TWI355539B - Light source module, illuminating apparatus and li - Google Patents

Description

1355539 P51950123TW 21879twf.doc/006 - IX. Description of the Invention: [Technical Field] The present invention relates to a light source module and an application thereof, and particularly

A light source module with simple structure, low cost and good light quality and its application. W [Prior Art] With the advancement of manufacturing technology, the types of lighting devices are becoming more diverse, and their application fields are becoming more and more extensive. A liquid crystal display is an electronic product that uses a lighting device (ie, a backlight module) to achieve a display effect. ^ • The application of LCD monitors has become more and more diverse over the years, such as the use of hands, computers (monitoring computers), monitors, cameras, automatic teller machines, televisions. (tdevision) and display in avionics. Generally, a liquid crystal display needs to illuminate information to be displayed by a lighting device. The lighting device can use different light sources, such as a fluorescent lamp or a light emitting diode. The fluorescent lamp has a lower cost and requires complicated control circuits, but the color is insufficient. And the sinfulness and other disadvantages. Therefore, the technology of using the light-emitting diode as the light source of the liquid crystal display has recently been proposed. Compared with the daylight bulb, the hair-emitting diode has a long service life, easy replacement, high reliability, and ^ The advantages of car color saturation, etc. However, most commercially available light-emitting diodes have limited chroma selection and chroma changes over time. Figure 1 shows US Patent No. 6,666,567 The disclosed light-emitting diode light source 1 539, 1355539 P51950123TW 21879twf.doc/006 is used to improve the chroma of the combined light. The light-emitting diode 100 includes a light-emitting diode 101. The light-emitting diode 101 is wrapped in

In the light emitting diode package 102. The light emitting diode package 102 is supported above the bottom plate 103 having optical recesses to allow light to exit from the bottom of the light emitting diode. In addition, a reflective protrusion can be placed under the elevated light emitting diode to change the direction of travel of the light. In addition, an architecture composed of a daylight bulb and a light-emitting diode has also been proposed to form a hybrid light source (hybridlights).

FIG. 2 and FIG. 3 illustrate a liquid crystal display backlight 200 disclosed in US Pat. No. 6,608,614, which includes a first LED array 2 〇1 for providing first chroma light and a second color providing A second light emitting diode array 202 of light. The light emitted from the light emitting diode arrays 2〇1 and 2〇2 passes through the light combining element 3〇1 (e.g., the waveguide element) and is then projected toward the liquid crystal display panel 302. The light emitted by the light-emitting diode grains is generally nearly perpendicular to the direction of the crystal grain surface, so that the light emitted from the light-emitting diode arrays 2〇1 and 202 is nearly perpendicular and parallel to the panel surface: light to be separated Combine element 3()1 to adjust the direction of the light. In addition, the chroma of the second light-emitting diode array can only be changed by the control system to adjust the chroma of the combined light. Figure 4 is a conventional device (We, -) having a bare die packaged with a light-emitting diode. This L_n side exit is combined with 4 = sentence combined light 'but the light intensity is poor. In addition, the sealing structure of the 1^ pole body has a large area. The light emitted from the bare die of the light-emitting diode is 1355539 P51950123TW 2l879twf.doc/006 straight to the grain surface. Therefore, the light-emitting diode bare crystal teaches (4) to be trimmed so that the bare die emits from the light-emitting diode = before the target, there is a chance to combine and mix into the desired chroma and low war for the group. The material structure is simple. • Another object of the invention is to provide a lighting device which is simple in structure, low in cost and can provide a uniform light source. It is still another object of the present invention to provide a liquid crystal display which can be applied to the above-described illumination device to achieve a good display effect. To achieve the above or other objects, the present invention provides a light source module that mainly includes an optical piate and at least one light emitting device. The optical carrier board includes a heat dissipation core plate and at least one electric circuit layer disposed on the heat dissipation core board. Further, the light emitting element is disposed on the optical carrier and electrically connected to the electronic circuit layer. In one embodiment of the present invention, the light source module has a plurality of light emitting elements, for example, and these light emitting elements are respectively disposed on opposite sides of the optical carrier and electrically connected to the corresponding electronic circuit layers. In an embodiment of the invention, the one side edge of the heat dissipation core plate has at least one slope, and the light emitting element is disposed above the slope. In an embodiment of the invention, one side edge of the heat dissipation core plate has two intersecting slopes ' and at least one light-emitting element is disposed on each of the slopes. In an embodiment of the invention, the light-emitting element is, for example, a light-emitting diode

