TWM416127U - Modular cooling device built in fin formed heat plates - Google Patents

Modular cooling device built in fin formed heat plates Download PDF

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Publication number
TWM416127U
TWM416127U TW100208759U TW100208759U TWM416127U TW M416127 U TWM416127 U TW M416127U TW 100208759 U TW100208759 U TW 100208759U TW 100208759 U TW100208759 U TW 100208759U TW M416127 U TWM416127 U TW M416127U
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Taiwan
Prior art keywords
hot plate
fin
heat
heat sink
cooling
Prior art date
Application number
TW100208759U
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Chinese (zh)
Inventor
Chen-Ching Ting
Chien-Chih Chen
Yu-Wei Chen
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Univ Nat Taipei Technology
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Application filed by Univ Nat Taipei Technology filed Critical Univ Nat Taipei Technology
Priority to TW100208759U priority Critical patent/TWM416127U/en
Publication of TWM416127U publication Critical patent/TWM416127U/en

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Abstract

A modular cooling device built in fin formed heat plates is the cooling device which is built with the fin formed vapor chamber in terms of principle of the heat pipe. This invention of the modular cooling device built in fin formed heat pipe mainly applies the fin formed heat plate which consists of the outer shell of heat pipe, the inner wall capillary structure of fin formed heat plates, and the working fluid. This invention of the modular cooling device built in fin formed heat plate uses the integral molding technique to fabricate the cooling device, which is integrated with vapor chamber and cooling plates. This manufacturing technique reduces the thermal resistance between vapor chamber and cooling plates, further increases its cooling efficiency. The integration of vapor chamber and cooling plates is carried out in the invention and reduces the joint procedure between vapor chamber and cooling plates as well as reduces the cooling grease. This inn ovation also expands the application of vapor chamber to the cooling plates and further increases the cooling capacity largely.

