WO2011061779A1 - 放熱機器及び放熱機器の製造方法 - Google Patents
放熱機器及び放熱機器の製造方法 Download PDFInfo
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- WO2011061779A1 WO2011061779A1 PCT/JP2009/006141 JP2009006141W WO2011061779A1 WO 2011061779 A1 WO2011061779 A1 WO 2011061779A1 JP 2009006141 W JP2009006141 W JP 2009006141W WO 2011061779 A1 WO2011061779 A1 WO 2011061779A1
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- fin
- protrusion
- groove
- radiating
- heat
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- 230000017525 heat dissipation Effects 0.000 claims description 22
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P11/00—Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H01L21/4878—Mechanical treatment, e.g. deforming
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Definitions
- the present invention relates to a heat radiating device for cooling a heat generating element used in various devices including a power conversion device, and more particularly to a heat radiating device sealed with a resin and a method for manufacturing the heat radiating device.
- a heat sink has been widely used as a heat radiating device for cooling a heat generating element.
- This heat sink is roughly classified into one in which the heat radiation fin and the heat radiation fin support base are integrated by die casting or extrusion, and one in which the heat radiation fin and the heat radiation fin support base are individually combined.
- the heat radiation fin and the heat radiation fin support base are individually combined.
- restrictions on the mold strength required for extrusion molding and die casting can be relaxed, and the fin pitch between adjacent radiation fins is reduced.
- the heat radiation fin length can be increased. Therefore, compared with the former, it is effective for reducing the installation area of the semiconductor device and reducing the cost by reducing the size of the heating element.
- a caulking method may be mentioned as a method of fitting the heat radiation fin and the heat radiation fin support base in a combination of the heat radiation fin and the heat radiation fin support base.
- a plurality of grooves parallel to the planar shape of the radiating fin support base are made in advance, the side edges of the radiating fins are fitted into the grooves from above, and the gaps between the plurality of grooves.
- a heat dissipating device is disclosed in which a groove fitting a side edge portion of the heat dissipating fin is pressed and narrowed by pressing the tip of a caulking tool against another plurality of formed grooves.
- the groove of the radiating fin support base is formed in a tapered shape that expands from the opening toward the bottom, and the radiating fin is grooved by forming rounds on both sides of the groove bottom.
- a technique is disclosed in which, when crimping, the heat dissipating fins are deformed into an expanding taper shape along the groove shape and are pressure-bonded to the groove.
- JP 2001-102786 A page 3, FIG. 8
- Japanese Patent Laid-Open No. 2002-299864 page 4, FIGS. 1 and 6)
- the caulking tool needs to widen two grooves, the groove for the radiating fin and the groove for the caulking tool. Become.
- a press device with a large frame and motor is required to increase the press load, so that the equipment for caulking the radiating fin to the radiating fin support base becomes large, and the equipment cost becomes expensive. There was a problem.
- This invention is made in view of the above-mentioned subject, and expands a contact area by eliminating a crevice between a side of a radiation fin and a radiation fin support base, and between a radiation fin and a radiation fin support base It is possible to provide a heat dissipation device and a method of manufacturing a heat dissipation device that can reduce the heat resistance of the heat sink, increase the heat dissipation effect, and reduce the press load when the heat dissipation fin is caulked to the heat dissipation fin support base.
- the heat dissipating device includes a plurality of heat dissipating fins, a heat dissipating fin support base having a heat generating element mounted on one surface and a plurality of parallel fin grooves formed on the other surface, and at least one fin fin. And a protrusion having a predetermined height exposed from the bottom surface of the groove. Then, the upper part of the protrusion presses one side surface of the radiating fin, so that the other side surface of the radiating fin is pressed against the side surface of the fin groove, and the radiating fin is located between the upper part of the protrusion and the side surface of the fin groove. It is fixed.
- the protrusion is tilted toward the heat dissipating fin and the one surface of the heat dissipating fin is pressed, so that the other surface of the heat dissipating fin is the fin groove.
- the gap between the side surface of the heat radiating fin and the fin groove can be eliminated by being pressed against the side surface.
- a large contact area between the radiating fin and the fin groove can be ensured, so that the thermal resistance between the radiating fin and the radiating fin support base is reduced, and the radiating effect can be enhanced.
- FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1 in the semiconductor device using the heat dissipation device of the present invention. It is a front view of the heat radiating device in Embodiment 1 of this invention. It is a perspective view of the radiation fin support base
- FIG. 4 is a cross-sectional view taken along the line BB in FIG. 3A according to the first embodiment of the present invention.
- FIG. 4 is a cross-sectional view taken along the line CC in FIG. 3A according to the first embodiment of the present invention.
- FIG. 9 is a cross-sectional view taken along the line BB in FIG. 8A in the second embodiment of the present invention.
- FIG. 9 is a cross-sectional view taken along the line CC in FIG. 8A according to the second embodiment of the present invention. It is a figure which shows the process of widening the front-end
- FIG. 6 is a cross-sectional view taken along the line CC in FIG. 3A according to the third embodiment of the present invention. It is sectional drawing between BB of FIG. 8A in Embodiment 4 of this invention. It is a figure which shows a part of front view of the thermal radiation apparatus in Embodiment 4 of this invention. It is a perspective view of the semiconductor device using the heat dissipation equipment of this invention. It is a top view of the semiconductor device using the heat radiating device of this invention.
- FIG. 19 is a cross-sectional view taken along the line DD of FIG. 18 in the semiconductor device using the heat dissipation device of the present invention.
- This embodiment relates to a heat dissipating device for efficiently dissipating heat generated from, for example, a heat generating element used in a power converter.
- the heating element include a diode in a converter unit that converts alternating current into direct current in a power conversion device, a bipolar transistor in an inverter unit that converts direct current into alternating current, an IGBT, a MOSFET, or a GTO as a switching element.
- the present invention is not limited to the embodiments.
- FIG. 1 is a top view of a semiconductor device using a heat dissipation device showing this embodiment
- FIG. 2 is a cross-sectional view taken along the line AA in FIG.
- a lead frame 7 is joined to one surface of the radiating fin support base 1 via an insulating resin sheet 10, and the lead frame 7 and the radiating fin support base 1 are electrically insulated.
- the lead frame 7 is soldered to the heating element 9 by a metal wire.
- the lead frame 7, the radiation fin support base 1, and the radiation fin 4 are formed of members having high thermal conductivity such as copper and aluminum in order to efficiently dissipate the heat generating element 9.
- the mold resin 6 covers the heating element 9, the lead frame 7 and the metal wire 8, and electrically insulates the above members from the outside of the semiconductor device.
- the insulating resin sheet 10 is mixed with an epoxy resin and a filler such as silicon or boron nitride particles.
- the linear expansion coefficient of the insulating resin sheet 10 is preferably smaller than the linear thermal expansion coefficient of the radiating fin support base 1.
- a plurality of parallel fin grooves 2 are formed on the other surface of the radiation fin support base 1, and the radiation fins 4 are mounted in the fin grooves 2.
- FIG. 3 shows a front view of the heat dissipating device in the first embodiment.
- 3A is a view showing a state in which one radiating fin 4 is attached to one fin groove 2 in a plurality of parallel fin grooves 2 formed on the radiating fin support base 1. It is. Further, the first protrusion 3 having a predetermined height is exposed from the bottom surface of the fin groove 2.
- the height of the first protrusion 3 is configured to be lower than the upper end portion of the fin groove 2. For this reason, even if the heat radiation fin 4 is inclined with respect to the height direction of the fin groove 2, it can be inserted without interfering with the fin groove 2 or the first protrusion 3. The heat radiation fin 4 can be easily inserted.
- FIG. 3B shows a state in which the first protrusion 3 is tilted toward the heat dissipating fin 4 by pressing, and the heat dissipating fin 4 is crimped between the upper portion of the first protrusion 3 and the side surface of the fin groove 2.
- FIG. FIG. 4 is a perspective view of the radiating fin support base 1, the fin groove 2, and the first protrusion 3.
- the fin groove 2 is formed in a rectangular parallelepiped shape.
- a protrusion 3 is formed in a rectangular parallelepiped shape from the bottom of the fin groove 2.
- FIG. 5 is a cross-sectional view taken along the line BB in FIG. 3 (a)
- FIG. 6 is a cross-sectional view taken along the line CC in FIG. 3 (a).
