WO2017202103A1 - 导电胶的贴附设备及贴附方法 - Google Patents

导电胶的贴附设备及贴附方法 Download PDF

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Publication number
WO2017202103A1
WO2017202103A1 PCT/CN2017/075755 CN2017075755W WO2017202103A1 WO 2017202103 A1 WO2017202103 A1 WO 2017202103A1 CN 2017075755 W CN2017075755 W CN 2017075755W WO 2017202103 A1 WO2017202103 A1 WO 2017202103A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
attaching
conductive paste
printed circuit
stage
Prior art date
Application number
PCT/CN2017/075755
Other languages
English (en)
French (fr)
Inventor
屠汉巍
刘明辉
丁红杰
郝西魁
王鹏程
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to EP17755407.8A priority Critical patent/EP3468318A4/en
Priority to US15/555,201 priority patent/US10231345B2/en
Publication of WO2017202103A1 publication Critical patent/WO2017202103A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/16—Materials and properties conductive
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

  • Embodiments of the present invention relate to the field of display device processing technologies, and in particular, to a conductive adhesive attaching device and a attaching method.
  • the conductive adhesive is respectively attached to the electrode region of the flexible circuit (FPC) board or the chip on film (COF), and then the conductive adhesive in one electrode region of the FPC or COF is crimped through the high temperature crimping joint.
  • FPC flexible circuit
  • COF chip on film
  • the embodiment of the present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a bonding device and a bonding method for a conductive adhesive, which can not only prevent the conductive adhesive from being pre-cured, but also can increase the flexible circuit board. And the recycling of the flip chip, which can reduce the manufacturing cost.
  • An embodiment of the present invention provides a conductive adhesive attaching apparatus, comprising: a stage on which at least one working surface for carrying a printed circuit board is disposed, on which a working surface is disposed a groove, a bottom surface of the groove is provided with a plurality of adsorption holes; a vacuum adsorption device, the vacuum adsorption device is respectively connected to the plurality of adsorption holes; and an attaching mechanism disposed on the loading table, Attaching the conductive paste to a predetermined area on the printed circuit board, the predetermined area being the printed circuit board to be with the flexible circuit board or The area where the flip chip is crimped to each other.
  • a rubber layer is disposed in a region of the bottom surface of the groove other than the plurality of adsorption holes.
  • the work surface is an upper surface of the stage.
  • the vacuum adsorption device is a vacuum pump.
  • the first drive mechanism is an X-axis servo motor
  • the second drive mechanism is a Y-axis servo motor, wherein the X-axis is parallel to the first direction and the Y-axis is parallel to the first Two directions.
  • the conductive paste includes a release film
  • the attaching mechanism includes: a feeding device for conveying the conductive paste to the stage in a direction parallel to the stage a semi-cutting knife for punching the conductive paste to form the conductive paste to form a predetermined length to be attached; a pressing knife for attaching the to-be-attached segment to the printing a predetermined area on the circuit board; a peeling bar for peeling the release film on the portion to be attached from the portion to be attached; and a recycling device for recycling The release film peeled off from the attachment section is described.
  • an embodiment of the present invention provides a method for attaching a conductive adhesive, comprising the steps of:
  • the stage is provided with at least one working surface for carrying the printed circuit board, and a groove is arranged on the working surface, and a bottom surface of the groove is provided Multiple adsorption holes;
  • the conductive paste is attached to a predetermined area on the printed circuit board, wherein the predetermined area is a region of the printed circuit board to be crimped to the flexible circuit board or the flip chip.
  • the attaching method further comprises the steps of:
  • a rubber layer is provided in a region of the bottom surface of the groove other than the plurality of adsorption holes.
  • the attaching method further comprises the steps of:
  • the stage is driven to move in a second direction on a plane parallel to the work surface, wherein the second direction is perpendicular to the first direction.
  • the conductive paste comprises a release film; and the attaching method further comprises the steps of:
  • the release film peeled off from the portion to be attached is recovered.
  • an embodiment of the present invention provides a method for attaching the conductive adhesive by using a conductive adhesive attachment device provided by an embodiment of the present invention, including the steps of:
  • the stage is provided with at least one working surface for carrying the printed circuit board, and the working surface is provided with a groove, the bottom surface of the groove Providing a plurality of adsorption holes;
  • the attaching method further comprises the steps of:
  • a rubber layer is disposed in a region other than the plurality of adsorption holes.
  • the work surface is an upper surface of the stage.
  • the attaching method further comprises the steps of:
  • the stage is driven by the second drive mechanism to move in a second direction on a plane parallel to the work surface; wherein the second direction is perpendicular to the first direction.
  • the first driving mechanism is an X-axis servo motor
  • the second driving mechanism is a Y-axis servo motor, wherein the X axis is parallel to the first direction, And the Y axis is parallel to the second direction.
  • the conductive paste comprises a release film; and the attaching method further comprises the steps of:
  • the release film on the portion to be attached and the portion to be attached are attached by the peeling rod Stripping;
  • the release film peeled off from the portion to be attached is recovered by the recovery device.
  • an embodiment of the present invention provides a method for attaching a conductive adhesive, comprising the steps of:
  • An electrode region of the flexible circuit board or the flip chip that is not attached with the conductive paste is crimped to a region of the printed circuit board to which the conductive paste is attached.
  • the flexible circuit board or the electrode region of the flip chip attached with the conductive paste is crimped to the glass substrate using a high temperature crimping joint;
  • the flexible circuit board or the electrode region of the flip chip that is not attached with the conductive paste is crimped to a region of the printed circuit board to which the conductive paste is attached by using a high temperature crimping joint.
  • the method for attaching the conductive adhesive provided by the embodiment of the invention not only can prevent the conductive adhesive from being pre-cured, but also can increase the recycling and reuse of the flexible circuit board and the flip chip, thereby reducing the manufacturing cost.
  • FIG. 1 is a structural view of a device for attaching a conductive paste according to an embodiment of the present invention
  • Figure 2 is a plan view of the stage of Figure 1;
  • FIG. 3 is a top view of a flexible circuit board or a flip chip
  • Figure 4 is a plan view of the printed circuit board when the conductive paste is attached
  • Figure 5 is a side view of a conductive paste.
  • a conductive adhesive such as an anisotropic conductive film (ACF) attachment method
  • ACF anisotropic conductive film
  • a conductive adhesive may include the following steps: first attaching a conductive adhesive to a flexible circuit (FPC) a plate or a chip on the surface of the electrode (Chip On Film, COF); then, one electrode region of the FPC or COF is crimped to the glass substrate through the conductive paste therein, and finally the other electrode of the FPC or COF The area is crimped to a printed circuit board (PCB) by a conductive paste therein.
  • FPC flexible circuit
  • COF Chip On Film
  • the heat radiated from the high temperature crimping joint causes conduction in the other electrode region of the FPC or COF.
  • the glue is pre-cured, resulting in subsequent crimping of the FPC or COF onto the printed circuit board through the conductive paste in the other electrode region, a poor crimping phenomenon may occur, resulting in a large number of crimps that need to be replaced or repaired. product.
