TWI805912B - 具有嵌入式背板之扇出發光二極體（ｌｅｄ）裝置基板、照明系統及製造方法 - Google Patents

具有嵌入式背板之扇出發光二極體（ｌｅｄ）裝置基板、照明系統及製造方法 Download PDF

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TWI805912B
TWI805912B TW109110722A TW109110722A TWI805912B TW I805912 B TWI805912 B TW I805912B TW 109110722 A TW109110722 A TW 109110722A TW 109110722 A TW109110722 A TW 109110722A TW I805912 B TWI805912 B TW I805912B
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substrate
led
conductive structures
conductive
array
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TW109110722A
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TW202105711A (zh
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邢智蛘
薛慶
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美商亮銳公司
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Abstract

本發明描述LED陣列面板及LED照明系統。一種面板包含具有一頂表面及一底表面之一基板。多個背板嵌入該基板中，各具有一頂表面及一底表面。多個第一導電結構至少從該等背板之各者之該頂表面延伸至該基板之該頂表面。多個LED陣列之各者電耦合至至少一些該等第一導電結構。多個第二導電結構從該等背板之各者延伸至該基板之至少該底表面。至少一些該等第二導電結構經由該背板耦合至至少一些該等第一導電結構。一導熱結構與該等背板之各者之該底表面接觸且延伸至該基板之至少該底表面。

Description

具有嵌入式背板之扇出發光二極體(LED)裝置基板、照明系統及製造方法
精度控制照明應用可需要生產及製造小的發光二極體(LED)照明系統。此等系統之較小大小可需要非習知組件及製程。
本發明描述LED陣列面板及LED照明系統。一種面板包含具有一頂表面及一底表面之一基板。多個背板嵌入該基板中，各具有一頂表面及一底表面。多個第一導電結構至少從該等背板之各者之該頂表面延伸至該基板之該頂表面。多個LED陣列之各者電耦合至至少一些該等第一導電結構。多個第二導電結構從該等背板之各者延伸至該基板之至少該底表面。至少一些該等第二導電結構經由該背板耦合至至少一些該等第一導電結構。一導熱結構與該等背板之各者之該底表面接觸且延伸至該基板之至少該底表面。
102:發光二極體(LED)陣列
120:發射器
122:信道
200:面板
202:發光二極體(LED)陣列總成
204:發光二極體(LED)陣列總成
210:頂表面
212:基板
214:底表面
220:背板
222:頂表面
224:底表面
226:第一導電結構
228:第二導電結構
229:第二導電結構
230:熱導體/導熱結構
240:發光二極體(LED)陣列
242:波長轉換結構
244:底膠填充材料
300:電路板
302:導電襯墊
304:導熱襯墊
412:電源模組
414:感測器模組
416:連接能力及控制模組
418:發光二極體(LED)裝置附接區
500:無線裝置
502:收發器
504:天線
506:揚聲器/麥克風
508:小鍵盤
510:顯示器/觸控墊
512:處理器
514:相機
516:記憶體
518:電源
600:無線裝置
620:殼體
640:透鏡
650:閃光燈
700:方法
702:步驟
704:步驟
706:步驟
708:步驟
710:步驟
800A:橫截面視圖
800B:橫截面視圖
800C:橫截面視圖
