TWI752202B - Support attached printed circuit board and manufacturing method therof - Google Patents

Abstract

A support attached printed circuit board and a manufacturing method are disclosed. The support attached printed circuit board in accordance with an aspect of the present invention includes a substrate part and a support. The substrate part includes a first outer layer conductive pattern layer and a first solder resist layer, which is formed on the first outer layer conductive pattern layer and formed with a first opening exposing at least a portion of the first outer layer conductive pattern layer, and the support includes a mask pattern layer, which is formed on the first solder resist layer and formed with a second opening connected with the first opening, and a support insulating layer, which is formed on the mask pattern layer and formed with a third opening connected with the second opening. The diameter of each of the first opening and the third opening becomes narrower toward the bottom thereof.

Description

Printed circuit board attached with support and method of manufacturing the same

The present invention relates to a printed circuit board with a support and a manufacturing method of the printed circuit board.

With the thinning and miniaturization of electronic products, the packages applied to the electronic products also tend to be thinned and miniaturized. For example, with the thinning and miniaturization of mobile devices, the thickness of printed circuit boards that encapsulate electronic components such as memories used in mobile devices also tends to be thinned and miniaturized.

When the thickness of the printed circuit board tends to be thinned, the possibility of occurrence of defects in the packaging step increases.

[Prior Art Document] [Patent Document] Korean Patent Publication No. 10-2011-0066044 (2011.06.16)

An object of the present invention is to provide a printed circuit board attached with a support which is easy to handle in the entire packaging step and has an improved packaging yield.

Furthermore, another object of the present invention is to provide a printed circuit board to which a support is attached, which can be electrically inspected before the encapsulation step.

According to an embodiment of the present invention, a printed circuit board with a support body attached includes: a base plate part and a support body attached to the base plate part, wherein the base plate part includes: a first outer conductor pattern layer; a solder resist layer formed on the first outer conductor pattern layer and forming a first opening exposing at least a part of the first outer conductor pattern layer, the support body includes: a mask pattern layer formed on a second opening communicated with the first opening is formed on the first solder resist layer; and a support insulating layer is formed on the mask pattern layer and formed a third opening communicated with the second opening The diameters of the first opening and the third opening become smaller toward the lower part.

According to another embodiment of the present invention, the printed circuit board attached with the support body includes: a solder resist layer formed with openings exposing the pads of the outer conductor pattern layer; a support body formed on the solder resist layer, and a through hole communicating with the opening is formed; and a mask pattern layer is sandwiched between the solder resist layer and the support body, and a through hole is formed to make the opening and the through hole communicate with each other pattern, and at least a part of the surface in contact with the support body is exposed through the through hole.

According to yet another embodiment of the present invention, a manufacturing method of a printed circuit board with a support body attached includes the steps of: forming a conductor pattern layer and an interlayer insulating layer on one side of a carrier substrate; forming the conductor pattern for covering the outermost layer forming a mask pattern layer on the solder mask layer; forming a support insulating layer for covering the mask pattern layer and the solder mask layer; and removing the solder mask layer and the support Each part of the insulating layer forms an opening that exposes a part of the outermost conductor pattern layer.

According to the embodiments of the present invention, it is possible to provide a support-attached printed circuit board that is easy to operate in the entire packaging step and has an improved packaging yield.

Also, according to another embodiment of the present invention, it is possible to provide a support-attached printed circuit board that can be electrically inspected before the encapsulation step.

The terms used in this application are only used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless there is a clear different meaning in the context of the article. It should be understood that in this application, terms such as "comprising" or "having" are used to refer to the existence of features, numbers, steps, operations, constituent elements, components or combinations thereof described in the specification, and do not preclude a or the presence or addition of more other features or numbers, steps, operations, constituent elements, components, or combinations thereof. In addition, in the whole specification, "on" means to be positioned above or below the target portion, and does not necessarily mean that the target portion must be positioned on the upper side with reference to the direction of gravity.

In addition, the so-called combination, in the contact relationship between the respective constituent elements, not only means that the respective constituent elements are in direct physical contact with each other, but is also used to cover the case where other constituent elements are sandwiched between the respective constituent elements. between elements, so that the constituent elements are in contact with the other constituents, respectively.

The sizes and thicknesses of the respective constituent elements shown in the drawings are arbitrarily represented for convenience of description, and the present invention is not necessarily limited to the illustrated ones.