  • two electrode regions 22 and 23 are oppositely disposed at the edge of the flexible circuit board (or flip chip) 21, and the two electrode regions 22 and 23 may be located at flexibility.
  • one of the electrode regions is for crimping to the glass substrate, and the other electrode region is for crimping to the printed circuit board 31, as shown in FIGS. 3 and 4.
  • the embodiment of the present invention provides an attaching device for the conductive paste 2 for attaching the conductive paste 2 to a region 32 on the printed circuit board 31, the region 32 being crimped by the printed circuit board 31 and the flexible circuit board 21.
  • the area is shown in Figure 4.
  • the attachment device With the attachment device, the attachment method of the existing conductive paste 2 can be improved. Specifically, the conductive paste 2 is attached to the electrode region of the flexible circuit board 21 for crimping with the glass substrate, and the electrode region of the flexible circuit board 21 for crimping with the printed circuit board 31 is not subjected to the conductive paste 2 Attachment.
  • the attaching device of the conductive paste 2 provided by the embodiment of the present invention attaches the conductive paste 2 to the region 32 on the printed circuit board 31 for crimping with the flexible circuit board 21. Then, the flexible circuit board 21 is crimped to the printed circuit board 31, at which time the electrode area of the flexible circuit board 21 for crimping with the printed circuit board 31 and the area 32 of the printed circuit board 31 are bonded to each other by the conductive paste 2 and Realize electrical conduction.
  • one electrode region of the flexible circuit board 21 has the conductive paste 2 and the other electrode region has no conductive paste 2, in the process of crimping the flexible circuit board 21 to the glass substrate through one electrode region having the conductive paste 2, There is a problem that the conductive paste in the other electrode region is pre-cured, so that the occurrence of poor crimping can be avoided.
  • the flexible circuit board 21 is subsequently crimped to the printed circuit board 31, if the crimping failure occurs, the flexible circuit board 21 only needs to be separated from the printed circuit board 31, and the conductive adhesive remaining on the printed circuit board 31 is removed. And attaching the conductive paste 2 and crimping the flexible circuit board 21 on the printed circuit board 31 again. Thereby, the recycling and reuse of the flexible circuit board 21 can be increased, so that the manufacturing cost can be reduced.
  • the attaching device of the conductive paste 2 provided by the embodiment of the present invention attaches the conductive paste 2 to the region of the printed circuit board 31 for crimping with the flexible circuit board 21, but this example is Embodiments of the invention are not limited thereto.
  • the bonding device of the conductive paste 2 provided by the embodiment of the present invention can also be used to attach the conductive paste 2 to the printed circuit board 31 for bonding with the flip chip 21, due to the specific The attachment method and process are the same as those described above, and the description will not be repeated here.
  • the step of punching the flip chip 21 and laminating the conductive paste 2 by manual feeding can be omitted.
  • the automatic feeding of the flip chip 21 can be realized, thereby not only improving the working efficiency of the rework system, thereby increasing the productivity, but also avoiding the pollution caused by the manual feeding to the conductive paste 2, and the product. Poor quality, etc.
  • the attachment device includes a stage 1 and an attachment mechanism.
  • the attachment mechanism will be described in detail below, and the stage 1 will be described first.
  • At least one working surface for carrying the printed circuit board 31 is disposed on the stage 1, and the working surface may be the upper surface of the stage 1 (i.e., in Fig. 2, the reference numerals indicate both the stage and the Said the working surface of the stage).
  • a plurality of grooves 11 are disposed on the working surface, and a plurality of adsorption holes 12 are disposed on a bottom surface of each of the grooves 11.
  • each of the grooves 11 is provided with four circular adsorption holes 12, but the number, shape and distribution of the adsorption holes 12 are not limited to those shown in FIG. 2, and other types may be employed. Any suitable way.
  • a printed circuit board 31 can be placed in each of the recesses 11.
  • the attaching apparatus may further include a vacuum adsorption device 8 connected to the plurality of adsorption holes 12 for extracting air between the bottom surface of the printed circuit board 31 and the bottom surface of the recess 11 through the adsorption holes 12.
  • a vacuum adsorption device 8 connected to the plurality of adsorption holes 12 for extracting air between the bottom surface of the printed circuit board 31 and the bottom surface of the recess 11 through the adsorption holes 12.
  • the vacuum adsorption device can be a vacuum pump.
  • the attachment device further comprises a first drive mechanism 9 and a second drive mechanism 10 for driving the stage 1 in a plane parallel to the work surface
  • the upper direction moves in a first direction (for example, the horizontal direction in FIG. 2);
  • the second driving mechanism 10 is used to drive the stage 1 in a second direction on a plane parallel to the working surface (for example, the vertical direction in FIG. 2) Moving;
  • the second direction and the first direction are mutually vertical.
  • the first direction and the second direction are respectively established as the X-axis and the Y-axis, thereby realizing the coordinate of the position of each printed circuit board 31 on the working surface, thereby
  • the first drive mechanism 9 and/or the second drive mechanism 10 can be automatically controlled to drive the carriage 1 to move to achieve precise alignment of the stage 1.
  • the X-axis can be parallel to the direction of transport of the conductive paste
  • the Y-axis is perpendicular to the direction of transport of the conductive paste.
  • the embodiment of the present invention has no limitation on the specific structure of the first driving mechanism and the second driving mechanism, as long as the two can realize the movement of the driving stage.
  • the first drive mechanism 9 may be an X-axis servo motor
  • the second drive mechanism 10 may be a Y-axis servo motor.
  • the attaching mechanism is disposed above (or around) the stage 1 for attaching the conductive paste 2 to a predetermined area on the printed circuit board 31.
  • the predetermined area is a region where the flexible circuit board (or flip chip) 21 is crimped on the printed circuit board 31, that is, as shown in FIG. 4, on the printed circuit board 31 for use with the flexible circuit board (or The crystalline film) 21 is crimped to the region 32.
  • the conductive paste 2 includes a subbing layer 332 and a release film 331 serving as a carrier.
  • the attaching mechanism attaches the conductive adhesive 2 by means of automatic feeding.
  • the attaching mechanism includes a feeding device 3, a half cutter 4, a press knife 5, a peeling bar 6, and a recovery device 7.
  • the feeding device 3 is for conveying the conductive paste 2 above the working surface of the stage 1 in a direction parallel to the stage 1 (i.e., the direction indicated by the horizontal arrow in Fig. 1).
  • the half cutter 4 is used for punching the adhesive layer 332 of the conductive paste 2, so that the adhesive layer 332 is formed into a predetermined length to be attached, without cutting the release film 331 of the conductive paste 2, which can be controlled by half cut.
  • the punching distance of the knife 4 is such that the cutting edge of the half cutter 4 cuts only the glue layer 332 of the conductive paste 2 when the half cutter 4 is moved vertically upward relative to the stage 1 to the highest position.
  • FIG. 4 it is assumed that the conductive paste 2 is translated relative to the printed circuit board 31 in the direction of the arrow in FIG. 4 (to the left).
  • the adhesive layer 332 of the conductive paste 2 is punched and formed.
  • Each of the segments to be attached wherein the length of each of the segments to be attached satisfies the length required to be attached to the region 32 of the printed circuit board 31, and each of the segments to be attached remains attached to the release film 331 at this time.
