JPWO2022130921A1 - - Google Patents
Info
- Publication number
- JPWO2022130921A1 JPWO2022130921A1 JP2022569817A JP2022569817A JPWO2022130921A1 JP WO2022130921 A1 JPWO2022130921 A1 JP WO2022130921A1 JP 2022569817 A JP2022569817 A JP 2022569817A JP 2022569817 A JP2022569817 A JP 2022569817A JP WO2022130921 A1 JPWO2022130921 A1 JP WO2022130921A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F12/34—Monomers containing two or more unsaturated aliphatic radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/025—Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Engineering & Computer Science (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020207389 | 2020-12-15 | ||
| JP2020207389 | 2020-12-15 | ||
| PCT/JP2021/043093 WO2022130921A1 (ja) | 2020-12-15 | 2021-11-25 | 重合性化合物、活性エネルギー線硬化性樹脂組成物、硬化物、レジスト用組成物、及びレジスト膜 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022130921A1 true JPWO2022130921A1 (https=) | 2022-06-23 |
| JPWO2022130921A5 JPWO2022130921A5 (https=) | 2023-02-24 |
| JP7288233B2 JP7288233B2 (ja) | 2023-06-07 |
Family
ID=82058785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022569817A Active JP7288233B2 (ja) | 2020-12-15 | 2021-11-25 | 重合性化合物、活性エネルギー線硬化性樹脂組成物、硬化物、レジスト用組成物、及びレジスト膜 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7288233B2 (https=) |
| KR (1) | KR102906921B1 (https=) |
| CN (1) | CN116670184B (https=) |
| TW (1) | TWI884320B (https=) |
| WO (1) | WO2022130921A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021181958A1 (ja) * | 2020-03-10 | 2021-09-16 | Dic株式会社 | （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000007758A (ja) * | 1998-06-27 | 2000-01-11 | Nagase Chiba Kk | Ｂ−ステージ化できる液状エポキシ樹脂組成物 |
| JP2007162027A (ja) * | 2002-03-29 | 2007-06-28 | Taiyo Ink Mfg Ltd | 不飽和基含有多分岐化合物、それを含有する硬化性組成物及びその硬化物 |
| CN103694430A (zh) * | 2014-01-02 | 2014-04-02 | 河北大学 | 聚不饱和酸没食子酸环氧酯医用高分子材料制备方法 |
| WO2019017013A1 (ja) * | 2017-07-21 | 2019-01-24 | Dic株式会社 | エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物 |
| JP2020117612A (ja) * | 2019-01-23 | 2020-08-06 | Dic株式会社 | エポキシ（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品 |
| JP2021008410A (ja) * | 2019-06-28 | 2021-01-28 | Dic株式会社 | エポキシ化合物、組成物、硬化物及び積層体 |
| WO2021181958A1 (ja) * | 2020-03-10 | 2021-09-16 | Dic株式会社 | （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3309339A (en) * | 1963-11-12 | 1967-03-14 | Allied Chem | New trisphenols and epoxide resins prepared therefrom |
| AU2003221053A1 (en) * | 2002-03-29 | 2003-10-27 | Taiyo Ink Manufacturing Co., Ltd. | Unsaturated polybranched compounds, curable compositions containing the same and cured articles thereof |
| JP2010285403A (ja) | 2009-06-15 | 2010-12-24 | Nissan Chem Ind Ltd | 架橋剤及び該架橋剤を含有するレジスト下層膜形成組成物 |
| JP6402968B2 (ja) * | 2014-03-03 | 2018-10-10 | Dic株式会社 | （メタ）アクリロイル基含有樹脂、（メタ）アクリロイル基含有樹脂の製造方法、硬化性樹脂材料、その硬化物、及びレジスト材料 |
| JP6575838B2 (ja) * | 2017-07-14 | 2019-09-18 | Dic株式会社 | エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物 |
| WO2020137309A1 (ja) * | 2018-12-26 | 2020-07-02 | Dic株式会社 | レジスト組成物 |
| JP7192521B2 (ja) * | 2019-01-23 | 2022-12-20 | Dic株式会社 | 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材 |
-
2021
- 2021-09-30 TW TW110136507A patent/TWI884320B/zh active
- 2021-11-25 JP JP2022569817A patent/JP7288233B2/ja active Active
- 2021-11-25 WO PCT/JP2021/043093 patent/WO2022130921A1/ja not_active Ceased
- 2021-11-25 KR KR1020237009036A patent/KR102906921B1/ko active Active
- 2021-11-25 CN CN202180084130.6A patent/CN116670184B/zh active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000007758A (ja) * | 1998-06-27 | 2000-01-11 | Nagase Chiba Kk | Ｂ−ステージ化できる液状エポキシ樹脂組成物 |
| JP2007162027A (ja) * | 2002-03-29 | 2007-06-28 | Taiyo Ink Mfg Ltd | 不飽和基含有多分岐化合物、それを含有する硬化性組成物及びその硬化物 |
| CN103694430A (zh) * | 2014-01-02 | 2014-04-02 | 河北大学 | 聚不饱和酸没食子酸环氧酯医用高分子材料制备方法 |
| WO2019017013A1 (ja) * | 2017-07-21 | 2019-01-24 | Dic株式会社 | エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物 |
| JP2020117612A (ja) * | 2019-01-23 | 2020-08-06 | Dic株式会社 | エポキシ（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品 |
| JP2021008410A (ja) * | 2019-06-28 | 2021-01-28 | Dic株式会社 | エポキシ化合物、組成物、硬化物及び積層体 |
| WO2021181958A1 (ja) * | 2020-03-10 | 2021-09-16 | Dic株式会社 | （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116670184B (zh) | 2025-12-09 |
| TW202231614A (zh) | 2022-08-16 |
| CN116670184A (zh) | 2023-08-29 |
| WO2022130921A1 (ja) | 2022-06-23 |
| KR102906921B1 (ko) | 2026-01-05 |
| KR20230051687A (ko) | 2023-04-18 |
| JP7288233B2 (ja) | 2023-06-07 |
| TWI884320B (zh) | 2025-05-21 |
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