Hereinafter, embodiments of the printed circuit board attached with a support body and its manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings. During the description with reference to the accompanying drawings, the same or corresponding components are assigned the same drawings as the same drawings. symbols, and omitting repetitive descriptions related to them.

Printed circuit board with support attached

(first embodiment)

FIG. 1 is a view showing a printed circuit board to which a support is attached according to a first embodiment of the present invention.

Referring to FIG. 1 , a printed circuit board 1000 attached with a support body according to the first embodiment of the present invention includes a substrate part 100 and a support body 200 . The substrate portion 100 may include a first outer conductor pattern layer 11 and a first solder resist layer 21 , and may further include a second outer conductor pattern layer 12 , an interlayer insulating layer 30 and a second solder resist layer 22 . The support body 200 includes a mask pattern layer 210 and a support insulating layer 220 .

The substrate portion 100 may be a general packaging printed circuit board. The substrate portion 100 may be a printed circuit board manufactured by a coreless process, but is not limited thereto.

The first outer conductor pattern layer 11 includes at least one of via pads, signal patterns, power patterns, ground patterns, and solder pads.

The first outer conductor pattern layer 11 can be made of copper (Cu), silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), platinum ( Pt) and so on.

The first solder resist layer 21 is formed on the first outer conductor pattern layer 11 , and a first opening 310 exposing at least a part of the first outer conductor pattern layer 11 is formed in the first solder resist layer 21 .

The first solder resist layer 21 may be formed by laminating solder resist films.

The first solder resist layer 21 can be formed using a photosensitive solder resist film, but is not limited thereto. That is, unlike the usual case, the first opening 310 of the present invention is not formed by a lithography step, so the first solder resist layer 21 does not have to include a photosensitive insulating substance. For example, the first solder resist layer 21 may also be formed using a thermosetting solder resist film in which an inorganic filler is dispersed in a thermosetting insulating resin. The method for forming the first opening 310 will be described later.

The first opening 310 exposes at least a portion of the bonding pad of the first outer conductor pattern layer 11 . Although the form of the solder pad is shown as a Solder Mask Defined (SMD: Solder Mask Defined) type in FIG. 1 and the like, the solder pad may be of a Non Solder Mask Defined (NSMD: Non Solder Mask Defined) type. . That is, the first opening 310 may be formed in a form in which the entirety of any one of the bonding pads of the first outer conductor pattern layer 11 is exposed.

The diameter of the first opening 310 may be smaller toward the lower portion. That is, the diameter of the first opening 310 may gradually decrease in the direction from the outer side of the substrate portion 100 toward the center in the thickness direction of the substrate portion 100 .

When the support body 200 described later is separated from the substrate portion 100 , solder may be formed in the first opening 310 so that the solder is formed on the bonding pads of the first outer conductor pattern layer 11 .

The support body 200 is attached to the substrate portion 100 . The support body 200 includes a mask pattern layer 210 and a support insulating layer 220 . After electronic components such as a memory are packaged into the substrate portion 100 of the printed circuit board 1000 to which the supporting body is attached according to the present embodiment, the supporting body 200 is removed from the substrate portion 100 .

The mask pattern layer 210 is formed on the first solder resist layer 21 , and a second opening 320 communicating with the first opening 310 is formed in the mask pattern layer 210 . The second opening 320 penetrates through the mask pattern layer 210 .

When the first opening 310 is formed in the first solder resist layer 21 , the mask pattern layer 210 functions as a mask. That is, the patterned form of the mask pattern layer 210 is transferred to the first solder resist layer 21 . Finally, the numbers of the first openings 310 and the second openings 320 are the same, and the first openings 310 and the second openings 320 communicate with each other.

The mask pattern layer 210 includes: a first metal layer 211 , which is in contact with the first solder resist layer 21 ; and a second metal layer 212 , which is formed on the first metal layer 211 . The first metal layer 211 and the second metal layer 212 may respectively include copper. For example, the first metal layer 211 and the second metal layer 212 may be formed of copper foil, respectively.

The thicknesses of the first metal layer 211 and the second metal layer 212 may be different from each other, but are not limited thereto. The respective low rough surfaces (Shiny surfaces) of the first metal layer 211 and the second metal layer 212 may be in contact with each other, so that separation can easily occur at the interface between each other, but it is not limited thereto.

