示）分別傾斜向下 延伸出之四梯形傾斜壁162。該保護蓋1〇之框體 12為一由四豎直框邊122首屢鈿噹閉士 / p 體。該框體12在外形上與該散熱器2〇之頂部相一 致。二該容置部14呈矩形，分別由該框體I。兩相 對框邊122之底端中部向外延伸而出，該二容置部 工4内部中空並與該框體12相連通以供容置該扣具 〇 40之對應部分。該蓋體16之蓋板164為一薄平矩 形板，其對應位於該傾斜壁162之上方。該蓋板 164與該框邊122相垂直且平行於散熱器20之頂 面。四該傾斜壁16 2分別由該蓋板16 4之周緣傾斜 向下向外延伸而出並連接於該四該框邊122頂端 緣，從而在該蓋體16内部形成一半封閉之容置空 間 160。 上述散熱器20由導熱性能良好之金屬材料如 ®銘、銅等一體形成，其包括一基板22及從該基板 22底面垂直向下延伸且平行間隔排列之複數散熱 鑛片24。該基板22為一矩形板，其外形與該框體 12所圍成之空間（未標示）形狀相一致。該基板 22底面中部二散熱鰭片24之間形成一溝槽26，用 以放置該扣具40 ° 上述扣具40為線型扣具，由彈性金屬線一體 變折而成’其包括一抵壓部42及自該抵壓部42兩 8 200949513 端分別延伸出之二扣臂44，二該扣臂44之末端分 別形成一扣鉤46。該抵壓部42容置於該散熱器20 基板22底面上形成之溝槽26内，其長度略大於該 '溝槽26之長度’使得二該扣臂44分別位於該散熱 器20相對兩側。 請一 … 併參閱圖3，組裝時，所琢1示残蓋1 υ卓 設於該散熱器20頂部，其中，該保護蓋10框體 ❹ 12四框邊122分別與該散熱器20基板22四侧邊 (未標示）相貼合，該扣具4〇之抵壓部42對應置 於該散熱器20之溝槽26内，該抵壓部42兩端（未 標不）分別伸出該散熱器20之部分對應容置於該 保護蓋10之二容置部14内，該保護蓋1〇蓋體16 與該散熱器20基板22之間形成一封閉空間（未標 示）以供各納塗敷在該基板22頂面之導熱膠3〇。 另」為增加裝配該保護蓋之牢固性，可以直接在該 保護蓋1〇框體12夕iroA m 辞粗谁裝 之框邊1 22内側面塗覆粘膠加固 Ϊ 7钻接兮Μ，也可以在該框體12外侧面加設膠 "2接該保護蓋與該散熱器2〇。 本發明之保護蓋]〇 Μ 2〇 ΤΙ R 〇框體12貼合於該散熱器 川頂部周圍，安裝定 ^ 1 . , . ^ 口方便。又，該保護蓋10蓋 體16由框體12整個頂邱触 頁口1^貝斜向内延伸而出，即使 s亥導熱膠30塗敷於散轨 ,L 政熱15 20整個頂面，也可以有 效地避免導熱膠30受到污汰 口 触丄， 又幻汚染。另’該保護蓋10框 體12延伸出之容置部1 方面可以避免該扣具 9 200949513 I W鬆動甚至月 時可以作為受^ 落 40產生相對滑動時使該保護 另一方面在拆卸該保護蓋1〇 便於拆卸。 穌上所迷，本發 -σ |明專利 法 佳 明 中 :出專利申請。惟’以上所述者僅為=明^ 實施例，舉凡熟悉本案技蓺 不發月之秦 精神所作之等效修飾或變I 在爰依本赛 請專利範圍内。戈變化，皆應涵蓋於… Θ【圖式簡單說明】 圖1 熱器及一 係本發明一較估杳^ 7 t -U 平乂佳實施例中保讀 扣具之立體分解圖。 L蓋與 圖2 係圖 1中保護蓋 之倒置圖。 圖3係圖 合圖。 1中保護蓋與散熱器及扣具之立 【主要元件符號說明】 ❹保護蓋 10 框體 12 框邊 122 容置部 14 蓋體 16 容置空間 160 傾斜壁 162 蓋板 164 散熱器 20 基板 22 散熱鰭片 24 溝槽 26 導熱膠 30 扣具 40 抵壓部 42 扣臂 44 散 組 200949513 .扣鉤 46200949513 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a protective cover, and more particularly to a protective cover for protecting a thermal conductive adhesive of a heat sink from contamination. [Prior Art] At present, in the field of heat dissipation of electronic components, a heat sink is usually added to the surface of the electronic component to discharge the heat generated by the heat sink in time, so that the heat sink and the surface of the electronic component are in close contact to reduce the thermal resistance of the interface. A layer of 'thermally conductive paste' having a good viscosity and a high thermal conductivity is usually applied between the contact surface of the heat sink and the electronic component, so that the surface of the heat sink is more closely contacted with the surface of the heat-generating electronic component, thereby enhancing the heat conduction effect. However, since the thermal conductive adhesive is a paste-like and easily contaminating chemical, it is necessary to protect the thermal conductive adhesive. The thinner cover is usually provided on the top of the heat sink, and the thermal adhesive is covered on the cover with a rectangular cover. In a certain degree, conventional techniques can effectively protect the thermal conductive adhesive. However, when the area of the thermal conductive adhesive is close to or even equal to the area of the top of the heat sink, the conventionally protected δ 蒦 cover structure will scratch and contaminate the thermal conductive rubber on the one hand, and on the other hand, it is easily deformed due to excessive cover area. Effectively protect the thermal paste. SUMMARY OF THE INVENTION A protective cover is used to protect a thermal conductive adhesive on a heat sink, and the protective cover is corresponding to the top of the heat-dissipating smear coated with a smuggling smuggling & gg # / sufficiency glue and is covered 6 200949513 •: Above the glue, it comprises a pivot body and a cover body extending from the frame body. The frame