TWI794443B - 邊材除去機構以及邊材除去方法 - Google Patents

邊材除去機構以及邊材除去方法 Download PDF

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Publication number
TWI794443B
TWI794443B TW108108194A TW108108194A TWI794443B TW I794443 B TWI794443 B TW I794443B TW 108108194 A TW108108194 A TW 108108194A TW 108108194 A TW108108194 A TW 108108194A TW I794443 B TWI794443 B TW I794443B
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TW
Taiwan
Prior art keywords
sapwood
sap material
substrate
tape
pulley
Prior art date
Application number
TW108108194A
Other languages
English (en)
Chinese (zh)
Other versions
TW201945305A (zh
Inventor
西尾仁孝
高松生芳
上野勉
酒井敏行
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201945305A publication Critical patent/TW201945305A/zh
Application granted granted Critical
Publication of TWI794443B publication Critical patent/TWI794443B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B32B38/105—Removing layers, or parts of layers, mechanically or chemically on edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW108108194A 2018-04-27 2019-03-12 邊材除去機構以及邊材除去方法 TWI794443B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018086932A JP7033310B2 (ja) 2018-04-27 2018-04-27 端材除去機構並びに端材除去方法
JP2018-086932 2018-04-27

Publications (2)

Publication Number Publication Date
TW201945305A TW201945305A (zh) 2019-12-01
TWI794443B true TWI794443B (zh) 2023-03-01

Family

ID=68357587

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108108194A TWI794443B (zh) 2018-04-27 2019-03-12 邊材除去機構以及邊材除去方法

Country Status (4)

Country Link
JP (1) JP7033310B2 (ja)
KR (1) KR102663971B1 (ja)
CN (1) CN110406241B (ja)
TW (1) TWI794443B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112893422B (zh) * 2021-03-19 2024-08-27 翰诠特种纺织品（平湖）有限公司 一种汽车内饰原毯边料处理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006227105A (ja) * 2005-02-15 2006-08-31 St Lcd Kk 表示パネルの不要部除去方法及び不要部除去装置
JP2014214055A (ja) * 2013-04-25 2014-11-17 三星ダイヤモンド工業株式会社 基板加工システムおよび基板加工方法
TW201733936A (zh) * 2016-03-29 2017-10-01 三星鑽石工業股份有限公司 邊材除去裝置及邊材除去方法
CN107253825A (zh) * 2010-09-30 2017-10-17 安瀚视特股份有限公司 防护玻璃及防护玻璃的制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3151630B2 (ja) * 1991-10-22 2001-04-03 ローム株式会社 基板の分割装置
JPH10296700A (ja) * 1997-04-22 1998-11-10 Rohm Co Ltd セラミックス基板のブレーク装置
WO2002057192A1 (fr) 2001-01-17 2002-07-25 Mitsuboshi Diamond Industrial Co., Ltd. Separateur et systeme de separation
JP4494753B2 (ja) * 2003-10-27 2010-06-30 リンテック株式会社 シート剥離装置及び剥離方法
KR100723421B1 (ko) 2006-03-13 2007-05-30 삼성전자주식회사 포인트 보간에 의한 렌더링 방법, 포인트 보간에 의한 렌더링 장치 및 기록매체
JP4906518B2 (ja) * 2007-01-15 2012-03-28 日東電工株式会社 粘着テープ貼付け方法およびこれを用いた粘着テープ貼付け装置
KR20140011217A (ko) * 2012-07-18 2014-01-28 삼성디스플레이 주식회사 필름 박리 장치
CN102894063A (zh) * 2012-10-24 2013-01-30 湛江市正大食品机械有限公司 全自动剥鱼皮机
JP6047439B2 (ja) * 2013-03-26 2016-12-21 株式会社Ｓｃｒｅｅｎホールディングス 剥離装置および剥離方法
JP2014214054A (ja) 2013-04-25 2014-11-17 三星ダイヤモンド工業株式会社 貼り合わせ基板の加工装置
JP2016095179A (ja) 2014-11-13 2016-05-26 三星ダイヤモンド工業株式会社 検査装置
CN205240901U (zh) * 2015-11-12 2016-05-18 微科智能自动化（深圳）有限公司 一种手机辅料自动剥离装置
CN205283945U (zh) * 2015-12-01 2016-06-01 阳程科技股份有限公司 撕膜装置
CN205736327U (zh) * 2016-05-30 2016-11-30 东莞市沃德精密机械有限公司 自动剥料装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006227105A (ja) * 2005-02-15 2006-08-31 St Lcd Kk 表示パネルの不要部除去方法及び不要部除去装置
CN107253825A (zh) * 2010-09-30 2017-10-17 安瀚视特股份有限公司 防护玻璃及防护玻璃的制造方法
JP2014214055A (ja) * 2013-04-25 2014-11-17 三星ダイヤモンド工業株式会社 基板加工システムおよび基板加工方法
TW201733936A (zh) * 2016-03-29 2017-10-01 三星鑽石工業股份有限公司 邊材除去裝置及邊材除去方法

Also Published As

Publication number Publication date
CN110406241A (zh) 2019-11-05
CN110406241B (zh) 2022-09-09
KR20190125167A (ko) 2019-11-06
KR102663971B1 (ko) 2024-05-07
TW201945305A (zh) 2019-12-01
JP2019188571A (ja) 2019-10-31
JP7033310B2 (ja) 2022-03-10

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