- the length in the longitudinal direction of the first protrusion 3 and the length in the longitudinal direction of the fin groove 2 are the same as the length in the groove longitudinal direction of the radiation fin support base 1. It is.
- the heat dissipation device in the first embodiment it is desirable to manufacture by the following steps. That is, first, a process of simultaneously forming a plurality of parallel fin grooves 2 on one surface of the radiating fin support base 1 and first protrusions 3 in each fin groove 2 by die casting or extrusion molding is performed. Next, a step of attaching one heat radiating fin 4 to one fin groove 2 is performed.
- the press blade 5 is inserted between the side surface of the fin groove 2 on the side where the radiating fins 4 are not mounted and the first protrusion 3, and the press blade 5 is weighted by a press machine, thereby
- the protrusion 3 is tilted toward the heat dissipating fin 4 and the upper portion of the first protrusion 3 is pressed against one side surface of the heat dissipating fin 4 to caulk the heat dissipating fin. It fixes between the upper part of protrusion 3 of this.
- FIG. 7 is a diagram showing a step of tilting the first protrusion 3 using the press blade 5 among the above steps.
- the shape of the tip portion of the press blade 5 is such that the width of the press blade 5 toward the tip portion as shown in FIG. 7 in order to facilitate insertion between the first protrusion 3 and the fin groove 2. It is desirable to make it narrower. Moreover, in order to make the press blade 5 difficult to break and to increase the press blade angle, it is desirable to partially flatten the tip of the press blade 5. From the above, it is desirable that the shape of the press blade 5 is a trapezoid so that the width of the press blade 5 becomes narrower toward the tip.
- a press blade 5 (or a caulking jig) is inserted between the side surface of the fin groove 2 on the side where the radiating fins 4 are not mounted and the first protrusion 3. Then, the first protrusion 3 is tilted toward the radiation fin 4 side. Specifically, as shown in FIG. 7B, a press blade 5 is inserted between the side surface of the fin groove 2 on the side where the radiating fin 4 is not mounted and the first protrusion 3. Press with a press.
- a metal having high plasticity such as copper or aluminum is used as the material of the first protrusion 3
- the first protrusion 3 is deformed by the press by the press machine and follows the shape of the tip of the press blade 5.
- the upper portion of the first protrusion 3 is in a state of biting into the side surface of the radiating fin 4 while maintaining the uprightness of the radiating fin 4.
- the shape of the tip of the press blade 5 and the stroke amount of the press blade are determined in advance so that the indentation 13 is formed on the side surface.
- the tilting amount of the first protrusion 3 can be easily managed by the stroke amount of the press blade 5.
- it can be easily determined whether the pressing process has been performed normally.
- the press load applied to the press blade 5 widens the component force in the direction in which the press blade 5 travels and the vertical direction, that is, between the first protrusion 3 and the fin groove 2. It becomes the sum of the component force with the direction.
- the first protrusion 3 is It is generally known that, for example, the tip of the first protrusion 3 is deformed toward the radiating fin 4 side, that is, buckled, without tilting from the interface with the radiating fin support base 1. When the first protrusion 3 is buckled and deformed, the amount of widening between the fin groove 2 and the first protrusion 3 is reduced, and there is a concern that the radiating fin 4 cannot be normally crimped.
- the shape of the first protrusion 3 can be made trapezoidal so that its width increases from the top to the bottom.
- the first protrusion 3. Can be prevented from buckling.
- a widening amount between the fin groove 2 and the first protrusion 3 can be secured, and the radiating fin 4 can be normally crimped.
- the press blade 5 (or caulking jig) is provided between the side surface of the fin groove 2 on the side where the heat dissipating fins 4 are not mounted and the first protrusion 3.
- the heat dissipating fin 4 is caulked between the upper part of the first protrusion 3 and the side surface of the fin groove 2.
- FIG. 8 shows a front view of the heat dissipating device in the second embodiment.
- symbol is attached
- the difference from the first embodiment is the point that two radiating fins are attached to one fin groove and the shape of the protrusion.
