JP2020010052A5 - - Google Patents
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- JP2020010052A5 JP2020010052A5 JP2019158380A JP2019158380A JP2020010052A5 JP 2020010052 A5 JP2020010052 A5 JP 2020010052A5 JP 2019158380 A JP2019158380 A JP 2019158380A JP 2019158380 A JP2019158380 A JP 2019158380A JP 2020010052 A5 JP2020010052 A5 JP 2020010052A5
- Authority
- JP
- Japan
- Prior art keywords
- base material
- wiring
- wiring board
- electronic component
- elastic modulus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 229910052751 metal Inorganic materials 0.000 claims description 10
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 13
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- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- YPHMISFOHDHNIV-FSZOTQKASA-N cycloheximide Chemical compound C1[C@@H](C)C[C@H](C)C(=O)[C@@H]1[C@H](O)CC1CC(=O)NC(=O)C1 YPHMISFOHDHNIV-FSZOTQKASA-N 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- -1 polyethylene naphthalate Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000003796 beauty Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000010070 molecular adhesion Effects 0.000 description 2
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- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000257303 Hymenoptera Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
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- 230000036772 blood pressure Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000037213 diet Effects 0.000 description 1
- 235000005911 diet Nutrition 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 244000144972 livestock Species 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000000474 nursing effect Effects 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017198758 | 2017-10-12 | ||
| JP2017198758 | 2017-10-12 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019519357A Division JP6582155B2 (ja) | 2017-10-12 | 2018-10-12 | 配線基板及び配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020010052A JP2020010052A (ja) | 2020-01-16 |
| JP2020010052A5 true JP2020010052A5 (enExample) | 2021-12-02 |
| JP7154508B2 JP7154508B2 (ja) | 2022-10-18 |
Family
ID=66100782
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019519357A Active JP6582155B2 (ja) | 2017-10-12 | 2018-10-12 | 配線基板及び配線基板の製造方法 |
| JP2019158380A Active JP7154508B2 (ja) | 2017-10-12 | 2019-08-30 | 配線基板及び配線基板の製造方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019519357A Active JP6582155B2 (ja) | 2017-10-12 | 2018-10-12 | 配線基板及び配線基板の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11284507B2 (enExample) |
| EP (1) | EP3697180A4 (enExample) |
| JP (2) | JP6582155B2 (enExample) |
| CN (1) | CN111213435B (enExample) |
| TW (1) | TWI762729B (enExample) |
| WO (1) | WO2019074115A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11284507B2 (en) * | 2017-10-12 | 2022-03-22 | Dai Nippon Printing Co., Ltd. | Wiring board and method for manufacturing wiring board |
| JP7249512B2 (ja) * | 2018-11-30 | 2023-03-31 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| CN113170576B (zh) * | 2019-01-21 | 2024-10-01 | 株式会社村田制作所 | 伸缩性布线基板 |
| US20220142834A1 (en) * | 2019-02-28 | 2022-05-12 | Loop Plus Pty Ltd | A sensing device, system and method |
| KR102311148B1 (ko) * | 2019-11-20 | 2021-10-13 | (주) 시큐라인 | Led 보호를 위한 플렉시블 조명장치 및 그 구성 방법 |
| JP7380158B2 (ja) * | 2019-12-06 | 2023-11-15 | 大日本印刷株式会社 | 伸縮性回路基板および伸縮性デバイス |
| CN115298279B (zh) | 2020-03-19 | 2024-01-09 | 三井化学株式会社 | 自粘着片 |
| KR20220013775A (ko) * | 2020-07-27 | 2022-02-04 | 삼성전자주식회사 | 연신 소자, 표시 패널, 센서 및 전자 장치 |
| JP7518395B2 (ja) * | 2021-12-20 | 2024-07-18 | 日亜化学工業株式会社 | 回路基板、発光装置及びそれらの製造方法 |
