M392990 五、新型說明： 【新型所屬之技術領域】 熱模組 本創作係-種關於散熱模組，尤其是一種具有節省工 時及節省縣之效果，_又有效咖雛絲效能之散 【先前技術】M392990 V. New description: [New technical field] Thermal module This is a kind of cooling module, especially one that has the effect of saving man-hours and saving counties. technology】
現今電子裝置（如筆記型電腦）内之電子元件（如中央 處理器）於玉作狀態下常產生大量熱能，而造成該電子元件 溫度之上升，如果沒㈣當的賴，將使該電子元件發生 過熱現象’造祕運料敎，甚至導致整個電子裝置發 生工作停止或當機的現象，爾著各種電子元件㈣度不 斷提升’錢產生之歸亦稍提高，耻朗於各種電 子裝置之散熱模組即曰漸重要。In today's electronic devices (such as notebook computers), electronic components (such as central processing units) often generate a large amount of thermal energy in the state of jade, which causes the temperature of the electronic component to rise. If not, the electronic components will be made. Overheating occurs. 'There is a problem in the production of secret materials, and even the phenomenon that the whole electronic device stops working or crashes. The electronic components (four) are constantly improving. The return of money is also slightly improved, and the heat dissipation of various electronic devices is shame. Modules are getting more and more important.
按’習知之散熱模組結構其結合方式大致上有兩種形 式：-為緊配方式及焊接方式；請參閱第1A圖示，係習知 採用緊配之散熱模組1，其包含—熱管11、-散熱器10及 基座13 ’其巾散熱$ 1〇具有複數散細片1Q1，該等散 熱‘韓片101係彼此堆疊構成所述散熱器1〇 ,且該等散熱轉 片101開設有-洞孔103，用以供對應熱管^ —端穿接固 定’前述熱管11的另-端則貫穿基座13相固定—起，以 構成前述散熱模組1。 當散熱模組1組裝時，該熱管11的-端必須――的穿 入每一另散熱鰭片101之洞孔103,直至所述熱管U的二 端&伸在最後-個散熱則皿之洞孔⑽外，才使熱技 11與散熱器10相固定一起。 、g 因此，由上述可知，習知緊配技術在組裝過程中，都 需經過一繁雜的組裝步驟，即須散熱則101需一片—片 的牙入雜官11的—端上，直接導致組裝的卫時增加， 此外又因雖巾鰭片之長度肢加工機台之影響而受限造 成整體組裝無法達到簡便。 再復參閱第IB、1C圖所示，係為習知以焊接方式之散 熱模組1 ’其包含—散熱器10、一熱管11及一基座13， 該散熱器ίο具有複數散熱韓片謝，該等散熱鰭片ι〇ι上 開設有-洞孔103，_孔1Q3具有—齡孔_用以收 容所述熱管11，及-銲料孔順祕容置料轉料15, 該銲料孔1032位於熱管孔1031上方，亦即銲料孔1〇32形 成在熱管孔1031上方且彼此相連通，而前述熱管η的一 ‘貝牙固疋在相對該等散熱鰭片1〇1的熱管孔1⑽1内，其 另一知則貝穿基座13相固定一起’以構成所述散熱模組p 所以當散熱模組1組裝時，預先將銲料15及熱管u 分別置於散熱鰭片101的銲料孔1032及熱管孔1〇31内（參 第1B圖示）’或是利用治具將膏狀之焊料15置於散熱鰭片 101的銲料孔1032及熱管孔1031内（圖中未示出），完成 散熱模組1的預組裝，然後加熱前述預組裝後的散熱模組 1 ’使#料孔1032内的銲料15融化，沿該銲料孔1⑽2的 孔壁流經銲料孔1032及熱管孔1031相接觸位置後到達熱 ΐ孔1031，以填充於熱管11與該等散熱鰭片π〗間的空 M392990 隙内’並待冷卻後’使熱管u與散_片ι〇ι姻定 (參第1C、1D圖示）。 雖習知之散熱模組i可達到散熱效果，然而在實際电 裝時=，因需麟述肋额的散熱難丨做-加熱程序 後，最後還需-冷卻程序才能製出所述散熱模組卜所以 使得造成整體組裝程序無法達到簡便，進而亦提高成本及 加工時間。 另者’由於融炫的銲料15流經銲料孔1032絲管孔 p的接觸位置時’容易堆積在前述接觸位置而形成附著 散熱則101上的顿珠，會導致散_ 不錢，進而影響使用者購買意願降低。 紐卜姚 是以’要如何解決上述習用之問題與缺失，即為本案之 在者从從事此行業之相關廠商所亟欲研究改善之方向所 【新型内容】 提供魏’為有效解決上述之問題，本創作之主要目的在 得有:Ϊ至少—熱管與—散熱器以緊配結合—體的設計， 于效郎省成本之散熱模組。 組。本創作之次要目的在提供一種具有降低工時之散熱模 ，匐作之次要目的在提供一種具有絕佳散熱效能之散 熬ί才具組。 至小2達上逑目的，本創作係提出一種散熱模組，其包括： 夕…、官具有一吸熱端及從遠離該吸熱端方向延伸一擴 M392990 熱端j及-散熱器具有-散熱面形成有複數散熱鰭片，及 相反該散熱面的-傳導面，該傳導面凹設有一受接槽相對 緊配該擴熱端並結合一體，且該擴熱端平切該傳導面，藉 由本創作熱管與散熱器緊配結合一體的設計，俾使有效^ 低工時及節省製程及成本，進而又有效達到絕佳之散熱效 • 能者。 【實施方式】 • 本創作之上述目的及其結構與功能上的特性，將依據所附 圖式之較佳實施例予以說明。 明-併參閲第2、3圖所示，本創作係一種散埶模也2，. : 縣創作之較佳實施财，其包括至少-熱管21及一散熱 : :，其中s亥熱官21具有一吸熱端211及一擴熱端212 ㈣離該吸熱端211方向延伸構成，透過前述吸熱端211 將吸收的熱量迅速傳導至擴熱端212。 别述散熱器23具有一散熱基座230，該ft熱基座230 » ^有-散熱面23卜及相反該散熱面231的一傳導面微， :述散熱面231係形成在該散熱基座23〇的一端面，且該 放熱面231上形成有複數散熱韓片234，前述傳導面 則升/成在4散熱基座230的另一端面，且該傳導面挪凹 。又有-叉接槽235(參第4圖示），該受接槽235相對緊配 擴熱端212並結合-體，亦即所述熱管21的擴熱端212係 '緊配方式，與散熱為23的受接槽235結合成-體，以構 成剛述政熱模組2 ’且前述擴熱端212平切該傳導面232。 如第4、5圖所tf ’前述受接槽235具有-封閉側2351 6 M392990 及一開放側2352相對該封閉側2351，且該封閉側2351與 開放側2352共同界定所述受接槽235 ;而該擴熱端212具 有一平切面2121，及一非平切面2122從該平切面212丨軸 向延伸構成’且該平切面2121係切齊所述開放側2352及 傳導面232 ’該非平切面2122則與前述受接槽235相緊密 合一起。