JP3586666B2 - Electronic circuit package with radiator and manufacturing method thereof - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit package with a radiator, and more particularly to a structure for radiating heat generated by a heat-generating component such as an integrated circuit through a radiator, and interposing thermal conductive grease at a contact surface between the heating element and the radiator. The present invention relates to an electronic circuit package having a structure.
[0002]
[Prior art]
Conventionally, in this type of package, when the heat-generating component and the radiator are in direct contact with each other, there is a problem that the contact area is reduced due to unevenness of the contact surface and thermal conductivity is deteriorated. Fluid heat-conductive grease is applied to the sheet so as to make close contact with each other, or a flexible solid sheet called a heat-conductive sheet or a heat-dissipating sheet is interposed to make close contact.
[0003]
The method using heat conductive grease has extremely good close contact and good heat conductivity because grease is more flexible than a heat conductive sheet or the like. In particular, when a plurality of heat-generating components having a height difference are attached to one radiator to radiate heat, there is a feature that the height difference of the components can be absorbed with flexibility. On the other hand, however, the workability when applying grease is poor due to the fluidity of the grease, and there is a problem that the grease protrudes to an excessive part. There is a drawback that it is difficult to remove such as soiling.
[0004]
As a method of improving such a defect, for example, there is a method described in JP-A-2001-77569. FIG. 4 is a cross-sectional view showing the conventional notebook computer.
[0005]
In FIG. 4, the CPU 41 is fixed on a wiring board 42, and the wiring board 42 is fixed to a mounting boss 44 provided on a lower housing 43 by screws 5. The upper part of the CPU 41 is covered by a keyboard 46 . Keyboard substrate 47 is a metal plate of aluminum or the like, it can be utilized as a heat sink. Thermally conductive grease 48 is filled between the CPU41 is an exothermic body and the keyboard substrate 4 7. However, the surface of the CPU 41 is partitioned by a film-like sheet 50, and the CPU 41 has a structure in which the CPU 41 does not directly contact the heat conductive grease 48. For this reason, when the heat radiating plate 47 is removed, the heat conductive grease 48 is not exposed because the heat generating body 41 and the sheet 50 are separated. Therefore, in the case of inspection, repair, and the like, the heat conductive grease 48 does not stain hands and clothes, and the workability is good.
[0006]
On the other hand, the method using a heat conductive sheet or a heat radiating sheet does not have the above-mentioned drawbacks as compared with the method using heat conductive grease, but the sheet is flexible, but has a fluidity because it is solid. Adhesion and followability are inferior to grease, and the difference in height that can be absorbed when there is a difference in height between the heat generating components is small. Alternatively, since a pressing force is applied to the heat-generating component, there is a disadvantage that the terminal portion of the heat-generating component is easily damaged .
[0007]
[Problems to be solved by the invention]
As described above, in the conventional example, since the heat conductive grease and the surface of the heating element are separated by a sheet, if this sheet is made larger than the heating element, excess grease protrudes from the heating element when applying grease. The problem of getting lost is gone. In addition, the above-mentioned problem is eliminated during inspection and repair without soiling the hands. However, in order to cover the surface of the heating element with a sheet, it is necessary to attach the sheet to a printed board using an adhesive or the like, and it is particularly troublesome to attach the sheet to a portion of the printed board where parts are concentrated. There is a problem. In addition, the size of the sheet may not be sufficiently large due to the mounting relationship with other components, and there is a problem that it cannot be said that a sufficient measure is taken against grease protrusion.
Accordingly, an object of the present invention is to provide an electronic circuit package with a radiator in which the handling property of heat conductive grease is improved, and a method of manufacturing the same.
[0008]
[Means for Solving the Problems]
This onset Ming, in order to achieve the above object, the heat generating components (e.g., integrated circuits) and a printed board having electronic components mounted containing, heat conduction to the heating part of the surface for dissipating the heat generated in the heat generating component A radiator having a radiator closely attached via the conductive grease,
The mounting part of the heat generating component of the printed board is limitedly covered with a tubular thin film sheet covering the printed board.
[0010]
Further, the method for manufacturing an electronic package circuit with a radiator according to the present invention,
By inserting a printed board on which electronic components including a heat-generating component (for example, an integrated circuit) are mounted through a tubular thin-film sheet, a mounting portion of the heat-generating component is limited to be covered with the thin-film sheet,
The peripheral edges of both openings of the tubular thin film sheet are respectively sealed, and the air inside the sealed thin film sheet is sucked and contracted,
A heat conductive grease having a predetermined thickness is applied on the thin film sheet in a mounting portion of the heat generating component, and a radiator is mounted on the heat conductive grease by a predetermined mounting structure.
