EP3642396B1 - Nickel electroplating bath for depositing a decorative nickel coating on a substrate - Google Patents

Nickel electroplating bath for depositing a decorative nickel coating on a substrate Download PDF

Info

Publication number
EP3642396B1
EP3642396B1 EP18730008.2A EP18730008A EP3642396B1 EP 3642396 B1 EP3642396 B1 EP 3642396B1 EP 18730008 A EP18730008 A EP 18730008A EP 3642396 B1 EP3642396 B1 EP 3642396B1
Authority
EP
European Patent Office
Prior art keywords
acid
nickel
electroplating bath
ranging
depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP18730008.2A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3642396A1 (en
Inventor
Philipp Wachter
Rajasekaran Neelamegam
Philip Hartmann
Klaus-Dieter Schulz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to EP21186683.5A priority Critical patent/EP3933072A1/en
Priority to PL18730008T priority patent/PL3642396T3/pl
Publication of EP3642396A1 publication Critical patent/EP3642396A1/en
Application granted granted Critical
Publication of EP3642396B1 publication Critical patent/EP3642396B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds

Definitions

  • the present invention relates to a nickel electroplating bath for depositing a decorative nickel coating on a substrate to be treated.
  • the present invention is also directed to a method for depositing a decorative nickel coating on a substrate to be treated.
  • the invention is related to the use of such an inventive nickel electroplating bath for depositing a bright nickel coating by conducting such a method.
  • the most conventional system is based on the so-called "Watts electrolytic bath", which has the following general composition: 240- 550 g/l nickel sulfate (NiSO 4 ⁇ 7 H 2 O or NiSO 4 ⁇ 6 H 2 O), 30-150 g/l nickel chloride (NiCl 2 ⁇ 6 H 2 O), and 30-55 g/l boric acid (H 3 BO 3 ).
  • nickel sulfate provides the necessary concentration of nickel ions, while nickel chloride improves anode corrosion and increases conductivity.
  • Boric acid is used as a weak buffer to maintain the pH value.
  • organic and inorganic agents are often added to the electrolyte.
  • the types of added brighteners and their concentrations determine the appearance of the nickel coating, i.e., brilliant, bright, semi-bright, satin, matte etc.
  • US 4,159,926 refers to a nickel electroplating bath comprising in aqueous solution at a pH of from 4 to 7, nickel ions at a Molar concentration of at least 0.25, chloride ions at a Molar concentration of at least 0.25, and a weak complexant for the nickel selected from formate, acetate, citrate, glutamate, anions and lactones of sugar acids and anions and lactones of acids having the formula X(C n H 2n )COOH where X is OH or NH 2 and n is 1 to 5, preferably 1 to 2, present at a Molar concentration of from 0.5 to 4.0 times that of the nickel.
  • US 2006/0096868 A1 refers to a nickel electroplating bath comprising an additive package comprising (i) sulphonic acid or sulphonic acid salts, (ii) sulfonated alkoxylate and (iii) organic acid selected from the group consisting of tolylacetic acid, salicylic acid, hydroxy-benzoic acid, benzyloxyacetone and mixtures of the foregoing.
  • EP 2 878 711 A1 refers to a deposition bath for depositing nickel, the bath comprising nickel ions, a conducting salt, and boric acid as buffer in a concentration equal or below 10 g/L.
  • DE 10 2014 207778 B3 refers to a deposition bath for depositing a bright nickel layer comprising boric acid.
  • boric acid has been classified as toxic in the meantime and is considered to be banned for the world market. So, the industry has a strong demand to replace boric acid by other non-toxic substances.
  • the present invention accordingly provides a nickel electroplating bath for depositing a decorative nickel coating on a substrate to be treated, the electroplating bath comprises at least a nickel ion source, at least one amino acid and/or at least one carboxylic acid, which is not an amino acid; wherein the total concentration of the amino acid(s) is ranging from 1 to 10 g/l, wherein the total concentration of carboxylic acid(s), which is/are not an amino acid, is ranging from 10 to 40 g/l; wherein the electroplating bath is free of boric acid; wherein the total concentration of the nickel ions is ranging from 55 to 80 g/l; and wherein the nickel electroplating bath has a chloride content ranging from 7.5 to 40 g/l, characterized in that the nickel electroplating bath further comprises