- FIG. 8A is a view showing a state in which two radiating fins 4 are attached to one fin groove 2 in a plurality of parallel fin grooves 2 formed in the radiating fin support base 1. . Further, a bifurcated second protrusion 11 having a predetermined height is exposed from the bottom surface of the substantially central portion of the fin groove 2. Here, the point that the height of the second protrusion 11 is configured to be lower than the upper end of the fin groove 2 is the same as in the first embodiment.
- FIG. 8B shows that the concave portion of the tip portion formed in the forked shape of the second protrusion 11 is widened by pressing so that the heat radiating fin 4 is placed on the upper portion of the second protrusion 11 and the side surface of the fin groove 2.
- FIG. 9 is a perspective view of the second protrusion 11.
- FIG. 9 shows a state in which each of the tip portions formed at the fork of the second protrusion 11 is trapezoidal so that the width increases from the top to the bottom of the second protrusion 11. .
- the respective shapes of the tip portions formed at the two branches of the second protrusion 11 may be rectangular.
- FIG. 10 is a cross-sectional view taken along the line BB in FIG. 8 (a)
- FIG. 11 is a cross-sectional view taken along the line CC in FIG. 8 (a).
- the same components as those in FIGS. 5 and 6 are denoted by the same reference numerals, and the description thereof is omitted. From these figures, in the second embodiment, the length of each of the second protrusion 11 and the fin groove 2 in the groove longitudinal direction is the same as the length of the radiating fin support base 1 in the groove longitudinal direction.
- the heat dissipation device in the second embodiment it is desirable to manufacture by the steps shown below. That is, a process of first forming a plurality of parallel fin grooves 2 on one surface of the radiating fin support base 1 and simultaneously forming a second protrusion 11 in each fin groove 2 so as to form a tip end portion in a bifurcated shape. Go through.
- the heat radiating fin support base 1, the fin grooves 2, and the second protrusions 11 are all formed by die casting or extrusion as in the first embodiment.
- a process of attaching two heat dissipating fins to one fin groove 2 is performed.
- the press blade 5 is inserted into the concave portion of the tip portion of the second protrusion 11 formed in a bifurcated shape, and the press blade 5 is weighted by a pressing machine, so that the tip portion of the second protrusion 11 is widened.
- the heat radiating fin 4 is fixed between the side surface of the fin groove 2 and the upper portion of the second protrusion 11.
- FIG. 12 is a diagram showing a step of widening the forked portion of the second protrusion 11 using the press blade 5 among the steps described above.
- symbol is attached
- the press blade 5 (or caulking jig) is inserted into the concave portion of the tip portion of the second protrusion 11 formed in the forked shape. Thereafter, a further load is applied to the press blade 5, and the press blade 5 is advanced until it abuts against the bottom of the tip portion of the second protrusion 11 formed in the forked shape.
- the second protrusion 11 is deformed and shown in FIG. 12 (b).
- the tip of the second protrusion 11 is widened according to the shape of the tip of the press blade 5.
- one upper portion of the second protrusion 11 formed in a bifurcated shape presses the radiating fin 4 against the side surface of the fin groove 2, so that the radiating fin 4 is connected to the upper portion of the first protrusion 3 and the fin groove 2. Caulked between the sides.
- the tip of the press blade 5 comes into contact with the bottom of the tip of the second protrusion 11 formed in a bifurcated shape and stops, as shown in FIG.
- the shape of the tip of the press blade 5 is such that the upper part of the second protrusion 11 is in a state of being bitten into the side surface of the heat radiating fin 4 while maintaining the uprightness of the heat radiating fin 4 and the dent 13 is formed on the side surface of the heat radiating fin 4.
- the stroke amount of the press blade is determined in advance. This makes it possible to easily manage the widening amount of the tip portion of the second protrusion 11 formed in the forked shape by the stroke amount of the press blade 5. Furthermore, by visually observing the side surface of the radiating fin 4, it can be easily determined whether the pressing process has been performed normally.
- the press blade 5 (or caulking jig) is inserted into the concave portion of the tip portion of the second protrusion 11 formed in the forked shape, and the tip portion of the second protrusion 11 is inserted. Is widened, so that one upper portion of the second protrusion 11 formed in a bifurcated shape presses the radiating fin 4 against the side surface of the fin groove 2, so that the radiating fin 4 and the upper portion of the first protrusion 3 are A mounting structure of the heat radiation fin that is caulked between the side surfaces of the fin groove 2 and has good adhesion between the heat radiation fin 4 and the side surface of the fin groove 2 can be obtained. As a result, a large contact area between the radiating fins 4 and the fin grooves 2 can be secured, so that the thermal resistance between the radiating fins and the radiating fin support base is reduced, and the heat radiating effect can be enhanced.