body is fitted around the top of the heat sink, and a closed protection space is formed between the body and the top of the heat sink. The cover plate and the plurality of plates are inclined by the periphery of the cover plate; and the inclined wall is extended and connected to the top end edge of the frame body. Compared with the S-knowledge technology, the protection space of the protective cover of the present invention is formed by tilting the top end edge of the frame obliquely upward and inward, and even if the thermal conductive adhesive is applied to the entire top surface of the heat sink, the contamination can be avoided. Moreover, the overall structure of the protective cover can withstand a large pressure, thereby effectively protecting the thermal conductive adhesive. [Embodiment] Please refer to FIG. 1 , which is a perspective view of a protective cover 10 and a heat sink 20 and a buckle 4 为本 according to a preferred embodiment of the present invention. The heat sink 20 is configured to absorb and dissipate heat generated by a heat-generating electronic component such as a central processing unit (not shown). The top of the heat sink 2 is in contact with the heat-generating electronic component, and a layer of thermal conductive adhesive is applied to the heat-dissipating adhesive. The top of the heat sink 20 is disposed on the top of the heat sink 2 to protect the heat conductive adhesive 30. The buckle 4 is attached to the heat sink 20 for fixing the heat sink 2 It is in intimate contact with the heat generating electronic component. Referring to FIG. 2 together, the protective cover 1 is a hollow housing as a whole, and is integrally formed of plastic or metal material. The protective cover 10 includes a frame body 12, two receiving portions 14 extending from the bottom of the frame body 12 to the two sides, and a cover body 16 extending from the top of the frame body 12 to the inner wall 7 200949513. The cover body 16 includes a rectangular cover plate 164 and four trapezoidal inclined walls 162 extending obliquely downward from the four sides (not shown) of the cover plate 164. The frame 12 of the protective cover 1 is a plurality of vertical frame sides 122 that are repeatedly used as a closing/p body. The frame 12 is identical in shape to the top of the heat sink 2''. The accommodating portion 14 has a rectangular shape and is respectively formed by the frame 1. The two ends of the two ends of the frame edge 122 extend outwardly, and the two receiving portions 4 are hollow inside and communicate with the frame 12 for receiving corresponding portions of the buckle 40. The cover 164 of the cover 16 is a thin flat rectangular plate correspondingly located above the inclined wall 162. The cover 164 is perpendicular to the frame edge 122 and parallel to the top surface of the heat sink 20. The slanting walls 16 2 are respectively inclined downwardly and outwardly from the periphery of the cover 16 4 and are connected to the top edges of the four rims 122 to form a half-closed accommodating space 160 inside the cover 16 . . The heat sink 20 is integrally formed of a metal material such as ®, copper or the like having good thermal conductivity, and includes a substrate 22 and a plurality of heat dissipating fins 24 extending vertically downward from the bottom surface of the substrate 22 and arranged in parallel. The substrate 22 is a rectangular plate whose outer shape conforms to the shape of the space (not shown) enclosed by the frame 12. A groove 26 is formed between the bottom surface of the bottom surface of the substrate 22 