CN101650010A - Led光源模组及其应用的光机装置 - Google Patents

Led光源模组及其应用的光机装置 Download PDF

Info

Publication number
CN101650010A
CN101650010A CN200810303760A CN200810303760A CN101650010A CN 101650010 A CN101650010 A CN 101650010A CN 200810303760 A CN200810303760 A CN 200810303760A CN 200810303760 A CN200810303760 A CN 200810303760A CN 101650010 A CN101650010 A CN 101650010A
Authority
CN
China
Prior art keywords
light source
led light
drive circuit
source module
circuit plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200810303760A
Other languages
English (en)
Inventor
温文福
黄凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200810303760A priority Critical patent/CN101650010A/zh
Priority to US12/346,790 priority patent/US7963671B2/en
Publication of CN101650010A publication Critical patent/CN101650010A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种LED光源模组,其包括一个LED驱动电路板,至少一个LED光源,一个散热垫以及一个散热器。所述LED驱动电路板的一侧表面上布置有用以驱动所述LED光源的驱动电路。所述LED光源固设在所述LED驱动电路板上并与所述驱动电路电连接。所述散热垫设置在所述LED驱动电路板上与设置有LED光源的一侧相对的另一侧。该散热器紧贴所述散热垫并与所述LED驱动电路板相固接。本发明LED光源模组,采用将所述LED光源固设在一LED驱动电路板上,构成一个可方便拆卸的LED光源模组,从而有效克服了因LED光源与光机一体设置而不易拆卸的缺陷。

Description

LED光源模组及其应用的光机装置
技术领域
本发明涉及一种LED光源模组及其应用的光机装置。
背景技术
LED(Light Emitting diode)作为一种体积小、不易发热、且使用寿命长的发光装置已被广泛用作投影机的光源,然而,LED在投影机内的配置方式均是采用将LED与投影机的光机一体设置,即将LED固设在所述光机上,该种配置方式使得LED的更换及维修十分复杂,当需要更换LED时,需要将光机拆下,然后再将LED取出更换,此过程不仅费时,而且由于光机是投影机内非常精密的组件,在拆卸光机时容易损坏光机。
发明内容
有鉴于此,有必要提供一便于拆卸的LED光源模组及其应用的光机装置。
一种LED光源模组,其包括一个LED驱动电路板,至少一个LED光源,一个散热垫以及一个散热器。所述LED驱动电路板的一侧表面上布置有用以驱动所述LED光源的驱动电路。所述LED光源固设在所述LED驱动电路板上并与所述驱动电路电连接。所述散热垫设置在所述LED驱动电路板上与设置有LED光源的一侧相对的另一侧。该散热器紧贴所述散热垫并与所述LED驱动电路板相连接。
一种光机装置,其包括一个LED光源模组以及一个光机。所述LED光源模组包括一个LED驱动电路板,至少一个LED光源,一个散热垫以及一个散热器。所述LED驱动电路板的一侧表面上布置有用以驱动所述LED光源的驱动电路。所述LED光源固设在所述LED驱动电路板上并与所述驱动电路电连接。所述散热垫设置在所述LED驱动电路板上与设置有LED光源的一侧相对的另一侧。该散热器紧贴所述散热垫并与所述LED驱动电路板相连接。所述光机包括一个进光部以及一个与所述进光部垂直设置的出光部,在所述进光部的底侧上开设有一个容置孔,所述LED光源模组容置在所述容置孔内。
相较现有技术,本发明LED光源模组,采用将所述LED光源固设在一LED驱动电路板上,构成一个可方便拆卸的LED光源模组,从而有效克服了因LED光源与光机一体设置而不易拆卸的缺陷。
附图说明
图1是本发明LED光源模组的分解示意图;
图2是图1中LED光源模组的组装示意图;
图3是本发明使用图1中LED光源模组的光机装置的分解示意图。
具体实施方式
请参阅图1及2,本发明较佳实施方式提供的一种LED光源模组100,其包括一个LED驱动电路板110,至少一个LED光源120,一个散热垫130以及一个散热器140。
所述LED驱动电路板110的一侧表面上布置有用以驱动所述LED光源120的驱动电路(图未示),所述LED驱动电路板110大致呈方形且在其对角位置处分别开设有两个定位孔112用以供该LED驱动电路板110定位。
所述LED光源120固设在所述LED驱动电路板110上,并与所述LED驱动电路板110上的驱动电路相电连接。本实施方式中采用三个LED光源120,其分别为红光LED光源122,蓝光LED光源124以及绿光LED光源126。
所述散热垫130设置在与所述LED驱动电路板110上设置有LED光源120的一侧相对的另一侧,用以将所述LED驱动电路板110以及LED光源120所发出的热量传导至所述散热器140上。该散热垫130可以采用导热硅胶等导热材料制成。
所述散热器140为一具有多个规则排列的散热鳍片142的散热装置,该散热器140紧贴所述散热垫130与所述LED驱动电路板110相固接,用以将所述散热垫130所传导的热量散发至空气中。
本发明LED光源模组,采用将所述LED光源固设在一LED驱动电路板上,构成一个可方便拆卸的LED光源模组,从而有效克服了现有技术中LED光源不易拆卸的缺陷。
请参阅图3,为本发明较佳实施方式提供的一种使用LED光源模组100的光机装置200,该光机装置200还包括一个光机210,一个壳体220。
所述光机210包括一个进光部212以及一个与所述进光部212垂直设置的出光部214,在所述进光部212的底侧212a上开设有容置孔216,该容置孔216用以容置所述LED光源模组100,且在所述容置孔216侧边设置有两个分别与所述光源模组100的LED驱动电路板110上的定位孔112相对应的定位柱218,该定位柱218穿置在所述的驱动电路板110的定位孔112内用以确定该光源模组100相对于光机装置200内部光学组件(图未示)的相对位置。
所述壳体220用以收容所述光机210以及所述LED光源模组100,所述光机210连同收容在其容置孔216内的LED光源模组100一并固设在所述壳体220内部,该壳体220对应所述光机210的容置孔216及LED光源模组100开设有一个开口222,该开口222的尺寸大于所述LED光源模组100的尺寸,用以方便所述LED光源模组100经过该开口222组装或者拆卸。
此外,该光机装置200还包括一个盖体230,该盖体230卡设在所述壳体220上的开口222内以封闭所述开口222。
本发明。使用LED光源模组的光机装置采用模组化的LED光源模组,在壳体上设置供所述LED光源模组拆卸的开口,从而方便所述LED光源模组的拆卸及更换。
另外,本领域技术人员还可在本发明精神内做其它变化,只要其不偏离本发明的技术效果,都应包含在本发明所要求保护的范围之内。