- the concave portion at the tip of the second protrusion 11 formed in a bifurcated shape is used. It is only necessary to caulk one place with the press blade 4 (or caulking jig). As a result, the number of press blades used in the manufacturing process of the heat dissipation device can be reduced as compared with the prior art, thereby reducing the load required at the time of pressing, and the press device can be downsized. .
- the second protrusion 11 having a bifurcated tip is used, but the first protrusion 3 used in the first embodiment is replaced with a fin instead of the above.
- Two of the grooves 3 may be arranged at substantially the center of the groove 3 to be realized.
- Embodiment 3 In the first embodiment and the second embodiment, the length in the groove longitudinal direction of each of the first protrusion 3, the second protrusion 11, and the fin groove 2 is the same as the length in the groove longitudinal direction of the radiating fin support base 1. And each was a series.
- the first protrusion 3 and the fin groove 2 in the first embodiment are each divided into a plurality of pieces in the groove longitudinal direction, and the divided first protrusion 3 and fin groove 2 have the same length. Now they are arranged in pairs.
- FIG. 13 is a cross-sectional view taken along the line BB in FIG. 3 (a)
- FIG. 14 is a cross-sectional view taken along the line CC in FIG. 3 (a).
- the same components as those in FIGS. 5 and 6 are denoted by the same reference numerals, and the description thereof is omitted.
- the first protrusion 3 and the fin groove 2 are each divided into two in the groove longitudinal direction, and the divided first protrusion 3 and fin groove 2 have the same length. Are arranged in pairs.
- Embodiment 3 when the first protrusion 3 and the fin groove 2 are formed by die casting, the dividing surface of the first protrusion 3 and the fin groove 2 is the first protrusion 3 and the fin groove 2. 2 is formed using a mold. On the other hand, when the 1st protrusion 3 and the fin groove 2 are formed by extrusion molding, it forms by cutting a division surface after shaping
- the contact surface between the radiation fin 4 and the side surface of the fin groove 2 due to the difference in linear expansion of the fin groove 2, the first protrusion 3 and the radiation fin 4, and Stress is applied to each of the contact surfaces between the radiating fins 4 and the upper portions of the first protrusions 3.
- the absolute value of the expansion / contraction amount increases, and thus the stress increases.
- the fin groove 2, the first protrusion 3 or the radiation fin 4 is deformed, and the contact surface between the radiation fin 4 and the side surface of the fin groove 2 and the contact surface between the radiation fin 4 and the upper portion of the first protrusion 3.
- the contact area is reduced.
- the thermal resistance between the radiating fins 4 and the fin grooves 2 increases, and there is a concern that the radiating effect deteriorates.
- the third embodiment by dividing the fin groove 2 and the first protrusion 3 in two in the groove longitudinal direction, the length of each fin groove and protrusion is shortened. As a result, the amount of expansion and contraction can be reduced, and the absolute value of the stress can be reduced. As described above, even in an environment where the ambient temperature is extremely low, a large contact area is ensured on the contact surface between the radiation fin 4 and the side surface of the fin groove 2 and the contact surface between the radiation fin 4 and the upper portion of the first protrusion 3. Therefore, it is possible to prevent an increase in thermal resistance between the radiating fins 4 and the fin grooves 2 in the above environment.
- the load required when the first protrusion 3 is pressed as described above is reduced, so that the press load can be further reduced.
- the fin groove 2 and the first protrusion 3 are each divided into two in the groove longitudinal direction, so that the fin groove 2 and the first protrusion 3 can be used even in an environment where the ambient temperature is extremely low.
- the amount of expansion and contraction of each of the protrusions 3 can be reduced, and a large contact area can be ensured on the contact surface between the radiating fin 4 and the side surface of the fin groove 2 and the contact surface between the radiating fin 4 and the upper portion of the first protrusion 3. Therefore, it is possible to prevent an increase in thermal resistance between the radiating fins 4 and the fin grooves 2 in the above environment.