  • the at least one amino acid and/or the at least one carboxylic acid are representing complexing agents for complexing the nickel ions in the respective nickel electroplating bath.
  • the "classical” complexing agent of the prior art namely boric acid
  • the nickel electroplating bath of the present invention is boric acid free.
  • nickel electroplating bath for depositing nickel coatings, such as bright nickel coating.
  • the nickel electroplating bath also shows good levelling performance and leads to well-levelled coatings.
  • the nickel electroplating bath has a chloride content ranging from 10 to 30 g/l.
  • chloride content means in the context of the present invention a chloride ion source.
  • Nickel chloride may be replaced partly by sodium chloride.
  • chloride in the electrolyte may be replaced partly by equivalent amounts of bromide.
  • a nickel ion source in the context of the present invention can be any kind of nickel salt or nickel complex, which is suitable to provide a free nickel ion in the respective nickel electrodeposition bath, such as nickel chloride and/or nickel sulfate.
  • the nickel electroplating bath of the present invention can be used for depositing decorative nickel coatings on a plurality of different kind of substrates to be treated based on a metal and/or metal alloy, in particular steel, copper, brass, aluminum, bronze, magnesium and/or zinc diecasting; or on "POP" substrates.
  • POP means in the sense of the invention "plating on plastics”.
  • POP substrates comprise a synthetic substrate, preferably based on at least one polymeric compound, more preferably based on acrylonitrile-butadiene- styrene (ABS), polyamide, polypropylene or ABS/PC (polycarbonate).
  • the nickel electroplating bath is substantially free, preferably completely free, of any other metal ion (additionally to the nickel ion source, which is always provided in the inventive electroplating bath), which can be electrolytically deposited together with the nickel ion source as nickel alloy layer.
  • the nickel electroplating bath is substantially free, preferably completely free, of an iron, gold, copper, bismuth, tin, zinc, silver, lead, and aluminum ion source.
  • substantially free means in the context of the present invention a concentration of less than 1 g/l, preferably less than 0.1 g/l, and more preferably less than 0.01 g/l of the respective metal ion source.
  • the at least one amino acid is selected from the group consisting of ⁇ alanine, glycine, glutamic acid, DL- aspartic acid, threonine, valine, glutamine or L-serine.
  • the at least one carboxylic acid which is not an amino acid, is selected from the group consisting of mono carboxylic acids, di carboxylic acids or tri carboxylic acids.
  • the at least one carboxylic acid which is not an amino acid, is selected from the group consisting of tartaric acid, glycolic acid, malic acid, acetic acid, lactic acid, citric acid, succinic acid, propanoic acid, formic acid or glutaric acid.
  • the electroplating bath comprises at least two different carboxylic acids, which are both not amino acids; wherein the total concentration of said two different carboxylic acids, is ranging from 10 to 40 g/l.
  • the electroplating bath comprises at least one amino acid and one carboxylic acid, which is not an amino acid; wherein the total concentration of said amino acid is ranging from 1 to 10 g/l, wherein the total concentration of said carboxylic acid, which is not an amino acid, is ranging from 10 to 40 g/l.
  • the total concentration of the nickel ions is ranging from 60 to 75 g/l, and preferably from 62 to 72 g/l.
  • the pH-Value of the electroplating bath ranges from 2 to 6, preferably from 3 to 5, more preferably from 3.5 to 4.7.
  • the nickel electroplating bath may comprise in certain embodiments of the present invention at least a wetting agent, such as 2-ethylhexylsulfate, di-alkylsulfusuccinate, polymerized naphtalenesulfonate, lauryl sulfate or lauryl ether sulfate, wherein the concentration of such a wetting agent, is used, is ranging from 5 to 500 mg/l, preferably ranging from 10 to 350 mg/l, and more preferably ranging from 20 to 250 mg/l.
