M264828 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱裝置，特別係一種對發熱電子元件進行冷卻用 之散熱裝置。 【先前技術】 隨著電子資訊業不斷發展，電子元件（尤為中央處理器）運行頻率及 速度在不斷提升。然而，電子元件産生之熱量隨之增多，溫度亦不斷升高， 嚴重威脅著電子元件運行時之性能，為確保電子元件能正常運作，通常採 用政熱器將電子元件所産生之大量熱量及時排出。其中，為使散熱器與電 子元件表面充分緊密接觸，以減小介面熱阻，通常需要散熱器底面保持光 滑平整，但無論其底面如何光滑平整，實際上其與電子元件大部分未接觸， 其間存在間隙，因此導致電子元件與散熱器間存在較大介面熱阻，散熱器 性能得不到有效的發揮。為減小散熱器與電子元件間介面熱阻，業者通常 於散熱器與電子元件間塗佈一層導熱介質，其一方面可填補間隙，另一方 面，導熱介質通常具有較好的粘性和較高熱傳導率，可使散熱器與發熱電 子元件接觸更加緊密，從而可增強熱傳導效果。 但如此便減-問題，每安裝散熱n前均需將導齡質塗佈於散熱器 底面，由於導熱介質係一種膏狀易污染性化學物質，使其按一定厚度均勻 平整地塗佈於散熱器底面與電子元件接觸之區域時，該操作需要非常小 心，否則將散熱器安裝至電子元件上時該導熱介質會造成對其他元件之污 染，在組裝電腦過程中實施該項猶非常不便，因此，業者通常於散熱器 成品上預先塗佈導熱介質，以減小組裝電腦過程之_。但彳㈣顯，以上 M264828 方式將導致另一問題：在散熱器運輸過程中該導熱介質極易造成對周圍埽 境之污染、受周圍物體之污染或被刮破，因此，必須對其運輸過程中進行 必要之保護。 為克服上述問題，業者推出多種對散熱器上之導熱介質進行保護用之 裝置，如使用一塑膠膜貼設於塗設有導熱介質之散熱器底面上，對其導熱 介質進行保遵，遠種方法雖然能夠防止導熱介質與周圍環境互相污染，惟， 該塑膠膜直接與導熱介質相貼設，在運輸等過程中導熱介質極易被周圍環 境之外力擠壓變形或被刮破。又如一種導熱介質保護蓋，該保護蓋係由塑 膠製成之一種帽狀體，其中央對應塗設有導熱介質之散熱器底面位置向外 凸出形成一腔體，該腔體邊緣向周圍延伸形成環形接合面，通過該接合面 使該保護蓋粘貼於散熱器底面，並使該腔體非接觸的蓋設於該導熱介質 上。該種保護蓋雖然能夠一定程度地防止導熱介質被擠壓變形或刮破，但， 由於該保護蓋係粘貼於散熱器底面，使得粘貼或拆除時較為麻煩，另外， 由於粘貼時使用之粘接劑等物體遺留在散熱器底面上，還需要清除等工 作，使得安裝散熱器於電子元件時之操作過於複雜不便。 後來業界出現一種不需要粘貼之導熱介質保護蓋。該保護蓋具有一底 面，該底面中央對應塗設有導熱介質之散熱器底面位置向外凸出形成一腔 體，該底面周Μ直延伸形成有側板。該側板可與散熱器基座之側緣干涉 配合而將該保護蓋固定於散熱器底面上，使該腔體非接觸的蓋設於該導熱 介質上。通過干涉配合安裝保護蓋於散熱器底面時，在運輸過程中該保護 蓋因外力而易脫落。 【新型内容】 M264828 創作之目的在於提供―種具有能有效保護導熱介質之保護體的散妖 裝置。 I作政熱H包括_散熱器、塗佈於散熱器上之導熱介質、位於 散熱器上之扣具及1轉護導熱介質之保護體，該扣具於散熱器兩側設 有才#該保4體具有-容置導熱介f之容室，該保護體與扣具之扣臂相 卡扣。 本創作相比先喊術具有如τ優點：本創作健裝置之髓體與扣具 之扣#相卡扣’故保護體在運輸或操作過程中不易脫落。另外，安裝散熱 益之則整個過程中將扣具_直固定於散熱器上，而安裝散熱器時只拆除保 遵體即可’運輸和安I過料比較雜快捷。 【實施方式】 #參閱第-圖及第二圖所示，本創作散熱裝置包括—散熱器1〇、固定 違政熱器1G於巾央處理n等電子元件（@未示）上之扣具如、塗佈於散熱 裔10底面對應電子元件位置之導熱介質30及一導熱介質3〇之保護體4〇， 該保濩體40安裝於散熱器1〇底面，對其導熱介質3〇予以保護。該散熱器 1〇具有一基座12及設置於基座12上之複數散熱鰭片14，該扣具2〇設置 於散熱器10上，其具有於散熱器10相對側邊向下延伸之二扣臂22，該扣 $ 22末端設有扣孔24。 該保護體40具有一底板42,該底板42中央對應塗設有導熱介質30之 散熱器10底面位置向外延伸凸出形成一腔體44，於底板42之相對側緣中 央分別斜向上向外延伸一段距離後進一步向下彎折延伸形成一卡勾48，該 卡勾48與底板42周緣垂直向上延伸，從而於底板42上形成側板46,該卡 M264828 勾48可與β玄扣具2〇之扣臂22相扣合。其中，該側板*根據所需情況， 可在底板42周緣之一部分或整個周緣形成。 該保護體40安裝於散熱器20底面時，其側板46套設於散熱器ι〇基 座12側緣，且側板46内側面與散熱器1〇基座n側緣相貼靠，使該腔體 44非接觸的蓋設於該導熱介質3〇上。該扣具2〇扣臂22之扣孔％勾扣於 保護體4〇之卡勾48上，從而既保護導熱介質3〇又防止保護體4〇於運輸 過程中脫離散熱H 10，啊使扣具2Q與健^ 1()預先組裝在—起，運輸 過程中扣具20不會散落或單獨放置。 該保護體40之腔體44 i要係提供可使導熱介質3〇非接觸的隔離於周 圍環境之容室，故該容室可由_使導熱介f 3Q非接觸的隔離於周圍環境 之任何方式或雜軸，如該賴觀絲面積小於散熱^ 1Q之基座12 底面面積，_底板整個周緣稍微斜向上向外延伸形成側板，從而該保護 體套叹於散熱ϋ 1G之基座12上時，其底板；f：睛基座12底面具有_定間距， 而該保護體與散熱器10之基座12底面圍成一錐形容室，使導熱介質3〇非 接觸的隔離於周圍環境。 該保護體40之卡勾48主要係提供可與扣具2〇之扣孔24相扣合之卡 扣結構，故該卡勾48及扣孔24可由任何能夠相扣合之卡扣結構置換，如 該卡勾48由一卡孔置換，而相應地該扣孔24由一卡勾置換等。 綜上所述，本創作符合新型專利要件，爰依法提出專利申請。惟，以 上所述者僅為本創作之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本 創作精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 M264828 第一圖係本創作散熱裝置在安裝前之立體分解圖 第二圖係第一圖之立體組合圖。 【主要元件符號說明】 46 48 散熱器 10 散熱鰭片 14 扣臂 22 導熱介質 30 底板 42 側板 基座 12 扣具 20 扣孔 24 保護體 40 腔体 44 卡勾M264828 8. Description of the new type: [Technical field to which the new type belongs] This creation relates to a heat sink, and in particular to a heat sink for cooling heating electronic components. [Previous technology] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially central processing units) are constantly increasing. However, the heat generated by electronic components increases and the temperature continues to increase, which seriously threatens the performance of electronic components during operation. In order to ensure the normal operation of electronic components, a large amount of heat generated by electronic