[0013]
Further, the radiator with electronic package circuit and a method of manufacturing the above arrangement, the tubular membrane sheet, the adhesive applied to the peripheral edge in the side of both the openings and forming a tubular shape, said printed circuit board It is preferable to fix (enclose) the front and back surfaces at a position covering the mounting portion of the heat generating component.
[0014]
The thin film sheet may have a thickness of 5 to 10 μm and may be made of a silicone material.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1A and 1B are an exploded perspective view and a cross-sectional view showing a first embodiment of an electronic circuit package with a radiator according to the present invention. 2A to 2D are perspective views showing a method of manufacturing the electronic circuit package with a radiator in FIG. 1. FIGS. 3A and 3B are an exploded perspective view and a sectional view showing an electronic circuit package with a radiator according to a second embodiment of the present invention.
[0016]
First, the configuration of the first embodiment will be described with reference to FIG. This embodiment is an example of a package in which an entire printed board on which an integrated circuit, a capacitor, and the like, which are heat-generating components, are mounted is covered with a bag-shaped thin film sheet. That is, a printed board 11 on which nine integrated circuits 111, three capacitors 113, and connection terminals 112 are mounted, and a thin film sheet 13 that encloses the printed board 11 in a state where the whole except for the connection terminals 112 is sealed. And heat conductive grease 14 (light black portion) applied on the thin film sheet 13 on the surface portion of the nine integrated circuits 111 with a predetermined thickness, and the radiator 12 mounted thereon. ing.
[0017]
Next, a method of manufacturing the package will be described with reference to FIG.
[0018]
6A, the printed circuit board 11 mounted with the six integrated circuits 111 and the connection terminals 112 and the like is put into the bag-like thin film sheet 13 through the opening 131. Thin film sheet 13 has a terminal hole 132 of the portion corresponding to the opening 131 and the connection terminal 111, the inner periphery of the opening 131 and the terminal hole 132 roughness steering Me adhesive is applied.
[0019]
In (b), the opening 131 of the thin film sheet 13 in which the printed board 13 is inserted and the peripheral edge of the terminal hole 132 to which the adhesive is applied are pressed and sealed. Then, the air inside is contracted by suction. The thin film sheet 13 is attracted to the surface of the integrated circuit or the surface of the printed board.
[0020]
In (c), the heat conductive grease 14 is applied with a predetermined thickness on the thin film sheet where the integrated circuit 111 is mounted.
[0021]
In (d), the radiator 12 is attached to the printed board 11 at a predetermined height after applying heat conductive grease 14 by inserting screws into holes on four sides thereof. Thus, the assembly operation is completed, and the package shown in FIG. 1 is completed.
[0022]
Next, a second embodiment will be described with reference to FIG. The present embodiment is an example of a package in which an integrated circuit as a heat-generating component and other electric components are mixed and only a part of the integrated circuit is limited by a printed board and is wrapped by a thin film sheet. The printed circuit board 21 on which the six integrated circuits 211, the three capacitors 214, the two light emitting diode assemblies 213, and the connection terminals 212 are mounted, and the entire printed circuit board on which the six integrated circuits 211 are mounted are described. A thin film sheet 23 to be encapsulated in a sealed state, a heat conductive grease 24 (light black portion) applied to a predetermined thickness on the thin film sheet 23 of the six integrated circuits 211, And a radiator 22 mounted on the conductive grease 24.
[0023]
The procedure for assembling this package is substantially the same as that of the previous embodiment described with reference to FIG. 2, except that the portion of the printed board limited to the heat-generating components is covered with a thin film sheet. That is, the thin film sheet 23 is a cylindrical thin film sheet having openings at both ends, and an adhesive is applied in advance to the inside of the periphery of both the openings. Then, the printed board 21 is inserted into both openings of the thin film sheet 23 to a predetermined position, and at the positions, the peripheral edges of both openings where the adhesive is applied are pressed against the front and back surfaces of the printed board, respectively, and sealed. Then, the inside air is sucked and sealed.
