JPWO2022130921A1 - - Google Patents

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Publication number
JPWO2022130921A1
JPWO2022130921A1 JP2022569817A JP2022569817A JPWO2022130921A1 JP WO2022130921 A1 JPWO2022130921 A1 JP WO2022130921A1 JP 2022569817 A JP2022569817 A JP 2022569817A JP 2022569817 A JP2022569817 A JP 2022569817A JP WO2022130921 A1 JPWO2022130921 A1 JP WO2022130921A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022569817A
Other versions
JPWO2022130921A5 (ja
JP7288233B2 (ja
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Application granted granted Critical
Publication of JP7288233B2 publication Critical patent/JP7288233B2/ja
Active legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/34—Monomers containing two or more unsaturated aliphatic radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/025—Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
JP2022569817A 2020-12-15 2021-11-25 重合性化合物、活性エネルギー線硬化性樹脂組成物、硬化物、レジスト用組成物、及びレジスト膜 Active JP7288233B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020207389 2020-12-15
JP2020207389 2020-12-15
PCT/JP2021/043093 WO2022130921A1 (ja) 2020-12-15 2021-11-25 重合性化合物、活性エネルギー線硬化性樹脂組成物、硬化物、レジスト用組成物、及びレジスト膜

Publications (3)

Publication Number Publication Date
JPWO2022130921A1 true JPWO2022130921A1 (ja) 2022-06-23
JPWO2022130921A5 JPWO2022130921A5 (ja) 2023-02-24
JP7288233B2 JP7288233B2 (ja) 2023-06-07

Family

ID=82058785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022569817A Active JP7288233B2 (ja) 2020-12-15 2021-11-25 重合性化合物、活性エネルギー線硬化性樹脂組成物、硬化物、レジスト用組成物、及びレジスト膜

Country Status (5)

Country Link
JP (1) JP7288233B2 (ja)
KR (1) KR20230051687A (ja)
CN (1) CN116670184A (ja)
TW (1) TW202231614A (ja)
WO (1) WO2022130921A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021181958A1 (ja) * 2020-03-10 2021-09-16 Dic株式会社 （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000007758A (ja) * 1998-06-27 2000-01-11 Nagase Chiba Kk Ｂ−ステージ化できる液状エポキシ樹脂組成物
JP2007162027A (ja) * 2002-03-29 2007-06-28 Taiyo Ink Mfg Ltd 不飽和基含有多分岐化合物、それを含有する硬化性組成物及びその硬化物
CN103694430A (zh) * 2014-01-02 2014-04-02 河北大学 聚不饱和酸没食子酸环氧酯医用高分子材料制备方法
WO2019017013A1 (ja) * 2017-07-21 2019-01-24 Dic株式会社 エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物
JP2020117612A (ja) * 2019-01-23 2020-08-06 Dic株式会社 エポキシ（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品
JP2021008410A (ja) * 2019-06-28 2021-01-28 Dic株式会社 エポキシ化合物、組成物、硬化物及び積層体
WO2021181958A1 (ja) * 2020-03-10 2021-09-16 Dic株式会社 （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285403A (ja) 2009-06-15 2010-12-24 Nissan Chem Ind Ltd 架橋剤及び該架橋剤を含有するレジスト下層膜形成組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000007758A (ja) * 1998-06-27 2000-01-11 Nagase Chiba Kk Ｂ−ステージ化できる液状エポキシ樹脂組成物
JP2007162027A (ja) * 2002-03-29 2007-06-28 Taiyo Ink Mfg Ltd 不飽和基含有多分岐化合物、それを含有する硬化性組成物及びその硬化物
CN103694430A (zh) * 2014-01-02 2014-04-02 河北大学 聚不饱和酸没食子酸环氧酯医用高分子材料制备方法
WO2019017013A1 (ja) * 2017-07-21 2019-01-24 Dic株式会社 エポキシ樹脂、およびこれを含むエポキシ樹脂組成物、並びに前記エポキシ樹脂組成物を用いた硬化物
JP2020117612A (ja) * 2019-01-23 2020-08-06 Dic株式会社 エポキシ（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物及び物品
JP2021008410A (ja) * 2019-06-28 2021-01-28 Dic株式会社 エポキシ化合物、組成物、硬化物及び積層体
WO2021181958A1 (ja) * 2020-03-10 2021-09-16 Dic株式会社 （メタ）アクリレート樹脂、活性エネルギー線硬化性（メタ）アクリレート樹脂組成物、及びレジスト下層膜、並びに（メタ）アクリレート樹脂の製造方法

Also Published As

Publication number Publication date
KR20230051687A (ko) 2023-04-18
CN116670184A (zh) 2023-08-29
TW202231614A (zh) 2022-08-16
JP7288233B2 (ja) 2023-06-07
WO2022130921A1 (ja) 2022-06-23

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