  • the state, while the release film 331 is always in a continuous strip shape.
  • the pressing blade 5 is used to attach the to-be-attached section punched by the half cutter 4 to the printed circuit In the preset area 32 on the board 31.
  • the peeling rod 6 is used for peeling off the release film on the current to-be-attached segment, at which time the adhesive layer 332 of the current attachment portion is attached in the preset region 32, and the release film 331 and the current to-be-attached segment are attached.
  • the glue layer 332 is separated and continues to move forward.
  • the recovery device 7 is for recovering the release film 331 peeled off from the portion to be attached, thereby completing the entire attachment process of the conductive paste 2.
  • the automatic attachment of the conductive adhesive 2 can be realized, and the process is performed except that the printed circuit board 31 is manually accessed. It can be done automatically by the attaching device, which can improve the working efficiency of the attached device and thus increase the productivity.
  • an embodiment of the present invention further provides a rework system, which includes a first attaching device of the conductive adhesive 2, and the first attaching device adopts the above conductive adhesive provided by the embodiment of the present invention. 2 attached equipment.
  • the rework system further includes a second attaching device of the conductive adhesive 2 for attaching the conductive adhesive 2 to a preset area on the flexible circuit board (or the flip chip) 21, wherein the preset area is the An electrode region of the flexible circuit board (or flip chip) 21 to be crimped to the glass substrate.
  • the second attaching device may be the attaching device of the above conductive adhesive 2 provided by the embodiment of the present invention, or the attaching device in the prior art.
  • the rework system further includes a crimping device of the flexible circuit board (or flip chip) 21 for crimping the flexible circuit board (or flip chip) 21 to which the conductive paste 2 is attached to the preset area 32.
  • the rework system further includes a third attaching device of the conductive adhesive 2 for attaching the conductive adhesive 2 to a predetermined area on the flip chip, the preset area being a crimping place on the glass substrate The electrode region of the flip chip is described.
  • the third attaching device may be the attaching device of the above conductive adhesive 2 provided by the embodiment of the present invention, or the attaching device in the prior art.
  • the rework system further includes a crimping device for the flip chip for crimping the flip chip to which the conductive paste 2 is attached to the printed circuit board 31 to which the conductive paste 2 is attached in the predetermined region 32.
  • the rework system provided by the embodiment of the present invention can not only prevent the conductive adhesive from being pre-cured by using the above-mentioned conductive adhesive attaching device provided by the embodiment of the present invention, but also can increase the recycling and reuse of the flexible circuit board and the flip chip. Therefore, the manufacturing cost can be reduced.
  • an embodiment of the present invention further provides a conductive adhesive sticker.
  • Attached method The attachment method can be performed manually or by a suitable device.
  • the attaching method includes the steps of:
  • a printed circuit board 31 is disposed on the stage 1, wherein the stage 1 is provided with at least one working surface for carrying the printed circuit board 31, and a recess 11 is provided on the working surface, the concave
  • the bottom surface of the groove 11 is provided with a plurality of adsorption holes 12;
  • the conductive paste 2 is attached to a predetermined area 32 on the printed circuit board 31, wherein the predetermined area 32 is a flexible circuit board (or flip chip) 21 of the printed circuit board 31. Areas that are crimped to each other.
  • the attaching method may further include the steps of:
  • a rubber layer 13 is provided in a region other than the plurality of adsorption holes 12 on the bottom surface of the groove 11.
  • the attaching method may further include the steps of:
  • the stage 1 is driven to move in a second direction (e.g., the vertical direction in FIG. 2) on a plane parallel to the work surface, wherein the second direction is perpendicular to the first direction.
  • a second direction e.g., the vertical direction in FIG. 2
  • the conductive paste 2 includes a release film; the attaching method further includes the steps of:
  • the conductive paste 2 is transported to the stage 1 in a direction parallel to the stage 1 Above
  • the release film on the portion to be attached is peeled off from the portion to be attached; as well as
  • the release film peeled off from the portion to be attached is recovered.
  • the method for attaching the conductive adhesive provided by the embodiment of the invention not only can prevent the conductive adhesive from being pre-cured, but also can increase the recycling and reuse of the flexible circuit board and the flip chip, thereby reducing the manufacturing cost.
  • an embodiment of the present invention further provides a method for attaching the conductive adhesive by using a conductive adhesive attachment device provided by an embodiment of the present invention.
  • the attaching method includes the steps of:
  • a printed circuit board 31 is disposed on the stage 1 , wherein the stage 1 is provided with at least one working surface for carrying the printed circuit board 31, and a groove 11 is disposed on the working surface.
  • the bottom surface of the groove 11 is provided with a plurality of adsorption holes 12;
  • the printed circuit board 31 is adsorbed on the working surface of the stage 1 by the vacuum adsorption device 8;
  • the conductive paste 2 is attached to the predetermined area 32 on the printed circuit board 31 by the attaching mechanism, and the predetermined area 32 is the flexible circuit board of the printed circuit board 31 (or The area where the flip chip 21 is crimped to each other.
  • the attaching method may further include the steps of:
  • a rubber layer 13 is provided in a region other than the plurality of adsorption holes 12 on the bottom surface of the groove 11.
  • the working surface is an upper surface of the stage 1.
  • the vacuum adsorption device 8 is a vacuum pump.
  • the attaching method may further include the steps of:
  • Driving by the second drive mechanism 10, the stage 1 to move in a second direction (eg, the vertical direction in FIG. 2) on a plane parallel to the work surface; wherein the second direction is The first direction is perpendicular to each other.
  • a second direction eg, the vertical direction in FIG. 2
  • the first direction is perpendicular to each other.
  • the first driving mechanism 9 is X A shaft servo motor
  • the second drive mechanism 10 is a Y-axis servo motor, wherein the X axis is parallel to the first direction and the Y axis is parallel to the second direction.
  • the conductive paste 2 includes a release film; and the attaching method may further include the steps of:
  • the conductive paste 2 is passed through the feeding device 3 in a direction parallel to the stage 1 before the step of attaching the conductive paste 2 to the predetermined region 32 on the printed circuit board 31 Delivered to the top of the stage 1;
  • the release film on the portion to be attached is separated from the Stripped to be attached.
  • the release film peeled off from the to-be-attached section is recovered by the recovery device 7.
  • the method for attaching the conductive adhesive provided by the embodiment of the present invention can prevent the conductive adhesive from being pre-cured by using the above-mentioned conductive adhesive attaching device provided by the embodiment of the present invention, and can increase the flexible circuit board and the flip chip. Recycling, which can reduce manufacturing costs.
  • an embodiment of the present invention further provides a method for attaching a conductive adhesive, comprising the steps of:
  • Attaching the electrode region (for example, the electrode region 23) of the flexible circuit board (or the flip chip) 21 to which the conductive paste 2 is not attached is attached to the printed circuit board 31
  • the conductive paste 2 may not be attached in the electrode region 22, and the conductive paste 2 may be attached in the electrode region 23.