800D:橫截面視圖
800E:橫截面視圖
800F:橫截面視圖
800G:橫截面視圖
800H:實例
800I:實例
800J:實例
800K:實例/總成
802:基板
803:通孔
804:金屬化層
806:腔
808:臨時結構
810:頂表面
812:背板
814:介電材料
816:導電襯墊
818:導熱材料
820:鈍化材料
822:導電柱
824:焊料材料
826:發光二極體(LED)陣列
D1:距離
w1:寬度
w2:寬度
可從結合隨附圖式藉由實例給出之以下描述獲得一更詳細 理解，其中：圖1係一例示性LED陣列之一俯視圖；圖2係包含多個LED陣列之一例示性面板之一橫截面視圖；圖3係包含耦合至一電路板之一單粒化LED陣列總成之一例示性LED照明系統之一橫截面視圖；圖4係一LED照明系統可附接至其之一例示性電路板之一方塊圖；圖5係一LED照明系統可併入其中之一例示性無線裝置之一方塊圖；圖6係一例示性無線裝置之一後視圖；圖7係製造一LED照明系統(諸如圖2之LED照明系統)之一例示性方法之一流程圖；及圖8A、圖8B、圖8C、圖8D、圖8E、圖8F、圖8G、圖8H、圖8I、圖8J及圖8K係在製程中之各種階段之LED照明系統之橫截面視圖。
相關申請案之交叉參考
本申請案主張2019年3月29日申請之美國臨時申請案第62/826,612號及2020年3月26日申請之美國非臨時申請案第16/831,378號之權利，該兩案以宛如全文闡述引用的方式併入本文中。
下文中將參考隨附圖式更充分描述不同光照明系統及/或發光二極體(「LED」)實施方案之實例。此等實例並非相互排斥，且一個實 例中找到之特徵可與一或多個其他實例中找到之特徵組合以達成額外實施方案。因此，將理解，隨附圖式中展示之實例僅為繪示目的而提供且其等不旨在以任何方式限制本發明。貫穿全文，相同數字係指相同元件。
將理解，儘管術語第一、第二、第三等可在本文中用於描述各種元件，然此等元件不應被此等術語限制。此等術語可用於將元件彼此區分。例如，在不背離本發明之範疇之情況下，一第一元件可被稱為一第二元件且一第二元件可被稱為一第一元件。如本文中使用，術語「及/或」可包含相關聯列出項目之一或多者之任一者及全部組合。
將理解，當一元件(諸如一層、區或基板)被稱為在另一元件「上」或「延伸至」另一元件上時，其可直接在該另一元件上或直接延伸至該另一元件上或亦可存在中介元件。相比之下，當一元件被稱為「直接在」另一元件上或「直接延伸至」另一元件上時，可不存在中介元件。亦將理解，當一元件被稱為「連接」或「耦合」至另一元件時，其可直接連接或耦合至該另一元件及/或經由一或多個中介元件連接或耦合至該另一元件。相比之下，當一元件被稱為「直接連接」或「直接耦合」至另一元件時，該元件與該另一元件之間不存在中介元件。將理解，此等術語旨在涵蓋除圖中描繪之任何定向以外的不同元件定向。
諸如「下方」、「上方」、「上」、「下」、「水平」或「垂直」之相對術語可在本文中用於描述如圖中繪示之一個元件、層或區與另一元件、層或區之一關係。將理解，此等術語意欲涵蓋除圖中描繪之定向以外的不同裝置定向。
此外，LED、LED陣列、電組件及/或電子組件是否容置於一個、兩個或兩個以上電子器件板上亦可取決於設計約束及/或應用。
半導體發光器件(LED)或光學功率發射器件(諸如發射紫外線(UV)或紅外線(IR)光學功率之器件)係當前可用之最高效光源之一。此等裝置(下文中「LED」)可包含發光二極體、諧振腔發光二極體、垂直腔雷射二極體、邊緣發射雷射或類似物。歸因於其等之緊湊大小及較低功率要求，例如，LED可為許多不同應用之受矚目候選。例如，其等可用作手持式電池供電裝置(諸如相機及蜂巢式電話)之光源(例如，閃光燈及相機閃光燈)。其等亦可用於例如汽車照明、抬頭顯示器(HUD)照明、園藝照明、街道照明、視訊火炬、一般照明(例如，家庭、商店、辦公室及工作室照明、劇場/舞台照明及建築照明)、擴增實境(AR)照明、虛擬實境(VR)照明、作為顯示器及IR光譜儀之背光。一單一LED可提供亮度小於一白熾光源之光且因此多接面裝置或LED陣列(諸如單片LED陣列、微型LED陣列等)可用於其中期望或需要更多亮度之應用。
圖1係一例示性LED陣列102之一俯視圖。在圖1中繪示之實例中，LED陣列102係發射器120之一陣列。LED陣列可用於任何應用，諸如需要LED陣列發射器之精度控制之應用。LED陣列102中之發射器120可個別地定址或可以群組/子集定址。