7 1355539 P51950123TW 21879twf.doc/006 Body die. Further, the bare die of the light emitting diode is bonded to the electronic circuit layer by, for example, a flip chip bonding technique or a wire bonding technique. When the wire bonding technique is used to connect the bare die and the electronic circuit layer, the electronic circuit layer may have, for example, at least one cavity, and the bare die of the light emitting diode is disposed in the recess. In addition, the recessed holes can, for example, blew out the heat dissipation core plate, and the bare die of the light emitting diode is directly disposed on the surface of the heat dissipation core plate. Further, the inner surface of the recessed hole may have, for example, a light reflecting layer.

In an embodiment of the invention, the light source module further includes a transparent material disposed on the optical carrier for encapsulating the bare die of the light emitting diode. Among them, the transparent material is, for example, one selected from the group consisting of an epoxy, a silicone, and the like. In an embodiment of the invention, the light-emitting element described above may also be a packaged light-emitting diode.

In an embodiment of the invention, the material of the heat dissipation core plate is selected from the group consisting of an eight-electric material, an electrical conductor, a heat conduction conductor, and one of the above-mentioned families. The core plate may be a flat heat pipe. In one embodiment of the invention, a flatted heat pipe is used. In an embodiment of the invention, the electronic circuit layer is, for example, a board. Further, the electronic circuit layer may also be a multi-layered structure composed of at least one dielectric screen conductive layer. Wherein, the dielectric layer is less: from the oxide, the ceramic material and the group consisting of the above, wherein 2 is k 8 1355539 P51950123TW 21879twf.doc/006 In one embodiment of the invention, the light-emitting element can emit a plurality of colors The light. The invention further provides an illumination device using the above-mentioned light source module, which mainly comprises at least one of the above-mentioned light source modules by a bottom plate, wherein the photonic carrier plate is disposed on the bottom plate to provide a light source. In an embodiment of the invention, the illumination device further includes at least one optical protrusion disposed between two adjacent optical carriers. In an embodiment of the invention, the shape of the optical protrusion is, for example, a pyramidal, a conic, a parablic or a semi-spherical. In an embodiment of the invention, the illumination device has at least one slot on the bottom plate, and the optical carrier is correspondingly inserted into the slot. In an embodiment of the invention, the lighting device further includes a heatsink disposed on the other side of the bottom plate with respect to the light emitting element, and the optical carrier is coupled to the heat sink. In an embodiment of the invention, the optical carrier of the illumination device described above is coupled to the heat sink, for example, through the bottom plate. In an embodiment of the invention, the illumination device further includes a controller electrically coupled to the corresponding light emitting element via the electronic circuit layer. In an embodiment of the invention, the illumination device further includes an optical element for directing light emitted by the light-emitting element. In an embodiment of the invention, the optical element is, for example, a light diffuser or a wave guide. 1355539 P51950123TW 21879twf.doc/006 The present invention further applies the above illumination device, and proposes a liquid crystal display, which mainly comprises a liquid crystal panel and the above illumination device. Wherein, the illumination device is assembled with the liquid crystal panel to provide a liquid crystal display. In the embodiment of the invention, the liquid crystal display further includes at least one optical film disposed between the liquid crystal panel and the illumination device. In an embodiment of the invention, the optical film comprises a diffusion sheet, a ruthenium sheet, a brightness enhancement sheet, and one of the groups of the above. Based on the above, the present invention mounts a light-emitting element by an optical carrier plate composed of a heat dissipation core plate and an electronic circuit layer, so that the structure is simple and the cost can be reduced. In addition, the cooling core board helps the light source module to dissipate heat, thus improving product reliability. When the light source module is applied to the illumination device, a light source with good uniformity of light intensity can be generated, and the wire can also be used as a backlight of the liquid crystal display to improve the display quality of the liquid crystal display. The above and other objects, features and advantages of the present invention will become more apparent and understood. [Embodiment] The present invention proposes a light source module which is simple in structure, low in cost, and excellent in light-emitting quality, and mainly mounts a light-emitting element by an optical carrier plate composed of a heat dissipation core plate and an electronic circuit layer. Among them, the electronic circuit layer can be easily fabricated and the light-emitting element can be electrically connected to the external circuit to achieve a simplified process. In addition, the heat-dissipating core board helps to transfer the heat energy of the two-piece light-emitting device to the outside, and the material-assisted light source module dissipates heat to improve product reliability. In addition, the heat dissipation core plate can have a slope p5l95〇123TW 21879twf.doc/006 °, in order to adjust the light direction of the light-emitting element, and further improve the light-emitting quality of the light source module. The present invention further integrates at least one light source module to provide an illumination device, which mainly combines a light source module with a bottom plate to achieve the effect of providing a light source by the light on the light source module. In addition, the present invention can further apply the illumination device to a liquid crystal display to provide a liquid crystal panel display light source, wherein the illumination quality of the illumination device is better, so that the display quality of the liquid crystal can be improved. The related content and features of the present invention will be described below by exemplifying a plurality of embodiments. 