components is usually discharged in a timely manner. . Among them, in order to make the heat sink sufficiently close to the surface of the electronic component to reduce the interface thermal resistance, the bottom surface of the heat sink is usually required to be smooth and flat, but no matter how smooth and flat the bottom surface is, it is actually not in contact with most of the electronic components. There is a gap, which results in a large interface thermal resistance between the electronic component and the heat sink, and the performance of the heat sink cannot be effectively exerted. In order to reduce the thermal resistance of the interface between the heat sink and the electronic component, the industry usually applies a layer of heat conductive medium between the heat sink and the electronic component. On the one hand, it can fill the gap, on the other hand, the heat conductive medium usually has better viscosity and higher Thermal conductivity can make the heat sink contact the heating electronic components more closely, which can enhance the thermal conductivity. However, this reduces the problem. Before installing the heat sink n, the guide material must be coated on the bottom surface of the heat sink. Since the heat conductive medium is a paste-like susceptible chemical substance, it is evenly and evenly coated on the heat sink according to a certain thickness. When the bottom surface of the device is in contact with electronic components, this operation needs to be very careful. Otherwise, the heat conductive medium will cause contamination of other components when the heat sink is mounted on the electronic components. It is very inconvenient to implement this during the process of assembling a computer, so In order to reduce the process of assembling a computer, the industry usually applies a thermally conductive medium in advance on the finished radiator. However, it is obvious that the above M264828 method will cause another problem: during the transportation of the radiator, the heat conductive medium is likely to cause pollution to the surrounding environment, pollution or scratches from surrounding objects, so it must be transported. Necessary protection. In order to overcome the above problems, the industry has introduced a variety of devices for protecting the heat conducting medium on the heat sink. For example, a plastic film is attached to the bottom surface of the heat sink coated with the heat conducting medium, and its heat conducting medium is guaranteed. Although the method can prevent the heat conducting medium and the surrounding environment from contaminating each other, the plastic film is directly attached to the heat conducting medium, and the heat conducting medium is easily deformed or scratched by external forces during the transportation process. Another example is a thermally conductive medium protection cover. The protective cover is a cap-shaped body made of plastic, and the center of the heat sink is coated with a thermally conductive medium on the bottom surface of the radiator to project outward to form a cavity. The edge of the cavity faces the surroundings. Extending to form a ring-shaped joint surface, the protective cover is adhered to the bottom surface of the heat sink through the joint surface, and the non-contact cover of the cavity is provided on the heat conductive medium. Although