  • a wetting agent such as 2-ethylhexylsulfate, di-alkylsulfusuccinate, polymerized naphtalenesulfonate, lauryl sulfate or lauryl ether sulfate, wherein the concentration of such a wetting agent, is used, is ranging from 5 to 500 mg/l, preferably ranging from 10 to 350 mg/l, and more preferably ranging from 20 to 250 mg/l
  • the electroplating bath may further comprise benzoic acid or an alkali metal, benzoate at a concentration ranging from 0.005 to 5 g/l, preferably from 0.02 to 2 g/l, more preferably from 0.05 to 0.5 g/l.
  • benzoic acid or an alkali metal benzoate at a concentration ranging from 0.005 to 5 g/l, preferably from 0.02 to 2 g/l, more preferably from 0.05 to 0.5 g/l.
  • benzoic acid or an alkali metal benzoate at a concentration ranging from 0.005 to 5 g/l, preferably from 0.02 to 2 g/l, more preferably from 0.05 to 0.5 g/l.
  • the electroplating bath may also further comprise salicylic acid at a concentration ranging from 0.1 to 10 g/l, preferably from 0.3 to 6 g/l, more preferably from 0.5 to 3.5 g/l.
  • salicylic acid at a concentration ranging from 0.1 to 10 g/l, preferably from 0.3 to 6 g/l, more preferably from 0.5 to 3.5 g/l.
  • the electroplating bath may further comprises additional compounds selected from brighteners, leveling agents, internal stress reducers, and wetting agents, in particular at a concentration ranging from 0.005 to 5 g/l, preferably from 0.02 to 2 g/l, more preferably from 0.05 to 0.5 g/l.
  • a primary brightener can be comprised in certain embodiments, preferably for bright nickel coatings, unsaturated, in most cases aromatic sulfonic acids, sulfonamides, sulfimides, N-sulfonylcarboxamides, sulfinates, diarylsulfones or the salts thereof, in particular the sodium or potassium salts.
  • the nickel electroplating bath of the present invention comprises at least a sulfonic acid and/or a derivative of a sulfonic acid in form of a sulfonic acid salt at a total concentration ranging from 0.1 to 5 g/l.
  • the most familiar compounds are for example m-benzenedisulfonic acid, benzoic acid sulfimide (saccharine), trisodium 1,3,6- naphthalene trisulfonate, sodium benzene monosulfonate, dibenzene sulfonamide, sodium benzene mono-sulfinate, vinyl sulfonic acid, allyl sulfonic acid, sodium salt of allyl sulfonic acid, p-toluene sulfonic acid, p-toluene sulfonamide, sodium propargyl sulfonate, benzoic acid sulfimide, 1,3,6-naphthalenetrisulfonic acid and benzoyl benzene sulfonamide.
  • the nickel electroplating bath of the present invention comprises saccharin and/or a saccharin derivative in form of a saccharin salt at a concentration ranging from 1.5 to 10 g/l.
  • Such a primary brightener can comprise propargyl alcohol and/or derivatives (ethoxylated or propoxylated) thereof.
  • the primary brighteners can be added to the electrolyte bath at a concentration ranging from 0.001 to 8 g/l, preferably from 0.01 to 2 g/l, more preferably from 0.02 to 1 g/l. It is also possible to use several primary brighteners simultaneously.
  • the object of the present invention is also solved by a method for depositing a decorative nickel coating on a substrate to be treated comprising the following method steps:
  • the method for depositing is executed in a working temperature range from 30°C to 70°C, preferably from 40°C to 65°C, and more preferably from 50°C to 60°C.
  • the method for depositing is executed in a working current density range from 1 to 7 Ampere/dm 2 (ASD), preferably from 1.5 to 6 ASD, and more preferably from 2 to 5 ASD.
  • ASD Ampere/dm 2
  • the method for depositing is executed in a working time for applying the voltage and the subsequent electrodeposition of the decorative nickel coating (method steps iii) and iv)) ranging from 5 to 50 minutes, preferably from 6 to 35 minutes, and more preferably from 8 to 25 minutes.
  • the electroplating bath further comprises at least a saccharin and/or a saccharin derivative in form of a saccharin salt, preferably the sodium salt of saccharin, at a concentration ranging from 1.5 to 7 g/l, preferably from 2 to 6 g/l; and at least a sulfonic acid and/or a derivative of a sulfonic acid in form of a sulfonic acid salt, preferably selected from the group consisting of allyl sulfonic acid, vinyl sulfonic acid, sodium salt of allyl sulfonic acid, sodium salt of vinyl sulfonic acid, or mixtures thereof, at a total concentration ranging from 0.25 to 3.5 g/l, preferably from 0.5 to 2.0 g/l.