Claims (10)

1.一种LED光源模组,其包括一个LED驱动电路板,至少一个LED光源,一个散热垫以及一个散热器,所述LED驱动电路板的一侧表面上布置有用以驱动所述LED光源的驱动电路,所述LED光源固设在所述LED驱动电路板上并与所述驱动电路电连接,所述散热垫设置在所述LED驱动电路板上与设置有LED光源的一侧相对的另一侧,该散热器紧贴所述散热垫并与所述LED驱动电路板相连接。
2.如权利要求1所述的LED光源模组,其特征在于:所述LED驱动电路板大致呈方形且其对角位置处分别开设有两个定位孔。
3.如权利要求1所述的LED光源模组,其特征在于:所述LED光源包括一个红光LED光源、一个蓝光LED光源以及一个绿光LED光源。
4.如权利要求1至3任一项所述的LED光源模组,其特征在于:所述散热垫由导热材料制成。
5.如权利要求4所述的LED光源模组,其特征在于:该散热垫由导热硅胶制成。
6.如权利要求4所述的LED光源模组,其特征在于:所述散热器包括多个规则排列的散热鳍片。
7.一种光机装置,其包括一个LED光源模组以及一个光机,所述LED光源模组包括一个LED驱动电路板,至少一个LED光源,一个散热垫以及一个散热器,所述LED驱动电路板的一侧表面上布置有用以驱动所述LED光源的驱动电路,所述LED光源固设在所述LED驱动电路板上并与所述驱动电路电连接,所述散热垫设置在所述LED驱动电路板上与设置有LED光源的一侧相对的另一侧,该散热器紧贴所述散热垫并与所述LED驱动电路板相连接,所述光机包括一个进光部以及一个与所述进光部垂直设置的出光部,在所述进光部的底侧上开设有个容置孔,所述LED光源模组容置在所述容置孔内。
8.如权利要求7所述的光机装置,其特征在于:所述LED驱动电路板大致呈方形且其对角位置处分别开设有两个定位孔,在所述容置孔侧边设置有两个分别与所述LED驱动电路板的定位孔相对应配合的定位柱。
9.如权利要求8所述的光机装置,其特征在于:该光机装置还包括一个壳体,所述光机及LED光源模组收容在所述壳体内,该壳体对应所述光机的容置孔及光源模组开设有一个开口,且该开口的尺寸大于所述LED光源模组的尺寸。
10.如权利要求9所述的光机装置,其特征在于:该光机装置还包括一个盖体,该盖体卡设在所述壳体的开口内以封闭所述开口。
CN200810303760A 2008-08-14 2008-08-14 Led光源模组及其应用的光机装置 Pending CN101650010A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200810303760A CN101650010A (zh) 2008-08-14 2008-08-14 Led光源模组及其应用的光机装置
US12/346,790 US7963671B2 (en) 2008-08-14 2008-12-30 LED module and light modulator with the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200810303760A CN101650010A (zh) 2008-08-14 2008-08-14 Led光源模组及其应用的光机装置

Publications (1)

Publication Number Publication Date
CN101650010A true CN101650010A (zh) 2010-02-17

Family

ID=41672303

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810303760A Pending CN101650010A (zh) 2008-08-14 2008-08-14 Led光源模组及其应用的光机装置

Country Status (2)

Country Link
US (1) US7963671B2 (zh)
CN (1) CN101650010A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687451A (zh) * 2013-12-13 2014-03-26 陕西宝成航空仪表有限责任公司 用于惯性导航类产品中精密器件的散热优化结构
CN107816645A (zh) * 2016-09-13 2018-03-20 赛尔富电子有限公司 一种超薄型led条形灯

