CN101650010A - Led光源模组及其应用的光机装置 - Google Patents

Led光源模组及其应用的光机装置 Download PDF

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CN101650010A
CN101650010A CN200810303760A CN200810303760A CN101650010A CN 101650010 A CN101650010 A CN 101650010A CN 200810303760 A CN200810303760 A CN 200810303760A CN 200810303760 A CN200810303760 A CN 200810303760A CN 101650010 A CN101650010 A CN 101650010A
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light source
led light
drive circuit
source module
circuit plate
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温文福
黄凯
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200810303760A priority Critical patent/CN101650010A/zh
Priority to US12/346,790 priority patent/US7963671B2/en
Publication of CN101650010A publication Critical patent/CN101650010A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种LED光源模组，其包括一个LED驱动电路板，至少一个LED光源，一个散热垫以及一个散热器。所述LED驱动电路板的一侧表面上布置有用以驱动所述LED光源的驱动电路。所述LED光源固设在所述LED驱动电路板上并与所述驱动电路电连接。所述散热垫设置在所述LED驱动电路板上与设置有LED光源的一侧相对的另一侧。该散热器紧贴所述散热垫并与所述LED驱动电路板相固接。本发明LED光源模组，采用将所述LED光源固设在一LED驱动电路板上，构成一个可方便拆卸的LED光源模组，从而有效克服了因LED光源与光机一体设置而不易拆卸的缺陷。

Description

LED光源模组及其应用的光机装置
技术领域
本发明涉及一种LED光源模组及其应用的光机装置。
背景技术
LED(Light Emitting diode)作为一种体积小、不易发热、且使用寿命长的发光装置已被广泛用作投影机的光源，然而，LED在投影机内的配置方式均是采用将LED与投影机的光机一体设置，即将LED固设在所述光机上，该种配置方式使得LED的更换及维修十分复杂，当需要更换LED时，需要将光机拆下，然后再将LED取出更换，此过程不仅费时，而且由于光机是投影机内非常精密的组件，在拆卸光机时容易损坏光机。
发明内容
有鉴于此，有必要提供一便于拆卸的LED光源模组及其应用的光机装置。
一种LED光源模组，其包括一个LED驱动电路板，至少一个LED光源，一个散热垫以及一个散热器。所述LED驱动电路板的一侧表面上布置有用以驱动所述LED光源的驱动电路。所述LED光源固设在所述LED驱动电路板上并与所述驱动电路电连接。所述散热垫设置在所述LED驱动电路板上与设置有LED光源的一侧相对的另一侧。该散热器紧贴所述散热垫并与所述LED驱动电路板相连接。
一种光机装置，其包括一个LED光源模组以及一个光机。所述LED光源模组包括一个LED驱动电路板，至少一个LED光源，一个散热垫以及一个散热器。所述LED驱动电路板的一侧表面上布置有用以驱动所述LED光源的驱动电路。所述LED光源固设在所述LED驱动电路板上并与所述驱动电路电连接。所述散热垫设置在所述LED驱动电路板上与设置有LED光源的一侧相对的另一侧。该散热器紧贴所述散热垫并与所述LED驱动电路板相连接。所述光机包括一个进光部以及一个与所述进光部垂直设置的出光部，在所述进光部的底侧上开设有一个容置孔，所述LED光源模组容置在所述容置孔内。
相较现有技术，本发明LED光源模组，采用将所述LED光源固设在一LED驱动电路板上，构成一个可方便拆卸的LED光源模组，从而有效克服了因LED光源与光机一体设置而不易拆卸的缺陷。
附图说明
图1是本发明LED光源模组的分解示意图；
图2是图1中LED光源模组的组装示意图；
图3是本发明使用图1中LED光源模组的光机装置的分解示意图。
具体实施方式
请参阅图1及2，本发明较佳实施方式提供的一种LED光源模组100，其包括一个LED驱动电路板110，至少一个LED光源120，一个散热垫130以及一个散热器140。
所述LED驱动电路板110的一侧表面上布置有用以驱动所述LED光源120的驱动电路(图未示)，所述LED驱动电路板110大致呈方形且在其对角位置处分别开设有两个定位孔112用以供该LED驱动电路板110定位。
所述LED光源120固设在所述LED驱动电路板110上，并与所述LED驱动电路板110上的驱动电路相电连接。本实施方式中采用三个LED光源120，其分别为红光LED光源122，蓝光LED光源124以及绿光LED光源126。
所述散热垫130设置在与所述LED驱动电路板110上设置有LED光源120的一侧相对的另一侧，用以将所述LED驱动电路板110以及LED光源120所发出的热量传导至所述散热器140上。该散热垫130可以采用导热硅胶等导热材料制成。
所述散热器140为一具有多个规则排列的散热鳍片142的散热装置，该散热器140紧贴所述散热垫130与所述LED驱动电路板110相固接，用以将所述散热垫130所传导的热量散发至空气中。
本发明LED光源模组，采用将所述LED光源固设在一LED驱动电路板上，构成一个可方便拆卸的LED光源模组，从而有效克服了现有技术中LED光源不易拆卸的缺陷。
请参阅图3，为本发明较佳实施方式提供的一种使用LED光源模组100的光机装置200，该光机装置200还包括一个光机210，一个壳体220。
所述光机210包括一个进光部212以及一个与所述进光部212垂直设置的出光部214，在所述进光部212的底侧212a上开设有容置孔216，该容置孔216用以容置所述LED光源模组100，且在所述容置孔216侧边设置有两个分别与所述光源模组100的LED驱动电路板110上的定位孔112相对应的定位柱218，该定位柱218穿置在所述的驱动电路板110的定位孔112内用以确定该光源模组100相对于光机装置200内部光学组件(图未示)的相对位置。
所述壳体220用以收容所述光机210以及所述LED光源模组100，所述光机210连同收容在其容置孔216内的LED光源模组100一并固设在所述壳体220内部，该壳体220对应所述光机210的容置孔216及LED光源模组100开设有一个开口222，该开口222的尺寸大于所述LED光源模组100的尺寸，用以方便所述LED光源模组100经过该开口222组装或者拆卸。
此外，该光机装置200还包括一个盖体230，该盖体230卡设在所述壳体220上的开口222内以封闭所述开口222。
本发明。使用LED光源模组的光机装置采用模组化的LED光源模组，在壳体上设置供所述LED光源模组拆卸的开口，从而方便所述LED光源模组的拆卸及更换。
另外，本领域技术人员还可在本发明精神内做其它变化，只要其不偏离本发明的技术效果，都应包含在本发明所要求保护的范围之内。