亦在圖1中展示LED陣列102之一3x3部分之一分解視圖。如3x3部分分解視圖中展示，LED陣列102可包含各具有一寬度w1之發射器120。在實施例中，寬度w1可為約100μm或更小(例如，30μm)。發射器120之間的信道122可為一寬度w2寬。在實施例中，寬度w2可為約20μm或更小(例如，5μm)。信道122可在相鄰發射器之間提供一氣隙或可含有其他材料。從一個發射器120之中心至一相鄰發射器120之中心之一距離d1可為約120μm或更小(例如，30μm)。將理解，本文中提供之寬度及 距離僅係實例且實際寬度及/或尺寸可變化。
將理解，儘管在圖1中展示配置成一對稱矩陣之矩形發射器，然任何形狀及配置之發射器適用於本文中描述之實施例。例如，圖1之LED陣列102可包含呈任何適用配置之超過20,000個發射器，諸如一20x100矩陣、一對稱矩陣、一非對稱矩陣或類似物。亦將理解，多組發射器、矩陣及/或板可以任何格式配置以實施本文中描述之實施例。
如上文提及，LED陣列(諸如LED陣列102)可包含具有細微間距及行距之發射器。諸如此之一LED陣列可被稱為一微型LED陣列或簡稱為一微型LED。一微型LED可包含設置於一基板上之個別發射器之一陣列或可為劃分為形成發射器之片段之一單一矽晶圓或晶粒。後一類型之微型LED可被稱為一單片LED。此等陣列可對在個別LED或發射器與一電路板及/或一LED照明系統中之其他組件之間形成可靠互連提出挑戰，尤其在各LED或發射器可分開定址的情況下。另外，此等陣列可需要顯著電力來為其等供電，諸如60瓦特或更多，且因此可在操作期間發射顯著熱。因此，針對此等陣列，需要可適應細微行距及細微地隔開之發射器之個別可定址性且提供足夠熱消散之一結構。
本文中描述之實施例可提供LED照明系統、包含複數個LED陣列面板及製造具有一細微行距之LED陣列之方法且可提供足夠熱消散以滿足此一LED陣列之要求。此等LED陣列及LED照明系統可用於各種應用中，包含例如相機閃光燈應用。
圖2係包含多個LED陣列之一例示性面板200之一橫截面視圖。在圖2中繪示之實例中，面板200包含一基板212及兩個LED陣列總成202及204。基板212可具有一頂表面210及一底表面214且可由任何適合電 路板材料形成，諸如一有機材料。在實施例中，基板212可由數種不同材料形成，諸如一核心材料、層壓材料、介電質、焊料遮罩及導電材料。兩個LED陣列總成202及204之各者可包含嵌入基板212中之一背板220、多個第一導電結構226、多個第二導電結構228、229、一熱導體230、一LED陣列240、一底膠填充材料244及波長轉換結構242。背板220可具有一頂表面222及一底表面224。LED陣列240可為一微型LED，諸如上文關於圖1描述。
在實施例中，針對LED陣列總成202及204之各者，第一導電結構226從背板220之頂表面延伸通過基板212且在基板212之頂表面210上方延伸。在一些實施例中，第一導電結構226可不在基板212之頂表面210上方延伸而可在基板212之頂表面210處或其下方停止。在一些實施例中，第一導電結構226可包含不同導電結構之一組合。例如，第一導電結構226可包含延伸在背板220與基板212之頂表面210之間的導電通孔。導電柱可安置於導電通孔上且電耦合至導電通孔(例如，經由導電通孔之頂部上之金屬襯墊)。可在柱上形成焊料凸塊，其等可回焊且各耦合至一LED陣列中之一LED或發射器。在一些實施例中，第一導電結構216之一子集可電耦合至LED陣列。雖然兩個第一導電結構226在圖2中展示為耦合至各背板220，但第一導電結構226之一陣列可耦合至各背板220且可具有類似於對應LED陣列224之行距。
儘管圖2中未展示，然LED陣列240之各者可經由背板220中或其上之表面跡線、通孔或其他金屬化層(諸如藉由第一導電結構226與第二導電結構228、229之間的電連接)電耦合至對應第二導電結構228、229，如一般技術者將理解。此可使LED陣列240中之個別LED或發射器 能夠在面板200切割成個別LED陣列總成202及204且安裝於一電路板上或以其他方式電耦合至另一外部總成時由一驅動器及/或其他電路個別地驅動。在實施例中，背板220可為一中介基板，其可由一非有機材料形成。在實施例中，背板220可完全嵌入基板212中，使得基板212在全部側上完全包圍背板220。背板220可由數種不同材料之任一者形成，包含例如有機、無機、矽或玻璃材料。
