TWI234639B - Improved structure of heat sink assembly - Google Patents

Abstract

The present invention provides an improved structure of a heat sink assembly, which includes a plurality of heat dissipation fins stacked together, in which said plurality of heat dissipation fins have a base plate and two folded side plates. A through hole is formed on the base plate adjacent to the side plate. A limiting part is inwardly folded on the side plate near the through hole. Furthermore, the top edge of the side plate is extendedly protruded with two latching parts, which are shrunk into the inner edge of the side plate. The latching parts are formed with an engagement aperture. Thus, when a plurality of heat dissipation fins are stacked together, the latching parts of a rear heat dissipating fin goes into the through hole formed on the front heat dissipating fin. Thus, this heat sink assembly has a more stable engagement and positioning performance.

Description

1234639 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a structural improvement of a heat sink combination. [Previous technology] According to the changes of the social structure, the quality of life required by people is relatively improved, and the requirements for things have changed from the old thinking of "usable to use", which has become quite delicate. Only continuous improvement or innovation In order to meet the needs of modern society. The era of global computerization is coming, and many of us have already developed our brains, and with the computer industry two = when the pieces are getting smaller and smaller, the electronic elements inside the computer :: the state is not good, it is very easy to make the computer as a whole Structural damage = The manufacturer of the internal cooling device of the computer has been built; Home: There will be a large area of the heat sink attached to and extend the power ::; :: piece surface ... to help heat dissipation, in order to protect the common heat sink of head 4 Can be divided into extruded type 'only die-casting and aluminum extrusion type and ancient: It is a folding type 3, the lack of die-casting and aluminum, while the stackable type is difficult and the heat dissipation area is limited. Please refer to the trend. The structure of 璺 and the conventional scattered beryllium beryllium 180 = 81 fins of the known heat sink. The conventional scattered 埶 is a σ 彳 view of A σ. Refer to the two .., 81, is a material with good thermal conductivity, which is borrowed 1234639 V. Description of the invention. (2): = system "Broken:" door "type, as shown in the figure It is shown that the plurality of heat sinks are arranged in a pile, and each of the heat sinks 81 is provided with a recess 82 on the same side, and the recess 82 can be used for welding several steel pipes 83 side by side as shown in Figure 8: The combination of heat sinks 80, but this type of heat sinks 81 are arranged in a stack. Because there is no clamping device to fasten and locate each other, the copper tube 83 must be welded to the recess 82 of the heat sink combination 80. It is stable and will not fall off. As a result, this type of conventional structure must be assembled in a way that requires too much effort and time, which is not in line with economic benefits, so it is necessary to improve it. 〇

As shown in FIG. I, 4 another type of conventional heat sink combination is not intended. Referring to the conventional heat sink Η shown in the figure, its cross-section :: is roughly a "Π" type, which is different from the aforementioned heat sink 81 in that the heat sink 91 of this type = is attached to the bottom plate 92 and the second The abutting portion 4 is recessed in the abutment of the side plate 93, and the front end of the two side plates 93 is symmetrically folded with a clip portion 95. When a heat sink 91 is assembled, the rear heat sink 91 can be borrowed from the clip portion 95 uses the abutting part 94 of the ^ collecting ^ hot sheet ^, and can have a slightly positioning effect; however, the total, ☆, tenth position effect is not good, and it is combined with the aforementioned heat sink 8 〇 are The external structure easily loosens the entire heat sink combination 90 structure; in addition, the sadness, the 90 combination of heat sinks is stacked layer by layer, and there are several bumps on the side edges (the clip portion 95 will slightly protrude), so The person taking the heat sink combination 90 ^ is in danger of poor touch and even scratches, so there is a need for improvement. "Wei Wei, in view of the lack of structure of the conventional invention, the inventor has invented a political heat combination Structural improvement ", which can overcome the above-mentioned conventional products