this kind of protective cover can prevent the thermal conductive medium from being deformed or scratched to some extent, the protective cover is affixed to the bottom surface of the heat sink, which makes it more troublesome to apply or remove. In addition, due to the bonding used during the application, Objects such as agents are left on the bottom surface of the heat sink, and cleaning and other work are needed, which makes the operation of installing the heat sink on electronic components too complicated and inconvenient. Later in the industry, a thermally conductive medium protective cover that did not need to be pasted appeared. The protective cover has a bottom surface, the center of the bottom surface corresponding to the position of the bottom surface of the radiator coated with the heat-conducting medium is protruded outward to form a cavity, and the bottom surface extends straight to form a side plate. The side plate can be interference-fitted with the side edge of the heat sink base to fix the protective cover on the bottom surface of the heat sink, so that the non-contact cover of the cavity is disposed on the heat conductive medium. When the protective cover is installed on the bottom surface of the radiator by interference fit, the protective cover is liable to fall off during transportation due to external forces. [New content] The purpose of the creation of M264828 is to provide-a demon device with a protective body that can effectively protect the heat-conducting medium. The working heat includes a radiator, a thermally conductive medium coated on the radiator, a fastener located on the radiator, and a protective body that protects the thermal medium. The fastener is provided on both sides of the radiator. The body 4 has a container chamber for accommodating the thermally conductive medium f, and the protective body is buckled with the arm of the fastener. Compared with the first shouting technique, this creation has advantages such as τ: the body of the creative device and the buckle # 相 卡扣 ’of the device, so the protective body is not easy to fall off during transportation or operation. In addition, during the installation of heat dissipation, the buckle is directly fixed to the radiator during the entire process, and only the safety body is removed when installing the radiator. [Embodiment] #Refer to the second figure and the second figure, this creative heat dissipation device includes-a heat sink 10, a fixed heat sink 1G on the central processing n and other electronic components (@ 未 示) buckles For example, the thermal conductive medium 30 coated on the bottom surface of the heat sink 10 corresponding to the position of the electronic component and a protective body 40 of the thermal conductive medium 30 are installed on the bottom surface of the radiator 10 to protect the thermal conductive medium 30. . The heat sink 10 has a base 12 and a plurality of heat-dissipating fins 14 disposed on the base 12. The buckle 20 is disposed on the heat sink 10, and has two extending downwards from opposite sides of the heat sink 10 Buckle arm 22, buckle hole 24 is provided at the end of the buckle. The protective body 40 has a bottom plate 42. The center of the bottom plate 42 corresponding to the bottom surface of the heat sink 10 coated with the heat-conducting medium 30 extends outward to protrude to form a cavity 