5A and 5B respectively illustrate a light source module of an embodiment of the present invention, and as shown in Figs. 5A and 5B, the light source module 5A mainly includes an optical carrier 510 and at least one light emitting element 52A. The optical carrier board ο includes a heat dissipation core board 512 and at least one electronic circuit layer 514 disposed on the heat dissipation core board 512. Further, the light emitting element 520 is disposed on the optical carrier board 51 and electrically connected to the electronic circuit layer 514. The heat dissipation core plate 512 is mainly used to carry the electronic circuit layer 5H and the light-emitting element 52, and can provide heat dissipation effect. Therefore, the material of the heat dissipation core-plate 512 is provided. For example, it may be selected from the group consisting of a dielectric material, an electrical conductor, a heat conducting conductor, and the like. Further, the present invention can also directly use a commonly known heat dissipating component as the heat dissipating core board 512. For example, The heat core plate 512 can be a flat heat pipe. The flat heat pipe has a hollow chamber inside, and can pass the heat conducting medium to achieve better heat dissipation efficiency. P51950123TW 21879twf.doc/006 The heat dissipation core plate 512 of the embodiment An electronic circuit layer 514 and a light-emitting element 520 are disposed on opposite sides, wherein the light-emitting element 520 is electrically connected to the corresponding electronic circuit layer 514. The light source module 500 illustrated in FIGS. 5A and 5B is for example only, and the present invention does not limit the number of the light emitting element 520 and the electronic circuit layer 514. In fact, the optical carrier 510 is shown in FIG. 5C. A plurality of specifically distributed light-emitting elements 520 can be disposed on the same side. In order to obtain light outputs of different colors, the light-emitting elements 520 emitting light of different colors can be applied. In more detail, for example, multiple color lights can be simultaneously emitted. The single light-emitting element 520, or a plurality of light-emitting elements 520 that can emit light of different colors. In order to adjust the light direction of the light-emitting element 520, the embodiment forms at least one slope on one side of the heat-dissipating core board 512, for example. 512a, and illuminating element 520 is disposed on the inclined surface 512a. In the embodiment illustrated in Figures 5A and 5B, the side edge of the heat dissipation core plate 512 has, for example, two intersecting slopes 512a, and each of the slopes 512a is respectively At least one light-emitting element 520 is disposed. It should be noted that the present invention does not limit the number and position of the above-mentioned slopes, and may even change the slope to a curved surface. As shown in Fig. 5C, the heat dissipation core plate 512 does not have a slope. The position of the electronic circuit layer 514 may vary depending on the distribution position of the light-emitting element #52〇 and the actual design. For example, the electronic circuit layer shown in '5A green 5Μ covers the inclined surface 512a of the heat dissipation core board S12 and a portion of the opposite planes 512b, and the electronic circuit layer 514 indicated by the ® 5B covers only the slope 512a of the thermal core board 512 of the 12 P51950123TW 21879twf.doc/006. In addition, the electronic circuit The layer 514 can be selected from various types of secret substrates, for example, a printed circuit board, which is directly attached to the heat dissipation core board 512. Alternatively, the electronic circuit layer 514 may be formed of at least a dielectric layer and at least a conductive layer - a multilayer wiring structure which is formed on the heat dissipation core plate 512 layer by layer, for example, in a build-up manner. The material of the dielectric layer may be selected from the group consisting of an oxide, a Taman material, and one of the above-mentioned groups, and the material of the conductive layer is, for example, a metal conductive material such as copper (Cu) or aluminum (A1). The light-emitting element 520 is, for example, a bare die of a light-emitting diode, and may be connected to bare by different bonding technologies such as flip chip bonding or wire bonding, for example, depending on the type of the bare die of the light-emitting diode. Die and electronic circuit layer 514. _~6(: sequentially _== the same type of light-emitting diode bare die and its suitable bonding structure. As shown in FIG. 6A, the bare LED die 61 has the first electrode on the same side 610a and the second electrode 61〇b, which is formed by, for example, a flip chip bonding technique, through conductive materials 612 such as a plurality of conductive bumps, conductive pastes, solders, etc. A plurality of contacts (not shown) on the electronic circuit layer 614 are bonded. Further, if the conductive bumps 612 are used to bond the LEDs 61 and the electronic circuit layer 614', the LEDs can be exposed in the LED. An iminder is filled between the pellet 61 and the electronic circuit layer 614 to improve the reliability of the conductive bump 612. This bonding method is applicable to the electronic circuit layer 614 having a high accumulation of wiring. An example in which the LED die 620 and the electronic circuit layer 624 are connected by edge bonding, wherein the LED is exposed

