TWI773728B - 聚醯亞胺膜 - Google Patents

聚醯亞胺膜 Download PDF

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Publication number
TWI773728B
TWI773728B TW107103223A TW107103223A TWI773728B TW I773728 B TWI773728 B TW I773728B TW 107103223 A TW107103223 A TW 107103223A TW 107103223 A TW107103223 A TW 107103223A TW I773728 B TWI773728 B TW I773728B
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Taiwan
Prior art keywords
polyimide
polyimide film
formula
bluing agent
film
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TW107103223A
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English (en)
Chinese (zh)
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TW201833225A (zh
Inventor
安井未央
片波嵐
桜井孝至
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日商住友化學股份有限公司
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=63017004&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI773728(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 日商住友化學股份有限公司 filed Critical 日商住友化學股份有限公司
Publication of TW201833225A publication Critical patent/TW201833225A/zh
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/17Amines; Quaternary ammonium compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/17Amines; Quaternary ammonium compounds
    • C08K5/18Amines; Quaternary ammonium compounds with aromatically bound amino groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/10Transparent films; Clear coatings; Transparent materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
TW107103223A 2017-02-01 2018-01-30 聚醯亞胺膜 TWI773728B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-017154 2017-02-01
JP2017017154 2017-02-01

Publications (2)

Publication Number Publication Date
TW201833225A TW201833225A (zh) 2018-09-16
TWI773728B true TWI773728B (zh) 2022-08-11

Family

ID=63017004

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107103223A TWI773728B (zh) 2017-02-01 2018-01-30 聚醯亞胺膜

Country Status (4)

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JP (2) JP6695367B2 (enrdf_load_stackoverflow)
KR (2) KR20180089860A (enrdf_load_stackoverflow)
CN (1) CN108373543B (enrdf_load_stackoverflow)
TW (1) TWI773728B (enrdf_load_stackoverflow)

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US20210340325A1 (en) * 2018-09-29 2021-11-04 Nippon Steel Chemical & Material Co., Ltd. Polyimide precursor, polyimide produced from same, and flexible device
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JP7520506B2 (ja) * 2018-12-25 2024-07-23 旭化成株式会社 ポリイミドワニス及びポリイミドフィルム、並びにこれらの製造方法
CN111381295A (zh) * 2018-12-28 2020-07-07 住友化学株式会社 光学膜
JP2020126162A (ja) * 2019-02-05 2020-08-20 三菱ケミカル株式会社 画像表示用導光板
JP2020126239A (ja) * 2019-02-05 2020-08-20 三菱ケミカル株式会社 画像表示用導光板
KR20200099856A (ko) 2019-02-15 2020-08-25 동우 화인켐 주식회사 플렉시블 디스플레이용 윈도우 필름
CN109942861A (zh) * 2019-03-12 2019-06-28 无锡创彩光学材料有限公司 一种柔性光致变色复合膜及其制备方法
JP2020186369A (ja) * 2019-05-10 2020-11-19 住友化学株式会社 ワニス、光学フィルム及び光学フィルムの製造方法
TWI708795B (zh) * 2019-06-14 2020-11-01 達興材料股份有限公司 聚(醯胺-醯亞胺)共聚物、薄膜用組成物以及薄膜
CN110534711B (zh) * 2019-07-24 2020-11-03 宁波锋成先进能源材料研究院有限公司 一种聚酰亚胺复合材料的制备方法以及聚酰亚胺复合材料在电池中的应用
KR102260028B1 (ko) * 2019-09-27 2021-06-03 피아이첨단소재 주식회사 폴리아믹산 조성물, 폴리아믹산 조성물의 제조방법 및 이를 포함하는 폴리이미드
KR102260048B1 (ko) * 2019-09-27 2021-06-03 피아이첨단소재 주식회사 폴리아믹산 조성물, 폴리아믹산 조성물의 제조방법 및 이를 포함하는 폴리이미드
KR102260052B1 (ko) * 2019-09-27 2021-06-03 피아이첨단소재 주식회사 폴리아믹산 조성물, 폴리아믹산 조성물의 제조방법 및 이를 포함하는 폴리이미드
KR102260038B1 (ko) * 2019-09-27 2021-06-03 피아이첨단소재 주식회사 폴리아믹산 조성물, 폴리아믹산 조성물의 제조방법 및 이를 포함하는 폴리이미드
JP7427513B2 (ja) * 2020-04-15 2024-02-05 太陽ホールディングス株式会社 積層体、およびディスプレイのカバーウィンドウ
WO2022102450A1 (ja) * 2020-11-10 2022-05-19 東洋紡株式会社 無色多層ポリイミドフィルム、積層体、フレキシブル電子デバイスの製造方法
EP4137469A4 (en) 2020-11-19 2023-10-11 Lg Chem, Ltd. PLATE FOR A DISPLAY DEVICE OR FLEXIBLE DISPLAY DEVICE AND DISPLAY DEVICE OR FLEXIBLE DISPLAY DEVICE
CN116640337B (zh) * 2022-02-15 2024-07-30 江苏矽时代材料科技有限公司 相位差光学膜的制备方法
KR20250037771A (ko) * 2022-07-13 2025-03-18 다이니폰 인사츠 가부시키가이샤 광학 필름, 광학 작용 필름, 접착 용이성 필름, 광학 적층체, 표면판, 화상 표시 장치 및 편광판
WO2024143295A1 (ja) * 2022-12-27 2024-07-04 株式会社カネカ 透明フィルム、ハードコートフィルムおよびディスプレイ
CN120418334A (zh) * 2022-12-27 2025-08-01 株式会社钟化 层叠体及显示器

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Also Published As

Publication number Publication date
JP2020125485A (ja) 2020-08-20
CN108373543A (zh) 2018-08-07
TW201833225A (zh) 2018-09-16
JP6695367B2 (ja) 2020-05-20
KR20190092345A (ko) 2019-08-07
JP2018123319A (ja) 2018-08-09
KR20180089860A (ko) 2018-08-09
CN108373543B (zh) 2022-09-20
JP7005680B2 (ja) 2022-01-21

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