- each of the fin groove 2 and the first protrusion 3 is divided into two pieces in the groove longitudinal direction.
- each of the fin groove 2 and the first protrusion 3 is divided into, for example, three pieces in the groove longitudinal direction. It is also possible to change the height.
- each of the fin grooves 2 is divided into three in the groove longitudinal direction, and the second protrusions 11 are formed at both ends of the radiating fin support base 1 in the divided fin grooves 2. It is arranged in pairs with the same length as the arranged fin grooves.
- the fins 2 in which the third protrusions 12 are divided are arranged in pairs with the same length as the fin grooves 2 arranged in the center of the heat radiation fin support base 1. Further, the height of the third protrusion 12 is higher than that of the second protrusion 11. As a result, as shown in FIG. 16, the radiating fin 4 is fixed by projections having different heights, that is, the second projection 11 and the third projection 12.
- the radiating fin support base 1 is warped or has dimensional variations, Due to misalignment or the like, the amount of widening of the recess formed at the tip of the second protrusion 11 changes. For example, when the amount of widening at the tip of the second protrusion 11 is large, the radiating fin 4 tends to be deformed in a dogleg shape toward the second protrusion 11 with the upper part of the second protrusion 11 as a base point.
- the three fin grooves 2 have the same height, but the height of the second protrusions 11 disposed at both ends of the radiating fin support base 1 is higher than that of the radiating fin support base 1.
- the height of the third protrusion 12 disposed in the center is increased.
- the 2nd protrusion 11 and the 3rd protrusion 12 are crimping the radiation fin 4 in the position where the height direction of a radiation fin differs, respectively. Therefore, the stress applied to the contact surface between the radiating fin 4 and the protrusion is dispersed on the contact surface between the upper part of the second protrusion 11 and the upper part of the third protrusion 12, and the radiating fin 4 is deformed into a dogleg shape. Can be prevented.
- the radiating fin 4 when the radiating fin 4 is inserted between the second protrusion 11 and the third protrusion 12 and the fin groove 2, the radiating fin 4 is interposed between the high third protrusion 12 and the fin groove 2. After being inserted, it is inserted between the second projection 11 having a low height and the fin groove 2. That is, the radiating fin 4 is inserted between the second protrusion 11 and the fin groove 2 in a state where rattling is suppressed between the third protrusion 12 and the fin groove 2. As a result, the radiating fin 4 can be easily inserted between the second protrusion 11 and the third protrusion 12 and the fin groove 2.
- the radiating fin 4 when the radiating fin 4 is long, when the radiating fin 4 is inserted between the second protrusion 11 and the third protrusion 12 and the fin groove 2, the radiating fin 4 tilts to the both ends of the radiating fin support base. It becomes difficult to insert into a certain second protrusion 11.
- the heat radiation fin 4 since the above-described third protrusion 12 having a high height can prevent the above-described heat radiation fin 4 from being inclined, the heat radiation fin 4 can be easily attached to the second protrusion 11 and the first protrusion. It can be inserted between the three protrusions 12 and the fin groove 2.
- the heat dissipation device After the heat dissipation fin 4 is inserted between the second protrusion 11 and the third protrusion 12 and the fin groove 2, the heat dissipation device is transported to the place where the press device is installed. . At this time, since the height of the third protrusion 12 is high, it is possible to suppress the inclination and the collapse of the radiating fin 4 during the conveyance.
- each of the fin grooves 2 is divided into three in the groove longitudinal direction, and the second protrusion 11 having a low height is the heat dissipation fin support base in the divided fin grooves 2.
- a pair of fin grooves arranged at both ends of the same length as the fin grooves.
- the fin grooves 2 are arranged in pairs with the same length as the fin grooves 2 disposed in the center of the heat radiation fin support base 1. As a result, the radiation fin 4 can be more reliably fixed between the second protrusion 11 and the third protrusion 12 and the fin groove 2.
- FIG. 17 is a perspective view of the semiconductor device
- FIG. 18 is a top view of the semiconductor device.
- FIG. 19 shows a cross-sectional view taken along the line DD in FIG.
- symbol is attached
- the radiating fin support base 1 and the radiating fins 4 whose sides and bottom are covered with the mold resin 6 are individualized.
