TWI753572B - 區域控制稀土氧化物ald及cvd塗佈 - Google Patents
區域控制稀土氧化物ald及cvd塗佈 Download PDFInfo
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- TWI753572B TWI753572B TW109131444A TW109131444A TWI753572B TW I753572 B TWI753572 B TW I753572B TW 109131444 A TW109131444 A TW 109131444A TW 109131444 A TW109131444 A TW 109131444A TW I753572 B TWI753572 B TW I753572B
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- C23C16/45529—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations specially adapted for making a layer stack of alternating different compositions or gradient compositions
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- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
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- Organic Chemistry (AREA)
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- Metallurgy (AREA)
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- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromagnetism (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
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Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3423610B1 (en) * | 2016-03-04 | 2022-05-04 | Beneq OY | A plasma etch-resistant film and a method for its fabrication |
| US9850573B1 (en) * | 2016-06-23 | 2017-12-26 | Applied Materials, Inc. | Non-line of sight deposition of erbium based plasma resistant ceramic coating |
| US10186400B2 (en) * | 2017-01-20 | 2019-01-22 | Applied Materials, Inc. | Multi-layer plasma resistant coating by atomic layer deposition |
| JP7165748B2 (ja) * | 2018-12-05 | 2022-11-04 | 京セラ株式会社 | プラズマ処理装置用部材およびこれを備えるプラズマ処理装置 |
| JP7249930B2 (ja) * | 2019-11-20 | 2023-03-31 | 東京エレクトロン株式会社 | 成膜方法および成膜装置 |
| CN112899617B (zh) | 2019-12-04 | 2023-03-31 | 中微半导体设备(上海)股份有限公司 | 形成耐等离子体涂层的方法、装置、零部件和等离子体处理装置 |
| KR102936161B1 (ko) * | 2019-12-09 | 2026-03-09 | 엔테그리스, 아이엔씨. | 다중 장벽 재료로 제조된 확산 장벽, 그리고 관련 물품 및 방법 |
| CN112981360B (zh) * | 2019-12-17 | 2023-01-24 | 中微半导体设备(上海)股份有限公司 | 一种微波退火装置和微波退火方法 |
| CN113539771B (zh) * | 2020-04-16 | 2024-04-12 | 中微半导体设备(上海)股份有限公司 | 零部件、其表面形成涂层的方法和等离子体反应装置 |
| CN113707525A (zh) * | 2020-05-20 | 2021-11-26 | 中微半导体设备(上海)股份有限公司 | 零部件、形成耐等离子体涂层的方法和等离子体反应装置 |
| KR20230027281A (ko) * | 2020-06-25 | 2023-02-27 | 램 리써치 코포레이션 | 반도체 프로세싱 챔버를 위한 매칭된 화학 물질 컴포넌트 바디 및 코팅 |
| CN114068274B (zh) * | 2020-08-03 | 2025-01-07 | 中微半导体设备(上海)股份有限公司 | 半导体零部件、等离子体处理装置及耐腐蚀涂层形成方法 |
| US12592364B2 (en) | 2020-08-03 | 2026-03-31 | Applied Materials, Inc. | Fluoride coating to improve chamber performance |
| CN114639584B (zh) * | 2020-12-15 | 2024-12-06 | 中微半导体设备(上海)股份有限公司 | 半导体零部件、等离子体处理装置及形成复合涂层的方法 |
| CN114664623B (zh) * | 2020-12-23 | 2024-12-10 | 中微半导体设备(上海)股份有限公司 | 耐等离子体腐蚀半导体零部件及其制备方法和等离子体反应装置 |
| TWI807253B (zh) * | 2021-01-29 | 2023-07-01 | 優材科技有限公司 | 半導體反應裝置與反應方法 |
| JP7699217B2 (ja) * | 2021-03-19 | 2025-06-26 | インテグリス・インコーポレーテッド | フッ素化イットリウムコーティングを有する基材、ならびに基材を製造および使用する方法 |
| FI130562B (en) * | 2021-05-21 | 2023-11-21 | Picosun Oy | Plasma resistant coating, related manufacturing process and uses |
| US11742416B2 (en) * | 2021-05-27 | 2023-08-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and method for manufacturing the same |
