TWI811382B - 密封片及密封體 - Google Patents

密封片及密封體 Download PDF

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Publication number
TWI811382B
TWI811382B TW108120647A TW108120647A TWI811382B TW I811382 B TWI811382 B TW I811382B TW 108120647 A TW108120647 A TW 108120647A TW 108120647 A TW108120647 A TW 108120647A TW I811382 B TWI811382 B TW I811382B
Authority
TW
Taiwan
Prior art keywords
sealing sheet
compound
group
resin
cyclic ether
Prior art date
Application number
TW108120647A
Other languages
English (en)
Chinese (zh)
Other versions
TW202000843A (zh
Inventor
長谷川樹
西嶋健太
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202000843A publication Critical patent/TW202000843A/zh
Application granted granted Critical
Publication of TWI811382B publication Critical patent/TWI811382B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Seal Device For Vehicle (AREA)
  • Closing Of Containers (AREA)
  • Containers And Plastic Fillers For Packaging (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW108120647A 2018-06-15 2019-06-14 密封片及密封體 TWI811382B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018114815 2018-06-15
JP2018-114815 2018-06-15
JP2018-117065 2018-06-20
JP2018117065 2018-06-20

Publications (2)

Publication Number Publication Date
TW202000843A TW202000843A (zh) 2020-01-01
TWI811382B true TWI811382B (zh) 2023-08-11

Family

ID=68841866

Family Applications (2)

Application Number Title Priority Date Filing Date
TW108120646A TWI813697B (zh) 2018-06-15 2019-06-14 裝置密封用黏著片及製造裝置密封體的方法
TW108120647A TWI811382B (zh) 2018-06-15 2019-06-14 密封片及密封體

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW108120646A TWI813697B (zh) 2018-06-15 2019-06-14 裝置密封用黏著片及製造裝置密封體的方法

Country Status (5)

Country Link
JP (2) JP7239579B2 (ja)
KR (2) KR20210021454A (ja)
CN (2) CN112368353B (ja)
TW (2) TWI813697B (ja)
WO (2) WO2019240261A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7368202B2 (ja) * 2019-11-29 2023-10-24 リンテック株式会社 封止シート
WO2021132486A1 (ja) * 2019-12-25 2021-07-01 日東電工株式会社 積層体
TW202323490A (zh) * 2021-09-28 2023-06-16 日商琳得科股份有限公司 片狀硬化性接著劑以及光學構件
CN118019819A (zh) * 2021-09-30 2024-05-10 琳得科株式会社 固化性粘接片和固化物的制造方法
TWI843230B (zh) * 2021-10-13 2024-05-21 日商巴川集團股份有限公司 密封材

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002226770A (ja) * 2001-02-02 2002-08-14 Arakawa Chem Ind Co Ltd コーティング剤組成物、コーティング剤硬化膜およびその製造方法
TW201720892A (zh) * 2015-11-27 2017-06-16 Nitto Denko Corp 黏著片材及附剝離膜之黏著片材
WO2018047919A1 (ja) * 2016-09-07 2018-03-15 リンテック株式会社 接着剤組成物、封止シート、及び封止体

Family Cites Families (16)

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JPS561202U (ja) 1979-06-13 1981-01-08
JPS5763280U (ja) 1980-10-01 1982-04-15
JP3654351B2 (ja) * 2001-07-27 2005-06-02 荒川化学工業株式会社 シラン変性エポキシ樹脂、その製造方法、樹脂組成物、半硬化物及び硬化物
JP4225162B2 (ja) * 2003-08-18 2009-02-18 日立化成工業株式会社 封止用フィルム
JP5651421B2 (ja) * 2010-10-07 2015-01-14 三井化学株式会社 封止用組成物及びそれを用いた封止用シート
JP5364075B2 (ja) 2010-11-12 2013-12-11 日東電工株式会社 熱硬化性樹脂組成物硬化体の製法およびそれにより得られた硬化物
JP5364078B2 (ja) 2010-11-18 2013-12-11 日東電工株式会社 熱硬化性樹脂組成物硬化体の製法およびそれにより得られた硬化物
US9263360B2 (en) 2012-07-06 2016-02-16 Henkel IP & Holding GmbH Liquid compression molding encapsulants
JP6091202B2 (ja) * 2012-12-17 2017-03-08 三菱樹脂株式会社 基材レス両面粘着シート
KR101971649B1 (ko) * 2012-12-17 2019-04-23 미쯔비시 케미컬 주식회사 무기재 양면 점착 시트
JP6249345B2 (ja) * 2013-03-22 2017-12-20 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板及びプリント配線板
CN107849414B (zh) * 2015-06-09 2020-06-05 株式会社Lg化学 粘合剂组合物、包含其的粘合膜和包含其的有机电子器件
JP6940224B2 (ja) * 2016-09-07 2021-09-22 リンテック株式会社 ガスバリア性積層体、及び封止体
TWI747950B (zh) * 2016-09-07 2021-12-01 日商琳得科股份有限公司 黏著劑組合物、密封片及密封體
JP2018095679A (ja) 2016-12-08 2018-06-21 三井化学株式会社 シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法
US20200031966A1 (en) * 2017-04-19 2020-01-30 Showa Denko K.K. Curable resin composition, cured product thereof, and structure including cured product thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002226770A (ja) * 2001-02-02 2002-08-14 Arakawa Chem Ind Co Ltd コーティング剤組成物、コーティング剤硬化膜およびその製造方法
TW201720892A (zh) * 2015-11-27 2017-06-16 Nitto Denko Corp 黏著片材及附剝離膜之黏著片材
WO2018047919A1 (ja) * 2016-09-07 2018-03-15 リンテック株式会社 接着剤組成物、封止シート、及び封止体

Also Published As

Publication number Publication date
KR20210021454A (ko) 2021-02-26
KR102710152B1 (ko) 2024-09-25
JPWO2019240260A1 (ja) 2021-07-08
CN112292435B (zh) 2023-09-01
TW202000832A (zh) 2020-01-01
TWI813697B (zh) 2023-09-01
JP7303188B2 (ja) 2023-07-04
KR20210021455A (ko) 2021-02-26
TW202000843A (zh) 2020-01-01
WO2019240260A1 (ja) 2019-12-19
CN112368353A (zh) 2021-02-12
JPWO2019240261A1 (ja) 2021-07-08
JP7239579B2 (ja) 2023-03-14
CN112292435A (zh) 2021-01-29
CN112368353B (zh) 2023-11-28
WO2019240261A1 (ja) 2019-12-19

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