- the fin length of the radiating fin 4 can be made longer than the length of the radiating fin 4 of the mold resin 6 in the longitudinal direction, and the fin pitch between adjacent radiating fins can be narrowed, thereby reducing the installation area of the semiconductor device. can do.
- the heat radiation effect can be expanded.
- an element having a small absolute maximum rating of the junction temperature can be selected as the heating element 9, and accordingly, the heating element can be reduced in size and cost.
- the side surface and the bottom surface of the radiating fin support base 1 are covered with the mold resin 6. Since the radiating fin support base 1 is formed by die casting or extrusion as described above, the radiating fin support base 1 may be in a state accompanied by warpage or undulation. In addition, the radiating fin support base 1 may expand and further deform due to changes in the ambient temperature. For the above reasons, the force that presses the radiating fins 4 against the side surfaces of the fin grooves 2 is reduced, and the heat resistance between the radiating fins 4 and the fin grooves 2 is increased, resulting in poor heat dissipation. Is concerned.
- the side surface and bottom surface of the radiating fin support base 1 can be constrained, and the expansion and deformation of the radiating fin support base 1 are suppressed. be able to. As a result, it can prevent that the force which presses the radiation fin 4 to the fin groove 2 falls, and the said heat dissipation can be prevented from deteriorating.
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Abstract
Description
図3は、実施の形態1における放熱機器の正面図を示すものである。このうち、図3(a)は、放熱フィン支持基盤1に形成された複数の平行なフィン溝2に、一個のフィン溝2に対して一個の放熱フィン4が装着されている状態を示す図である。また、フィン溝2の底面から所定の高さを有する第一の突起3が露出している。ここで第一の突起3の高さは、フィン溝2の上端部よりも低くなるように構成されている。このため、放熱フィン4をフィン溝2の高さ方向に対して斜めに傾けた状態でも、フィン溝2や第一の突起3と干渉することなく挿入することができ、放熱機器の製造工程において放熱フィン4の挿入が容易になる。
図8は、実施の形態2における放熱機器の正面図を示すものである。なお、図3と同一の構成には同一の符号を付し、それらの説明を省略する。実施の形態1との違いは、一個のフィン溝に対して二個の放熱フィンを装着する点及び突起の形状である。
実施の形態1及び実施の形態2においては、第一の突起3、第二の突起11及びフィン溝2それぞれの溝長手方向の長さは、放熱フィン支持基盤1の溝長手方向の長さと同じでかつそれぞれが一連のものであった。この実施の形態3では、例えば実施の形態1における第一の突起3及びフィン溝2をそれぞれ溝長手方向に複数個に分割し、分割された第一の突起3とフィン溝2がそれぞれ同じ長さで対をなして配置されている。
実施の形態3においては、フィン溝2及び第一の突起3それぞれ溝長手方向に二個に分割したが、それぞれを例えば溝長手方向に三個に分割し、分割したフィン溝及び突起それぞれの高さを変えることも可能である。
2 フィン溝
3 第一の突起
4 放熱フィン
5 プレス刃
9 発熱素子
11 第二の突起
12 第三の突起
Claims (8)
- 複数の放熱フィンと、
一面に発熱素子が実装され、他面には複数の平行なフィン溝が形成された放熱フィン支持基盤と、
上記フィン溝には、少なくとも一個の放熱フィンが装着され、かつ溝の底面から露出した所定の高さの突起を有し、
上記突起の上部が放熱フィンの一側面を押し付けることにより、上記放熱フィンの他側面が上記フィン溝の側面に押圧され、上記放熱フィンが上記突起の上部とフィン溝の側面との間に固定されることを特徴とする放熱機器。
- フィン溝にはそれぞれ、二個の放熱フィンが装着されることを特徴とする請求項1に記載の放熱機器。
- 突起は、その先端部が二股状に分岐していることを特徴とする請求項2に記載の放熱機器。