1234639 V. Description of the invention (3) [Summary of the invention] The technical problem to be solved by the invention "the structure improvement of the heat sink combination" is that the conventional heat sink has a certain effect in the case of continuous stacking. Not chapter [so easily susceptible to external forces to loosen, the hot film combination is necessary to improve the latch structure. ^ The structural improvement of the cymbal sheet combination ", which is composed of a plurality of fins, Ϊ The number of fins has a bottom plate and a folding stand ^ The two side plate bottom plate is worn on the side adjacent to the side plate ^ There are two inner side edges of the side plate And the side plate further extends a convex hole at the top edge; by this, several = the funnel card portion is provided with a card that can be passed through the front heat sink: d "', and the funnel card portion of the heat plate is an inner protrusion of the hot plate side plate The position-limiting function of the neighboring hot-spot thermal film is locked by the card hole to the front-scattered positioning function: bit .... Makes the heat sink combination more stable. For other purposes, the six descriptions and related drawings. The characteristics of the new Lai Lai will be detailed from the following [Embodiments] For the preferred embodiment of the present invention and the technology, means and effects of n = used, please refer to the illustrations as follows: one * embodiment Structure: y, picture A is not for the creation of this kind of $ ,,,, and structural restrictions. It is not $ in patent applications

Page 7 1234639 V. Description of the invention (4) Please refer to the first figure for the three-dimensional appearance of the heat sink combination of the present invention. Referring to the figure, it is revealed that there is a heat sink combination 1, which is composed of a number of heat sinks 10 with recesses 11 and a number of perforations 21: {20 stacks, several copper tubes 30 series It can pass through the perforation 21 and be inserted into the recess 11 ′. After the welding or gluing operation is performed, the complete structure shown in the figure can be completed. Please refer to the second and third figures, which are the three-dimensional appearance view and the side sectional view 6 of the heat sink 10 with the recessed portion 11 of the present invention. Referring to these two figures, the heat sink 10 is a thermally conductive material and has good ductility. Metal sheet, which is stamped to have a cross-section “door π” shape, and the heat sink 10 has a bottom plate 2 and a folded ψ ^ side plate 1 3, wherein the recess 11 is disposed on one side thereof The bottom plate 12 is at a predetermined central position of the plate 13; the bottom plate 12 is near the four corners and is adjacent to the side plate 13 and is provided with a through hole 14; and the side plate 13 is near the through hole 14 and is inwardly positioned. The limit position portion 15 is folded, and the side plate 13 is further extended at the top edge to protrude two pole card portions 16 that are retracted into the inner edge of the side plate 13. A card hole 1 is provided on the card insertion portion 16. 7. Please refer to the fourth figure, which shows the combined state of the number of heat sinks 10 with recesses 11 according to the present invention. Referring to the figure, when the plurality of heat sinks 10 are stacked and installed, they are connected by the rear heat sink 10 The embedded card portion 16 is penetrated in the through hole i 4 of the front heat sink i 〇, and the rear heat sink 10 is engaged with the front heat sink 4 by the card hole 17 on the enemy card portion 16 so as to protrude within the limit. Bit 1 5 Making the number of heat sinks i 0 stacked and installed can have a better positioning effect of the latches, and is not easy to fall off; In addition, it is worth noting that the heat sinks 10 are combined with each other, and the embedded parts of the heat sinks 16 are caused by the card. It fits into the limiting part of the inner protrusion of the side plate 1 3, so the card is inserted ^ 1 6 ^ $ 致

1234639 V. Description of the invention (5) The external path or projecting from the side plate 1 3 ′ does not cause the lack of bumps as in the conventional heat sink combination. Referring again to the fifth and sixth figures, the three-dimensional appearance diagram and the combined state diagram of the heat sink 20 with the perforation 21 according to the present invention are shown. Referring to the two figures, the heat sink 20 disclosed also has a bottom plate 22, a side plate 23, a through hole 24, a limiting portion 25, a card insertion portion 26, and a card hole 27, and the combined state is also the same as the aforementioned recessed portion 11. The heat sink 10 is the same, and the same points are not described in detail, except that the main difference between the heat sink 20 disclosed in the fifth and sixth figures is that the

The heat sink 20 is provided with a perforation 21 at a predetermined position in the center of the bottom plate 22, and the perforation 21 is shown in the sixth figure. The perforation 21 is for the copper tube 30 to pass through, and the copper tube 30 is in contact with the wall of the perforation 21 Welding or gluing can be performed on the points to form a structure as shown in the first figure. From the above, it can be concluded that the present invention has the following advantages ...

