TWI762729B - 配線基板及配線基板的製造方法 - Google Patents

配線基板及配線基板的製造方法 Download PDF

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Publication number
TWI762729B
TWI762729B TW107135987A TW107135987A TWI762729B TW I762729 B TWI762729 B TW I762729B TW 107135987 A TW107135987 A TW 107135987A TW 107135987 A TW107135987 A TW 107135987A TW I762729 B TWI762729 B TW I762729B
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TW
Taiwan
Prior art keywords
base material
wiring
wiring board
reinforcing member
electronic component
Prior art date
Application number
TW107135987A
Other languages
English (en)
Chinese (zh)
Other versions
TW201923979A (zh
Inventor
小川健一
染谷𨺓夫
Original Assignee
日商大日本印刷股份有限公司
國立大學法人東京大學
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Application filed by 日商大日本印刷股份有限公司, 國立大學法人東京大學 filed Critical 日商大日本印刷股份有限公司
Publication of TW201923979A publication Critical patent/TW201923979A/zh
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Publication of TWI762729B publication Critical patent/TWI762729B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Insulated Conductors (AREA)
  • Insulated Conductors (AREA)
TW107135987A 2017-10-12 2018-10-12 配線基板及配線基板的製造方法 TWI762729B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017198758 2017-10-12
JP2017-198758 2017-10-12

Publications (2)

Publication Number Publication Date
TW201923979A TW201923979A (zh) 2019-06-16
TWI762729B true TWI762729B (zh) 2022-05-01

Family

ID=66100782

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107135987A TWI762729B (zh) 2017-10-12 2018-10-12 配線基板及配線基板的製造方法

Country Status (6)

Country Link
US (2) US11284507B2 (enExample)
EP (1) EP3697180A4 (enExample)
JP (2) JP6582155B2 (enExample)
CN (1) CN111213435B (enExample)
TW (1) TWI762729B (enExample)
WO (1) WO2019074115A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111213435B (zh) * 2017-10-12 2023-07-14 大日本印刷株式会社 配线基板和配线基板的制造方法
JP7249512B2 (ja) * 2018-11-30 2023-03-31 大日本印刷株式会社 配線基板及び配線基板の製造方法
EP3813496B1 (en) * 2019-01-21 2025-08-20 Murata Manufacturing Co., Ltd. Stretchable wiring board
US20220142834A1 (en) * 2019-02-28 2022-05-12 Loop Plus Pty Ltd A sensing device, system and method
KR102311148B1 (ko) * 2019-11-20 2021-10-13 (주) 시큐라인 Led 보호를 위한 플렉시블 조명장치 및 그 구성 방법
JP7380158B2 (ja) * 2019-12-06 2023-11-15 大日本印刷株式会社 伸縮性回路基板および伸縮性デバイス
JP7434527B2 (ja) 2020-03-19 2024-02-20 三井化学株式会社 自己粘着シート
KR102905931B1 (ko) * 2020-07-27 2025-12-29 삼성전자주식회사 연신 소자, 표시 패널, 센서 및 전자 장치
KR20230070808A (ko) 2021-11-15 2023-05-23 삼성전자주식회사 반도체 패키지 및 제조방법
JP7518395B2 (ja) * 2021-12-20 2024-07-18 日亜化学工業株式会社 回路基板、発光装置及びそれらの製造方法
KR102732578B1 (ko) * 2022-11-18 2024-11-21 한국생산기술연구원 부분 수직 주름 박형 평판 케이블의 연속 절연막 코팅방법, 및 이에 의해 제조된 부분 수직 주름 박형 평판 케이블

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI263466B (en) * 2000-05-16 2006-10-01 Mitsui Mining & Smelting Co Method for manufacturing printed wiring board
US20140299362A1 (en) * 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
TW201709222A (zh) * 2015-02-02 2017-03-01 Fujikura Ltd 伸縮性配線基板

