TWI762661B - 用於在基板上沉積裝飾用鎳塗層之鎳電鍍浴 - Google Patents

用於在基板上沉積裝飾用鎳塗層之鎳電鍍浴 Download PDF

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Publication number
TWI762661B
TWI762661B TW107121396A TW107121396A TWI762661B TW I762661 B TWI762661 B TW I762661B TW 107121396 A TW107121396 A TW 107121396A TW 107121396 A TW107121396 A TW 107121396A TW I762661 B TWI762661 B TW I762661B
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TW
Taiwan
Prior art keywords
acid
nickel
electroplating bath
range
depositing
Prior art date
Application number
TW107121396A
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English (en)
Chinese (zh)
Other versions
TW201905243A (zh
Inventor
菲利浦 沃琪特
拉賈瑟卡朗 尼拉梅罕
菲利普 哈特曼
克拉斯－戴特 俗茲
Original Assignee
德商德國艾托特克公司
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Application filed by 德商德國艾托特克公司 filed Critical 德商德國艾托特克公司
Publication of TW201905243A publication Critical patent/TW201905243A/zh
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Publication of TWI762661B publication Critical patent/TWI762661B/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
TW107121396A 2017-06-23 2018-06-22 用於在基板上沉積裝飾用鎳塗層之鎳電鍍浴 TWI762661B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17177732 2017-06-23
??17177732.9 2017-06-23
EP17177732.9 2017-06-23

Publications (2)

Publication Number Publication Date
TW201905243A TW201905243A (zh) 2019-02-01
TWI762661B true TWI762661B (zh) 2022-05-01

Family

ID=59215623

Family Applications (1)

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TW107121396A TWI762661B (zh) 2017-06-23 2018-06-22 用於在基板上沉積裝飾用鎳塗層之鎳電鍍浴

Country Status (10)

Country Link
EP (2) EP3642396B1 (hu)
JP (2) JP2020524746A (hu)
CN (1) CN110785516A (hu)
DK (1) DK3642396T3 (hu)
ES (1) ES2890664T3 (hu)
HU (1) HUE056778T2 (hu)
PL (1) PL3642396T3 (hu)
PT (1) PT3642396T (hu)
TW (1) TWI762661B (hu)
WO (1) WO2018234229A1 (hu)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113614290A (zh) * 2019-04-15 2021-11-05 德国艾托特克公司 用于沉积半光亮镍或半光亮镍合金涂层的电镀镍或镍合金电镀浴
CN116083987A (zh) * 2022-11-25 2023-05-09 盐城吉瓦新材料科技有限公司 一种具有保护层的电镀金刚线及其制备工艺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060096868A1 (en) * 2004-11-10 2006-05-11 Siona Bunce Nickel electroplating bath designed to replace monovalent copper strike solutions

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Publication number Priority date Publication date Assignee Title
GB1541118A (en) * 1976-12-03 1979-02-21 Bnf Metals Tech Centre Nickel plating
JPS5562188A (en) * 1978-06-19 1980-05-10 Oosakashi Bright black nickel electroplating bath
DD154615B1 (de) * 1980-11-20 1987-11-25 Hans U Galgon Elektrolyt zur galvanischen adscheidung glaenzender goldlegierungen
JPS5881988A (ja) * 1981-11-06 1983-05-17 C Uyemura & Co Ltd 梨地状めつき用添加剤
JPS61163289A (ja) * 1985-01-14 1986-07-23 Nippon Kagaku Sangyo Kk ニツケル及びニツケル合金による黒色電気めつき浴
JPS63171892A (ja) * 1988-01-13 1988-07-15 C Uyemura & Co Ltd 電気めっき方法
JPH09157884A (ja) * 1995-12-12 1997-06-17 Dipsol Chem Co Ltd 非酸性ニッケルめっき浴及び該めっき浴を用いためっき方法
EP0785296B1 (en) * 1995-12-29 2000-03-15 AT&T Corp. Electroplating of nickel on nickel ferrite devices
JP4737790B2 (ja) * 1999-10-01 2011-08-03 株式会社シミズ ほう酸を含まないニッケルめっき浴
JP3261676B2 (ja) * 1999-12-16 2002-03-04 東京都 電気ニッケルめっき浴。
TW200934895A (en) * 2008-02-04 2009-08-16 Magtech Technology Co Ltd Nickel plating method with low contamination and high utilization rate
US20110114498A1 (en) * 2009-11-18 2011-05-19 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
JP5675303B2 (ja) * 2010-11-30 2015-02-25 日東光学株式会社 ニッケルめっき浴およびこれを用いた電鋳型の製造方法
CN103132114B (zh) * 2013-03-21 2016-02-10 湖南特力液压有限公司 耐磨工件及其耐磨镀层的制造方法
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
JP6195745B2 (ja) * 2013-06-19 2017-09-13 地方独立行政法人東京都立産業技術研究センター 電気ニッケルめっき液、めっき液の製造方法および電気めっき方法
DE102013113129A1 (de) * 2013-11-27 2015-05-28 RIAG Oberflächentechnik AG Verfahren zur galvanischen Abscheidung von Nickel und entsprechender Elektrolyt
DE102014207778B3 (de) * 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht
DE102014118614A1 (de) * 2014-12-15 2016-06-16 Harting Kgaa Borsäurefreies Nickel-Bad
KR101693514B1 (ko) * 2015-12-24 2017-01-06 주식회사 포스코 전기강판용 Fe-Ni-P 합금 다층 강판 및 이의 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060096868A1 (en) * 2004-11-10 2006-05-11 Siona Bunce Nickel electroplating bath designed to replace monovalent copper strike solutions

Also Published As

Publication number Publication date
EP3933072A1 (en) 2022-01-05
TW201905243A (zh) 2019-02-01
ES2890664T3 (es) 2022-01-21
DK3642396T3 (da) 2021-10-11
PT3642396T (pt) 2021-09-10
EP3642396A1 (en) 2020-04-29
CN110785516A (zh) 2020-02-11
JP2020524746A (ja) 2020-08-20
EP3642396B1 (en) 2021-07-28
JP2023090747A (ja) 2023-06-29
HUE056778T2 (hu) 2022-03-28
PL3642396T3 (pl) 2021-12-27
WO2018234229A1 (en) 2018-12-27

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