  • the electrode region 23 of the flexible circuit board (or the flip chip) 21 to which the conductive paste 2 is attached may be crimped to the glass substrate; and the flexible circuit board (or the cover)
  • the electrode region 22 of the crystalline film 21 to which the conductive paste 2 is not attached is crimped to the region 32 of the printed circuit board 31 to which the conductive paste 2 is attached.
  • the electrode region of the flexible circuit board (or the flip chip) 21 to which the conductive paste 2 is attached may be crimped to the glass substrate by using a high temperature crimping joint;
  • the electrode region of the flexible circuit board (or the flip chip) 21 to which the conductive paste 2 is not attached may be crimped to the printed circuit board 31 by using a high temperature crimping joint to which the conductive paste is attached. Area 32 of 2.

Abstract

本发明的实施例提供了一种导电胶的贴附设备及贴附方法。所述贴附设备包括：载台，在所述载台上设置有至少一个用于承载印刷电路板的工作面，在所述工作面上设置有凹槽，所述凹槽的底面设置有多个吸附孔；真空吸附装置，所述真空吸附装置分别与所述多个吸附孔连接；以及贴附机构，其设置在所述载台上方，用以将所述导电胶贴附在所述印刷电路板上的预设区域中，所述预设区域为所述印刷电路板的将与柔性电路板或覆晶薄膜互相压接的区域。本发明的实施例提供的导电胶的贴附设备，其不仅可以避免导电胶提前固化，而且可以增加柔性电路板和覆晶薄膜的回收再利用，从而可以降低制造成本。

Description

导电胶的贴附设备及贴附方法 技术领域
本发明的实施例涉及显示装置加工技术领域，具体地，涉及一种导电胶的贴附设备及贴附方法。
背景技术
在将导电胶分别贴附在柔性电路(FPC)板或覆晶薄膜(Chip On Film，COF)两端的电极区域中，接着通过高温压接头将FPC或COF的一个电极区域中的导电胶压接至玻璃基板，最后通过高温压接头将FPC或COF的另一个电极区域中的导电胶压接至印刷电路板的情况下，在压接所述一个电极区域中的导电胶的过程中，高温压接头辐射出来的热量会使所述另一个电极区域中的导电胶提前固化，会出现压接不良的现象，从而产生了大量的需要更换或修复的压接产品，并且由于所述另一个电极区域中的导电胶提前固化而使得所述FPC或所述COF报废，从而增加了制造成本。
发明内容
本发明的实施例旨在至少解决现有技术中存在的技术问题之一，提出了一种导电胶的贴附设备及贴附方法，其不仅可以避免导电胶提前固化，而且可以增加柔性电路板和覆晶薄膜的回收再利用，从而可以降低制造成本。
本发明的实施例提供了一种导电胶的贴附设备，其包括：载台，在所述载台上设置有至少一个用于承载印刷电路板的工作面，在所述工作面上设置有凹槽，所述凹槽的底面设置有多个吸附孔；真空吸附装置，所述真空吸附装置分别与所述多个吸附孔连接；以及贴附机构，其设置在所述载台上方，用以将所述导电胶贴附在所述印刷电路板上的预设区域中，所述预设区域为所述印刷电路板的将与柔性电路板或 覆晶薄膜互相压接的区域。
在一个实施例中，在所述凹槽底面的除所述多个吸附孔之外的区域中设置有橡胶层。
在一个实施例中，所述工作面为所述载台的上表面。
在一个实施例中，所述真空吸附装置为真空泵。
在一个实施例中，所述贴附设备还包括：第一驱动机构，其用于驱动所述载台在平行于所述工作面的平面上沿第一方向移动；以及第二驱动机构，其用于驱动所述载台在平行于所述工作面的平面上沿第二方向移动；其中所述第二方向与所述第一方向相互垂直。
在一个实施例中，所述第一驱动机构是X轴伺服电机，并且所述第二驱动机构是Y轴伺服电机，其中X轴平行于所述第一方向，并且Y轴平行于所述第二方向。
在一个实施例中，所述导电胶包括离型膜；所述贴附机构包括：供料装置，其用于沿平行于所述载台的方向将所述导电胶输送至所述载台的上方；半切刀，其用于冲切所述导电胶，使所述导电胶形成具有预设长度的待贴附段；压刀，其用于将所述待贴附段贴附在所述印刷电路板上的所述预设区域中；剥离杆，其用于将所述待贴附段上的所述离型膜与所述待贴附段剥离；以及回收装置，其用于回收自所述待贴附段上剥离下来的离型膜。
作为另一个技术方案，本发明的实施例提供了一种导电胶的贴附方法，包括步骤：
在载台上设置印刷电路板，其中所述载台上设置有至少一个用于承载所述印刷电路板的工作面，在所述工作面上设置有凹槽，所述凹槽的底面设置有多个吸附孔；
通过所述吸附孔将所述印刷电路板吸附在所述载台的工作面上；以及
将所述导电胶贴附在所述印刷电路板上的预设区域中，其中所述预设区域为所述印刷电路板的将与柔性电路板或覆晶薄膜互相压接的区域。
在一个实施例中，所述贴附方法还包括步骤：
在载台上设置印刷电路板的步骤之前，在所述凹槽底面的除所述多个吸附孔之外的区域中设置橡胶层。
在一个实施例中，所述贴附方法还包括步骤：
驱动所述载台在平行于所述工作面的平面上沿第一方向移动；以及
驱动所述载台在平行于所述工作面的平面上沿第二方向移动，其中所述第二方向与所述第一方向相互垂直。
在一个实施例中，在所述贴附方法中，所述导电胶包括离型膜；所述贴附方法还包括步骤：
在将所述导电胶贴附在所述印刷电路板上的预设区域中的步骤之前，沿平行于所述载台的方向将所述导电胶输送至所述载台的上方；
冲切所述导电胶，使所述导电胶形成具有预设长度的待贴附段；以及
将所述待贴附段贴附在所述印刷电路板上的所述预设区域中；