  • a bright nickel coating is deposited.
  • the selective choice of the above-mentioned additives shows the unique application of the inventive nickel electroplating bath for the purpose of depositing decorative nickel coatings of different optical appearance and chemical properties.
  • the electroplating bath further comprises at least a diol, preferably selected from the group consisting of 2,5 hexinediol and 1,4 butinediol, at a concentration ranging from 10 to 300 mg/l, preferably from 50 to 250 mg/l, more preferably from 100 to 220 mg/l; or at least an additive selected from the group of pyridiniumpropylsulfobetaine (PPS) or derivatives thereof (such as PPS-OH), at a total concentration ranging from 5 to 350 mg/l, preferably from 10 to 200 mg/l, more preferably from 50 to 150 mg/l.
  • PPS pyridiniumpropylsulfobetaine
  • the object of the present invention is also solved by making use of such a nickel electroplating bath for depositing a bright nickel coating by conducting such a method.
  • the present invention thus addresses the problem of providing a boric acid free nickel electroplating bath for depositing decorative nickel coatings, such as bright nickel coating.
  • the substrates have been always pretreated in the following manner before their use for the nickel deposition:
  • Sample substrates have been scratched for subjective optical judgment of leveling. The glance of the resulting nickel coatings on the substrates has been also judged optically.
  • the size of the sample substrates have been always 7 cm x 10 cm (width x length) leading to a surface to be treated of 70 cm 2 on one side (Tables 1,2, and 3).
  • Table 1 shows conducted experiments for bright nickel coatings in accordance with embodiments of the present invention.
  • the nickel deposition took place for all experiments listed in Table 1 in a Hull cell wherein 2.5 Ampere (A) was applied for 10 minutes at a temperature of 55°C +/- 3°C. Further, 3 liter/min pressure air was introduced during nickel deposition.
  • the nickel concentration was 67 g/l for all experiments listed in Table 1.
  • Table 2 exhibits comparative experiments for bright nickel coatings in accordance with comparative embodiments outside of the present invention.
  • the nickel deposition took place for all experiments listed in Table 2 in a Hull cell at a temperature of 55°C +/- 3 °C as in the experiments listed in Table 1. Further, 3 liter/min pressure air was introduced during nickel deposition. The respective columns are showing the number of the experiment, the used acid as complexing agent, the concentration of the acid used as complexing agent, the pH-value of the nickel bath, the applied current in Ampere (A), the nickel ion concentration in g/l, the application time of the current in minutes, and the achieved result of the nickel coating (columns have been described from the left to the right of Table 2). Table 2: Comparative experiments for bright nickel coatings Exp.
  • Experiments 30 to 35 show comparative experiments making use of the same respective acids as complexing agent as in certain experiments in Table 1, but with a different concentration. Experiments 30 to 35 all have a too low or too high concentration of the complexing agent for the nickel ions compared to the claimed concentration ranges.
  • Table 3 exhibits inventive experiments for bright nickel coatings in accordance with further embodiments of the present invention.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP18730008.2A 2017-06-23 2018-06-18 Nickel electroplating bath for depositing a decorative nickel coating on a substrate Active EP3642396B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP21186683.5A EP3933072A1 (en) 2017-06-23 2018-06-18 Nickel electroplating bath for depositing a decorative nickel coating on a substrate
PL18730008T PL3642396T3 (pl) 2017-06-23 2018-06-18 Kąpiel do powlekania elektrolitycznego niklem do osadzania dekoracyjnej powłoki niklowej na podłożu