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5224265A (en) * 1991-10-29 1993-07-06 International Business Machines Corporation Fabrication of discrete thin film wiring structures
US7491892B2 (en) * 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
US7265298B2 (en) * 2003-05-30 2007-09-04 The Regents Of The University Of California Serpentine and corduroy circuits to enhance the stretchability of a stretchable electronic device
US8217381B2 (en) * 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
MY151572A (en) 2005-06-02 2014-06-13 Univ Illinois Printable semiconductor structures and related methods of making and assembling
US7880371B2 (en) * 2006-11-03 2011-02-01 Danfoss A/S Dielectric composite and a method of manufacturing a dielectric composite
JP5096855B2 (ja) * 2007-09-27 2012-12-12 新光電気工業株式会社 配線基板の製造方法及び配線基板
KR100967362B1 (ko) * 2008-02-28 2010-07-05 재단법인서울대학교산학협력재단 스트레칭 및 벤딩이 가능한 배선구조체 및 이의 제조방법
US8207473B2 (en) * 2008-06-24 2012-06-26 Imec Method for manufacturing a stretchable electronic device
JP4538069B2 (ja) * 2008-11-28 2010-09-08 株式会社東芝 プリント配線板
EP2392196B1 (en) * 2009-01-30 2018-08-22 IMEC vzw Stretchable electronic device
WO2010086033A1 (en) * 2009-01-30 2010-08-05 Interuniversitair Microelektronica Centrum Vzw Stretchable electronic device
JP5570353B2 (ja) 2010-09-03 2014-08-13 バイエル マテリアルサイエンス株式会社 伸縮性配線を有する導電部材
JP5640854B2 (ja) * 2011-03-25 2014-12-17 ソニー株式会社 導電性素子およびその製造方法、配線素子、情報入力装置、表示装置、電子機器、ならびに原盤
US9226402B2 (en) * 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
KR101466795B1 (ko) * 2012-11-06 2014-11-28 재단법인대구경북과학기술원 신축성 기판 및 그 제조방법
KR20140100299A (ko) * 2013-02-06 2014-08-14 한국전자통신연구원 전자회로 및 그 제조방법
US9788789B2 (en) * 2013-08-30 2017-10-17 Thalmic Labs Inc. Systems, articles, and methods for stretchable printed circuit boards
KR20150069079A (ko) * 2013-12-12 2015-06-23 한국전자통신연구원 신축성 소자 및 그의 제조방법
JP6191991B2 (ja) * 2014-03-31 2017-09-06 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
KR102042137B1 (ko) * 2014-05-30 2019-11-28 한국전자통신연구원 전자장치 및 그 제조 방법
JP6506653B2 (ja) * 2015-07-30 2019-04-24 日本メクトロン株式会社 伸縮性配線基板
JP6793510B2 (ja) * 2016-09-28 2020-12-02 日本メクトロン株式会社 伸縮性配線基板及び伸縮性配線基板の製造方法
US20180192520A1 (en) * 2016-12-29 2018-07-05 Intel Corporation Stretchable electronic system based on controlled buckled flexible printed circuit board (pcb)
CN111213435B (zh) * 2017-10-12 2023-07-14 大日本印刷株式会社 配线基板和配线基板的制造方法
US10959326B2 (en) * 2017-11-07 2021-03-23 Dai Nippon Printing Co., Ltd. Stretchable circuit substrate and article

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI263466B (en) * 2000-05-16 2006-10-01 Mitsui Mining & Smelting Co Method for manufacturing printed wiring board
US20140299362A1 (en) * 2013-04-04 2014-10-09 Electronics And Telecommunications Research Institute Stretchable electric device and manufacturing method thereof
TW201709222A (zh) * 2015-02-02 2017-03-01 Fujikura Ltd 伸縮性配線基板

Also Published As

Publication number Publication date
US11284507B2 (en) 2022-03-22
JP7154508B2 (ja) 2022-10-18
CN111213435A (zh) 2020-05-29
WO2019074115A1 (ja) 2019-04-18
US20220210912A1 (en) 2022-06-30
JP2020010052A (ja) 2020-01-16
CN111213435B (zh) 2023-07-14
TW201923979A (zh) 2019-06-16
JPWO2019074115A1 (ja) 2019-11-14
EP3697180A4 (en) 2021-06-30
JP6582155B2 (ja) 2019-09-25
EP3697180A1 (en) 2020-08-19
US20200260573A1 (en) 2020-08-13
US11968777B2 (en) 2024-04-23

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