- フィン溝と突起は、それぞれフィン溝の長手方向に複数個に分割され、上記分割されたフィン溝と突起は、それぞれ上記フィン溝の長手方向に同じ長さで対をなして配置されていることを特徴とする請求項1乃至3に記載の放熱機器。
- 分割された突起の高さが、分割された突起毎にそれぞれ異なることを特徴とする請求項4に記載の放熱機器。
- 分割された突起のうち、放熱フィン支持の基盤の両側に配置された突起の高さよりも、上記放熱フィン支持基盤の中央部に配置された突起の高さの方が高いことを特長とする請求項5に記載の放熱機器。
- 放熱フィン支持基盤の一面に複数の平行なフィン溝と突起とを同時に形成する工程と、
一個のフィン溝に対して一個の放熱フィンを上記フィン溝に装着する工程と、
放熱フィンの上部にプレス刃5を当接させ、同時に上記フィン溝の側面のうち放熱フィンが装着されていない側の側面と、上記突起の間にプレス刃を挿入する工程と、
上記プレス刃をプレス機により加重することにより、上記突起を放熱フィン側に傾倒させて、上記突起の上部を放熱フィンの一側面に押し付けて放熱フィンをカシメる工程とを含む放熱機器の製造方法。
- 放熱フィン支持基盤の一面に複数の平行なフィン溝を形成し、同時に突起をその先端部を二股状に成形するように形成する工程と、
一個のフィン溝に対して二個の放熱フィンを上記フィン溝に装着する工程と、
上記突起の二股状に形成された先端部の凹部にプレス刃を挿入する工程と、
上記プレス刃をプレス機により加重することにより、上記突起の先端部を拡幅させて、上記突起の上部を放熱フィンの一側面に押し付けて放熱フィンをカシメる工程とを含む放熱機器の製造方法。
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EP09851406.0A EP2503593B1 (en) | 2009-11-17 | 2009-11-17 | Heat dissipating device and method for manufacturing heat dissipating device |
US13/510,162 US9134076B2 (en) | 2009-11-17 | 2009-11-17 | Radiator and method of manufacturing radiator |
JP2011541722A JP5418601B2 (ja) | 2009-11-17 | 2009-11-17 | 放熱機器及び放熱機器の製造方法 |
CN200980162488.5A CN102668066B (zh) | 2009-11-17 | 2009-11-17 | 散热设备及散热设备的制造方法 |
PCT/JP2009/006141 WO2011061779A1 (ja) | 2009-11-17 | 2009-11-17 | 放熱機器及び放熱機器の製造方法 |
TW099100062A TWI434020B (zh) | 2009-11-17 | 2010-01-05 | 散熱機器及散熱機器之製造方法 |
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JP2013135209A (ja) * | 2011-12-22 | 2013-07-08 | 崇賢 ▲黄▼ | ヒートシンク及びその製造方法 |
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JPWO2013114647A1 (ja) * | 2012-01-31 | 2015-05-11 | 三菱電機株式会社 | 半導体装置とその製造方法 |
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JP2013229456A (ja) * | 2012-04-26 | 2013-11-07 | Mitsubishi Electric Corp | ヒートシンクおよびヒートシンク一体型半導体モジュール |
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WO2015046040A1 (ja) * | 2013-09-27 | 2015-04-02 | 三菱電機株式会社 | かしめヒートシンクおよびヒートシンク一体型パワーモジュール |
JPWO2015046040A1 (ja) * | 2013-09-27 | 2017-03-09 | 三菱電機株式会社 | かしめヒートシンク、ヒートシンク一体型パワーモジュール、かしめヒートシンクの製造方法、および、ヒートシンク一体型パワーモジュールの製造方法 |
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JP2020098882A (ja) * | 2018-12-19 | 2020-06-25 | アイシン精機株式会社 | 半導体装置及びその製造方法 |
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Also Published As
Publication number | Publication date |
---|---|
US9134076B2 (en) | 2015-09-15 |
TW201118331A (en) | 2011-06-01 |
EP2503593B1 (en) | 2017-12-20 |
TWI434020B (zh) | 2014-04-11 |
EP2503593A1 (en) | 2012-09-26 |
CN102668066A (zh) | 2012-09-12 |
CN102668066B (zh) | 2015-04-29 |
EP2503593A4 (en) | 2014-01-15 |
JP5418601B2 (ja) | 2014-02-19 |
US20120227952A1 (en) | 2012-09-13 |
JPWO2011061779A1 (ja) | 2013-04-04 |
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