在圖2中展示之實例中，第二電導體228、229在背板220之頂表面222與基板212之底表面214之間提供一電連接。導電結構228可為例如基板212中之導電通孔。在一些實施例中，導電結構228可為微孔、電線、金屬柱、焊料柱或其他導電結構。導電結構229可為例如從背板220水平延伸至導電結構228且提供其間之一電連接之電跡線。如將理解，可使用各種類型及配置之電跡線，包含例如扇入、扇出、線性及彎曲水平佈局。導電結構228、229可由各種導電材料形成，包含例如金屬(諸如銅、銀、鋁、金或金屬合金)或導電聚合組合物、石墨烯或導電陶瓷。
熱導體230可為具有良好熱轉移性質之任何類型之熱材料之一結構，諸如銅、鋁或其他金屬材料。熱導體230可為一金屬棒或其他剛性熱轉移板。熱導體230可安置於基板212之底表面214中之一腔中且熱耦合至背板220。在圖2中繪示之實例中，熱導體230具有與背板220接觸之一頂表面及與基板212之底表面214共面之一底表面。然而，在實施例中，熱導體230之底表面可相對於基板212之底表面214實質上共面、凹陷或在基板212之底表面214下方延伸。當面板200被切割且一個別LED陣列總成202或204安裝於一電路板上時，熱導體230可耦合至一對應熱板或其他散熱器裝置或材料，其可提供一LED陣列所需之熱消散量，諸如上文關 於圖1描述。如圖2中所示，複數個陣列之第一導電結構226、複數個第二導電結構228及229、及複數個熱導體230彼此分開。複數個第二導電結構228及229在一垂直方向上圍繞背板220且未穿透背板220。
一波長轉換結構242可安置於LED陣列240之各者上方。在實施例中，波長轉換結構242可為一磷光體材料，諸如含有至少一個磷光體材料或量子點或染料之一模製或陶瓷材料。波長轉換結構242可為任何適合厚度以使用一選定波長轉換材料提供所要波長轉換性質。與一或多個波長轉換材料組合之一LED陣列可在處於一開啟狀態時產生白光或其他顏色之單色光。可由波長轉換結構242轉換由開啟狀態之LED發射之光之全部或僅一部分。未轉換光可為從LED陣列總成202、204發射之光之最終光譜之部分，但其無需如此。藉由實例，具有一波長轉換結構242之一LED陣列總成202、204可為或可包含與一黃光發射磷光體材料或綠光發射及紅光發射磷光體材料組合之藍光發射LED或發射器。藉由另一實例，具有一波長轉換結構242之LED陣列總成202、204可為或可包含與藍光發射及黃光發射磷光體材料或藍光發射、綠光發射及紅光發射磷光體材料組合之UV發射LED或發射器。
底膠填充材料244可為以其他方式曝露之電及/或電子組件及導電元件提供保護及/或提供或輔助LED陣列244機械耦合至基板212之頂表面210。在實施例中，底膠填充材料可為一聚合物黏結劑且可包圍第一導電結構226在基板212之頂表面212上方突出之部分。
LED陣列總成(諸如圖2之LED陣列總成202、204)可包含額外元件(未展示)，諸如光吸收體、反射體、其他光學塗層或電絕緣材料。在實施例中，一LED陣列總成可包含一光學及電絕緣材料，諸如有機、無機或有機/無機黏結劑或填充劑材料之一組合。例如，黏著劑、環氧樹脂、丙烯酸酯或硝化纖維素可與陶瓷顆粒結合使用以提供底膠填充 244。另一有機/無機黏結劑、填充劑或側壁可為例如具有嵌入反射氧化鈦或其他反射散射顆粒之一環氧樹脂。無機黏結劑可包含溶膠凝膠(例如，TEOS或MTMS之一溶膠凝膠)或液體玻璃(例如，矽酸鈉或矽酸鉀)(亦被稱為水玻璃)。在實施例中，黏結劑可包含調整實體性質之填充劑。填充劑可包含無機奈米顆粒、矽石、玻璃顆粒或纖維或能夠改良光學或熱效能之其他材料。
在實施例中，微透鏡或其他主要或次要光學元件(諸如反射體、散射元件或吸收體)可相對於各LED或發射器或相關聯波長轉換結構耦合或定位。另外或替代地，一主要光學器件可定位於整個LED陣列上方，其可在適合封裝中直接附接或安裝於距LED陣列之一距離處。保護層、透明層、熱層或其他封裝結構可視需要用於特定應用。