| US20220384290A1 (en) * | 2021-06-01 | 2022-12-01 | Wolfspeed, Inc. | Multilayer encapsulation for humidity robustness and highly accelerated stress tests and related fabrication methods |
| JP7668168B2 (ja) * | 2021-06-22 | 2025-04-24 | 東京エレクトロン株式会社 | プラズマ処理装置のチャンバ内の部品を再生する方法 |
| JP2023124884A (ja) * | 2022-02-26 | 2023-09-07 | Toto株式会社 | 複合構造物および複合構造物を備えた半導体製造装置 |
| US12049697B2 (en) * | 2022-08-08 | 2024-07-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multilayer ALD coating for critical components in process chamber |
| US12486571B2 (en) | 2022-10-07 | 2025-12-02 | Applied Materials, Inc. | Atomic layer deposition coating system for inner walls of gas lines |
| CN116065115A (zh) * | 2023-01-30 | 2023-05-05 | 福建阿石创新材料股份有限公司 | 一种Y2O3-YAlO3复合材料及其制备方法和应用 |
| US12404584B2 (en) | 2023-07-18 | 2025-09-02 | Applied Materials, Inc. | Parallel atomic layer deposition of target element interiors |
| WO2025159165A1 (ja) * | 2024-01-25 | 2025-07-31 | 京セラ株式会社 | 耐食性部材 |
| CN119663213B (zh) * | 2025-02-19 | 2025-05-16 | 武汉工程大学 | 一种适用于刻蚀机零部件的y2o3-bzo复合涂层的制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW567584B (en) * | 2000-04-14 | 2003-12-21 | Asm Microchemistry Oy | Process for producing oxide thin films |
| CN1690254A (zh) * | 2004-04-13 | 2005-11-02 | 应用材料有限公司 | 具有含电镀钇涂层的制程腔室构件 |
Family Cites Families (89)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03115535A (ja) | 1989-09-28 | 1991-05-16 | Nippon Mining Co Ltd | 希土類金属の酸素低減方法 |
| US5805973A (en) | 1991-03-25 | 1998-09-08 | General Electric Company | Coated articles and method for the prevention of fuel thermal degradation deposits |
| US5630314A (en) | 1992-09-10 | 1997-05-20 | Hitachi, Ltd. | Thermal stress relaxation type ceramic coated heat-resistant element |
| JP3362113B2 (ja) | 1997-07-15 | 2003-01-07 | 日本碍子株式会社 | 耐蝕性部材、ウエハー設置部材および耐蝕性部材の製造方法 |
| JP3510993B2 (ja) | 1999-12-10 | 2004-03-29 | トーカロ株式会社 | プラズマ処理容器内部材およびその製造方法 |
| US7384438B1 (en) | 2000-07-19 | 2008-06-10 | 3M Innovative Properties Company | Fused Al2O3-Y2O3-ZrO2 eutectic abrasive particles, abrasive articles, and methods of making and using the same |
| US6685991B2 (en) | 2000-07-31 | 2004-02-03 | Shin-Etsu Chemical Co., Ltd. | Method for formation of thermal-spray coating layer of rare earth fluoride |
| JP5290488B2 (ja) * | 2000-09-28 | 2013-09-18 | プレジデント アンド フェロウズ オブ ハーバード カレッジ | 酸化物、ケイ酸塩及びリン酸塩の気相成長 |
| US6916534B2 (en) | 2001-03-08 | 2005-07-12 | Shin-Etsu Chemical Co., Ltd. | Thermal spray spherical particles, and sprayed components |
| JP2002356387A (ja) | 2001-03-30 | 2002-12-13 | Toshiba Ceramics Co Ltd | 耐プラズマ性部材 |
| JP4277973B2 (ja) | 2001-07-19 | 2009-06-10 | 日本碍子株式会社 | イットリア−アルミナ複合酸化物膜の製造方法、イットリア−アルミナ複合酸化物膜および耐蝕性部材 |
| US8357454B2 (en) | 2001-08-02 | 2013-01-22 | Siemens Energy, Inc. | Segmented thermal barrier coating |
| JP4921652B2 (ja) * | 2001-08-03 | 2012-04-25 | エイエスエム インターナショナル エヌ.ヴェー. | イットリウム酸化物およびランタン酸化物薄膜を堆積する方法 |
| US20030029563A1 (en) | 2001-08-10 | 2003-02-13 | Applied Materials, Inc. | Corrosion resistant coating for semiconductor processing chamber |
| US7371467B2 (en) | 2002-01-08 | 2008-05-13 | Applied Materials, Inc. | Process chamber component having electroplated yttrium containing coating |