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP17177732 2017-06-23
PCT/EP2018/066090 WO2018234229A1 (en) 2017-06-23 2018-06-18 NICKEL ELECTROPLACING BATH FOR DEPOSITION OF A DECORATIVE NICKEL COATING ON A SUBSTRATE

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP21186683.5A Division EP3933072A1 (en) 2017-06-23 2018-06-18 Nickel electroplating bath for depositing a decorative nickel coating on a substrate

Publications (2)

Publication Number Publication Date
EP3642396A1 EP3642396A1 (en) 2020-04-29
EP3642396B1 true EP3642396B1 (en) 2021-07-28

Family

ID=59215623

Family Applications (2)

Application Number Title Priority Date Filing Date
EP21186683.5A Withdrawn EP3933072A1 (en) 2017-06-23 2018-06-18 Nickel electroplating bath for depositing a decorative nickel coating on a substrate
EP18730008.2A Active EP3642396B1 (en) 2017-06-23 2018-06-18 Nickel electroplating bath for depositing a decorative nickel coating on a substrate

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP21186683.5A Withdrawn EP3933072A1 (en) 2017-06-23 2018-06-18 Nickel electroplating bath for depositing a decorative nickel coating on a substrate

Country Status (10)

Country Link
EP (2) EP3933072A1 (hu)
JP (2) JP7536452B2 (hu)
CN (1) CN110785516A (hu)
DK (1) DK3642396T3 (hu)
ES (1) ES2890664T3 (hu)
HU (1) HUE056778T2 (hu)
PL (1) PL3642396T3 (hu)
PT (1) PT3642396T (hu)
TW (1) TWI762661B (hu)
WO (1) WO2018234229A1 (hu)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7551647B2 (ja) * 2019-04-15 2024-09-17 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー 半光沢ニッケル又は半光沢ニッケル合金コーティングを析出するためのガルバニックニッケル又はニッケル合金電気めっき浴
CN116083987A (zh) * 2022-11-25 2023-05-09 盐城吉瓦新材料科技有限公司 一种具有保护层的电镀金刚线及其制备工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001172790A (ja) * 1999-12-16 2001-06-26 Tokyo Metropolis 電気ニッケルめっき浴。
DE102014207778B3 (de) * 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1541118A (en) * 1976-12-03 1979-02-21 Bnf Metals Tech Centre Nickel plating
JPS5562188A (en) * 1978-06-19 1980-05-10 Oosakashi Bright black nickel electroplating bath
DD154615B1 (de) * 1980-11-20 1987-11-25 Hans U Galgon Elektrolyt zur galvanischen adscheidung glaenzender goldlegierungen
JPS5881988A (ja) * 1981-11-06 1983-05-17 C Uyemura & Co Ltd 梨地状めつき用添加剤
JPS61163289A (ja) * 1985-01-14 1986-07-23 Nippon Kagaku Sangyo Kk ニツケル及びニツケル合金による黒色電気めつき浴
JPS63171892A (ja) * 1988-01-13 1988-07-15 C Uyemura & Co Ltd 電気めっき方法
JPH09157884A (ja) * 1995-12-12 1997-06-17 Dipsol Chem Co Ltd 非酸性ニッケルめっき浴及び該めっき浴を用いためっき方法
DE69607130T2 (de) * 1995-12-29 2000-10-19 At & T Corp., New York Elektroplattieren von Nickel auf Nickel-Ferrit Vorrichtungen
JP4737790B2 (ja) * 1999-10-01 2011-08-03 株式会社シミズ ほう酸を含まないニッケルめっき浴
US20060096868A1 (en) * 2004-11-10 2006-05-11 Siona Bunce Nickel electroplating bath designed to replace monovalent copper strike solutions
TW200934895A (en) * 2008-02-04 2009-08-16 Magtech Technology Co Ltd Nickel plating method with low contamination and high utilization rate
US20110114498A1 (en) * 2009-11-18 2011-05-19 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
JP5675303B2 (ja) * 2010-11-30 2015-02-25 日東光学株式会社 ニッケルめっき浴およびこれを用いた電鋳型の製造方法
CN103132114B (zh) * 2013-03-21 2016-02-10 湖南特力液压有限公司 耐磨工件及其耐磨镀层的制造方法
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
JP6195745B2 (ja) * 2013-06-19 2017-09-13 地方独立行政法人東京都立産業技術研究センター 電気ニッケルめっき液、めっき液の製造方法および電気めっき方法
DE102013113129A1 (de) * 2013-11-27 2015-05-28 RIAG Oberflächentechnik AG Verfahren zur galvanischen Abscheidung von Nickel und entsprechender Elektrolyt
DE102014118614A1 (de) * 2014-12-15 2016-06-16 Harting Kgaa Borsäurefreies Nickel-Bad
KR101693514B1 (ko) * 2015-12-24 2017-01-06 주식회사 포스코 전기강판용 Fe-Ni-P 합금 다층 강판 및 이의 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001172790A (ja) * 1999-12-16 2001-06-26 Tokyo Metropolis 電気ニッケルめっき浴。
DE102014207778B3 (de) * 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht

Also Published As

Publication number Publication date
DK3642396T3 (da) 2021-10-11
JP2020524746A (ja) 2020-08-20
WO2018234229A1 (en) 2018-12-27
PT3642396T (pt) 2021-09-10
TW201905243A (zh) 2019-02-01
JP7536452B2 (ja) 2024-08-20
ES2890664T3 (es) 2022-01-21
EP3642396A1 (en) 2020-04-29
PL3642396T3 (pl) 2021-12-27
EP3933072A1 (en) 2022-01-05
HUE056778T2 (hu) 2022-03-28
JP2023090747A (ja) 2023-06-29
CN110785516A (zh) 2020-02-11
TWI762661B (zh) 2022-05-01