圖3係包含耦合至一電路板300之一單粒化LED陣列總成202之一例示性LED照明系統之一橫截面視圖。在圖3中繪示之實例中，基板212之底表面214相鄰於電路板300之一頂表面放置。電路板可具有數個導電襯墊302。在圖3中繪示之實例中，電路板300上之導電襯墊302焊接或以其他方式電耦合至第二導電結構229。基板212中之導熱結構230亦可焊接、放置成與電路板上之一導熱襯墊304接觸或以其他方式熱耦合至導熱襯墊304。導熱結構230與電路板300之間的直接接觸及/或接合實現從LED總成202至電路板300之高效熱轉移以用於散熱目的而無需LED照明系統之頂部上方(或別處)之可例如以其他方式阻擋來自LED陣列240之光發射之額外熱消散結構。電路板300可為特定應用中使用之一較大系統之部分(下文關於圖4、圖5及圖6描述實例)。由於第二導電結構229與第一導電結構226電耦合，故LED陣列202可電耦合至電路板300以經由電路板 300上之電路供電、驅動或以其他方式控制來自LED陣列202之光學發射。
如上文提及，LED陣列(諸如LED陣列202、204)可為可定址總成且可支援受益於光分佈之細粒強度、空間及時間控制之應用。此可包含(但不限於)從像素區塊或個別像素發射之光之精確空間型樣化。取決於應用，所發射光可為在光譜上相異、隨時間調適及/或環境回應的。LED陣列可以各種強度、空間或時間型樣提供預程式化光分佈。所發射光可至少部分基於所接收感測器資料且可用於光學無線通信。相關聯光學器件可在一像素、像素區塊或裝置位準上相異。一例示性LED陣列可包含具有高密度像素之一共同控制中央區塊之一裝置，高密度像素具有一相關聯共同光學器件，而邊緣像素可具有個別光學器件。由LED陣列支援之常見應用可包含相機閃光燈、汽車頭燈、建築及區域照明、街道照明及資訊顯示器。
圖4係包含用於附接一LED陣列總成(諸如LED陣列總成202、204)之一LED裝置附接區418之一例示性電路板300。在圖4中繪示之實例中，電路板300在一基板上包含一電源模組412、一感測器模組414以及一連接能力及控制模組418。
感測器模組414可包含其中將實施LED陣列之一應用所需之感測器。例示性感測器可包含光學感測器(例如，IR感測器及影像感測器)、運動感測器、熱感測器、機械感測器、近接感測器或甚至計時器。藉由實例，街道照明、一般照明及園藝照明應用中之LED可基於數個不同感測器輸入(諸如所偵測之一使用者之存在、所偵測環境照明條件、所偵測天氣條件或基於白天/夜晚時間)而關閉/開啟及/或調整。此可包含例如 調整光輸出之強度、光輸出之形狀、光輸出之顏色及/或開燈或關燈以保存能量。針對AR/VR應用，運動感測器可用於偵測使用者移動。運動感測器本身可為LED，諸如IR偵測器LED。藉由另一實例，針對相機閃光燈應用，影像及/或其他光學感測器或像素可用於量測待擷取之一場景之照明，使得可最佳地校準閃光燈照明顏色、強度照明型樣及/或形狀。在替代實施例中，電路板300不包含一感測器模組。
連接能力及控制模組416可包含系統微控制器及經組態以從一外部裝置接收一控制輸入之任何類型之有線或無線模組。藉由實例，一無線模組可包含藍芽、Zigbee、Z波、網格、WiFi、近場通信(NFC)及/或同級間模組。微控制器可為任何類型之專用電腦或處理器，其可嵌入一LED照明系統中且經組態或可組態以從有線或無線模組或LED照明系統中之其他模組、裝置或系統接收輸入(諸如感測器資料及從附接於LED裝置附接區418處之一LED陣列回饋之資料)且基於此將控制信號提供至其他模組。由專用處理器實施之演算法可在併入一非暫時性電腦可讀儲存媒體中以供專用處理器執行之一電腦程式、軟體或韌體中實施。非暫時性電腦可讀儲存媒體之實例包含一唯讀記憶體(ROM)、一隨機存取記憶體(ROM)、一暫存器、快取記憶體及半導體記憶體裝置。記憶體可包含為微控制器之部分或可在別處實施(在電路板300上或其外)。
如本文中使用，術語模組可係指安置於可焊接至一或多個電路板300之個別電路板上之電及/或電子組件。然而，術語模組亦可係指提供類似功能性但可個別地焊接至一或多個電路板之一相同區或不同區中之電及/或電子組件。雖然電路板300在圖4中繪示為具有某些模組，但此等僅為了繪示及實例。一般技術者將認知，一電路板可取決於應用而包含 任何數目及各種不同模組。