For the present embodiment, the support body 200 can be removed from the substrate portion 100 by separation at the interface between the first metal layer 211 and the second metal layer 212 .

Here, the first metal layer 211 may include nickel (Ni) or titanium (Ti). For example, the first metal layer 211 may be formed using nickel foil (Nickel Foil), and the second metal layer 212 may be formed using copper foil (Copper Foil). In this case, since the first outer conductor pattern layer 11 and the first metal layer 211 include different metal substances, the first metal layer remaining on the first solder resist layer 21 is removed by etching after the support body 200 is removed. At 211, the first outer conductor pattern layer 11 is not affected.

The supporting insulating layer 220 is formed on the mask pattern layer 210 , and a third opening 330 communicating with the second opening 320 is formed in the supporting insulating layer 220 . The third opening 330 penetrates through the support insulating layer 220 .

The support insulating layer 220 supports the substrate portion 100 . Therefore, it can be easily handled during the step of packaging the support-attached printed circuit board 1000 according to the present embodiment. Also, even if an external impact is applied during the encapsulation step, the support insulating layer 220 can prevent the substrate portion 100 from being deformed.

The support insulating layer 220 may include insulating resin such as epoxy resin. Also, the support insulating layer 220 may include a reinforcing material contained in the insulating resin. The reinforcing material can be at least any one of glass cloth, glass fiber, inorganic filler and organic filler. The reinforcing material can enhance the rigidity of the support insulating layer 220 and reduce the thermal expansion coefficient.

The third opening 330 communicates with the second opening 320 . The first opening 310 , the second opening 320 and the third opening 330 communicate with each other to form an opening portion 300 . At least a part of the first outer conductor pattern layer 11 is exposed to the outside through the opening portion 300 .

The third opening 330 communicates with the second opening 320 through a Blast step. That is, the abrasive particles form the third opening 330 in the supporting insulating layer 220 , and form the first opening 310 in the first solder resist layer 21 through the pre-formed second opening 320 .

When the third openings 330 are formed in the supporting insulating layer 220 through the sandblasting step, the resist pattern layer 230 serving as a mask may be formed on the supporting insulating layer 220 . The resist pattern layer 230 is formed with a fourth opening 340 which penetrates through the resist pattern layer 230 and communicates with the third opening 330 .

The third opening 330 may expose at least a part of a side of the mask pattern layer 210 in contact with the support insulating layer 220 . In the sandblasting step, the etching speed of the mask pattern layer 210 including the metal material and the support insulating layer 220 including the organic material may be different. Therefore, one side of the mask pattern layer 210 may be exposed through the third opening 330 .

The diameter of the third opening 330 may be smaller toward the lower portion. That is, the diameter of the third opening 330 may gradually decrease in the direction from the outer side of the substrate portion 100 toward the center in the thickness direction of the substrate portion 100 .

According to this embodiment, at least a part of the first outer conductor pattern layer 11 of the substrate portion 100 is exposed to the outside through the first opening 310 , the second opening 320 , the third opening 330 and the fourth opening 340 . Therefore, the support body 200 can support the substrate portion 100 while realizing the electrical inspection of the substrate portion 100 .

The second outer conductor pattern layer 12 is formed under the first outer conductor pattern layer 11 . The second outer conductor pattern layer 12 constitutes the outermost conductor pattern layer of the substrate portion 100 together with the first outer conductor pattern layer 11 .

The second outer conductor pattern layer 12 includes at least one of via pads, signal patterns, power patterns, ground patterns, and solder pads.

Copper (Cu), silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), platinum ( Pt) and so on.

In the packaging step, electronic components such as a memory or an application processor (AP: Application Processor) may be arranged on the second outer conductor pattern layer 12 . The second outer conductor pattern layer 12 and the electronic component may be bonded by wire bonding or flip chip bonding.

Compared with the first outer conductor pattern layer 11 , the second outer conductor pattern layer 12 can be formed to have a smaller line width and a smaller pitch.

The interlayer insulating layer 30 is formed between the first outer conductor pattern layer 11 and the second outer conductor pattern layer 12 .

The interlayer insulating layer 30 may include insulating resin such as epoxy resin. The interlayer insulating layer 30 may be a photosensitive insulating layer including a photosensitive insulating resin.

The interlayer insulating layer 30 may include a reinforcing material contained in an insulating resin. The reinforcing material can be at least one of glass cloth, glass fiber, inorganic filler and organic filler.