13 1355539 P51950123TW 21879twf.doc/006 The particle 620 has a first electrode 62〇a and a second electrode 62% on the same side, and the first electrode 620a and the second electrode 620b are respectively connected by a wire bonding technique through a plurality of wires 622. A plurality of contacts (not shown) on the electronic circuit layer 624. It should be noted that the electronic circuit layer 624 of the embodiment further has a recess 624a, and the LED die 〇 can be disposed in the recess 624a by an adhesive (not shown). Adjusting the height of the bare die 620 of the light-emitting diode contributes to the wire-drawing action. In addition, the recess 62 can expose the heat dissipation core plate 626, for example, and the LED die 62 can be directly disposed on the surface of the heat dissipation core plate 626 to help dissipate heat from the LED die 620. Herein, the preferred method proposed by the present invention is to design the coupling electrode corresponding to the LED 620 (ie, the above contact) on the electronic circuit layer 624, and the heat dissipation core plate 626 itself does not serve as an electrode. . The connection between the plurality of light-emitting i-pole bare dies 620 can be easily formed in series by the connection of the electronic circuit layer 624, so that the problem of excessive driving current and difficulty in control can be avoided. Of course, the invention does not exclude the use of the heat-dissipating core plate 6 2 6 as an electrode. Further, the inner surface of the recessed hole 624a may have, for example, a light reflecting layer 628 which contributes to improvement of the light source of the entire light source module. After the wire bonding is completed, for example, a transparent material 629 encapsulating the bare die 620 of the LED and the wire 622 may be formed. The transparent material 6 is, for example, selected from the group consisting of an epoxide, a sulphur oxide polymer, and the like. One of the ethnic groups formed. FIG. 6C illustrates an example in which the LED 630 and the electronic circuit layer 634 are connected by a center wire bonding method. The bare die of the light-emitting diode (4) has a top electrode 630a and a bottom electrode (10) 〇m 1355539 P51950123TW 21879twf.doc/〇〇6

