TWI752202B - 貼附有支撐體的印刷電路板及該印刷電路板的製造方法 - Google Patents
貼附有支撐體的印刷電路板及該印刷電路板的製造方法 Download PDFInfo
- Publication number
- TWI752202B TWI752202B TW107109783A TW107109783A TWI752202B TW I752202 B TWI752202 B TW I752202B TW 107109783 A TW107109783 A TW 107109783A TW 107109783 A TW107109783 A TW 107109783A TW I752202 B TWI752202 B TW I752202B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- pattern layer
- opening
- conductor pattern
- printed circuit
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 239000010410 layer Substances 0.000 claims description 426
- 239000004020 conductor Substances 0.000 claims description 131
- 229910052751 metal Inorganic materials 0.000 claims description 63
- 239000002184 metal Substances 0.000 claims description 63
- 239000011229 interlayer Substances 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 238000005488 sandblasting Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 description 17
- 239000011888 foil Substances 0.000 description 16
- 239000000654 additive Substances 0.000 description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- 239000000470 constituent Substances 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 8
- 238000007772 electroless plating Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 238000010030 laminating Methods 0.000 description 7
- 230000000996 additive effect Effects 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
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- 239000000126 substance Substances 0.000 description 6
- 101001134276 Homo sapiens S-methyl-5'-thioadenosine phosphorylase Proteins 0.000 description 5
- 102100022050 Protein canopy homolog 2 Human genes 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000012779 reinforcing material Substances 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 230000015654 memory Effects 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
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- 239000011368 organic material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0148943 | 2017-11-09 | ||
| KR1020170148943A KR102450598B1 (ko) | 2017-11-09 | 2017-11-09 | 지지체 부착 인쇄회로기판 및 지지체 부착 인쇄회로기판의 제조방법 |
| ??10-2017-0148943 | 2017-11-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201919450A TW201919450A (zh) | 2019-05-16 |
| TWI752202B true TWI752202B (zh) | 2022-01-11 |
Family
ID=66450129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107109783A TWI752202B (zh) | 2017-11-09 | 2018-03-22 | 貼附有支撐體的印刷電路板及該印刷電路板的製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7088531B2 (ko) |
| KR (1) | KR102450598B1 (ko) |
| CN (1) | CN109769355A (ko) |
| TW (1) | TWI752202B (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114531787A (zh) * | 2020-11-23 | 2022-05-24 | 碁鼎科技秦皇岛有限公司 | 电路板防焊层的制备方法 |
| KR20220151431A (ko) | 2021-05-06 | 2022-11-15 | 삼성전기주식회사 | 인쇄회로기판 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201615685A (zh) * | 2010-08-10 | 2016-05-01 | 日立化成工業股份有限公司 | 樹脂組成物、樹脂硬化物、配線板以及配線板的製造方法 |
| TW201618264A (zh) * | 2014-07-31 | 2016-05-16 | 新光電氣工業股份有限公司 | 支撐構件、導線基板、導線基板的製造方法及半導體封裝體的製造方法 |
| TW201630732A (zh) * | 2014-10-16 | 2016-09-01 | Taiyo Ink Mfg Co Ltd | 層合結構體、乾薄膜及可撓性印刷配線板 |
| CN106098668A (zh) * | 2016-08-15 | 2016-11-09 | 苏州晶方半导体科技股份有限公司 | 半导体芯片封装结构以及封装方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5179920B2 (ja) * | 2008-03-28 | 2013-04-10 | 日本特殊陶業株式会社 | 多層配線基板 |
| KR101103301B1 (ko) | 2009-12-10 | 2012-01-11 | 엘지이노텍 주식회사 | 다층인쇄회로기판 및 그 제조방법 |
| JP6399422B2 (ja) * | 2013-02-15 | 2018-10-03 | パナソニックＩｐマネジメント株式会社 | プリント配線板用材料、プリント配線板用材料の製造方法、プリント配線板の製造方法 |
| JP6637864B2 (ja) * | 2016-09-29 | 2020-01-29 | 新光電気工業株式会社 | キャリア基材付き配線基板、キャリア基材付き配線基板の製造方法 |
-
2017
- 2017-11-09 KR KR1020170148943A patent/KR102450598B1/ko active IP Right Grant
-
2018
- 2018-02-08 CN CN201810128642.8A patent/CN109769355A/zh active Pending
- 2018-02-14 JP JP2018024570A patent/JP7088531B2/ja active Active
- 2018-03-22 TW TW107109783A patent/TWI752202B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201615685A (zh) * | 2010-08-10 | 2016-05-01 | 日立化成工業股份有限公司 | 樹脂組成物、樹脂硬化物、配線板以及配線板的製造方法 |
| TW201618264A (zh) * | 2014-07-31 | 2016-05-16 | 新光電氣工業股份有限公司 | 支撐構件、導線基板、導線基板的製造方法及半導體封裝體的製造方法 |
| TW201630732A (zh) * | 2014-10-16 | 2016-09-01 | Taiyo Ink Mfg Co Ltd | 層合結構體、乾薄膜及可撓性印刷配線板 |
| CN106098668A (zh) * | 2016-08-15 | 2016-11-09 | 苏州晶方半导体科技股份有限公司 | 半导体芯片封装结构以及封装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102450598B1 (ko) | 2022-10-07 |
| TW201919450A (zh) | 2019-05-16 |
| JP2019087717A (ja) | 2019-06-06 |
| CN109769355A (zh) | 2019-05-17 |
| JP7088531B2 (ja) | 2022-06-21 |
| KR20190053007A (ko) | 2019-05-17 |
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