Similar Documents

Publication Publication Date Title
US9790607B1 (en) 3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating baths
US9145617B2 (en) Adhesion promotion of cyanide-free white bronze
JPH08209379A (ja) アルカリ亜鉛および亜鉛合金電気めっき浴およびプロセス
JP2011520037A (ja) 改良された銅−錫電解液及び青銅層の析出方法
TWI417427B (zh) 含銀合金鍍敷浴、使用其之電解鍍敷方法
CN104911648A (zh) 无氰化物的酸性亚光银电镀组合物及方法
JP2023090747A (ja) 基材上に装飾ニッケルコーティングを堆積させるためのニッケル電気メッキ浴
KR101046301B1 (ko) 니켈플래쉬 도금용액, 전기아연강판 및 이의 제조방법
US20030085130A1 (en) Zinc-nickel electrolyte and method for depositing a zinc-nickel alloy therefrom
US20090159453A1 (en) Method for silver plating
WO2019117230A1 (ja) ３価クロムメッキ液およびこれを用いた３価クロムメッキ方法
KR20100121399A (ko) 니켈플래쉬 도금용액, 전기아연도금강판 및 이의 제조방법
KR102258233B1 (ko) 전해 도금액
US20200240029A1 (en) Indium electroplating compositions and methods for electroplating indium on nickel
US11408085B2 (en) Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or semi-bright nickel alloy coating
KR102215209B1 (ko) 아르기닌과 비스에폭사이드의 코폴리머를 갖는 니켈 전기도금 조성물 및 니켈을 전기도금하는 방법
US3890210A (en) Method and electrolyte for electroplating rhodium-rhenium alloys
KR20200010340A (ko) 귀금속 염 물질, 그 제조 방법 및 전기 도금용 용도
JP2023507515A (ja) 三価クロム電気めっき浴中の鉄イオンの濃度を低減させるための方法

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: UNKNOWN

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

TPAC Observations filed by third parties

Free format text: ORIGINAL CODE: EPIDOSNTIPA

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20191206

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20210330

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1414815

Country of ref document: AT

Kind code of ref document: T

Effective date: 20210815

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602018020819

Country of ref document: DE

REG Reference to a national code

Ref country code: PT

Ref legal event code: SC4A

Ref document number: 3642396

Country of ref document: PT

Date of ref document: 20210910

Kind code of ref document: T

Free format text: AVAILABILITY OF NATIONAL TRANSLATION

Effective date: 20210903

REG Reference to a national code

Ref country code: DK

Ref legal event code: T3

Effective date: 20211005

REG Reference to a national code

Ref country code: FI

Ref legal event code: FGE

REG Reference to a national code

Ref country code: RO

Ref legal event code: EPE

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20210728

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2890664

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20220121

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211028

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211029

RAP4 Party data changed (patent owner data changed or rights of a patent transferred)

Owner name: ATOTECH DEUTSCHLAND GMBH & CO. KG

REG Reference to a national code

Ref country code: HU

Ref legal event code: AG4A

Ref document number: E056778

Country of ref document: HU

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602018020819

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20220429

REG Reference to a national code

Ref country code: AT

Ref legal event code: UEP

Ref document number: 1414815

Country of ref document: AT

Kind code of ref document: T

Effective date: 20210728

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20220630

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20220618

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220618

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220630

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220618

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220618

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220630

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: PL

Payment date: 20230612

Year of fee payment: 6

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20230830

Year of fee payment: 6

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240627

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DK

Payment date: 20240624

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 20240618

Year of fee payment: 7

Ref country code: CZ

Payment date: 20240529

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: RO

Payment date: 20240612

Year of fee payment: 7

Ref country code: FR

Payment date: 20240625

Year of fee payment: 7

Ref country code: FI

Payment date: 20240624

Year of fee payment: 7

Ref country code: BG

Payment date: 20240627

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: PT

Payment date: 20240524

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20240624

Year of fee payment: 7

Ref country code: HU

Payment date: 20240613

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210728

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20240619

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20240710

Year of fee payment: 7