DeCtr〇de) 63〇b, wherein the bare LEDs 63 of the LEDs are directly connected to the contacts (not shown) of the electronic circuit layer via the bonding pads 630a by wire bonding technology, and connected to the electron thickness through the wires 632. Other contacts of 634 (not shown). Wherein, the bottom electrode (four) 匕 example: conductive adhesive or soldering shaft f sub-circuit layer 634 contact (not shown)::. After the wire bonding is completed, for example, a transparent material (4) of the encapsulating light-emitting diode 630 and the wire 632 can be formed, and the transparent material (10) is exemplified.

The group consisting of epoxide, Wei polymer and upper parent makes it possible to use - in addition to the above-mentioned bare die of the light-emitting diode as the light-emitting element, the present invention can also adopt the light-emitting diode which has been packaged. The body or the basin can provide the light-emitting wheel it} as a light-emitting element to be connected to the electronic circuit. However, the selection of the illuminating element may be different according to the design and the actual requirements. The phase _ structure and the bonding method are based on the existing technical water, and the technical person in the field of the forest is easy to push and refer to This will not be detailed. two

This U further proposes a lighting device that integrates at least one of the above-described light source modules. Ffil 7 绘 shows a lighting according to an embodiment of the present invention, and FIG. 7 is a partially enlarged view of the illumination I. It should be noted that although the (4) device of the present embodiment is formed by a plurality of button modules, in other embodiments, the present device may have only one light source module. As shown in Figures 7A and 7B, the illumination device 700 primarily includes a bottom plate 710 and a plurality of optical carrier plates 72, wherein the optical carrier plates are disposed on the bottom plate 710. The structure of each optical carrier 72() is as described above in the example of P51950123TW 21879 twf.doc/006 and will not be described in detail herein. Further, for example, the bevel design of the heat dissipation core plate 722, the number and arrangement of the light-emitting elements 726, the material of each member, the bonding manner of the light-emitting element 726 and the electronic circuit layer 724, and the like are also referred to the above embodiment. Referring to FIG. 7A and FIG. 7B again, in order to increase the light output, at least one optical protrusion 73 配置 is disposed between two adjacent optical carrier plates 720 (the present embodiment shows a plurality of optical protrusions 730). The shape can be pyramidal, conical, parabolic, hemispherical or other specially designed shapes. These optical protrusions 730 can reflect the light emitted by the light-emitting element 726 to a particular direction. In addition, in order to combine the optical carrier 720 with the bottom plate 71, the present embodiment forms a plurality of slots 712, for example, on the bottom plate, so that the optical carrier 72 can be correspondingly inserted into the slot 712. The illuminating device 700 of the present embodiment may further include a heat sink 74A disposed on the other side of the bottom plate 710 with respect to the light emitting element 726 and connected to the optical carrier 720. In addition, in order to provide a better heat dissipation effect, the optical carrier 720 can be integrated with the heat sink 740, for example, through the bottom plate 710. The illuminating device 700 of the present embodiment may further include a controller (not shown) that is electrically connected to the illuminating element 726 via the electronic circuit layer 724 of the corresponding optical carrier 720 for controlling the operation of the illuminating element 726. For example, a light source of the light-emitting element 726 is provided, the brightness of the light-emitting element 726 is controlled, and the light mixing effect of the light-emitting element 726 is adjusted. In addition, as shown in the cross-sectional view of the illumination device 700, as shown in the cross-sectional view of the illumination device 700, in order to homogenize the light output of the illumination device 700 or control the light output direction, the illumination device may further include an optical component 750 for guiding the light-emitting component 726 (see Figures 7A and 7B) 1355539 P51950123TW 21879twf.doc/006 Light emitted. This optical S piece 75 is, for example, a diffusion sheet or a waveguide element. . . Fig. 8 is a view showing a liquid crystal display of the present invention using the above illumination device. As shown in Fig. 8, the liquid crystal display is mainly composed of a liquid crystal panel 81A and an illumination device 820. The liquid crystal panel 81 is disposed above the illumination device 820 to receive the light source s provided by the illumination device 82 to display image information. The detailed structure of the illuminating device (10) is described in the foregoing embodiments, and will not be described in detail herein. In addition, the liquid crystal display unit can be disposed between the liquid crystal panel 81A and the illumination device 82A, such as a diffusion film, a silicon film, a brightness enhancement film, and the like. Improve the quality of the light source. The γ ® map f is a graph that simulates the light intensity and position measured from the surface of the liquid crystal panel. The horizontal axis represents the light intensity in the horizontal direction and the vertical direction of the liquid crystal panel, and the horizontal axis represents the (four) position on the liquid crystal panel. According to the result, the illumination device proposed in the present invention can be adjusted by the arrangement between the light-emitting elements and the inclined surface of the heat-dissipating core board or the optical carrier, so that the horizontal direction of the liquid crystal panel can be used with you. Both the light and the light uniformity are provided. In this way, it helps to buckle the display quality of the liquid crystal display. As described in the above, the light source module, the illumination device and the UtfH proposed by the present invention have at least the following features and advantages: Cylinder water (4)? The optically loaded two-load I-light component composed of a heat-dissipating core board and an electronic circuit layer has a simple structure and can reduce the manufacturing cost. In this way, the fabrication of the circuit layer is easy, and the package light element integrated with the light-emitting element is electrically connected to an external circuit, which contributes to simplifying the process. only