and the heat dissipation fins 24 for placing the fastener 40°. The fastener 40 is a linear fastener, and the elastic metal wire is integrally folded into a package. The portion 42 and the two buckle arms 44 respectively extending from the ends of the pressing portions 42 and 8 , 200949513 respectively form a hook 46 at the ends of the buckle arms 44 . The pressing portion 42 is received in the groove 26 formed on the bottom surface of the substrate 22 of the heat sink 20, and the length thereof is slightly larger than the length of the 'groove 26' so that the two latching arms 44 are respectively located on opposite sides of the heat sink 20. . Please refer to FIG. 3, and when assembled, the first cover 1 is disposed on the top of the heat sink 20, wherein the protective cover 10 frame ❹ 12 four frame sides 122 and the heat sink 20 substrate 22 respectively The four side edges (not shown) are in contact with each other, and the pressing portion 42 of the buckle 4 is correspondingly disposed in the groove 26 of the heat sink 20, and the two ends (not labeled) of the pressing portion 42 respectively extend out A portion of the heat sink 20 is correspondingly received in the two receiving portions 14 of the protective cover 10. A protective space (not labeled) is formed between the cover body 16 and the heat sink 20 substrate 22 for each The thermal conductive adhesive 3 is coated on the top surface of the substrate 22. In addition, in order to increase the firmness of assembling the protective cover, it is possible to directly apply the adhesive reinforcement Ϊ 7 drill 兮Μ on the side of the frame 1 22 of the protective cover 1 〇 frame 12 An adhesive can be added to the outer side of the frame 12 to connect the protective cover to the heat sink 2 . The protective cover of the present invention] 〇 Μ 2〇 ΤΙ R 〇 frame 12 is attached around the top of the radiator, and the installation is fixed. Moreover, the cover 16 of the protective cover 10 extends obliquely inwardly from the entire top contact opening of the frame 12, even if the thermal conductive adhesive 30 is applied to the loose track, the entire top surface of the L-political heat 15 20 It can also effectively prevent the thermal adhesive 30 from being touched by the dirt mouth and illusory pollution. In addition, the cover portion 12 of the protective cover 10 can be prevented from being disassembled by the cover portion 9 200949513 IW can be loosened even when the moon is used as the receiving 40 to make the relative sliding. 1〇 Easy to disassemble. The fascination of Jesus, this hair - σ | Ming patent law Jiaming: Patent application. However, the above is only the example of the = Ming ^, and the equivalent modification or change I of the Qin spirit that is not familiar with the technology of this case is within the scope of the patent. The change of Ge should be covered by... Θ [Simple description of the drawing] Fig. 1 The heat exchanger and the system of the present invention are estimated to be 立体^ 7 t -U 乂 U 实施 实施 实施 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 L cover and Figure 2 are an inverted view of the protective cover in Figure 1. Figure 3 is a diagram of the figure. 1 Protective cover and heat sink and fasteners [Description of main components] ❹ Protective cover 10 Frame 12 Frame side 122 accommodating part 14 Cover body 16 accommodating space 160 Inclined wall 162 Cover 164 Heat sink 20 Substrate 22 Heat sink fins 24 Groove 26 Thermal paste 30 Buckle 40 Pressing part 42 Buckle arm 44 Group 200949513 . Buckle 46
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