The interlayer insulating layer 30 may be formed in plural. When a plurality of interlayer insulating layers 30 are formed, inner conductor pattern layers 40 may be formed between adjacent interlayer insulating layers 30 . According to the number of the interlayer insulating layers 30 formed on the substrate portion 100 , the inner conductor pattern layer 40 may be formed in a single or a plurality of layers.

The inner conductor pattern layer 40 includes at least one of via pads, signal patterns, power patterns, and ground patterns. For the inner conductor pattern layer 40 , copper (Cu), silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), and platinum (Pt) having excellent electrical properties can be used. ) and so on.

The second solder resist layer 22 is formed on the second outer conductor pattern layer 12 so as to cover the second outer conductor pattern layer 12 .

The second solder resist layer 22 may be formed with an opening O exposing at least a portion of the second outer conductor pattern layer 12 .

Although the form of the solder pad is shown as a Solder Mask Defined (SMD: Solder Mask Defined) type in FIG. 1 and the like, the solder pad may be of a Non Solder Mask Defined (NSMD: Non Solder Mask Defined) type. . That is, the opening O may be formed to expose the entirety of any one of the bonding pads of the second outer conductor pattern layer 12 .

Reference numeral V1 marked in FIG. 1 is a via hole for interlayer connection between the first outer conductor pattern layer 11 and the inner conductor pattern layer 40, and reference numeral V2 is a via for connecting the second outer conductor pattern layer 12 to the inner conductor pattern layer 40. A via hole for interlayer connection of the inner conductor pattern layer 40 .

Therefore, for the printed circuit board 1000 to which the supporting body is attached according to the present embodiment, the substrate portion 100 may be supported by the supporting body 200 during the encapsulation step. Therefore, the substrate portion 100 can be handled more easily. Also, the substrate portion 100 can be prevented from being deformed during the encapsulation step. Also, since the first outer conductor pattern layer 11 of the substrate portion 100 is exposed through the first opening 310 , the second opening 320 , the third opening 330 and the fourth opening 340 , it is possible to check whether the substrate portion 100 is defective or not before the encapsulation step. Conduct electrical inspection.

(Second Embodiment)

FIG. 2 is a diagram illustrating a printed circuit board to which a support is attached according to a second embodiment of the present invention.

For the printed circuit board 2000 with a support attached to the present embodiment, compared with the printed circuit board with a support attached to the printed circuit board 1000 according to the first embodiment of the present invention, the difference lies in the second outer conductor pattern layer 12. The following description will focus on this.

The second outer conductor pattern layer 12 may be buried in the interlayer insulating layer 30 , and one side of the second outer conductor pattern layer 12 may be exposed to the side of the interlayer insulating layer 30 . That is, with reference to FIG. 2 , the second outer conductor pattern layer 12 may be embedded in the interlayer insulating layer 30 formed on the outermost layer so that the lower surface is exposed to the lower surface of the outermost interlayer insulating layer 30 .

At this time, grooves may be formed on one surface of the second outer conductor pattern layer 12 .

Also, the flatness of the second outer conductor pattern layer 12 may be higher than that of the first outer conductor pattern layer 11 . Here, the flatness may refer to: with reference to FIG. 2 , the degree of dispersion in height between the lower surfaces of the second outer conductor pattern layer 12 is lower than the degree of dispersion in height between the upper surfaces of the first outer conductor pattern layer 11 .

The features of the support-attached printed circuit board 2000 of the present embodiment described above are attributed to the manufacturing method of the present invention for manufacturing the substrate portion 100 using the carrier substrate (C of FIG. 5 ).

That is, the second outer conductor pattern layer 12 is first formed on one side of the carrier substrate instead of the interlayer insulating layer 30, so that when the carrier substrate is removed, one side of the second outer conductor pattern layer 12 is exposed to the outermost interlayer insulating layer 30 side. In addition, when the carrier substrate is removed, the ultra-thin copper foil of the carrier substrate remains on the substrate portion, and when the ultra-thin copper foil is removed by etching, a part of the second outer conductor pattern layer 12 is also removed, so that the second outer conductor pattern One side of layer 12 may form grooves. In addition, in the manufacturing step, since the second outer conductor pattern layer 12 is formed first, and then the first outer conductor pattern layer 11 is formed, the flatness of the second outer conductor pattern layer 12 can be higher than the first outer conductor pattern layer 12 which has accumulated process errors and other variables. A flatness of the outer conductor pattern layer 11 .