According to the conventional heat dissipation module structure, there are basically two forms of combination: - a tight fitting method and a welding method; see the 1A illustration, which is a well-known heat dissipation module 1 including a heat pipe 11. The heat sink 10 and the pedestal 13 ′ have a heat dissipation amount of 1 1, and the heat dissipation 'Korean 101 series are stacked on each other to form the heat sink 1 〇, and the heat dissipation fins 101 are opened. The hole 103 is provided for the corresponding heat pipe to be fixedly connected to the other end of the heat pipe 11 to be fixed through the base 13 to form the heat dissipation module 1. When the heat dissipation module 1 is assembled, the end of the heat pipe 11 must penetrate into the hole 103 of each of the other heat dissipation fins 101 until the two ends of the heat pipe U are extended to the last heat sink. Outside the hole (10), the thermal technology 11 is fixed together with the heat sink 10. Therefore, it can be seen from the above that the conventional tight fitting technique requires a complicated assembly step in the assembly process, that is, the heat is required to be 101. The piece of the tooth is inserted into the end of the miscellaneous 11 and directly leads to assembly. The increase in the number of guards is also limited by the influence of the length of the arm fin processing machine. Referring to Figures IB and 1C again, it is a conventional heat-dissipating module 1 'which includes a heat sink 10, a heat pipe 11 and a pedestal 13 having a plurality of heat-dissipating Korean tablets. The heat dissipation fins ι〇ι are provided with a hole 103, the hole 1Q3 has an age hole _ for accommodating the heat pipe 11, and the solder hole slidably receives the material transfer material 15, the solder hole 1032 Located above the heat pipe hole 1031, that is, the solder holes 1〇32 are formed above the heat pipe hole 1031 and communicate with each other, and a 'bee of the heat pipe η is fixed in the heat pipe hole 1(10)1 of the heat dissipation fins 1〇1. Another knowledge is that the pedestal 13 is fixed together to form the heat dissipation module p. Therefore, when the heat dissipation module 1 is assembled, the solder 15 and the heat pipe u are respectively placed in the solder holes 1032 of the heat dissipation fin 101 and The heat pipe hole 1〇31 (refer to FIG. 1B) is used to place the cream solder 15 in the solder hole 1032 and the heat pipe hole 1031 (not shown) of the heat dissipation fin 101 by using a jig to complete the heat dissipation. The module 1 is pre-assembled, and then the pre-assembled heat dissipation module 1 ' is heated to melt the solder 15 in the # hole 1032 The wall of the hole along the solder hole 1 (10) 2 flows through the contact hole between the solder hole 1032 and the heat pipe hole 1031 and reaches the hot hole 1031 to be filled in the gap between the heat pipe 11 and the heat sink fin π 〗 After cooling, 'the heat pipe u is smashed with the scatter piece (refer to the 1C, 1D illustration). Although