TWI884320B - 聚合性化合物、活性能量線硬化性樹脂組成物、硬化物、抗蝕用組成物、及抗蝕膜 - Google Patents

聚合性化合物、活性能量線硬化性樹脂組成物、硬化物、抗蝕用組成物、及抗蝕膜 Download PDF

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Publication number
TWI884320B
TWI884320B TW110136507A TW110136507A TWI884320B TW I884320 B TWI884320 B TW I884320B TW 110136507 A TW110136507 A TW 110136507A TW 110136507 A TW110136507 A TW 110136507A TW I884320 B TWI884320 B TW I884320B
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TW
Taiwan
Prior art keywords
compound
polymerizable compound
polymerizable
unsaturated group
meth
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TW110136507A
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English (en)
Chinese (zh)
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TW202231614A (zh
Inventor
今田知之
長江教夫
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日商Ｄｉｃ股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/34—Monomers containing two or more unsaturated aliphatic radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/025—Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
TW110136507A 2020-12-15 2021-09-30 聚合性化合物、活性能量線硬化性樹脂組成物、硬化物、抗蝕用組成物、及抗蝕膜 TWI884320B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2020-207389 2020-12-15
JP2020207389 2020-12-15

Publications (2)

Publication Number Publication Date
TW202231614A TW202231614A (zh) 2022-08-16
TWI884320B true TWI884320B (zh) 2025-05-21

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TW110136507A TWI884320B (zh) 2020-12-15 2021-09-30 聚合性化合物、活性能量線硬化性樹脂組成物、硬化物、抗蝕用組成物、及抗蝕膜

Country Status (5)

Country Link
JP (1) JP7288233B2 (https=)
KR (1) KR102906921B1 (https=)
CN (1) CN116670184B (https=)
TW (1) TWI884320B (https=)
WO (1) WO2022130921A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021181958A1 (ja) * 2020-03-10 2021-09-16 Dic株式会社 （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000007758A (ja) * 1998-06-27 2000-01-11 Nagase Chiba Kk Ｂ−ステージ化できる液状エポキシ樹脂組成物
TW201908360A (zh) * 2017-07-21 2019-03-01 日商迪愛生股份有限公司 環氧樹脂、及含有其之環氧樹脂組成物、以及使用該環氧樹脂組成物之硬化物
JP2020117612A (ja) * 2019-01-23 2020-08-06 Dic株式会社 エポキシ（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3309339A (en) * 1963-11-12 1967-03-14 Allied Chem New trisphenols and epoxide resins prepared therefrom
AU2003221053A1 (en) * 2002-03-29 2003-10-27 Taiyo Ink Manufacturing Co., Ltd. Unsaturated polybranched compounds, curable compositions containing the same and cured articles thereof
JP4714135B2 (ja) * 2002-03-29 2011-06-29 太陽ホールディングス株式会社 不飽和基含有多分岐化合物、それを含有する硬化性組成物及びその硬化物
JP2010285403A (ja) 2009-06-15 2010-12-24 Nissan Chem Ind Ltd 架橋剤及び該架橋剤を含有するレジスト下層膜形成組成物
CN103694430B (zh) 2014-01-02 2016-02-10 河北大学 聚不饱和酸没食子酸环氧酯医用高分子材料制备方法
JP6402968B2 (ja) * 2014-03-03 2018-10-10 Dic株式会社 （メタ）アクリロイル基含有樹脂、（メタ）アクリロイル基含有樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料
JP6575838B2 (ja) * 2017-07-14 2019-09-18 Dic株式会社 エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物
WO2020137309A1 (ja) * 2018-12-26 2020-07-02 Dic株式会社 レジスト組成物
JP7192521B2 (ja) * 2019-01-23 2022-12-20 Dic株式会社 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
JP7375347B2 (ja) * 2019-06-28 2023-11-08 Dic株式会社 エポキシ化合物、組成物、硬化物及び積層体
WO2021181958A1 (ja) * 2020-03-10 2021-09-16 Dic株式会社 （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000007758A (ja) * 1998-06-27 2000-01-11 Nagase Chiba Kk Ｂ−ステージ化できる液状エポキシ樹脂組成物
TW201908360A (zh) * 2017-07-21 2019-03-01 日商迪愛生股份有限公司 環氧樹脂、及含有其之環氧樹脂組成物、以及使用該環氧樹脂組成物之硬化物
JP2020117612A (ja) * 2019-01-23 2020-08-06 Dic株式会社 エポキシ（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品

Also Published As

Publication number Publication date
CN116670184B (zh) 2025-12-09
TW202231614A (zh) 2022-08-16
CN116670184A (zh) 2023-08-29
WO2022130921A1 (ja) 2022-06-23
KR102906921B1 (ko) 2026-01-05
KR20230051687A (ko) 2023-04-18
JPWO2022130921A1 (https=) 2022-06-23
JP7288233B2 (ja) 2023-06-07

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