| US20080213496A1 (en) | 2002-02-14 | 2008-09-04 | Applied Materials, Inc. | Method of coating semiconductor processing apparatus with protective yttrium-containing coatings |
| JP2003277051A (ja) | 2002-03-22 | 2003-10-02 | Ngk Insulators Ltd | イットリア−アルミナ複合酸化物膜を有する積層体、イットリア−アルミナ複合酸化物膜、耐蝕性部材、耐蝕性膜およびイットリア−アルミナ複合酸化物膜の製造方法 |
| DE60319470T2 (de) | 2002-08-02 | 2009-03-26 | Fujikura Ltd. | Herstellungsverfahren für einen polykristallinen Dünnfilm und Herstellungsverfahren für ein Oxidsupraleiter-Bauelement |
| KR100772740B1 (ko) | 2002-11-28 | 2007-11-01 | 동경 엘렉트론 주식회사 | 플라즈마 처리 용기 내부재 |
| US7560376B2 (en) | 2003-03-31 | 2009-07-14 | Tokyo Electron Limited | Method for adjoining adjacent coatings on a processing element |
| CN1288108C (zh) | 2003-10-24 | 2006-12-06 | 东芝陶瓷股份有限会社 | 耐等离子体构件、其制造方法及形成热喷涂涂层的方法 |
| JP4606121B2 (ja) | 2004-01-29 | 2011-01-05 | 京セラ株式会社 | 耐食膜積層耐食性部材およびその製造方法 |
| US7291403B2 (en) * | 2004-02-03 | 2007-11-06 | General Electric Company | Thermal barrier coating system |
| JP2006082474A (ja) | 2004-09-17 | 2006-03-30 | Tosoh Corp | 樹脂部材 |
| JP2006186306A (ja) | 2004-09-30 | 2006-07-13 | Toshiba Ceramics Co Ltd | ガス拡散プレートおよびその製造方法 |
| KR101226120B1 (ko) | 2004-10-26 | 2013-01-24 | 쿄세라 코포레이션 | 내식성 부재 및 그 제조방법 |
| KR100915722B1 (ko) | 2005-06-23 | 2009-09-04 | 도쿄엘렉트론가부시키가이샤 | 반도체 처리 장치용의 구성 부재 및 그 제조 방법, 및반도체 처리 장치 |
| US7968205B2 (en) | 2005-10-21 | 2011-06-28 | Shin-Etsu Chemical Co., Ltd. | Corrosion resistant multilayer member |
| JP2007217782A (ja) | 2006-02-20 | 2007-08-30 | Showa Denko Kk | 希土類元素のフッ化物皮膜を有する耐食性皮膜およびその製造方法 |
| JP4546447B2 (ja) | 2006-12-22 | 2010-09-15 | トーカロ株式会社 | 耐プラズマエロージョン性に優れる溶射皮膜被覆部材およびその製造方法 |
| JP5252613B2 (ja) | 2006-12-25 | 2013-07-31 | 国立大学法人東北大学 | イオン注入装置およびイオン注入方法 |
| US10622194B2 (en) | 2007-04-27 | 2020-04-14 | Applied Materials, Inc. | Bulk sintered solid solution ceramic which exhibits fracture toughness and halogen plasma resistance |
| US7696117B2 (en) | 2007-04-27 | 2010-04-13 | Applied Materials, Inc. | Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas |
| US8900422B2 (en) * | 2008-04-23 | 2014-12-02 | Intermolecular, Inc. | Yttrium and titanium high-K dielectric film |
| CN101577211B (zh) * | 2008-05-09 | 2011-07-20 | 中微半导体设备(上海)有限公司 | 抗等离子体腐蚀的反应室部件、其制造方法以及包含该部件的等离子体反应室 |
| US8206829B2 (en) | 2008-11-10 | 2012-06-26 | Applied Materials, Inc. | Plasma resistant coatings for plasma chamber components |
| US9017765B2 (en) | 2008-11-12 | 2015-04-28 | Applied Materials, Inc. | Protective coatings resistant to reactive plasma processing |
| US8858745B2 (en) | 2008-11-12 | 2014-10-14 | Applied Materials, Inc. | Corrosion-resistant bonding agents for bonding ceramic components which are exposed to plasmas |
| US8470460B2 (en) * | 2008-11-25 | 2013-06-25 | Rolls-Royce Corporation | Multilayer thermal barrier coatings |
| TW201100578A (en) | 2009-06-19 | 2011-01-01 | Saint Gobain Ceramics & Plastics Inc | Sealed plasma coatings |
| US8449994B2 (en) | 2009-06-30 | 2013-05-28 | Honeywell International Inc. | Turbine engine components |
| WO2011049938A2 (en) | 2009-10-20 | 2011-04-28 | Saint-Gobain Ceramics & Plastics, Inc. | Microelectronic processing component having a corrosion-resistant layer, microelectronic workpiece processing apparatus incorporating same, and method of forming an article having the corrosion-resistant layer |