在将所述导电胶贴附在所述印刷电路板上的预设区域中的步骤之后，将所述待贴附段上的所述离型膜与所述待贴附段剥离；以及
回收自所述待贴附段上剥离下来的离型膜。
作为另一个技术方案，本发明的实施例提供了一种通过本发明的实施例所提供的导电胶的贴附设备来实现的所述导电胶的贴附方法，包括步骤：
在所述载台上设置印刷电路板，其中所述载台上设置有至少一个用于承载所述印刷电路板的工作面，在所述工作面上设置有凹槽，所述凹槽的底面设置有多个吸附孔；
通过所述真空吸附装置将所述印刷电路板吸附在所述载台的工作面上；以及
通过所述贴附机构将所述导电胶贴附在所述印刷电路板上的预设区域中，所述预设区域为所述印刷电路板的将与柔性电路板或覆晶薄膜互相压接的区域。
在一个实施例中，所述贴附方法还包括步骤：
在所述载台上设置印刷电路板的步骤之前，在所述凹槽底面的除 所述多个吸附孔之外的区域中设置橡胶层。
在一个实施例中，在所述贴附方法中，所述工作面为所述载台的上表面。
在一个实施例中，在所述贴附方法中，所述真空吸附装置为真空泵。
在一个实施例中，所述贴附方法还包括步骤：
通过所述第一驱动机构驱动所述载台在平行于所述工作面的平面上沿第一方向移动；以及
通过所述第二驱动机构驱动所述载台在平行于所述工作面的平面上沿第二方向移动；其中所述第二方向与所述第一方向相互垂直。
在一个实施例中，在所述贴附方法中，所述第一驱动机构是X轴伺服电机，并且所述第二驱动机构是Y轴伺服电机，其中X轴平行于所述第一方向，并且Y轴平行于所述第二方向。
在一个实施例中，在所述贴附方法中，所述导电胶包括离型膜；所述贴附方法还包括步骤：
在将所述导电胶贴附在所述印刷电路板上的预设区域中的步骤之前，通过所述供料装置沿平行于所述载台的方向将所述导电胶输送至所述载台的上方；
通过所述半切刀冲切所述导电胶，使所述导电胶形成具有预设长度的待贴附段；以及
通过所述压刀将所述待贴附段贴附在所述印刷电路板上的所述预设区域中；
在将所述导电胶贴附在所述印刷电路板上的预设区域中的步骤之后，通过所述剥离杆将所述待贴附段上的所述离型膜与所述待贴附段剥离；以及
通过所述回收装置回收自所述待贴附段上剥离下来的离型膜。
作为另一个技术方案，本发明的实施例提供了一种导电胶的贴附方法，包括步骤：
将导电胶贴附在位于柔性电路板或覆晶薄膜相对的两端处的两个电极区域之一中；
将所述导电胶贴附在印刷电路板上的用于与所述柔性电路板或者所述覆晶薄膜压接的区域中；
将所述柔性电路板或所述覆晶薄膜的贴附有所述导电胶的电极区域压接至玻璃基板；以及
将所述柔性电路板或所述覆晶薄膜的未贴附有所述导电胶的电极区域压接至所述印刷电路板的贴附有所述导电胶的区域。
在一个实施例中，利用高温压接头将所述柔性电路板或所述覆晶薄膜的贴附有所述导电胶的电极区域压接至玻璃基板；以及
利用高温压接头将所述柔性电路板或所述覆晶薄膜的未贴附有所述导电胶的电极区域压接至所述印刷电路板的贴附有所述导电胶的区域。
本发明的实施例具有以下有益效果：
本发明的实施例提供的导电胶的贴附设备，其通过所述载台承载印刷电路板，并通过所述贴附机构将导电胶贴附在印刷电路板上的用于与柔性电路板或者覆晶薄膜压接的区域中。这样，只需在柔性电路板或者覆晶薄膜上的用于与玻璃基板压接的电极区域中贴附导电胶即可，即，柔性电路板或者覆晶薄膜的一个电极区域具有导电胶，而另一个电极区域没有导电胶，从而在将柔性电路板(或者覆晶薄膜)压接至玻璃基板的过程中，不再存在所述另一个电极区域中的导电胶提前固化的问题，从而可以避免压接不良现象的产生。此外，在后续将柔性电路板(或者覆晶薄膜)压接至印刷电路板时，如果出现压接不良，仅需将柔性电路板(或者覆晶薄膜)与印刷电路板相分离，并去除印刷电路板上残留的导电胶，并重新在印刷电路板上进行导电胶的贴附和柔性电路板(或者覆晶薄膜)的压接即可，从而可以增加柔性电路板和覆晶薄膜的回收再利用，从而可以降低制造成本。
本发明的实施例提供的导电胶的贴附方法，其不仅可以避免导电胶提前固化，而且可以增加柔性电路板和覆晶薄膜的回收再利用，从而可以降低制造成本。
附图说明
图1为本发明的实施例提供的导电胶的贴附设备的结构图；
图2为图1中载台的俯视图；
图3为柔性电路板或者覆晶薄膜的俯视图；
图4为印刷电路板在贴附导电胶时的俯视图；以及
图5为导电胶的侧视图。
具体实施方式
为使本领域的技术人员更好地理解本发明的实施例的技术方案，下面结合附图来对本发明的实施例提供的导电胶的贴附设备及贴附方法进行详细描述。
本发明的分明人在研究和实践中发现，导电胶，例如各向异性导电胶膜(Anisotropic Conductive Film，ACF)的贴附方法可以包括以下步骤：首先将导电胶分别贴附在柔性电路(FPC)板或覆晶薄膜(Chip On Film，COF)两端的电极区域上；然后，将FPC或COF的一个电极区域通过其中的导电胶压接至玻璃基板，最后将该FPC或COF的另一个电极区域通过其中的导电胶压接至印刷电路板(PCB)上。
上述导电胶的贴附方法在实际应用中会存在以下缺陷。
一方面，在将FPC或COF的所述一个电极区域通过其中的导电胶压接至玻璃基板的过程中，高温压接头辐射出来的热量会使FPC或COF的所述另一个电极区域中的导电胶提前固化，导致后续通过所述另一个电极区域中的导电胶将FPC或COF压接至印刷电路板上时，会出现压接不良的现象，从而产生了大量的需要更换或修复的压接产品。
另一方面，如果在将FPC或COF压接至印刷电路板时，出现了压接不良的现象，则由于FPC或COF在压接到印刷电路板上之后无法再进行导电胶的贴附，因而只能报废FPC或COF，而无法回收再利用，从而增加了制造成本。
为此，本发明的分明人提出了改进的导电胶的贴附设备及贴附方法，下面将对它们进行详细描述。
参照图1至图5，在柔性电路板(或覆晶薄膜)21的边缘处相对设置有两个电极区域22和23，这两个电极区域22和23可以位于柔性 电路板(或覆晶薄膜)21相对的两端处，其中一个电极区域用于压接至玻璃基板，另一个电极区域用于压接至印刷电路板31，如图3和图4所示。
本发明的实施例提供的导电胶2的贴附设备，用于将导电胶2贴附在印刷电路板31上的区域32中，该区域32为印刷电路板31与柔性电路板21压接的区域，如图4所示。通过该贴附设备，可以对现有的导电胶2的贴附方法进行改进。具体地，将导电胶2贴附在柔性电路板21的用于与玻璃基板压接的电极区域上，而柔性电路板21的用于与印刷电路板31压接的电极区域不进行导电胶2的贴附。此外，利用本发明的实施例提供的导电胶2的贴附设备将导电胶2贴附在印刷电路板31上的用于与柔性电路板21压接的区域32中。然后，将柔性电路板21压接至印刷电路板31，此时柔性电路板21的用于与印刷电路板31压接的电极区域与印刷电路板31的区域32通过导电胶2相互粘接并实现电导通。