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010008876B4 (de) * 2010-02-22 2017-07-27 Integrated Micro-Electronics Bulgaria Lichtquelle mit Array-LEDs zum direkten Betrieb am Wechselspannungsnetz und Herstellungsverfahren hierfür
DE212013000056U1 (de) * 2012-01-19 2014-10-15 Phoseon Technology, Inc. Randgewichteter Abstand von LEDS für Bereich verbesserter Gleichmässigkeit
CN104321589A (zh) * 2012-05-23 2015-01-28 普司科Led股份有限公司 光学半导体照明装置
JP6186877B2 (ja) * 2013-05-17 2017-08-30 セイコーエプソン株式会社 光源装置およびプロジェクター
USD767806S1 (en) 2015-05-27 2016-09-27 Marcelo L. Colacilli LED cinema light
US11626448B2 (en) 2019-03-29 2023-04-11 Lumileds Llc Fan-out light-emitting diode (LED) device substrate with embedded backplane, lighting system and method of manufacture
US10986722B1 (en) * 2019-11-15 2021-04-20 Goodrich Corporation High performance heat sink for double sided printed circuit boards
US11631594B2 (en) 2019-11-19 2023-04-18 Lumileds Llc Fan out structure for light-emitting diode (LED) device and lighting system
US11777066B2 (en) 2019-12-27 2023-10-03 Lumileds Llc Flipchip interconnected light-emitting diode package assembly
US11664347B2 (en) 2020-01-07 2023-05-30 Lumileds Llc Ceramic carrier and build up carrier for light-emitting diode (LED) array
US11476217B2 (en) * 2020-03-10 2022-10-18 Lumileds Llc Method of manufacturing an augmented LED array assembly

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473870A (en) * 1983-04-15 1984-09-25 Carlingswitch, Inc. Lamp housing
US5640792A (en) * 1995-06-07 1997-06-24 National Service Industries, Inc. Lighting fixtures
CN2634503Y (zh) 2003-06-23 2004-08-18 唯特科技股份有限公司 组合式光箱结构
CN100514176C (zh) 2005-12-07 2009-07-15 财团法人工业技术研究院 照明装置及运用此照明装置的投影系统
US7794114B2 (en) * 2006-10-11 2010-09-14 Cree, Inc. Methods and apparatus for improved heat spreading in solid state lighting systems
CN101207110B (zh) 2006-12-22 2010-05-19 富准精密工业(深圳)有限公司 发光二极管模组
US7766527B2 (en) * 2008-05-20 2010-08-03 Tyco Electronics Corporation Low power LED light engine for light guide

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103687451A (zh) * 2013-12-13 2014-03-26 陕西宝成航空仪表有限责任公司 用于惯性导航类产品中精密器件的散热优化结构
CN103687451B (zh) * 2013-12-13 2016-05-11 陕西宝成航空仪表有限责任公司 用于惯性导航类产品中精密器件的散热优化结构
CN107816645A (zh) * 2016-09-13 2018-03-20 赛尔富电子有限公司 一种超薄型led条形灯
CN107816645B (zh) * 2016-09-13 2024-02-06 赛尔富电子有限公司 一种超薄型led条形灯

Also Published As

Publication number Publication date
US7963671B2 (en) 2011-06-21
US20100039817A1 (en) 2010-02-18

Similar Documents

Publication Publication Date Title
CN101650010A (zh) Led光源模组及其应用的光机装置
US20180253999A1 (en) Lighting Device with Transparent Substrate and Heat Sink
US8159152B1 (en) High-power LED lamp
CN108303814B (zh) 显示装置
US20080080188A1 (en) Modulized Assembly Of A Large-sized LED Lamp
US20080055908A1 (en) Assembled structure of large-sized led lamp
US20100321950A1 (en) Water-cooling module for led headlamp
JP2010262903A (ja) 車両用灯具
JP2010085781A (ja) 画像表示装置
US20130223061A1 (en) Multi-layer array type led device having a multi-layer heat dissipation structure
US8870410B2 (en) Optical panel for LED light source
CN105427756A (zh) 双面led显示屏
CN102628583A (zh) 一种显示装置的外框、背光模组及液晶显示装置
EP2613078B1 (en) Light source apparatus and cooling thereof
CN111391317A (zh) Lcd3d打印机及lcd3d打印系统
US20190032910A1 (en) Led lamp
CN103206678A (zh) 灯座和具有该灯座的照明装置
CN105976728A (zh) 一种散热型led显示屏
US20090267794A1 (en) Light emitting diode based traffic light module
JP2011053313A (ja) Led表示装置
CN203010558U (zh) 一种模组化半导体照明装置
JP2014110153A (ja) Ledモジュール、led光源ユニット、およびそれらを利用したled灯具
KR20200046941A (ko) 플렉서블 led 필름 모듈
CN103994362A (zh) 照明装置
CN215892015U (zh) 一种紫外线光源

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20100217