[0024]
In the first embodiment described above, not only the integrated circuit as the heat-generating component but also the general component of the capacitor is covered with the thin-film sheet on the entire printed board, so that the environment resistance of the package is enhanced. There is. This environmental resistance means that the package is isolated from bad environments such as wind, rain, moisture, dust, corrosive gas, etc. when the package is used by being housed in an outdoor eaves or a simple cabinet installed outdoors. It is a function to protect. That is, by enclosing the printed circuit board on which the electronic components vulnerable to a bad environment are mounted with the thin film sheet, the environmental resistance can be enhanced, and the reliability and life can be secured.
[0025]
Further, the second embodiment is applied to a case where such environmental resistance is not particularly required and the number of heat-generating components is extremely small.
[0026]
In this embodiment, since the thin film sheet uses an extremely thin silicone film having a thickness of 5 to 10 μm, the fluidity of the heat conductive grease is not impaired and the close contact between the heat generating component and the radiator is not affected. And high thermal conductivity is obtained.
[0027]
The adhesive to be applied to the thin film sheet may be one that adheres by pressing or heat, but this adhesive uses a release agent to remove the adhesive part when removing the thin film sheet during inspection and repair. An adhesive that can be easily peeled off is used.
[0028]
【The invention's effect】
As described above , according to the present invention, it is possible to provide an electronic circuit package with a radiator and a method for manufacturing the electronic circuit package, in which the handling property of the thermally conductive grease is improved. That is, according to the present invention, when applying the heat conductive grease, the grease protrudes to the terminal portion of the heat generating component itself or the adjacent component, which may have a bad effect, as compared with the conventional method in which only the heat generating component is separated by the sheet. Is completely eliminated, and the seat mounting operation is simplified.
[Brief description of the drawings]
FIG. 1A is an exploded perspective view showing a first embodiment of the present invention, and FIG.
2A to 2D are perspective views showing a method for manufacturing the electronic circuit package with a radiator in FIG. 1;
FIGS. 3A and 3B are an exploded perspective view and a cross-sectional view showing a second embodiment of the present invention.
FIG. 4 is a sectional view showing a conventional example.
[Explanation of symbols]
11, 21 Printed board 12, 22 Radiator 13, 23 Thin film sheet 14, 24 Thermal conductive grease 111, 211 Integrated circuit 112, 212 Connection terminal 213 Light emitting diode assembly 113, 214 Capacitor 131 Opening 132 Terminal hole

Claims (7)

Radiator having a heat-generating component electronic component comprising a are mounted printed circuit board, and a radiator in which the mounted so closely to through the thermal conductive grease on the surface of the heat-generating component for dissipating the heat generated in the heat generating component In the electronic circuit package with instrument,
The mounting portion of the heat generating components, the electronic circuit package with a radiator characterized by limiting it <br/> being encapsulated in tubular thin-film sheet covering the printed board of the printed circuit board. The tubular thin-film sheet is fixed on the front and back surfaces of the printed board at a position covering the mounting part of the heat-generating component by an adhesive applied to the inside of the periphery of both openings forming the tubular shape.
The electronic circuit package with a radiator according to claim 1, wherein: The heat generating component is at least an integrated circuit.
The electronic circuit package with a radiator according to claim 1 or 2, wherein: The thin film sheet is a silicone material having a thickness of 5 to 10 μm.
The electronic circuit package with a radiator according to any one of claims 1 to 3, characterized in that: By inserting a printed board on which electronic components including heat-generating components are mounted, through a thin film sheet having a tubular shape, a mounting portion of the heat-generating components is limited to be covered with the thin film sheet,
The peripheral edges of both openings of the tubular thin film sheet are respectively sealed, and the air inside the sealed thin film sheet is sucked and contracted ,
Radiating said on the thin film sheet in the implementation section of the heat-generating component, as well as applying the heat conductive grease at a predetermined thickness, and wherein the attaching the predetermined mounting structure radiator on the heat conductive grease Manufacturing method of electronic package circuit with instrument. The peripheral portions of both openings of the cylindrical thin film sheet are sealed on the front and back surfaces of the printed board at a position covering the mounting portion of the heat-generating component with an adhesive applied to the inside of the peripheral portion. The method for manufacturing an electronic circuit package with a radiator according to claim 5, wherein: The heat generating component is at least an integrated circuit.
The method for manufacturing an electronic circuit package with a radiator according to claim 5 or 6, wherein:

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