Description

五、新型說明: 【新型所屬之技術領域】 本創作是有關於-種鰭片式熱板模組散熱器,將敎板原理 應用在散熱鰭>}上,增加散熱效率,並以熱板均熱料合熱板 散熱鰭>1為-體的製作方式’大大降低傳統熱板均熱片與散熱 鰭片接合_熱阻,提供—種更高散熱功率的散熱裝置,可廣 =應用於光電、通信、電力、航太與生醫等產業之產品散熱上: 提升產品可靠度及使用壽命’特別是應用在超高頰咖及高功 率LED燈之散熱上。 q 【先前技術】 熱管是藉由鮮内部的作流體崎氣之相變化方式達 到超高攜帶熱量之目的。熱管兩端分別為加熱端與冷凝端,中 間部分稱為_段。當熱管加熱端受熱時,管_工作流體因 賴而汽化膨脹,造成管内之壓差現象,使得熱蒸氣瞬間衝向 熱管的另-端’即冷雜。f減氣到達冷凝端時,蒸氣因管 内外的溫度差而散熱’並重新凝結成液體,凝結的液體藉由管 内壁的毛細結構傳回加鏡,達成熱㈣機構。鮮為現今技 術非常成熟且應用極廣的產品。 熱管因其柱狀結構,使用時不利與發熱源之平面做較密 的接觸’近年來已有許多研究朝_發熱板,驗因其平板機 構,更方便進行平面的散熱接觸。不過,由於熱板均熱片之一 面與發熱源緊密結合,反面不利安裝一般較大的銘材散熱韓 片’因為熱傳導率與距離成反比的緣故。因此,與熱板均熱片 搭配的賴鰭牌朝向高鋪的熱管或驗發展,但在接合過 程均因接合處熱闕提高而造絲熱效率大打折扣。 本創作韓片式熱板模組散熱器以模組化概念及技術整併 熱板均熱片與熱板散熱轉片為一體,不但製程更簡易與便宜, 更可大大提高散熱效率。 【新型内容】 β為突破熱板均削無法搭配—般較大蹄散熱鰭片的問 題及改善以熱板均熱片的散熱片組與熱板均熱片的接合問 題’本創作鰭片式熱板模組熱器以優異設計及製作方式將熱 板均熱片與熱板均熱;=;式的散熱則整併為—體,熱板均熱 片受熱汽化之工作液體直接傳到熱板則内,達到超大熱值 與超高速率的熱傳效果。 【實施方式】 參照第1 ®,係本創作鰭片式熱板模組散熱器整體示意 圖。鰭片式熱板模組散熱器包含一鰭片式熱板外殼100、一鰭 片式熱板内壁毛細結構200、及一工作液體300。鰭片式熱板 模組散熱器-邊為鰭片結構1{η,另一邊為平板結構102。散 熱時將平板結構102貼附在熱源上方,當熱源上的熱透過鰭 M416127 片式熱板模組散熱器之平板結構102傳到鰭片式熱板模組散 熱器内,造成内部工作液體300瞬時汽化,汽化的工作液體 300因膨脹而快迷傳到鰭片式熱板模組散熱器的鰭片結構工〇工 遠端,傳到鰭片結構1〇丨遠端的工作液體3〇〇蒸氣因鰭片式 熱板模組散熱器内外溫差而散熱並重新液化,重新液化的工 作液體300順著韓片式熱板内壁毛細結構2〇〇回流到平板结 構102處再受熱汽化,如此構成循環達到散熱的目的。 參照第2圖’係本創作縛片式熱板模組散熱器的製程解說 爆炸示意圖。鰭片式熱板模組散熱器的製程包含一兩端開放 並中空的鰭片式熱板外殼1〇3、一兩端開放並中空的鰭片式熱 板内壁毛細結構104、一片梳子狀毛細結構1〇5、一片具有孔 的梳子狀毛細結構106、一片梳子狀外殼1〇7、及一片具有管 子穿孔的梳子狀外殼1〇8。鰭片式熱板模組散熱器的製程方式 乃將製作完成的兩端開放並巾空賴以熱板内壁毛細結構 104裝入兩端開放並中空的鰭片式熱板外殼1〇3後兩端再分 別盍上梳子狀毛細結構105及具有孔的梳子狀毛細結構, 接著梳子狀毛細結構105再蓋上梳子狀外殼1〇7,具有孔的梳 子狀毛細結構⑽在孔解具有管子穿·好狀外殼1〇8 的孔後’蓋上具有管子穿孔的梳子狀外殼⑽,並將兩端開放 且中空的鰭片式熱板外殼103與梳子狀外殼1〇7及具有管子 穿孔的梳子狀外殼⑽進行永久性接合域結,完成後以具 有管子穿孔喊子狀外殼1G8 _L的管子進行抽氣並填入工作 6 液體咖’完錢將管子㈣便完·片式驗模組散熱器的 製作。 雖然本創作已以-較佳實施觸露如上,然其並非用以 限定本創作’任何熟習此技藝者,在不麟本創作之精神和 範圍内,當可作各種之更賴潤飾,因此本鑛之保護範圍 當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖係為本創作鰭片式熱板模組散熱器整體示意圖。 第2圖係為本創作鰭片式熱板模組散熱器的製作解說爆炸示 意圖。 ^ 【主要元件符號說明】 100 ·鰭片式熱板外殼 101 :鰭片結構 102 :平板結構 103 :兩端開放並中空的鰭片式熱板外殼 104 :兩端開放並中空的鰭片式熱板内壁毛細結構 105 :梳子狀毛細結構 1〇6 :具有礼的梳子狀毛細結構 107 :梳子狀外殼 108 :具有管子穿孔的梳子狀外殼 200 ·轉片式熱板内壁毛細結構 300 :工作液體V. New description: [New technology field] This creation is about a kind of fin-type hot plate module radiator, which applies the principle of the raft on the heat sink fins} to increase the heat dissipation efficiency and use the hot plate. The heat-dissipating heat-dissipating fins >1 is the body-making method' greatly reduces the traditional hot plate heat-sinking sheet and the heat-dissipating fins _thermal resistance, providing a heat-dissipating device with higher heat dissipation power, which can be widely applied In the heat dissipation of products such as optoelectronics, communication, electric power, aerospace and biomedical industries: Improve product reliability and service life', especially in the heat dissipation of ultra-high cheek coffee and high-power LED lights. q [Prior Art] The heat pipe is designed to achieve ultra-high heat carrying capacity by means of a fresh internal fluid phase change. The two ends of the heat pipe are the heating end and the condensing end, and the middle part is called the _ section. When the heating end of the heat pipe is heated, the pipe_working fluid vaporizes and expands due to the pressure, causing a pressure difference in the pipe, so that the hot steam instantaneously rushes to the other end of the heat pipe, that is, cold. When the degassing reaches the condensing end, the vapor dissipates heat due to the temperature difference between the inside and outside of the tube and recondenses into a liquid. The condensed liquid is returned to the mirror by the capillary structure of the inner wall of the tube to reach a heat (4) mechanism. It is rarely a product that is very mature and widely used today. Due to its columnar structure, the heat pipe is disadvantageously used to make a close contact with the plane of the heat source. In recent years, many researches have been made on the heat-generating plate, and the flat-plate mechanism is more convenient for planar heat-dissipating contact. However, since one side of the hot plate of the hot plate is closely combined with the heat source, the reverse side is disadvantageously installed because the heat conductivity is inversely proportional to the distance. Therefore, the Laifeng brand that is matched with the hot plate of the hot plate is oriented toward the high-flow heat pipe, but the heat efficiency of the wire is greatly reduced due to the heat increase at the joint. The creation of the Korean-style hot plate module heatsink is a modular concept and a technical integration of the hot plate heat spreader and the hot plate heat transfer rotor, which not only makes the process simpler and cheaper, but also greatly improves the heat dissipation