17 1355539 P51950123TW 21879twf.doc/006

3. The heat dissipation core board can transmit the heat energy of the light-emitting component to the outside to help the heat dissipation of the light source module and improve product reliability. Fourth, the heat dissipation core board can have a beveled design to adjust the light direction of the light-emitting elements, thereby improving the light-emitting quality. 5. Optical protrusions can be placed between the optical carriers to adjust the light direction. This improves the light quality.

6. The illumination device of the present invention can provide a good light source, which can provide good light intensity and light uniformity both in the horizontal direction and the vertical direction, thereby contributing to the improvement of the display quality of the liquid crystal display. The present invention has been disclosed in the above several embodiments, but it is not intended to be used in the present invention, and the general knowledge in the field of the invention may be changed without departing from the spirit and scope of the invention. Therefore, the scope of protection of the invention is subject to the scope of the patent application of (10). [Simplified illustration]

Figures 1 to 4 show w for a variety of different types of light sources. ^5A~5C纟 will show a light source module of an embodiment of the present invention.曰%r gamma 6C sequentially shows different types of luminescent diodes of the present invention and their suitable bonding structures. = 7A Green shows an illumination farm in accordance with an embodiment of the present invention. Figure % is a partial enlarged view of the lighting device of Figure 7A. Figure 7C is a cross-sectional view of the lighting device of Figure 7A. Device. Fig. 8 is a view showing a liquid crystal display of the present invention using the above illumination device. 18 1355539 P51950123TW 21879twf.doc/006 FIG. 9 is a graph showing the relationship between the light intensity and the position measured by the surface of the liquid crystal panel. [Main component symbol description] 100: Light-emitting diode light source 101: Light-emitting diode 102: Light-emitting diode package 103: Base plate 200: Liquid crystal display 201: First light-emitting diode array 202: Second light-emitting diode Array 301: optical combination element 302. liquid crystal display panel 500: light source module 510: optical carrier 512: heat dissipation core board 512a: slope 512b: plane 514: electronic circuit layer 520: light-emitting element 610: light-emitting diode bare crystal Particle 610a: first electrode 610b: second electrode 612: conductive material 614: electronic circuit layer