(third embodiment)

3 is a diagram illustrating a printed circuit board to which a support is attached according to a third embodiment of the present invention.

For the printed circuit board 3000 with the support attached to the present embodiment, compared with the printed circuit board 1000 with the support attached according to the first embodiment of the present invention, the difference lies in the mask pattern layer 210, Hereinafter, the explanation will be made focusing on this.

The mask pattern layer 210 applied in this embodiment further includes a release layer 213 sandwiched between the first metal layer 211 and the second metal layer 212 .

In the process of removing the support body 200 from the substrate part 100 , the release layer 213 may be formed of a non-adhesive substance for easy separation. That is, for the printed circuit board 3000 with the support attached to the present embodiment, different from the printed circuit board 1000 with the support attached in the first embodiment, between the first metal layer 211 and the release layer 213 The interface between them is separated.

The release layer 213 can be made of phenolic resin, urea resin, melamine resin, epoxy resin, polyester resin.

(Fourth Embodiment)

4 is a diagram illustrating a printed circuit board to which a support is attached according to a fourth embodiment of the present invention.

For the printed circuit board 4000 with the support attached to the present embodiment, compared with the printed circuit board 1000 with the support attached according to the first embodiment of the present invention, the difference lies in the mask pattern layer 210, Hereinafter, the explanation will be made focusing on this.

The mask pattern layer 210 includes: a release layer 213 , which is in contact with the first solder resist layer 21 ; and a metal layer 214 , which is formed on the release layer 213 .

Therefore, in this embodiment, when the support body 200 and the substrate portion 100 are separated, the separation can be performed at the interface between the first solder resist layer 21 and the release layer 213 .

Finally, unlike the first embodiment, in the present embodiment, the step of removing a part of the support body 200 remaining on the substrate portion 100 is not required after separating the support body 200 .

The description of the release layer 213 , the first metal layer 211 and the second metal layer 212 in the first to third embodiments can be directly adopted for the release layer 213 and the metal layer 214 applied to this embodiment.

Manufacturing method of printed circuit board with support

5 to 12 are diagrams sequentially illustrating a method of manufacturing a printed circuit board to which a support is attached according to an embodiment of the present invention.

According to an embodiment of the present invention, the manufacturing method of the printed circuit board with the support attached may include the following steps: forming a conductor pattern layer and an interlayer insulating layer on one side of the carrier substrate; forming a conductor pattern layer for covering the outermost layer. Solder resist layer; forming a mask pattern layer on the solder resist layer; forming a support insulating layer for covering the mask pattern layer and the solder resist layer; A part of the exposed opening of the conductor pattern layer may further include a step of removing the carrier substrate.

Referring to FIG. 5 , a first interlayer insulating layer and a first conductor pattern layer are sequentially formed on one surface of the carrier substrate.

The carrier substrate C may be a common auxiliary material used in coreless manufacturing. That is, the carrier substrate C may include: the support core S; the carrier metal foil CF2 formed on both sides of the support core S; and the ultra-thin metal foil CF1 formed on the carrier metal foil CF2.

The first interlayer insulating layer 30 can be formed by laminating a photosensitive insulating film on the carrier substrate C. As shown in FIG. In addition, the first interlayer insulating layer 30 can be formed by laminating a build-up insulating film such as an Ajinomoto Build-up Film (ABF: Ajinomoto Build-up Film) on the carrier substrate C. As shown in FIG. When the first interlayer insulating layer 30 in this step is formed of a photosensitive insulating film, it is possible to form a via hole for interlayer connection between the first conductor pattern layer and the third conductor pattern layer, which will be described later, by a lithography step. through-hole formation step.

The first conductor pattern layer 40 is formed on one surface of the first interlayer insulating layer 30 laminated on the carrier substrate C. As shown in FIG. The first conductor pattern layer 40 may be formed by any one of a semi-additive process (SAP: Semi Additive Process), a modified semi-additive process (MSAP: Modified Semi Additive Process), and a subtractive process (Subtractive Process).

In the case where the first conductor pattern layer 40 is formed by the SAP process, in this step, the first conductor pattern layer 40 may be formed to include an electroless plating layer formed on the first interlayer insulating layer 30 and an electroless plating layer formed on the electroless The structure of the electrolytic plating layer of the plating layer. In the case where the first conductor pattern layer 40 is formed by the MSAP process, in this step, the first conductor pattern layer 40 may be formed to include a metal foil formed on the first interlayer insulating layer 30 and an electrolytic electrode formed on the metal foil Structure of the plating layer.