如上文提及，一LED照明系統(諸如圖3中繪示)可用於數種不同應用中，且在其中可期望緊密堆積之LED陣列及/或可個別定址之LED裝置或發射器之閃光燈應用中可尤其有用。圖5及圖6係可併入LED照明系統(諸如圖3之LED照明系統300)之例示性應用系統之圖。圖5及圖6中繪示之實例係針對一LED閃光燈應用，但一般技術者將理解，LED陣列總成(諸如本文中描述)可用於許多不同應用。
一LED陣列可非常適於行動裝置之相機閃光燈應用。通常，來自一高強度LED之一強烈短暫閃光可用於支援影像擷取。不幸地，在使用習知LED閃光燈的情況下，大多數光浪費在照明已被良好地照亮或無需另外照明之區域上。使用一發光像素陣列可在一判定時間量內提供一場景之部分之受控照明。例如，此可容許相機閃光燈僅照明在滾動快門擷取期間成像之該等區域，甚至提供最小化跨一所擷取影像之信雜比且最小化一人或目標物件上或跨其之陰影之照明，及/或提供突顯陰影之高對比度照明。若LED陣列之發射器在光譜上相異，則閃光燈照明之色溫可動態地調整以提供所要色調或色暖。
圖5係一例示性無線裝置500之一圖。在圖5中繪示之實例中，無線裝置500包含一處理器512、一收發器502、一天線504、一揚聲器/麥克風506、一小鍵盤508、一顯示器/觸控墊510、一記憶體516、一電源518及一相機514。
處理器512可為一通用處理器、一專用處理器、一習知處理器、一數位信號處理器(DSP)、一微處理器、與一DSP核心相關聯之一或多個微處理器、一控制器、一微控制器、一特定應用積體電路 (ASIC)、一場可程式化閘陣列(FPGA)電路、一積體電路(IC)、一狀態機及類似物。處理器512可耦合至且可從揚聲器/麥克風506、小鍵盤508、顯示器/觸控墊510及/或相機514接收使用者輸入資料。處理器512亦可將使用者資料輸出至揚聲器/麥克風506、小鍵盤508、顯示器/觸控墊510及/或相機514接收使用者輸入資料。另外，處理器512可從任何類型之適合記憶體(諸如記憶體516)存取資訊且將資料儲存於其中。處理器512可從電源518接收電力且可經組態以將電力分佈及/或控制至無線裝置500中之其他組件。
處理器512亦可耦合至相機514。在實施例中，相機514可包含例如一影像感測器、讀出電路、一閃光燈模組及/或操作相機514所需之任何其他所需電路或控制件。在實施例中，閃光燈模組可包含一LED照明系統(諸如圖3之LED照明系統300)及一驅動器、一或多個感測器及/或操作閃光燈所需之任何其他電路或控制件。
圖6係展示相機514之更多細節之一無線裝置600之一後視圖。在圖6中繪示之實例中，無線裝置600包含一殼體620及一相機514。相機514包含一透鏡640，相機之影像感測器(圖6中未展示)可經由其擷取一場景之一影像。相機模組514亦可包含可包含一或多個LED陣列之一閃光燈650，該一或多個LED陣列可為一或多個LED照明系統(諸如圖3之LED照明系統300)之部分。
圖7係製造一LED陣列面板及/或一LED照明系統(諸如圖2之面板200及/或圖3之LED照明系統300)之一例示性方法700之一流程圖。圖8A、圖8B、圖8C、圖8D、圖8E、圖8F、圖8G、圖8H、圖8I、圖8J及圖8K係在製程中之各種階段之一LED陣列面板之橫截面視圖。
在圖7中繪示之例示性方法700中，在一基板中形成一腔(702)。圖8A係基板802之一橫截面視圖800A。基板802具有形成於其中之通孔803及形成於基板802之頂表面及底表面之部分上方及通孔803中之金屬化層804。金屬化層804形成圖2之第二導電結構228、229之至少部分。圖8B係具有形成於其中之一腔806之基板802之一橫截面視圖800B。雖然開口在橫截面視圖中展示為將基板806完全分離為兩件，但腔可部分形成穿過基板或可為完全形成穿過基板但在全部側上被基板802之至少一部分包圍之一通孔或其他開口。
再次參考圖7，可將一背板放置於基板中之腔中(704)。圖8C及圖8D係基板在放置背板之不同點處之橫截面視圖800C及800D。在圖8C中，將一膠帶808或其他臨時結構放置於基板802上方且黏著或以其他方式耦合至金屬化層804之一頂表面810。在圖8D中，一背板812放置於腔806中且黏著或以其他方式耦合至膠帶或其他臨時結構808。