19 1355539 P51950123TW 21879twf.doc/006 • 620: LED die _ 620a: first electrode 620b: second electrode 622: wire 624: electronic circuit layer 624a: recess 626: heat sink core plate 628: light reflection Layer® 629: transparent material • 630: light-emitting diode bare die 630a: top electrode 630b: bottom electrode 632: wire 634: electronic circuit layer 639: transparent material 700: illumination device φ 710: bottom plate 712: slot 720: Optical carrier 722: heat dissipation core plate 724: electronic circuit layer 726: light-emitting element 730: optical protrusion 740: heat sink

20 1355539 P51950123TW 21879twf.doc/006 « 800 : LCD 810 . LCD panel 820 : Lighting 830 : Optical diaphragm

Claims (1)

1355539 100-10-18 X. Patent application scope: .1. A lighting device comprising: a bottom plate; at least one optical carrier plate comprising: a heat dissipation core plate 'through the bottom plate, a part of the heat dissipation core plate and another a part of the heat dissipation core plates are respectively located on opposite sides of the bottom plate; Two electronic circuit layers are respectively disposed on opposite sides of one end of the heat dissipation core board, and the two electronic circuit layers directly contact the heat dissipation core board; and a plurality of light emitting elements are respectively disposed on opposite sides of the optical carrier board, and It is electrically connected to the corresponding electronic circuit layer. 2. The illuminating device of claim 2, wherein the end of the heat dissipation core plate has two intersecting slopes, and at least one of the light-emitting elements is disposed on the slopes. 3. The illumination device of claim 2, wherein each of the light-emitting elements is a bare die of a light-emitting diode. 4. The illuminating device of claim 3, wherein each of the illuminating diodes 11 is barely bonded to the electronic circuit layer of the city by a flip chip bonding technique. 5. The illuminating device of claim 3, wherein each of the bare dies is joined to the corresponding electronic circuit layer by a wire bonding technique. 6. The device of claim 5, wherein each of the 22 丄 100-10-18 ^ sub-layers has at least a recessed hole and each is placed in the corresponding recessed hole. Λ 先 先 先 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸 裸It should be a beveled pole. As shown in the sixth aspect of the patent application, the inner surface of the recess has a radiation-emitting layer. ~, (four) set, each of which A illuminating device according to item 3 of the profit-making scope, further comprising a plurality of illuminating plates disposed on the optical carrier plate for encapsulating the swarf-pole body dies respectively. 10. The illumination device of claim 9, wherein the +f materials are selected from the group consisting of peroxide, oxypolymer, and a group thereof. U. The illumination device of claim 1, wherein each of the light-emitting elements is a packaged light-emitting diode. 12. The illuminating device of claim 1, wherein the material of the heat dissipating core plate is selected from the group consisting of a dielectric material, an electrical conductor, a heat conducting conductor, and one of the groups of the above. 13. The lighting device of claim 1, wherein the heat dissipation core plate is a flat heat pipe. 14. The illumination device of claim 1, wherein each of the electronic circuit layers is a printed circuit board or a multilayer structure of at least one dielectric layer and at least one conductive layer. 15. The illuminating device of claim 14, wherein the illuminating device is the same as the oxide, the ceramic material, and the above-mentioned composition: , wherein the a first piece of light emits multiple colors of light. The illumination device as described in claim i, further comprising an optical protrusion according to the invention, disposed between two adjacent optical carriers. The illuminating device of claim 17, wherein the shape of the light output comprises a pyramid shape, a conical shape, a parabolic shape or a hemispherical shape. The device of claim 4, wherein the bottom has at least one slot and the optical carrier is inserted through the slot. 20 ‘If you are in the middle of the patent scope! The illumination device of the present invention further includes a sheet that is disposed on the other side of the substrate relative to the light-emitting elements, and the optical carrier is coupled to the heat sink. The illuminating device of claim 2, wherein the preloading plate passes through the bottom plate to be coupled to the heat sink. Field 22. The illumination splitting of claim 1, further comprising controlling the light-emitting elements to be connected to the light-emitting elements. (10) Layer and I 2: The lighting device described in claim i, further includes - a yak for guiding the light emitted by the light-emitting elements. 