| DE102010015470A1 (de) * | 2010-04-16 | 2011-10-20 | Forschungszentrum Jülich GmbH | Verfahren zur Innenbeschichtung von Funktionsschichten mit einem Vergütungsmaterial |
| TW201209957A (en) | 2010-05-28 | 2012-03-01 | Praxair Technology Inc | Substrate supports for semiconductor applications |
| US20120103519A1 (en) * | 2010-10-25 | 2012-05-03 | Greene, Tweed Of Delaware, Inc. | Plasma Etch Resistant, Highly Oriented Yttria Films, Coated Substrates and Related Methods |
| US8916021B2 (en) | 2010-10-27 | 2014-12-23 | Applied Materials, Inc. | Electrostatic chuck and showerhead with enhanced thermal properties and methods of making thereof |
| KR20130025025A (ko) | 2011-09-01 | 2013-03-11 | 주식회사 코미코 | 정전척 |
| US9090046B2 (en) | 2012-04-16 | 2015-07-28 | Applied Materials, Inc. | Ceramic coated article and process for applying ceramic coating |
| US9394615B2 (en) | 2012-04-27 | 2016-07-19 | Applied Materials, Inc. | Plasma resistant ceramic coated conductive article |
| KR101637801B1 (ko) | 2012-05-22 | 2016-07-07 | 가부시끼가이샤 도시바 | 플라즈마 처리 장치용 부품 및 플라즈마 처리 장치용 부품의 제조 방법 |
| US9343289B2 (en) | 2012-07-27 | 2016-05-17 | Applied Materials, Inc. | Chemistry compatible coating material for advanced device on-wafer particle performance |
| CN103794458B (zh) | 2012-10-29 | 2016-12-21 | 中微半导体设备(上海)有限公司 | 用于等离子体处理腔室内部的部件及制造方法 |
| CN103794445B (zh) | 2012-10-29 | 2016-03-16 | 中微半导体设备(上海)有限公司 | 用于等离子体处理腔室的静电夹盘组件及制造方法 |
| CN103794460B (zh) | 2012-10-29 | 2016-12-21 | 中微半导体设备(上海)有限公司 | 用于半导体装置性能改善的涂层 |
| JP5578383B2 (ja) * | 2012-12-28 | 2014-08-27 | Toto株式会社 | 耐プラズマ性部材 |
| US9850568B2 (en) * | 2013-06-20 | 2017-12-26 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
| US9711334B2 (en) | 2013-07-19 | 2017-07-18 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based thin film coatings on process rings |
| US9583369B2 (en) | 2013-07-20 | 2017-02-28 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles |
| US9624593B2 (en) | 2013-08-29 | 2017-04-18 | Applied Materials, Inc. | Anodization architecture for electro-plate adhesion |
| US9440886B2 (en) | 2013-11-12 | 2016-09-13 | Applied Materials, Inc. | Rare-earth oxide based monolithic chamber material |
| US9725799B2 (en) | 2013-12-06 | 2017-08-08 | Applied Materials, Inc. | Ion beam sputtering with ion assisted deposition for coatings on chamber components |
| CN104711541A (zh) * | 2013-12-11 | 2015-06-17 | 北京有色金属研究总院 | 一种氧化锆和氧化铝梯度复合涂层及其制备方法 |
| CN107078086B (zh) | 2014-02-07 | 2021-01-26 | 恩特格里斯公司 | 静电夹具以及制造其之方法 |
| JPWO2015151857A1 (ja) | 2014-03-31 | 2017-04-13 | 株式会社東芝 | 耐プラズマ部品及び耐プラズマ部品の製造方法及び耐プラズマ部品の製造に用いる膜堆積装置 |
| US20150311043A1 (en) | 2014-04-25 | 2015-10-29 | Applied Materials, Inc. | Chamber component with fluorinated thin film coating |
| US9976211B2 (en) * | 2014-04-25 | 2018-05-22 | Applied Materials, Inc. | Plasma erosion resistant thin film coating for high temperature application |
| US9869013B2 (en) | 2014-04-25 | 2018-01-16 | Applied Materials, Inc. | Ion assisted deposition top coat of rare-earth oxide |
| US10730798B2 (en) | 2014-05-07 | 2020-08-04 | Applied Materials, Inc. | Slurry plasma spray of plasma resistant ceramic coating |