the conventional heat-dissipation module i can achieve the heat-dissipating effect, in the actual electrical installation, it is difficult to heat-dissipate the heat of the ribs. After the heating process, the cooling program is finally required to produce the heat-dissipating module. Therefore, the overall assembly process cannot be simplified, and the cost and processing time are also increased. In addition, when the molten solder 15 flows through the contact position of the wire hole p of the solder hole 1032, it is easy to accumulate at the above-mentioned contact position to form a dang bead on the heat-dissipating 101, which may cause dissipation and no money, thereby affecting the use. The willingness to purchase is reduced. Nub Yao is based on 'how to solve the above problems and lack of use, that is, the case of the case is from the relevant manufacturers engaged in this industry, the direction of research and improvement [new content] to provide Wei's effective solution to the above problems The main purpose of this creation is: Ϊ At least—the design of the heat pipe and the heat sink to be tightly coupled, and the heat dissipation module of the cost of the lang. group. The second objective of this creation is to provide a cooling module with reduced working hours. The secondary purpose of the creation is to provide a group of components with excellent heat dissipation performance. To the small 2, the author proposes a heat dissipation module, which includes: ???...the official has a heat absorbing end and extends from the direction away from the heat absorbing end, a M392990 hot end j and a heat sink have a heat dissipating surface Forming a plurality of heat dissipating fins, and a conducting surface opposite to the heat dissipating surface, wherein the conducting surface is recessed with a receiving groove that is relatively tightly coupled to the heat expanding end and integrated, and the heat expanding end is flattened by the conductive surface. The combination of the creation of the heat pipe and the heat sink is designed to effectively reduce the number of working hours and save the process and cost, and thus effectively achieve excellent heat dissipation. [Embodiment] The above object of the present invention, its structural and functional features, will be described in accordance with a preferred embodiment of the accompanying drawings. Ming - and as shown in Figures 2 and 3, this creation is a kind of diffusion model also. 2: The best implementation of the county creation, which includes at least - heat pipe 21 and a heat dissipation: :, where s Hai 21 has a heat absorbing end 211 and a heat expanding end 212 (4) extending from the heat absorbing end 211, and the heat absorbed by the heat absorbing end 211 is quickly transmitted to the heat expanding end 212. The heat sink 23 has a heat dissipation base 230. The heat dissipation surface 230 is provided with a heat dissipation surface 23 and a conductive surface of the heat dissipation surface 231. The heat dissipation surface 231 is formed on the heat dissipation base. A plurality of heat-dissipating fins 