由于柔性电路板21的一个电极区域具有导电胶2，而另一个电极区域没有导电胶2，在通过具有导电胶2的一个电极区域将柔性电路板21压接至玻璃基板的过程中，不再存在另一个电极区域中的导电胶提前固化的问题，从而可以避免压接不良现象的产生。此外，在后续将柔性电路板21压接至印刷电路板31时，如果出现压接不良，仅需将柔性电路板21与印刷电路板31相分离，去除印刷电路板31上残留的导电胶2，并重新在印刷电路板31上进行导电胶2的贴附和柔性电路板21的压接即可。从而可以增加柔性电路板21的回收再利用，从而可以降低制造成本。
在以上的描述中，以本发明的实施例提供的导电胶2的贴附设备将导电胶2贴附在印刷电路板31上的用于与柔性电路板21压接的区域为例，但是本发明的实施例不限于此。对于覆晶薄膜21，同样可以采用本发明的实施例提供的导电胶2的贴附设备将导电胶2贴附在印刷电路板31上的用于与覆晶薄膜21压接的区域，由于具体的贴附方式和过程与上述的相同，在此不再重复描述。另外，对于覆晶薄膜21，由于无需在其用于与印刷电路板31压接的电极区域中贴附导电胶2， 因而可以省去将覆晶薄膜21冲切下来、并采用手动供料的方式进行导电胶2贴附的步骤。而省去该步骤可以实现覆晶薄膜21的自动供料，从而不仅可以提高返工系统的工作效率，进而提高产能，而且还可以避免因手动供料以贴附导电胶2所产生的污染、产品质量下降等不良。
下面对本发明的实施例提供的导电胶2的贴附设备的结构进行详细描述。具体地，该贴附设备包括载台1和贴附机构。所述贴附机构将在下文详细描述，在此先描述所述载台1。在载台1上设置有至少一个用于承载印刷电路板31的工作面，该工作面可以是载台1的上表面(即，在图2中，附图标记既表示载台，又表示所述载台的工作面)。可选地，如图2所示，在该工作面上设置有多个凹槽11，每一个凹槽11的底面设置有多个吸附孔12。图2示出了每一个凹槽11的底面设置有4个圆形吸附孔12，但是，吸附孔12的数量、形状和分布方式并不局限于图2中示出的那些，还可以采用其他任意合适的方式。每一个凹槽11中可以放置一个印刷电路板31。
所述贴附设备还可以包括真空吸附装置8，该真空吸附装置8分别与多个吸附孔12连接，用以通过吸附孔12抽取印刷电路板31的底面与凹槽11的底面之间的空气，以实现真空吸附印刷电路板31，从而可以保证在贴附导电胶2时，载台1上的印刷电路板31能够固定不动。例如，所述真空吸附装置可以是真空泵。
进一步可选地，在每一个凹槽11底面的除所述多个吸附孔12之外的区域中设置有多个橡胶层13，用以增加印刷电路板31与载台1的工作面的贴合度。图2示出了每一个凹槽11底面的除所述多个吸附孔12之外的区域设置有3个矩形橡胶层13，但是，橡胶层13的数量、形状和分布方式并不局限于图2中示出的那些，还可以采用其他任意合适的方式。
另外可选地，为了实现载台1的精确对位，贴附设备还包括第一驱动机构9和第二驱动机构10，第一驱动机构9用于驱动载台1在平行于工作面的平面上沿第一方向(例如，图2中的水平方向)移动；第二驱动机构10用于驱动载台1在平行于工作面的平面上沿第二方向(例如，图2中的竖直方向)移动；第二方向与第一方向相互 垂直。这样，通过在工作面所在平面上建立坐标系，将上述第一方向和第二方向上分别建立为X轴和Y轴，可以实现各个印刷电路板31在工作面上的位置的坐标化，从而可以通过编程自动控制第一驱动机构9和/或第二驱动机构10驱动载台1移动，以实现载台1的精确对位。换言之，X轴可以平行于导电胶的传输方向，并且Y轴垂直于导电胶的传输方向。本发明的实施例对第一驱动机构和第二驱动机构的具体结构没有限制，只要二者能够实现驱动载台的移动即可。例如，所述第一驱动机构9可以是X轴伺服电机，所述第二驱动机构10可以是Y轴伺服电机。
接着，对所述贴附机构进行描述。贴附机构设置在载台1上方(或周围)，用以将导电胶2贴附在印刷电路板31上的预设区域中。该预设区域为在印刷电路板31上压接柔性电路板(或覆晶薄膜)21的区域，即，如图4所示，印刷电路板31上的、用于与柔性电路板(或者覆晶薄膜)21压接的区域32。
如图5所示，为了便于包装(例如以卷轴的方式包装)，导电胶2包括胶层332和用作载体的离型膜331。在此基础上，可选地，该贴附机构采用自动供料的方式贴附导电胶2。具体地，如图1所示，贴附机构包括供料装置3、半切刀4、压刀5、剥离杆6和回收装置7。其中，供料装置3用于沿平行于载台1的方向(即图1中水平箭头所示的方向)将导电胶2输送至载台1的工作面上方。半切刀4用于冲切导电胶2的胶层332，使胶层332形成为各自具有预设长度的待贴附段，而并不切断导电胶2的离型膜331，这可以通过控制半切刀4的冲切距离来实现，该冲切距离满足当半切刀4相对于载台1竖直向上移动至最高位置时，半切刀4的刀刃仅切断导电胶2的胶层332。如图4所示，假设导电胶2相对于印刷电路板31沿图4中的箭头方向(向左)平移，当导电胶2经过半切刀4时，导电胶2的胶层332被冲切形成各个待贴附段，其中，每一个待贴附段的长度满足贴附在印刷电路板31的区域32上所需的长度，此时每一个待贴附段与离型膜331仍然保持贴合状态，而离型膜331始终保持连续的带状。
压刀5用于将被半切刀4冲切下来的待贴附段贴附在印刷电路 板31上的预设区域32中。剥离杆6用于将当前待贴附段上的离型膜剥离，此时当前待贴附段的胶层332贴附在预设区域32中，而离型膜331与当前待贴附段的胶层332相分离，并继续向前移动。回收装置7用于回收自待贴附段上剥离下来的离型膜331，从而完成导电胶2的整个贴附过程。
综上所述，通过将载台1的自动对位与贴附机构的自动传输相结合，可以实现导电胶2的自动贴附，该过程除了手动取放印刷电路板31之外，其余动作均可由贴附设备自动完成，从而可以提高贴附设备的工作效率，进而提高产能。
作为另一个技术方案，本发明的实施例还提供一种返工系统，该返工系统包括导电胶2的第一贴附设备，该第一贴附设备采用了本发明的实施例提供的上述导电胶2的贴附设备。
可选的，返工系统还包括导电胶2的第二贴附设备，用于将导电胶2贴附在柔性电路板(或覆晶薄膜)21上的预设区域，该预设区域为所述柔性电路板(或覆晶薄膜)21的将与所述玻璃基板压接的电极区域。该第二贴附设备可以是本发明的实施例提供的上述导电胶2的贴附设备，或者是现有技术中的贴附设备。
可选地，返工系统还包括柔性电路板(或覆晶薄膜)21的压接设备，用于将贴附有导电胶2的柔性电路板(或覆晶薄膜)21压接至预设区域32贴附有导电胶2的印刷电路板31。可选地，返工系统还包括导电胶2的第三贴附设备，用于将导电胶2贴附在覆晶薄膜上的预设区域，该预设区域为在所述玻璃基板上压接所述覆晶薄膜的电极区域。该第三贴附设备可以是本发明的实施例提供的上述导电胶2的贴附设备，或者是现有技术中的贴附设备。