Claims (10)

1.一种LED光源模组，其包括一个LED驱动电路板，至少一个LED光源，一个散热垫以及一个散热器，所述LED驱动电路板的一侧表面上布置有用以驱动所述LED光源的驱动电路，所述LED光源固设在所述LED驱动电路板上并与所述驱动电路电连接，所述散热垫设置在所述LED驱动电路板上与设置有LED光源的一侧相对的另一侧，该散热器紧贴所述散热垫并与所述LED驱动电路板相连接。
2.如权利要求1所述的LED光源模组，其特征在于：所述LED驱动电路板大致呈方形且其对角位置处分别开设有两个定位孔。
3.如权利要求1所述的LED光源模组，其特征在于：所述LED光源包括一个红光LED光源、一个蓝光LED光源以及一个绿光LED光源。
4.如权利要求1至3任一项所述的LED光源模组，其特征在于：所述散热垫由导热材料制成。
5.如权利要求4所述的LED光源模组，其特征在于：该散热垫由导热硅胶制成。
6.如权利要求4所述的LED光源模组，其特征在于：所述散热器包括多个规则排列的散热鳍片。
7.一种光机装置，其包括一个LED光源模组以及一个光机，所述LED光源模组包括一个LED驱动电路板，至少一个LED光源，一个散热垫以及一个散热器，所述LED驱动电路板的一侧表面上布置有用以驱动所述LED光源的驱动电路，所述LED光源固设在所述LED驱动电路板上并与所述驱动电路电连接，所述散热垫设置在所述LED驱动电路板上与设置有LED光源的一侧相对的另一侧，该散热器紧贴所述散热垫并与所述LED驱动电路板相连接，所述光机包括一个进光部以及一个与所述进光部垂直设置的出光部，在所述进光部的底侧上开设有个容置孔，所述LED光源模组容置在所述容置孔内。
8.如权利要求7所述的光机装置，其特征在于：所述LED驱动电路板大致呈方形且其对角位置处分别开设有两个定位孔，在所述容置孔侧边设置有两个分别与所述LED驱动电路板的定位孔相对应配合的定位柱。
9.如权利要求8所述的光机装置，其特征在于：该光机装置还包括一个壳体，所述光机及LED光源模组收容在所述壳体内，该壳体对应所述光机的容置孔及光源模组开设有一个开口，且该开口的尺寸大于所述LED光源模组的尺寸。
10.如权利要求9所述的光机装置，其特征在于：该光机装置还包括一个盖体，该盖体卡设在所述壳体的开口内以封闭所述开口。
CN200810303760A 2008-08-14 2008-08-14 Led光源模组及其应用的光机装置 Pending CN101650010A (zh)

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US12/346,790 US7963671B2 (en) 2008-08-14 2008-12-30 LED module and light modulator with the same

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