234 are formed on the heat-dissipating surface 231, and the conductive surface is raised/finished on the other end surface of the heat-dissipating susceptor 230, and the conductive surface is concave. Further, there is a fork groove 235 (refer to FIG. 4), the receiving groove 235 is relatively tightly coupled with the heat-expanding end 212 and coupled to the body, that is, the heat-expansion end 212 of the heat pipe 21 is closely matched, and The receiving groove 235 having a heat dissipation of 23 is combined into a body to constitute the just-described thermal module 2' and the aforementioned heat-expanding end 212 is cut to the conductive surface 232. As shown in Figures 4 and 5, the aforementioned receiving groove 235 has a closed side 2351 6 M392990 and an open side 2352 opposite the closed side 2351, and the closed side 2351 and the open side 2352 together define the receiving groove 235; The heat-generating end 212 has a flat cut surface 2121, and a non-flat cut surface 2122 extends axially from the flat cut surface 212 to form 'and the flat cut surface 2121 is aligned with the open side 2352 and the conductive surface 232'. The non-flat surface 2122 Then, it is closely combined with the aforementioned receiving groove 235.
再者’績參閱第3、4圖示，前述散熱模組2更包含一 傳導基座25，該傳導基座25具有一凹槽251，其凹設形成 在傳導基座25的-端面’且該凹槽251相對緊配該吸熱端 211並結合-體，亦即藉由前述凹槽251採以緊配方式斑 所述吸熱端211結合為—體，麟傳導基座沾的另一端面 與相對-發熱it件（如中央處理器、南北橋晶片·.等)相貼 :起，以使刖述傳導基座25將吸收到發熱元件（圖中未 不)產生的熱量’透過熱管21的吸熱端211傳導到擴埶端 該擴熱端212再將接收的熱量傳導至該散熱器23之 人¥面232上’然後透過散熱面231上的散熱韓片234， 々缝與外界的冷空氣熱交換，俾令該發熱元件快速散熱。 藉由本創作之熱官21與散熱器幻以緊配方 二體的設計，使得本創作不需如f知緊配方式需二二 :Γ面在製造上能有效降低工時、製程‘ ❿又有效翻聽散熱效能者Further, the heat dissipation module 2 further includes a conductive base 25 having a recess 251 formed in the end surface of the conductive base 25 and The groove 251 is relatively tightly coupled to the heat absorbing end 211 and is coupled to the body, that is, the heat absorbing end 211 is combined into a body by the groove 251, and the other end face of the lining conductive base is The relative heat generating component (such as a central processing unit, a north-south bridge chip, etc.) is attached to the heat conducting element 21 so that the heat generated by the heating element (not shown) is transmitted through the heat pipe 21 The heat absorbing end 211 is conducted to the expanding end, and the heat radiating end 212 transmits the received heat to the person's face 232 of the heat sink 23, and then passes through the heat dissipating piece 234 on the heat dissipating surface 231, and sews the cold air with the outside. The heat exchange allows the heating element to dissipate quickly. With the design of the hotman 21 and the radiator of the creation, the design of the radiator is not required to be the same as the method of matching the two: the surface can effectively reduce the working hours and the process. Listening to the heat sink
收時僅需將熱管21與散熱器_分離： 進仃分類回收處理。 J -人者，由於本創作之散熱模組2因無需使用任何鮮料 7At the time of collection, it is only necessary to separate the heat pipe 21 from the radiator _: J - person, because the heat module 2 of this creation does not need to use any fresh materials 7