44. The center of the opposite side edge of the bottom plate 42 is obliquely upward and outward. After extending a certain distance, it is further bent downward to form a hook 48 that extends vertically upwards from the periphery of the bottom plate 42 to form a side plate 46 on the bottom plate 42. The card M264828 hook 48 can be connected to the β-xuan buckle 2〇 The buckle arm 22 is engaged with each other. Wherein, the side plate * may be formed on a part of the periphery of the bottom plate 42 or the entire periphery as required. When the protection body 40 is installed on the bottom surface of the radiator 20, its side plate 46 is sleeved on the side edge of the heat sink 12 and the inner side surface of the side plate 46 is in abutment with the side edge of the heat sink 10 base n, so that the cavity A non-contact cover of the body 44 is disposed on the thermally conductive medium 30. The buckle 20% of the buckle arm 22 of the buckle arm 22 is hooked on the hook 48 of the protective body 40, thereby protecting both the thermally conductive medium 30 and the protective body 40 from dissipating heat during transportation. Tool 2Q and Jian ^ 1 () are pre-assembled together. The buckle 20 will not be scattered or placed separately during transportation. The cavity 44 i of the protection body 40 is to provide a container that can isolate the thermally conductive medium 30 from the surrounding environment in a non-contact manner. Therefore, the container can be isolated from the surrounding environment by any means that makes the thermally conductive medium f 3Q non-contact. Or the miscellaneous axis, if the area of the wire is smaller than the area of the bottom surface of the base 12 that dissipates heat ^ 1Q, _ the entire periphery of the base plate extends slightly obliquely upwards and outwards to form a side plate, so that the protective cover sighs on the base 12 of the heat dissipation ϋ 1G F: the bottom surface of the eye base 12 has a fixed distance, and the protective body and the bottom surface of the base 12 of the heat sink 10 form a cone-shaped chamber, so that the thermally conductive medium 30 is non-contactly isolated from the surrounding environment. The hook 48 of the protective body 40 mainly provides a buckle structure that can be engaged with the buckle hole 24 of the fastener 20, so the hook 48 and the buckle hole 24 can be replaced by any buckle structure that can be engaged with each other. For example, the hook 48 is replaced by a hook hole, and correspondingly the buckle hole 24 is replaced by a hook. In summary, this creation complies with the requirements for new patents, and a patent application is filed in accordance with the law. However, the above is only a preferred embodiment of this creation. For example, those who are familiar with the skills of this case and equivalent modifications or changes based on the spirit of this creation should be covered by the following patent applications. [Schematic description] M264828 The first picture is a three-dimensional exploded view of the original heat sink before installation. The second picture is a three-dimensional combined view of the first picture. [Description of main component symbols] 46 48 Radiator 10 Radiating fins 14 Buckle arm 22 Thermally conductive medium 30 Base plate 42 Side plate Base 12 Buckle 20 Buckle hole 24 Protective body 40 Cavity 44 Hook