再次參考圖7，可在基板及背板上方形成一介電材料之至少一個層(706)。圖8E及圖8F係基板在介電材料之至少一個層之形成期間之各個點處之橫截面視圖800E及800F。圖8E係展示形成於背板812及基板802之一個側上方之介電材料814之一橫截面視圖而背板812及基板802之另一側仍在膠帶或其他臨時結構808上。在圖8E中繪示之實例中，介電材料814亦填充基板802內未使用另一材料填充之全部空隙及通孔。在圖8F中，移除膠帶或其他臨時結構808，且在藉由移除其他臨時結構808之膠帶而曝露之基板802及背板812之側上形成介電材料814之至少一個其他層。在實施例中，介電材料可為一聚合物介電材料，諸如聚醯亞胺。
介電材料814之至少一個層可為一或多個重佈層(RDL)。 RDL層之數目可取決於實施LED陣列面板之特定應用。關於圖2之面板200，基板802連同介電材料814之至少部分可形成圖2之基板212，背板220嵌入基板212中。換言之，將背板220嵌入基板212中之一個方法可包含在一基板(諸如基板802)中形成一腔，且接著在基板及背板上方形成一或多個介電層，使得背板連同介電材料之至少一個層嵌入基板中。
再次參考圖7，可在介電材料之至少一個層中形成一腔，從而曝露背板之一表面之至少一部分(708)。將一導熱材料放置於介電材料之至少一個層中(710)。再次參考圖8F，在介電材料814中形成一腔，且將導熱材料818放置於腔中。
圖8G係面板之一橫截面視圖800G。在圖8G中，圖8F之整個總成已翻轉，且在現在之介電材料814之頂表面中形成通孔且曝露背板812之一表面。可使用一導電材料填充或加襯裡於通孔，且可在介電材料814之一外表面上形成導電襯墊816。例如，具有導電材料之通孔(及視情況襯墊)可形成圖2之第一導電結構226。可在現在之介電材料814之底表面中形成其他通孔及視情況導電襯墊816。此等可電耦合至金屬化層804且可為延伸至基板212之底表面之圖2之第二導電結構228、229之部分。儘管圖8G中未展示，然形成於介電材料814及金屬化層804之底表面中之通孔/襯墊816之此等部分可藉由背板812中或其上之跡線及/或通孔或藉由加襯裡於或填充通孔之金屬化層804或導電材料之其他部分電耦合至形成於介電材料814之頂表面中之通孔/襯墊816，如上文關於圖2說明。此可提供第一導電結構226與第二導電結構228、229之間的一電耦合，如上文描述。雖然僅三個通孔/襯墊816在圖8G中展示為從背板812之頂表面延伸，但可存在緊密隔開之通孔/襯墊之一陣列，其可電耦合至LED陣列中之個 別LED或發射器。
圖8H、圖8I、圖8J及圖8K係在方法中之各種額外階段之面板之實例800H、800I、800J及800K之圖。在圖8H中，可在介電材料814之頂表面及底表面之某些部分上形成一焊料遮罩或其他鈍化材料820。在圖8I中，可在圖8G之導電襯墊816上形成導電柱822(諸如銅柱)。在圖8J中，可在導電柱822上形成焊料材料824(諸如一焊料凸塊或球)。在圖8K中，可將一LED陣列826放置或以其他方式安置於焊料材料822上方。可加熱整個總成800K，且焊料材料822可回焊，因此將LED陣列826電且機械地耦合至柱822。柱822可耦合至LED陣列826中之個別LED或發射器。儘管未展示，然可執行後續處理步驟，包含形成底膠填充，在LED陣列826上方形成波長轉換結構(例如，磷光體整合)，基板薄化或雷射剝離(例如，薄化或移除LED陣列826之任何生長或其他臨時基板)，及/或將面板切割成多個LED照明系統(諸如圖3之LED照明系統300)。
在實施例中，可藉由施加一電壓以電泳地沈積含有至少一個磷光體材料之一材料而形成波長轉換結構。變化一施加電壓持續時間可相應地變化所沈積材料之一量及厚度。替代地，LED可塗佈有含有磷光體之材料，例如使用一有機黏結劑將磷光體顆粒黏著至LED陣列。可施配、網版印刷、噴灑、模製或層壓含有磷光體之材料。替代地，針對某些應用。含有至少一個磷光體材料之玻璃及/或含有一磷光體材料之一預形成燒結陶瓷可耦合至LED陣列。
雖然上文描述之圖展示具有某些相對大小之導熱材料、LED陣列及背板，但一般技術者將認知，此等元件之大小可變化。例如，背板可大於或小於對應LED陣列，且導熱材料可大於或小於背板。此等元 件之各者之大小可取決於例如效能及成本最佳化。
在已詳細描述實施例之情況下，熟習此項技術者將瞭解，鑑於本描述，可在不脫離發明概念之精神之情況下修改本文中描述之實施例。因此，不意欲將本發明之範疇限於所繪示及描述之特定實施例。
200:面板