1. The structure improvement of the heat sink combination of the present invention, wherein the heat sink is provided with a through hole at the position where the bottom plate is adjacent to the two side plates, and a limiting portion is folded on the side plate toward the inner plate, and the top edge of the side plate is The extension card is provided with two carding portions that are retracted into the inner edge of the side plate. This allows the card-engaging portion of the rear heat sink to pass through the through hole of the front heat sink, and the rear heat sink can borrow a card provided on the card embedding unit. The hole is engaged with the limiting portion of the inward protrusion of the side plate of the front heat sink. When a plurality of heat sinks are stacked and assembled into a heat sink combination, a relatively stable locking positioning effect can be obtained, which makes the present invention extremely stable and difficult. Those who are affected by external forces. 2 · The "structure improvement of the heat sink combination" of the present invention, in which, when the plurality of heat sinks are combined with each other, the card-embedded parts of the heat sinks are engaged with the limiting parts of the inner protrusions of the side plate so that the drinking card parts are not exposed or protrude from the side plate Without the occurrence of the same as the conventional 1234639 V. Description of the invention (6) The bumps of the heat sink combination are missing, and the heat sink combination of the present invention can have a better touch without the risk of being injured. The invention has been described with reference to the detailed drawings of the preferred embodiment. Those skilled in the art can derive many variations from the preferred embodiment without departing from the scope of the invention. Therefore, the preferred embodiment does not limit the scope of the invention. The scope of the invention is defined in the scope of patent application.

Page 10 1234639

Brief description of the drawings on page 11 [Brief description of the drawings] The first picture is the three-dimensional appearance of the heat sink combination of the present invention; the second picture is the three-dimensional appearance of the scatter sheet with recesses of the present invention. Side sectional view of the heat sink with a recessed portion of the invention. The fourth figure is a view of the combined state of the heat sink with a recessed portion of the invention. The fifth figure is the three-dimensional appearance view of the heat sink with a perforation of the invention. Figure 7 shows the combined state of several heat sinks. Figure 7 shows the structure of multiple conventional heat sink stacks. Figure 8 shows a cross-sectional view of a conventional heat sink combination. Figure 9 shows another structure of a conventional heat sink combination. schematic diagram. [Simple description of component symbols] 1 heat sink combination 1 0 heat sink 11 recessed 12 base plate 1 3 side plate 14 through hole 1 5 limit portion 1 6 card insertion portion 17 card hole 20 heat sink 21 perforated 22 base plate 2 3 side plate 24 through Hole 2 5 Limiting part 2 6 Engaging part 27 Card hole 30 Copper tube 8 0 Heat sink combination 8 1 Heat sink 82 Recess 8 8 Copper pipe 9 0 Heat sink combination 9 1 Heat sink 92 Base plate 93 Side plate 94 Abutment portion 9 5 clip

Claims (1)

1234639 VI. Patent application scope: 1 type of monthly hot film combination Xi AL .. Dekou V white y is an improvement on the structure of the right, the right and the left, and the structure of the mouth, which consists of several base plates and folding There is only one worm on the side plate, which is only for insects / ', Zhuang I, ^ shape ... Moon pile is assembled, and is characterized by: The bottom plate of the number of fins is attached to the side of the side plate. A predetermined number of through-holes are worn through, and the side plate is limited by the internal protrusion. The sub-side plate extends from the top edge to a card that retracts into the inner edge of the side plate. Convex, and willing to enter.卩, and a card is set on the card part, so that you can wear the function of the limit position of the front heat sink. 2 · Rushen improvement, which is provided with a recess, 3 · Rushen improvement, where the, and the perforation is 4 · Rushen improvement, where the sheet has 0 through-holes of heat sinks and heat sinks, so that the request The number of patented heat sinks and the recess are requested. The number of patented heat sinks is available for counting copper tubes. The number of patented heatsinks are stacked and assembled, and the first one of the rear heatsink is available for the first one to be worn on the bottom plate. It is assumed that the first item is heat conduction, and the rear heat sink assembly has the one side plate copper tube and the center pre-assembler. The said embedded parts of the heat sink and the heat sink can be embedded in the central predetermined position of the structure of the heat sink combination with a more stable fixed heat sink through the card hole. The structure of the heat sink combination is provided with a perforated heat sink combination at a fixed position. The metal has a good ductility. 5 · The structure of the heat sink combination described in item 丄 of the patent application is improved. The through-hole is penetrating. Near the four corners of the bottom plate and adjacent to the side plate.