24. The illumination device of claim 23, wherein the component comprises a diffuser or a waveguide component. First, a liquid crystal display comprising: a liquid crystal panel; 24 1355539 100-10-18 - a lighting device assembled with the liquid crystal panel to provide a light source for display of the liquid crystal panel, the lighting device comprising: a bottom plate At least one optical carrier board includes: a thermal core plate extending through the bottom plate, wherein a portion of the heat dissipation core plate and another portion of the heat dissipation core plate are respectively located on opposite sides of the S-floor; two electronic circuit layers , respectively disposed on opposite sides of the heat-dissipating core board, and the two electronic circuit layers directly contact the side heat-dissipating core board; and a plurality of light-emitting elements are disposed on opposite sides of the county carrier board and are respectively electrically The liquid crystal display according to claim 25, wherein the two intersecting slopes and the liquids on the slopes are respectively described above.接 = circuit layer bonding. Bonding technology and corresponding electrons 29. As described in claim 27 of the scope of the patent, the bare diode of the light-emitting diode is a snail The circuit layer is bonded to the liquid crystal display according to claim 29, wherein each of the electronic circuit layers has at least one recessed hole. And each of the light-emitting diodes 5 is disposed in the corresponding recessed hole. 31. The liquid crystal display according to claim 30, wherein the recessed holes in the one of the recessed holes of the heat-dissipating core board are exposed. And the liquid crystal display of the heat-dissipating core plate is disposed on the inner surface of each of the recessed holes of the heat-dissipating core plate. A liquid crystal display according to claim 27, further comprising a plurality of transparent materials disposed on the optical carrier for respectively encapsulating the light emitting diodes The liquid crystal display of claim 33, wherein the transparent material is selected from the group consisting of an epoxide, a siloxane polymer, and the group of the above-mentioned ones. , 35. If the scope of patent application is 25 The liquid crystal display, wherein the light-emitting elements are packaged light-emitting diodes. The liquid crystal display of claim 25, wherein the material of the heat-dissipating core plate is selected from a dielectric material, The electric conductor, the heat transfer body, and one of the above-mentioned groups of the above-mentioned ones. The light source module according to claim 25, wherein the core plate is a flat heat pipe. The liquid crystal display of claim 25, wherein each of the conductive layers - the board or the at least - dielectric layer and at least - the liquid crystal display of claim 38, wherein the 26 1355539 100 -10-18 The material of the dielectric layer is selected from the group consisting of oxides, ceramic materials, and the like. 40. The liquid crystal display of claim 25, wherein the light emitting elements emit light of a plurality of colors. The liquid crystal display of claim 25, wherein the illumination device further comprises at least one optical protrusion disposed between two adjacent light plates. 42. The liquid crystal display of claim 41, wherein the shape of the optical protrusions comprises a pyramidal shape, a conical shape, a parabolic shape or a spherical shape. The liquid crystal display of claim 25, wherein the substrate has at least one slot, and the optical carrier is correspondingly inserted and passed through the slot. 44. The liquid crystal display of claim 25, wherein the illuminating device further comprises a heat sink, the other side of the bottom plate is coupled to the light emitting parts, and the optical carrier is connected to the heat sink. 45. The liquid crystal display of claim 25, wherein the optical carrier passes through the singularity; and the liquid crystal display according to claim 25, a controller for driving a light-emitting element, which is electrically connected to the light-emitting elements via the electronic circuits. (4) 4 7. The liquid crystal display according to claim 29, further comprising > - optical film , which is disposed on the liquid crystal panel and the liquid crystal display as described in claim 47, wherein 27 1355539 100-10-18 The optical film comprises a diffusion sheet, a prism sheet, a brightness enhancement sheet, and one of the groups of the above. 28