The first conductor pattern layer 40 and the first interlayer insulating layer 30 are respectively equivalent to the inner conductor pattern layer 40 and the outermost interlayer insulating layer of the printed circuit board 1000 with the support according to the first embodiment of the present invention. Layer 30.

Next, referring to FIG. 6 , a second interlayer insulating layer and a second conductor pattern layer are sequentially formed.

The second interlayer insulating layer 30 can be formed by laminating photosensitive insulating films. Also, the second interlayer insulating layer 30 can be formed by laminating a build-up insulating film such as an Ajinomoto Build-up Film (ABF: Ajinomoto Build-up Film).

The second conductor pattern layer 11 is formed on one side of the second interlayer insulating layer 30 . The second conductor pattern layer 11 can be formed by any one of a semi-additive process (SAP: Semi Additive Process), a modified semi-additive process (MSAP: Modified Semi Additive Process), and a subtractive process (Subtractive Process).

In the case where the second conductor pattern layer 11 is formed by the SAP process, the second conductor pattern layer 11 may be formed to include an electroless plating layer formed on the second interlayer insulating layer 30 and an electrolytic plating layer formed on the electroless plating layer The structure of the cladding. In the case where the second conductor pattern layer 11 is formed by the MSAP process, the second conductor pattern layer 11 may be formed to include a metal foil formed on the second interlayer insulating layer 30 , an electroless plating layer formed on the metal foil, and a metal foil formed on the metal foil. The structure of the electrolytic plating layer of the electroless plating layer.

In addition, in the step of forming the second conductor pattern layer 11 , the first via hole V1 for interlayer connection between the first conductor pattern layer 40 and the second conductor pattern layer 11 may be formed together with the second conductor pattern layer 11 .

The first via hole V1 can be formed by forming a first through hole in the second interlayer insulating layer 30 by laser drilling, and sequentially forming an electroless plating layer and an electrolytic plating layer in the first through hole. In the case where the second interlayer insulating layer 30 includes a photosensitive substance, the first through hole may be formed through a lithography step.

The second conductor pattern layer 11 and the second interlayer insulating layer 30 are respectively equivalent to the first outer conductor pattern layer 11 and the outermost interlayer insulating layer of the printed circuit board 1000 with the support attached according to the first embodiment of the present invention, respectively. Layer 30.

Next, referring to FIG. 7 , a first solder resist layer is formed so as to cover the second conductor pattern layer.

The first solder resist layer 21 can be formed by laminating a solder resist film on the second interlayer insulating layer 30 . The first solder resist layer 21 may include a photosensitive substance, but is not limited thereto.

Next, referring to FIG. 8 , a mask pattern layer is formed on the first solder resist layer.

The mask pattern layer 210 can be formed by: after laminating the material 210 ′ for forming the mask pattern layer on the first solder resist layer 21 , forming a second opening through the material 210 ′ for forming the mask pattern layer 320.

The material 210 ′ for forming the mask pattern layer may be a structure including the first metal layer 211 and the second metal layer 212 described for the printed circuit board 1000 with the support attached according to the first embodiment of the present invention . In this case, the material 210 ′ for forming the mask pattern layer is laminated so that the first metal layer 211 is in contact with the first solder resist layer 21 . Also, the material 210 ′ for forming the mask pattern layer may include the first metal layer 211 , the second metal layer 212 , and The structure of the release layer 213 . In this case, the material 210 ′ for forming the mask pattern layer is laminated so that the first metal layer 211 is in contact with the first solder resist layer 21 . Also, the material 210 ′ for forming the mask pattern layer may be a structure including the release layer 213 and the metal layer 214 described for the printed circuit board 4000 with the support attached according to the fourth embodiment of the present invention. In this case, the material 210 ′ for forming the mask pattern layer is laminated so that the release layer 213 is in contact with the first solder resist layer 21 .

The second opening 320 formed in the mask pattern layer 210 may be formed by forming a resist pattern ( etching resist pattern), and contact the etching solution to the material 210 ′ for forming the mask pattern layer through the opening formed in the resist pattern.

The second openings 320 are formed in the mask pattern layer 210 corresponding to the positions where the first openings 310 are to be formed in the first solder resist layer 21 .