可选地，返工系统还包括覆晶薄膜的压接设备，用于将贴附有导电胶2的覆晶薄膜压接至预设区域32贴附有导电胶2的印刷电路板31。
本发明的实施例提供的返工系统，其通过采用本发明的实施例提供的上述导电胶的贴附设备，不仅可以避免导电胶提前固化，而且可以增加柔性电路板和覆晶薄膜的回收再利用，从而可以降低制造成本。
作为另一个技术方案，本发明的实施例还提供一种导电胶的贴 附方法。所述贴附方法可以手动执行，也可以通过合适的装置来实行。所述贴附方法包括步骤：
在载台1上设置印刷电路板31，其中所述载台1上设置有至少一个用于承载所述印刷电路板31的工作面，在所述工作面上设置有凹槽11，所述凹槽11的底面设置有多个吸附孔12；
通过所述吸附孔将所述印刷电路板31吸附在所述载台1的工作面上；以及
将所述导电胶2贴附在所述印刷电路板31上的预设区域32中，其中所述预设区域32为所述印刷电路板31的将与柔性电路板(或覆晶薄膜)21互相压接的区域。
在一个实施例中，所述贴附方法还可以包括步骤：
在载台1上设置印刷电路板31的步骤之前，在所述凹槽11底面的除所述多个吸附孔12之外的区域中设置橡胶层13。
在一个实施例中，所述贴附方法还可以包括步骤：
驱动所述载台1在平行于所述工作面的平面上沿第一方向(如，图2中的水平方向)移动；以及
驱动所述载台1在平行于所述工作面的平面上沿第二方向移动(如，图2中的竖直方向)，其中所述第二方向与所述第一方向相互垂直。
在一个实施例中，在所述贴附方法中，所述导电胶2包括离型膜；所述贴附方法还包括步骤：
在将所述导电胶2贴附在所述印刷电路板31上的预设区域32中的步骤之前，沿平行于所述载台1的方向将所述导电胶2输送至所述载台1的上方；
冲切所述导电胶2，使所述导电胶2形成具有预设长度的待贴附段；以及
将所述待贴附段贴附在所述印刷电路板31上的所述预设区域32中；
在将所述导电胶2贴附在所述印刷电路板31上的预设区域32中的步骤之后，将所述待贴附段上的所述离型膜与所述待贴附段剥离； 以及
回收自所述待贴附段上剥离下来的离型膜。
本发明的实施例提供的导电胶的贴附方法，其不仅可以避免导电胶提前固化，而且可以增加柔性电路板和覆晶薄膜的回收再利用，从而可以降低制造成本。
作为另一个技术方案，本发明的实施例还提供一种通过本发明实施例所提供的导电胶的贴附设备来实现的所述导电胶的贴附方法。所述贴附方法包括步骤：
在所述载台1上设置印刷电路板31，其中所述载台1上设置有至少一个用于承载所述印刷电路板31的工作面，在所述工作面上设置有凹槽11，所述凹槽11的底面设置有多个吸附孔12；
通过所述真空吸附装置8将所述印刷电路板31吸附在所述载台1的工作面上；以及
通过所述贴附机构将所述导电胶2贴附在所述印刷电路板31上的预设区域32中，所述预设区域32为所述印刷电路板31的将与柔性电路板(或覆晶薄膜)21互相压接的区域。
在一个实施例中，所述贴附方法还可以包括步骤：
在所述载台1上设置印刷电路板31的步骤之前，在所述凹槽11底面的除所述多个吸附孔12之外的区域中设置橡胶层13。
在一个实施例中，在所述的贴附方法中，所述工作面为所述载台1的上表面。
在一个实施例中，在所述贴附方法中，所述真空吸附装置8为真空泵。
在一个实施例中，所述贴附方法还可以包括步骤：
通过所述第一驱动机构9驱动所述载台1在平行于所述工作面的平面上沿第一方向移动(如，图2中的水平方向)；以及
通过所述第二驱动机构10驱动所述载台1在平行于所述工作面的平面上沿第二方向(如，图2中的竖直方向)移动；其中所述第二方向与所述第一方向相互垂直。
在一个实施例中，在所述贴附方法中，所述第一驱动机构9是X 轴伺服电机，并且所述第二驱动机构10是Y轴伺服电机，其中X轴平行于所述第一方向，并且Y轴平行于所述第二方向。
在一个实施例中，在所述贴附方法中，所述导电胶2包括离型膜；所述贴附方法还可以包括步骤：
在将所述导电胶2贴附在所述印刷电路板31上的预设区域32中的步骤之前，通过所述供料装置3沿平行于所述载台1的方向将所述导电胶2输送至所述载台1的上方；
通过所述半切刀4冲切所述导电胶2，使所述导电胶2形成具有预设长度的待贴附段；以及
通过所述压刀5将所述待贴附段贴附在所述印刷电路板31上的所述预设区域32中；
在将所述导电胶2贴附在所述印刷电路板31上的预设区域32中的步骤之后，通过所述剥离杆6将所述待贴附段上的所述离型膜与所述待贴附段剥离；以及
通过所述回收装置7回收自所述待贴附段上剥离下来的离型膜。
本发明的实施例提供的导电胶的贴附方法，其通过采用本发明的实施例提供的上述导电胶的贴附设备，不仅可以避免导电胶提前固化，而且可以增加柔性电路板和覆晶薄膜的回收再利用，从而可以降低制造成本。
作为另一个技术方案，本发明的实施例还提供了一种导电胶的贴附方法，包括步骤：
将导电胶2贴附在位于柔性电路板(或覆晶薄膜)相对的两端处的两个电极区域22和23之一(例如，电极区域22)中；
将所述导电胶2贴附在印刷电路板31上的用于与所述柔性电路板(或所述覆晶薄膜)21压接的区域32中；
将所述柔性电路板(或所述覆晶薄膜)21的贴附有所述导电胶2的电极区域(例如，电极区域22)压接至玻璃基板；以及
将所述柔性电路板(或所述覆晶薄膜)21的未贴附有所述导电胶2的电极区域(例如，电极区域23)压接至所述印刷电路板31的贴附有所述导电胶2的区域32。
应当理解的是，可以不在电极区域22中贴附所述导电胶2，而在电极区域23中贴附所述导电胶2。相应地，可以将所述柔性电路板(或所述覆晶薄膜)21的贴附有所述导电胶2的电极区域23压接至玻璃基板；以及将所述柔性电路板(或所述覆晶薄膜)21的未贴附有所述导电胶2的电极区域22压接至所述印刷电路板31的贴附有所述导电胶2的区域32。
在一个实施例中，可以利用高温压接头将所述柔性电路板(或所述覆晶薄膜)21的贴附有所述导电胶2的电极区域压接至玻璃基板；以及
可以利用高温压接头将所述柔性电路板(或所述覆晶薄膜)21的未贴附有所述导电胶2的电极区域压接至所述印刷电路板31的贴附有所述导电胶2的区域32。
应当理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明的实施例并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (20)

  1. 一种导电胶的贴附设备，包括：
    载台，在所述载台上设置有至少一个用于承载印刷电路板的工作面，在所述工作面上设置有凹槽，所述凹槽的底面设置有多个吸附孔；