202:發光二極體(LED)陣列總成
204:發光二極體(LED)陣列總成
210:頂表面
212:基板
214:底表面
220:背板
222:頂表面
224:底表面
226:第一導電結構
228:第二導電結構
229:第二導電結構
230:熱導體/導熱結構
240:發光二極體(LED)陣列
242:波長轉換結構
244:底膠填充材料

Claims (19)

  1. 一種發光二極體(LED)陣列面板，該面板包括：一基板，其具有一頂表面及一底表面；複數個背板，其等嵌入該基板中，該複數個背板之各者具有一頂表面及一底表面；複數個陣列之第一導電結構，其等至少從該複數個背板之各者之該頂表面延伸至該基板之該頂表面；複數個LED陣列，各電耦合至該複數個陣列之第一導電結構之一陣列；複數個第二導電結構，其等從該複數個背板之各者延伸至至少該基板之該底表面，至少一些該等第二導電結構電耦合至該複數個LED陣列之至少一者；及複數個熱導體，該複數個熱導體之至少一者與該複數個背板之一者之該底表面接觸且延伸至至少該基板之該底表面，其中該複數個陣列之第一導電結構、該複數個第二導電結構及該複數個熱導體彼此分開，且其中該複數個第二導電結構在一垂直方向上圍繞該複數個背板且未穿透該複數個背板。
  2. 如請求項1之面板，其中該複數個背板包括一非有機材料。
  3. 如請求項1之面板，其中該基板包括一有機材料。
  4. 如請求項1之面板，其中該複數個陣列之第一導電結構包括複數個金屬柱陣列。
  5. 如請求項1之面板，其中該複數個陣列之第一導電結構在該基板之該頂表面上方延伸。
  6. 如請求項1之面板，其中該複數個第二導電結構至少部分包括該基板中之導電通孔。
  7. 如請求項6之面板，其中該複數個第二導電結構進一步包括該背板上之表面跡線，其等電耦合至該基板中之該等導電通孔。
  8. 如請求項6之面板，其中該基板包括一介電材料之至少一個層，且在該介電材料之該至少一個層中形成該等導電通孔。
  9. 如請求項1之面板，其中該複數個LED陣列係單片(monolithic)LED陣列，各包括複數個發射器，該複數個發射器之各者具有100μm或更小之一寬度且配置成列及行，其中相鄰列及行之間的信道(lanes)具有20μm或更小之一寬度。
  10. 一種發光二極體(LED)照明系統，其包括：一基板部分，其具有一頂表面及一底表面； 一背板，其嵌入該基板部分中，該背板具有一頂表面及一底表面；一陣列之第一導電結構，其至少從該背板之該頂表面延伸至該基板部分之該頂表面；一LED陣列，其電耦合至該陣列之第一導電結構；複數個第二導電結構，其等從該背板延伸至至少該基板之該底表面，至少一些該等第二導電結構經由該背板電耦合至該陣列之第一導電結構；及一熱導體，其與該背板之該底表面接觸且延伸至至少該基板之該底表面，其中該陣列之第一導電結構、該複數個第二導電結構及該熱導體彼此分開，且其中該複數個第二導電結構在一垂直方向上圍繞該複數個背板且未穿透該複數個背板。
  11. 如請求項10之系統，其中該背板包括一非有機材料。
  12. 如請求項10之系統，其中該基板包括一有機材料。
  13. 如請求項10之系統，其中該陣列之第一導電結構包括一金屬柱陣列。
  14. 如請求項10之系統，其中該陣列之第一導電結構在該基板之該頂表面上方延伸。
  15. 如請求項10之系統，其中該複數個第二導電結構至少部分包括該基板中之導電通孔。
  16. 如請求項15之系統，其中該複數個第二導電結構進一步包括該背板上之表面跡線，其等電耦合至該基板中之該等導電通孔。
  17. 如請求項15之系統，其中該基板包括一介電材料之至少一個層，且在該介電材料之該至少一個層中形成該等導電通孔。
  18. 如請求項10之系統，其中該LED陣列係一單片LED陣列。
  19. 如請求項18之系統，其中該單片LED陣列包括複數個發射器，該複數個發射器之各者具有100μm或更小之一寬度且配置成列及行，其中相鄰列及行之間的信道具有20μm或更小之一寬度。
TW109110722A 2019-03-29 2020-03-27 具有嵌入式背板之扇出發光二極體（ｌｅｄ）裝置基板、照明系統及製造方法 TWI805912B (zh)

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