TWI831743B - 半導體裝置、顯示裝置以及半導體裝置的製造方法 - Google Patents
半導體裝置、顯示裝置以及半導體裝置的製造方法 Download PDFInfo
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- TWI831743B TWI831743B TW107116241A TW107116241A TWI831743B TW I831743 B TWI831743 B TW I831743B TW 107116241 A TW107116241 A TW 107116241A TW 107116241 A TW107116241 A TW 107116241A TW I831743 B TWI831743 B TW I831743B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Geometry (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017099571 | 2017-05-19 | ||
| JP2017-099571 | 2017-05-19 | ||
| JP2017-133092 | 2017-07-06 | ||
| JP2017133092 | 2017-07-06 | ||
| JP2017-216684 | 2017-11-09 | ||
| JP2017216684 | 2017-11-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201903967A TW201903967A (zh) | 2019-01-16 |
| TWI831743B true TWI831743B (zh) | 2024-02-11 |
Family
ID=64273557
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107116241A TWI831743B (zh) | 2017-05-19 | 2018-05-14 | 半導體裝置、顯示裝置以及半導體裝置的製造方法 |
| TW112130256A TWI880293B (zh) | 2017-05-19 | 2018-05-14 | 半導體裝置、顯示裝置以及半導體裝置的製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112130256A TWI880293B (zh) | 2017-05-19 | 2018-05-14 | 半導體裝置、顯示裝置以及半導體裝置的製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11152512B2 (enExample) |
| JP (2) | JP2019075532A (enExample) |
| KR (2) | KR102696580B1 (enExample) |
| CN (2) | CN117116946A (enExample) |
| TW (2) | TWI831743B (enExample) |
| WO (1) | WO2018211351A1 (enExample) |
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| JP6790950B2 (ja) * | 2017-03-22 | 2020-11-25 | Tdk株式会社 | 状態検出装置 |
| US11139562B2 (en) * | 2018-09-14 | 2021-10-05 | Innolux Corporation | Antenna device |
| CN110911382B (zh) * | 2018-09-14 | 2021-06-25 | 群创光电股份有限公司 | 天线装置 |
| CN110190132A (zh) * | 2019-05-17 | 2019-08-30 | 深圳市华星光电半导体显示技术有限公司 | 薄膜晶体管器件及其制备方法 |
| US11662258B2 (en) * | 2019-05-29 | 2023-05-30 | Wiliot, LTD. | Force sensor integrated on substrate |
| US10944027B2 (en) * | 2019-06-14 | 2021-03-09 | X Display Company Technology Limited | Pixel modules with controllers and light emitters |
| KR102708310B1 (ko) * | 2019-07-05 | 2024-09-24 | 주성엔지니어링(주) | 박막 트랜지스터 |
| KR20210010333A (ko) * | 2019-07-19 | 2021-01-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102959520B1 (ko) * | 2019-11-25 | 2026-04-30 | 삼성전자주식회사 | 지문 센서를 포함하는 전자 장치 |
| CN111293178A (zh) * | 2020-02-21 | 2020-06-16 | 合肥鑫晟光电科技有限公司 | 一种薄膜晶体管及其制备方法 |
| US11978774B2 (en) * | 2020-10-05 | 2024-05-07 | Sandisk Technologies Llc | High voltage field effect transistor with vertical current paths and method of making the same |
| CN112735272B (zh) * | 2020-12-30 | 2022-05-17 | 武汉华星光电技术有限公司 | 显示面板及显示装置 |
| CN112782895A (zh) * | 2021-01-27 | 2021-05-11 | 武汉华星光电技术有限公司 | 显示面板及液晶显示装置 |
| JP7587792B2 (ja) * | 2021-02-25 | 2024-11-21 | 株式会社デンソー | 窒化物半導体装置の製造方法 |
| CN114566514B (zh) * | 2021-05-18 | 2025-08-12 | 友达光电股份有限公司 | 感光装置 |
| US12426277B2 (en) | 2021-07-23 | 2025-09-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Embedded double side heating phase change random access memory (PCRAM) device and method of making same |
| CN116113238A (zh) * | 2021-09-16 | 2023-05-12 | 联华电子股份有限公司 | 半导体存储器结构及其制作方法 |
| US11415673B1 (en) | 2021-11-24 | 2022-08-16 | Aurora Operations, Inc. | Silicon photonics device for LIDAR sensor and method for fabrication |
| US11513289B1 (en) | 2021-11-24 | 2022-11-29 | Aurora Operations, Inc. | Silicon photonics device for LIDAR sensor and method for fabrication |
| CN115050840B (zh) * | 2021-12-09 | 2025-05-13 | 友达光电股份有限公司 | 半导体装置及其制造方法 |
| KR20230089590A (ko) * | 2021-12-13 | 2023-06-21 | 삼성디스플레이 주식회사 | 표시장치 및 그 제조방법 |
| CN116184710B (zh) * | 2023-03-09 | 2024-09-27 | 厦门天马微电子有限公司 | 显示装置 |
| JP7724249B2 (ja) * | 2023-03-24 | 2025-08-15 | コネクテックジャパン株式会社 | インプリント用マスターモールドの作製方法 |
| KR20250040803A (ko) * | 2023-09-15 | 2025-03-25 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| US20250194086A1 (en) | 2023-12-06 | 2025-06-12 | Silicon Storage Technology, Inc. | Method of making memory cells, transistor devices and logic devices on silicon-on-insulator substrate |
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| JP6330220B2 (ja) * | 2014-03-27 | 2018-05-30 | 株式会社Joled | 表示装置、電子機器および基板 |
| KR20170072889A (ko) | 2014-10-10 | 2017-06-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치 |
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| KR102865103B1 (ko) * | 2015-05-22 | 2025-09-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 및 상기 반도체 장치를 포함하는 표시 장치 |
| US9852926B2 (en) * | 2015-10-20 | 2017-12-26 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method for semiconductor device |
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2018
- 2018-05-07 WO PCT/IB2018/053142 patent/WO2018211351A1/en not_active Ceased
- 2018-05-07 KR KR1020197035534A patent/KR102696580B1/ko active Active
- 2018-05-07 CN CN202310860817.5A patent/CN117116946A/zh active Pending
- 2018-05-07 CN CN201880033195.6A patent/CN110651358A/zh active Pending
- 2018-05-07 US US16/613,147 patent/US11152512B2/en not_active Expired - Fee Related
- 2018-05-07 KR KR1020247025760A patent/KR102824388B1/ko active Active
- 2018-05-14 TW TW107116241A patent/TWI831743B/zh active
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2021
- 2021-07-06 US US17/367,677 patent/US11705525B2/en active Active
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| TW201903967A (zh) | 2019-01-16 |
| CN117116946A (zh) | 2023-11-24 |
| US11152512B2 (en) | 2021-10-19 |
| CN110651358A (zh) | 2020-01-03 |
| TW202347616A (zh) | 2023-12-01 |
| US11705525B2 (en) | 2023-07-18 |
| KR20200004344A (ko) | 2020-01-13 |
| JP2019075532A (ja) | 2019-05-16 |
| JP2023009074A (ja) | 2023-01-19 |
| US20210343869A1 (en) | 2021-11-04 |
| US20200203532A1 (en) | 2020-06-25 |
| TWI880293B (zh) | 2025-04-11 |
| KR102696580B1 (ko) | 2024-08-19 |
| JP7430763B2 (ja) | 2024-02-13 |
| KR102824388B1 (ko) | 2025-06-23 |
| KR20240122579A (ko) | 2024-08-12 |
| WO2018211351A1 (en) | 2018-11-22 |
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