| KR102732578B1 (ko) * | 2022-11-18 | 2024-11-21 | 한국생산기술연구원 | 부분 수직 주름 박형 평판 케이블의 연속 절연막 코팅방법, 및 이에 의해 제조된 부분 수직 주름 박형 평판 케이블 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5224265A (en) * | 1991-10-29 | 1993-07-06 | International Business Machines Corporation | Fabrication of discrete thin film wiring structures |
| JP3261119B2 (ja) | 2000-05-16 | 2002-02-25 | 三井金属鉱業株式会社 | プリント配線板の製造方法 |
| US7491892B2 (en) * | 2003-03-28 | 2009-02-17 | Princeton University | Stretchable and elastic interconnects |
| US7265298B2 (en) * | 2003-05-30 | 2007-09-04 | The Regents Of The University Of California | Serpentine and corduroy circuits to enhance the stretchability of a stretchable electronic device |
| US8217381B2 (en) * | 2004-06-04 | 2012-07-10 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
| JP4536430B2 (ja) * | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
| TWI427802B (zh) | 2005-06-02 | 2014-02-21 | 美國伊利諾大學理事會 | 可印刷半導體結構及製造和組合之相關方法 |
| US7880371B2 (en) * | 2006-11-03 | 2011-02-01 | Danfoss A/S | Dielectric composite and a method of manufacturing a dielectric composite |
| JP5096855B2 (ja) * | 2007-09-27 | 2012-12-12 | 新光電気工業株式会社 | 配線基板の製造方法及び配線基板 |
| KR100967362B1 (ko) | 2008-02-28 | 2010-07-05 | 재단법인서울대학교산학협력재단 | 스트레칭 및 벤딩이 가능한 배선구조체 및 이의 제조방법 |
| US8207473B2 (en) * | 2008-06-24 | 2012-06-26 | Imec | Method for manufacturing a stretchable electronic device |
| JP4538069B2 (ja) * | 2008-11-28 | 2010-09-08 | 株式会社東芝 | プリント配線板 |
| EP2392196B1 (en) | 2009-01-30 | 2018-08-22 | IMEC vzw | Stretchable electronic device |
| WO2010086033A1 (en) * | 2009-01-30 | 2010-08-05 | Interuniversitair Microelektronica Centrum Vzw | Stretchable electronic device |
| JP5570353B2 (ja) | 2010-09-03 | 2014-08-13 | バイエル マテリアルサイエンス株式会社 | 伸縮性配線を有する導電部材 |
| JP5640854B2 (ja) * | 2011-03-25 | 2014-12-17 | ソニー株式会社 | 導電性素子およびその製造方法、配線素子、情報入力装置、表示装置、電子機器、ならびに原盤 |
| US9226402B2 (en) * | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
| KR101466795B1 (ko) * | 2012-11-06 | 2014-11-28 | 재단법인대구경북과학기술원 | 신축성 기판 및 그 제조방법 |
| KR20140100299A (ko) * | 2013-02-06 | 2014-08-14 | 한국전자통신연구원 | 전자회로 및 그 제조방법 |
| US20140299362A1 (en) * | 2013-04-04 | 2014-10-09 | Electronics And Telecommunications Research Institute | Stretchable electric device and manufacturing method thereof |
| US9788789B2 (en) * | 2013-08-30 | 2017-10-17 | Thalmic Labs Inc. | Systems, articles, and methods for stretchable printed circuit boards |
| KR20150069079A (ko) * | 2013-12-12 | 2015-06-23 | 한국전자통신연구원 | 신축성 소자 및 그의 제조방법 |
| JP6191991B2 (ja) * | 2014-03-31 | 2017-09-06 | パナソニックＩｐマネジメント株式会社 | 伸縮性フレキシブル基板およびその製造方法 |
| KR102042137B1 (ko) * | 2014-05-30 | 2019-11-28 | 한국전자통신연구원 | 전자장치 및 그 제조 방법 |
| JP6574576B2 (ja) | 2015-02-02 | 2019-09-11 | 株式会社フジクラ | 伸縮性配線基板 |
| JP6506653B2 (ja) * | 2015-07-30 | 2019-04-24 | 日本メクトロン株式会社 | 伸縮性配線基板 |
| JP6793510B2 (ja) * | 2016-09-28 | 2020-12-02 | 日本メクトロン株式会社 | 伸縮性配線基板及び伸縮性配線基板の製造方法 |
| US20180192520A1 (en) * | 2016-12-29 | 2018-07-05 | Intel Corporation | Stretchable electronic system based on controlled buckled flexible printed circuit board (pcb) |
| US11284507B2 (en) * | 2017-10-12 | 2022-03-22 | Dai Nippon Printing Co., Ltd. | Wiring board and method for manufacturing wiring board |
| US10959326B2 (en) * | 2017-11-07 | 2021-03-23 | Dai Nippon Printing Co., Ltd. | Stretchable circuit substrate and article |
-
2018
- 2018-10-12 US US16/755,765 patent/US11284507B2/en active Active
- 2018-10-12 WO PCT/JP2018/038196 patent/WO2019074115A1/ja not_active Ceased
- 2018-10-12 CN CN201880066287.4A patent/CN111213435B/zh active Active
- 2018-10-12 JP JP2019519357A patent/JP6582155B2/ja active Active
- 2018-10-12 EP EP18865635.9A patent/EP3697180A4/en active Pending
- 2018-10-12 TW TW107135987A patent/TWI762729B/zh active
-
2019
- 2019-08-30 JP JP2019158380A patent/JP7154508B2/ja active Active
-
2022
- 2022-02-15 US US17/671,994 patent/US11968777B2/en active Active
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