The material 210 ′ for forming the mask pattern layer may be laminated on the carrier substrate C at the same time as the first solder resist layer 21 is laminated, or the first solder resist layer 21 may be laminated on the carrier substrate C and then laminated on the first solder resist layer. Layer 21.

Next, referring to FIG. 9 , a support insulating layer is laminated on the mask pattern layer and the first solder resist layer so as to cover the mask pattern layer.

At this time, the material 230 ′ for forming the resist pattern layer may be laminated together with the supporting insulating layer 220 . Alternatively, after the supporting insulating layer 220 is stacked, the material 230 ′ for forming the resist pattern layer may be stacked.

Next, referring to FIG. 10 , the carrier substrate is removed from the first interlayer insulating layer, and a third conductor pattern layer is formed on the first interlayer insulating layer.

The carrier substrate C can be removed from the first interlayer insulating layer 30 by being separated at the interface between the carrier metal foil CF2 and the ultra-thin metal foil CF1.

After that, the ultra-thin metal foil CF1 remaining on the first interlayer insulating layer 30 is removed by flash etching or half etching. At this time, if the ultra-thin metal foil CF1 and the first conductor pattern layer 40 include the same conductive substance, in this step, a part of the first conductor pattern layer 40 may be removed together with the ultra-thin metal foil CF1. Therefore, grooves may be formed on the side of the first conductor pattern layer 40 exposed to the side of the first interlayer insulating layer 30 .

After that, the third conductor pattern layer 12 is formed on one surface of the first interlayer insulating layer 30 . The third conductor pattern layer 12 can be formed by any one of a semi-additive process (SAP: Semi Additive Process), a modified semi-additive process (MSAP: Modified Semi Additive Process), and a subtractive process (Subtractive Process).

After that, the second solder resist layer 22 exposing at least a part of the third conductor pattern layer 12 is laminated on one side of the first interlayer insulating layer 30 .

The third conductor pattern layer 12 is equivalent to the second outer conductor pattern layer 12 of the above-mentioned printed circuit board 1000 with the support attached according to the first embodiment of the present invention.

Next, referring to FIG. 11 , the material for forming the resist pattern layer is patterned to expose a portion of the supporting insulating layer. That is, in the material 230 ′ for forming the resist pattern layer, the fourth opening 340 is formed by patterning.

Considering the integration with the first opening 310 , the second opening 320 and the third opening 330 , the fourth opening 340 is preferably formed to be larger than the first opening 310 , the second opening 320 and the third opening 330 .

Next, referring to FIG. 12 , the resist pattern layer and the mask pattern layer are used as masks to form a third opening and a first opening in the supporting insulating layer and the first solder resist layer, respectively.

This step can be carried out by a sandblasting step. That is, the abrasive particles grind the supporting insulating layer 220 to form the third openings 330 in the supporting insulating layer 220 , and at this time, the resist pattern layer 230 acts as a mask. In addition, the abrasive particles grind the first solder resist layer 21 exposed through the fourth opening 340 , the third opening 330 and the second opening 320 to form the first opening 310 in the first solder resist layer 21 . At this time, the mask pattern layer 210 functions for the cover.

In addition, different from the above, the third opening 330 and the first opening 310 may also be formed by laser drilling.

One embodiment of the present invention has been described above. However, anyone with ordinary knowledge in any technical field can construct the Various modifications and changes may be made to the present invention by addition, change, deletion, or addition of elements, and these should also be considered to be included in the scope of the patent application of the present invention.

11‧‧‧First outer conductor pattern layer (second conductor pattern layer) 12‧‧‧Second outer conductor pattern layer (third conductor pattern layer) 21‧‧‧First solder resist layer 22‧‧‧Second resister Soldering layer 30‧‧‧Interlayer insulating layer 40‧‧‧Inner conductor pattern layer (first conductor pattern layer) 100‧‧‧Substrate part 200‧‧‧Support body 210‧‧‧Mask pattern layer 210'‧‧‧ Material for forming the mask pattern layer 211‧‧‧First metal layer 212‧‧‧Second metal layer 213‧‧‧Releasable layer 214‧‧‧Metal layer 220‧‧‧Support insulating layer 230‧‧‧Resistance Resist pattern layer 230'‧‧‧Material for forming resist pattern layer 300‧‧‧opening part 310‧‧‧first opening 320‧‧‧second opening 330‧‧‧third opening 340‧‧‧ Fourth openings 1000, 2000, 3000, 4000‧‧‧Printed circuit board with support attached C‧‧‧Carrier substrate CF1‧‧‧Ultra-thin metal foil CF2‧‧‧Carrier metal foil V1, V2‧‧‧pass Hole O‧‧‧Opening