efficiency. [New content] β is a problem that can not be matched with the hot plate evenly, the problem of the larger heat sink fins is improved, and the problem of the heat sink between the heat sink and the heat spreader of the hot plate is improved. The hot plate module heater heats the hot plate soaking plate and the hot plate in an excellent design and manufacturing manner; the heat dissipation of the hot plate is integrated into the body, and the working liquid heated by the hot plate of the hot plate is directly transferred to the heat. In the board, the heat transfer effect of super large heat value and super high speed is achieved. [Embodiment] Refer to the 1st ®, which is the overall schematic diagram of the finned hot plate module heat sink. The finned hot plate module heat sink comprises a finned hot plate outer casing 100, a finned hot plate inner wall capillary structure 200, and a working liquid 300. Finned hot plate module heat sink - the side is a fin structure 1 {η, and the other side is a flat structure 102. When the heat is dissipated, the flat structure 102 is attached to the heat source. When the heat on the heat source passes through the flat plate structure 102 of the fin type M416127 hot plate module heat sink, the heat is transmitted to the heat sink of the fin type hot plate module, thereby causing the internal working liquid 300. Instantaneous vaporization, vaporized working fluid 300 is rapidly spread to the fin structure of the fin-type hot plate module radiator, and is transferred to the working fluid of the fin structure at the distal end of the fin structure. The vapor is dissipated and reliquefied due to the temperature difference between the inner and outer fins of the fin-type hot plate module, and the re-liquefied working liquid 300 is returned to the flat structure 102 along the capillary structure of the Korean hot plate and then heated and vaporized. The cycle achieves the purpose of heat dissipation. Refer to Figure 2 for a schematic diagram of the process of creating a heat sink module heat sink. The fin-type hot plate module heat sink comprises a fin-shaped hot plate outer casing 1 〇 3 which is open at both ends and hollow, and a fin-shaped hot plate inner wall capillary structure 104 which is open at both ends and has a comb-like capillary The structure 1〇5, a comb-like capillary structure 106 having a hole, a comb-like outer casing 1〇7, and a comb-like outer casing 1〇8 having a tube perforation. The fin-type hot plate module heat sink is manufactured by the two ends of the fin-shaped hot plate outer casing 1 〇 3 open at both ends of the hot plate inner wall capillary structure 104. Then, the comb-like capillary structure 105 and the comb-like capillary structure having the holes are respectively attached, and then the comb-like capillary structure 105 is further covered with the comb-like outer casing 1〇7, and the comb-like capillary structure (10) having the holes has the tube piercing in the hole solution. After the hole of the casing 1〇8, a comb-like casing (10) having a pipe perforation is covered, and the fin-shaped hot plate casing 103 and the comb-like casing 1〇7 which are open at both ends and hollow, and a comb-like casing having a pipe perforation are provided. (10) Carry out the permanent joint domain knot. After completion, pump the pipe with the pipe piercing shell 1G8 _L and fill it with the work. 6 Liquid coffee 'When the money is finished, the pipe is finished (4) and the chip test module radiator is produced. . Although this creation has been exposed as above in the preferred embodiment, it is not intended to limit the creation of any of the artists who are familiar with the art, and in the spirit and scope of the creation of the book, when it is possible to make a variety of refinements, The scope of protection of the mine shall be subject to the definition of the scope of the patent application attached. [Simple description of the diagram] The first diagram is a schematic diagram of the heat sink of the fin-type hot plate module. Figure 2 is a schematic illustration of the explosion of the finned hot plate module heat sink. ^ [Main component symbol description] 100 · Finned hot plate housing 101 : Fin structure 102 : Flat structure 103 : Finned hot plate housing 104 with both ends open and hollow: Fin-type heat which is open at both ends and hollow Inner wall capillary structure 105: comb-like capillary structure 1〇6: comb-like capillary structure 107: comb-like outer casing 108: comb-like outer casing 200 with pipe perforations · rotor-type hot plate inner wall capillary structure 300: working liquid