    真空吸附装置，所述真空吸附装置分别与所述多个吸附孔连接；以及
    贴附机构，其设置在所述载台上方，用以将所述导电胶贴附在所述印刷电路板上的预设区域中，所述预设区域为所述印刷电路板的将与柔性电路板或覆晶薄膜互相压接的区域。
  2. 根据权利要求1所述的导电胶的贴附设备，其中，在所述凹槽底面的除所述多个吸附孔之外的区域中设置有橡胶层。
  3. 根据权利要求1所述的导电胶的贴附设备，其中，所述工作面为所述载台的上表面。
  4. 根据权利要求1所述的导电胶的贴附设备，其中，所述真空吸附装置为真空泵。
  5. 根据权利要求1-4中任意一项所述的导电胶的贴附设备，其中，所述贴附设备还包括：
    第一驱动机构，其用于驱动所述载台在平行于所述工作面的平面上沿第一方向移动；以及
    第二驱动机构，其用于驱动所述载台在平行于所述工作面的平面上沿第二方向移动；其中所述第二方向与所述第一方向相互垂直。
  6. 根据权利要求5所述的导电胶的贴附设备，其中，所述第一驱动机构是X轴伺服电机，并且所述第二驱动机构是Y轴伺服电机，其中X轴平行于所述第一方向，并且Y轴平行于所述第二方向。
  7. 根据权利要求1-6中任意一项所述的导电胶的贴附设备，其中，所述导电胶包括离型膜；
    所述贴附机构包括：
    供料装置，其用于沿平行于所述载台的方向将所述导电胶输送至所述载台的上方；
    半切刀，其用于冲切所述导电胶，使所述导电胶形成具有预设长度的待贴附段；
    压刀，其用于将所述待贴附段贴附在所述印刷电路板上的所述预设区域中；
    剥离杆，其用于将所述待贴附段上的所述离型膜与所述待贴附段剥离；以及
    回收装置，其用于回收自所述待贴附段上剥离下来的离型膜。
  8. 一种导电胶的贴附方法，包括步骤：
    在载台上设置印刷电路板，其中所述载台上设置有至少一个用于承载所述印刷电路板的工作面，在所述工作面上设置有凹槽，所述凹槽的底面设置有多个吸附孔；
    通过所述吸附孔将所述印刷电路板吸附在所述载台的工作面上；以及
    将所述导电胶贴附在所述印刷电路板上的预设区域中，其中所述预设区域为所述印刷电路板的将与柔性电路板或覆晶薄膜互相压接的区域。
  9. 根据权利要求8所述的贴附方法，还包括步骤：
    在载台上设置印刷电路板的步骤之前，在所述凹槽底面的除所述多个吸附孔之外的区域中设置橡胶层。
  10. 根据权利要求8或9所述的贴附方法，还包括步骤：
    驱动所述载台在平行于所述工作面的平面上沿第一方向移动； 以及
    驱动所述载台在平行于所述工作面的平面上沿第二方向移动，其中所述第二方向与所述第一方向相互垂直。
  11. 根据权利要求8-10中任意一项所述的贴附方法，其中，所述导电胶包括离型膜；
    所述贴附方法还包括步骤：
    在将所述导电胶贴附在所述印刷电路板上的预设区域中的步骤之前，沿平行于所述载台的方向将所述导电胶输送至所述载台的上方；
    冲切所述导电胶，使所述导电胶形成具有预设长度的待贴附段；以及
    将所述待贴附段贴附在所述印刷电路板上的所述预设区域中；
    在将所述导电胶贴附在所述印刷电路板上的预设区域中的步骤之后，将所述待贴附段上的所述离型膜与所述待贴附段剥离；以及
    回收自所述待贴附段上剥离下来的离型膜。
  12. 一种通过根据权利要求7所述的导电胶的贴附设备来实现的所述导电胶的贴附方法，包括步骤：
    在所述载台上设置印刷电路板，其中所述载台上设置有至少一个用于承载所述印刷电路板的工作面，在所述工作面上设置有凹槽，所述凹槽的底面设置有多个吸附孔；
    通过所述真空吸附装置将所述印刷电路板吸附在所述载台的工作面上；以及
    通过所述贴附机构将所述导电胶贴附在所述印刷电路板上的预设区域中，所述预设区域为所述印刷电路板的将与柔性电路板或覆晶薄膜互相压接的区域。
  13. 根据权利要求12所述的贴附方法，还包括步骤：
    在所述载台上设置印刷电路板的步骤之前，在所述凹槽底面的除所述多个吸附孔之外的区域中设置橡胶层。
  14. 根据权利要求12所述的贴附方法，其中，所述工作面为所述载台的上表面。
  15. 根据权利要求12所述的贴附方法，其中，所述真空吸附装置为真空泵。
  16. 根据权利要求12-15中任意一项所述的贴附方法，还包括步骤：
    通过所述第一驱动机构驱动所述载台在平行于所述工作面的平面上沿第一方向移动；以及
    通过所述第二驱动机构驱动所述载台在平行于所述工作面的平面上沿第二方向移动；其中所述第二方向与所述第一方向相互垂直。
  17. 根据权利要求16所述的贴附方法，其中，所述第一驱动机构是X轴伺服电机，并且所述第二驱动机构是Y轴伺服电机，其中X轴平行于所述第一方向，并且Y轴平行于所述第二方向。
  18. 根据权利要求12-17中任意一项所述的贴附方法，其中，所述导电胶包括离型膜；
    所述贴附方法还包括步骤：
    在将所述导电胶贴附在所述印刷电路板上的预设区域中的步骤之前，通过所述供料装置沿平行于所述载台的方向将所述导电胶输送至所述载台的上方；
    通过所述半切刀冲切所述导电胶，使所述导电胶形成具有预设长度的待贴附段；以及
    通过所述压刀将所述待贴附段贴附在所述印刷电路板上的所述预设区域中；
    在将所述导电胶贴附在所述印刷电路板上的预设区域中的步骤之后，通过所述剥离杆将所述待贴附段上的所述离型膜与所述待贴附段 剥离；以及
    通过所述回收装置回收自所述待贴附段上剥离下来的离型膜。
  19. 一种导电胶的贴附方法，包括步骤：
    将导电胶贴附在位于柔性电路板或覆晶薄膜相对的两端处的两个电极区域之一中；
    将所述导电胶贴附在印刷电路板上的用于与所述柔性电路板或者所述覆晶薄膜压接的区域中；
    将所述柔性电路板或所述覆晶薄膜的贴附有所述导电胶的电极区域压接至玻璃基板；以及
    将所述柔性电路板或所述覆晶薄膜的未贴附有所述导电胶的电极区域压接至所述印刷电路板的贴附有所述导电胶的区域。
  20. 根据权利要求19所述的贴附方法，其中，利用高温压接头将所述柔性电路板或所述覆晶薄膜的贴附有所述导电胶的电极区域压接至玻璃基板；以及
    利用高温压接头将所述柔性电路板或所述覆晶薄膜的未贴附有所述导电胶的电极区域压接至所述印刷电路板的贴附有所述导电胶的区域。
PCT/CN2017/075755 2016-05-26 2017-03-06 导电胶的贴附设备及贴附方法 WO2017202103A1 (zh)

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