| US10196728B2 (en) | 2014-05-16 | 2019-02-05 | Applied Materials, Inc. | Plasma spray coating design using phase and stress control |
| US9551070B2 (en) | 2014-05-30 | 2017-01-24 | Applied Materials, Inc. | In-situ corrosion resistant substrate support coating |
| CN105225997B (zh) | 2014-06-12 | 2018-01-23 | 中微半导体设备(上海)有限公司 | 一种静电夹盘及静电夹盘的制造方法 |
| KR20160030812A (ko) | 2014-09-11 | 2016-03-21 | 삼성전자주식회사 | 플라즈마 처리 장치 |
| KR102182699B1 (ko) | 2014-11-11 | 2020-11-25 | (주) 코미코 | 플라즈마 처리 장치용 내부재 및 이의 제조 방법 |
| US10141582B2 (en) | 2014-12-22 | 2018-11-27 | Sonata Scientific LLC | SOFC interconnect barriers and methods of making same |
| CN105990081B (zh) | 2015-02-09 | 2018-09-21 | 中微半导体设备(上海)有限公司 | 等离子体处理装置及其制作方法 |
| SG11201706564UA (en) | 2015-02-13 | 2017-09-28 | Entegris Inc | Coatings for enhancement of properties and performance of substrate articles and apparatus |
| CN107532283B (zh) | 2015-03-18 | 2021-01-15 | 恩特格里斯公司 | 涂覆有氟退火膜的物件 |
| US9790582B2 (en) | 2015-04-27 | 2017-10-17 | Lam Research Corporation | Long lifetime thermal spray coating for etching or deposition chamber application |
| US20160379806A1 (en) | 2015-06-25 | 2016-12-29 | Lam Research Corporation | Use of plasma-resistant atomic layer deposition coatings to extend the lifetime of polymer components in etch chambers |
| US20160375515A1 (en) | 2015-06-29 | 2016-12-29 | Lam Research Corporation | Use of atomic layer deposition coatings to protect brazing line against corrosion, erosion, and arcing |
| KR101916872B1 (ko) | 2015-10-15 | 2018-11-08 | 아이원스 주식회사 | 반도체 공정 장비 부품의 코팅층 재생 방법 및 이에 따른 반도체 공정 장비 부품 |
| JP2017092156A (ja) | 2015-11-03 | 2017-05-25 | ナショナル チュン−シャン インスティテュート オブ サイエンス アンド テクノロジー | 高密度のプラズマ及び高温の半導体製造プロセスに用いられる窒化アルミニウムの静電チャンク |
| EP3423610B1 (en) | 2016-03-04 | 2022-05-04 | Beneq OY | A plasma etch-resistant film and a method for its fabrication |
| US11326253B2 (en) * | 2016-04-27 | 2022-05-10 | Applied Materials, Inc. | Atomic layer deposition of protective coatings for semiconductor process chamber components |
| US10186400B2 (en) * | 2017-01-20 | 2019-01-22 | Applied Materials, Inc. | Multi-layer plasma resistant coating by atomic layer deposition |
| US11180847B2 (en) | 2018-12-06 | 2021-11-23 | Applied Materials, Inc. | Atomic layer deposition coatings for high temperature ceramic components |
| US10858741B2 (en) | 2019-03-11 | 2020-12-08 | Applied Materials, Inc. | Plasma resistant multi-layer architecture for high aspect ratio parts |
| KR20230088721A (ko) | 2020-10-15 | 2023-06-20 | 헤레우스 코나믹 노스 아메리카 엘엘씨 | 다층 소결 세라믹체 및 제조 방법 |
| US12439625B2 (en) | 2022-05-23 | 2025-10-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device structure and method for forming the same |
-
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-
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW567584B (en) * | 2000-04-14 | 2003-12-21 | Asm Microchemistry Oy | Process for producing oxide thin films |
| CN1690254A (zh) * | 2004-04-13 | 2005-11-02 | 应用材料有限公司 | 具有含电镀钇涂层的制程腔室构件 |
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| US12049696B2 (en) | 2024-07-30 |
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