Claims (1)

申請專利範圍: •〜種韓片式熱板模組散熱器,包含: 一鰭片式熱板外殼,以便封住工作液體; 一鰭片式熱板_毛細結構,設置輯収熱板外殼之内; -工作液體,妙於則式熱板外殼之内,當則式熱板 模組散熱妓熱後’工作㈣受熱而瞬時汽化膨脹,工作液 體之蒸氣傳_片式熱板模組散熱器的鰭片結構遠端,因内 7溫差而餘並制凝結,錄凝結後之工作㈣順著毛細 結構回到熱源端再受熱汽化構成循環。 2·如申請專利範圍第丨項所述式熱板模組散熱器,其中 的鰭片式熱板包含有熱板底座與熱源接觸、削;该板與環 境接觸。 3·如申請專利範圍第〗項所述的·式熱板模組散熱器,其中 轉片式熱板形狀可為方形、三角形、多角形、橢圓形等。 ’如申請專利範園第i項所述的鰭収熱板模組散熱器,其中 .鳍片式熱_外殼材ff可為銅、銘、不_等高熱傳材料。 •如申請專利範圍第i項所述的鰭片式熱板模組散熱器,其中 胃片式熱板内壁毛細結構可為網狀物、粉狀物、溝槽狀、纖 維物、混合式等。 6’如申凊專利範圍第j項所述的鰭片式熱板模組散熱器,其中 鰭片式熱板内壁毛細結構的材質可為銅、銘、錄、纖維絲、 複合物專南毛細力材料。 如申睛專利範圍第1項所述的鰭片式熱板模組散熱器,其中 製程方式以製作兩端開放並中空的鰭以熱板外殼、兩端開 放並中空賴板_毛細結構、梳子狀毛細結構、及梳子二 外殼後面安賴合,料线填^^作液體。Patent application scope: • ~ Han type hot plate module radiator, including: a fin-type hot plate shell to seal the working fluid; a fin-type hot plate _ capillary structure, set the collection of hot plate housing Inside; - working liquid, better than the inside of the hot plate shell, when the hot plate module heats up and heats up 'work (4) heated and instantaneous vaporization expansion, steam of working liquid _ chip type hot plate module radiator The distal end of the fin structure, due to the internal temperature difference of 7 and coagulation, recording the work after condensation (4) along the capillary structure back to the heat source end and then heated to form a cycle. 2. The heat sink module heat sink according to the scope of claim 2, wherein the finned hot plate comprises a hot plate base in contact with and cut by a heat source; the plate is in contact with the environment. 3. The heat transfer module heat sink according to the scope of the patent application, wherein the shape of the rotary heat plate may be square, triangular, polygonal, elliptical or the like. For example, the fin heat collecting plate module heat sink according to item i of the patent application garden, wherein the fin type heat_outer material ff can be a high heat transfer material such as copper, inscription or not. • The fin-type hot plate module heat sink according to claim i, wherein the inner wall of the stomach-type hot plate may be a mesh, a powder, a groove, a fiber, a hybrid, etc. . 6' The fin-type hot plate module heat sink according to item j of the patent application scope, wherein the material of the fin-shaped hot plate inner wall capillary structure can be copper, inscription, recording, fiber filament, composite southerly capillary Force material. For example, the fin-type hot plate module heat sink according to the first aspect of the patent scope includes the method of manufacturing the fins which are open at both ends and hollow, with a hot plate shell, open ends and a hollow plate _ capillary structure, comb The capillary structure and the comb shell are placed behind each other, and the material line is filled with liquid.
TW100208759U 2011-05-16 2011-05-16 Modular cooling device built in fin formed heat plates TWM416127U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107017728A (en) * 2017-05-27 2017-08-04 中山大洋电机股份有限公司 A kind of phase-change heat motor case and its ventilated machine of application

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107017728A (en) * 2017-05-27 2017-08-04 中山大洋电机股份有限公司 A kind of phase-change heat motor case and its ventilated machine of application
CN107017728B (en) * 2017-05-27 2019-11-26 中山大洋电机股份有限公司 A kind of phase-change heat motor case and its ventilated machine of application

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