FIG. 1 is a view showing a printed circuit board to which a support is attached according to a first embodiment of the present invention. FIG. 2 is a diagram illustrating a printed circuit board to which a support is attached according to a second embodiment of the present invention. 3 is a diagram illustrating a printed circuit board to which a support is attached according to a third embodiment of the present invention. 4 is a diagram illustrating a printed circuit board to which a support is attached according to a fourth embodiment of the present invention. 5 to 12 are diagrams sequentially illustrating a method of manufacturing a printed circuit board to which a support is attached according to an embodiment of the present invention.

11‧‧‧First outer conductor pattern layer (second conductor pattern layer)

12‧‧‧Second outer conductor pattern layer (third conductor pattern layer)

21‧‧‧First solder mask

22‧‧‧Second solder mask

30‧‧‧Interlayer insulating layer

40‧‧‧Inner conductor pattern layer (first conductor pattern layer)

100‧‧‧Substrate part

200‧‧‧Support

210‧‧‧Mask pattern layer

211‧‧‧First metal layer

212‧‧‧Second metal layer

220‧‧‧Support insulating layer

230‧‧‧Resist pattern layer

300‧‧‧Opening

310‧‧‧First Opening

320‧‧‧Second Opening

330‧‧‧Third opening

340‧‧‧Fourth Opening

1000‧‧‧Printed circuit boards with supports attached

V1, V2‧‧‧via

O‧‧‧Opening

Claims (16)

A printed circuit board attached with a support body, comprising: a base plate part and a support body attached to the base plate part, wherein the base plate part comprises: a first outer conductor pattern layer; A first opening for exposing at least a part of the first outer conductor pattern layer is formed on the first outer conductor pattern layer, and the support body includes: a mask pattern layer formed on the first resistor A second opening communicated with the first opening is formed on the solder layer; and a supporting insulating layer is formed on the mask pattern layer and has a third opening communicated with the second opening, so The respective diameters of the first opening and the third opening become smaller toward the lower part. The printed circuit board attached with a support body according to claim 1, wherein the third opening exposes at least a part of a side of the mask pattern layer in contact with the support insulating layer. The printed circuit board with the support attached to the claim 1, wherein the mask pattern layer comprises: a first metal layer in contact with the first solder resist layer; and a second metal layer , formed on the first metal layer. The printed circuit board attached with the support body according to claim 3, wherein the first metal layer and the second metal layer respectively comprise copper. The printed circuit board attached with a support body according to claim 3, wherein the first metal layer comprises nickel or titanium. The printed circuit board with the support attached to the claim 3, wherein the mask pattern layer further comprises: a release layer sandwiched between the first metal layer and the second metal layer between. The printed circuit board with the support attached to the claim 1, wherein the mask pattern layer comprises: a release layer, in contact with the first solder resist layer; and a metal layer, formed on on the release layer. The printed circuit board with the support attached to the claim 1, wherein the substrate portion further comprises: a second outer conductor pattern layer formed on the lower portion of the first outer conductor pattern layer; and An interlayer insulating layer is formed between the first outer conductor pattern layer and the second outer conductor pattern layer. The printed circuit board attached with a support body according to claim 8, wherein the flatness of the second outer conductor pattern layer is higher than the flatness of the first outer conductor pattern layer. The support-attached printed circuit board according to claim 8, wherein the second outer conductor pattern layer is embedded in the interlayer insulating layer, and one side of the second outer conductor pattern layer is exposed on one side of the interlayer insulating layer. The printed circuit board attached with the support body according to the claim 8, wherein the substrate portion further comprises: a second solder resist layer formed on the second outer conductor pattern layer in a manner of covering the second outer conductor pattern layer. on the second outer conductor pattern layer. A printed circuit board attached with a support body, comprising: a solder resist layer formed with openings exposing pads of an outer conductor pattern layer; a support body formed on the solder resist layer and formed with the openings connected through holes; and a mask pattern layer sandwiched between the solder resist layer and the support, and formed with a through pattern that communicates the opening and the through hole, and is connected to the support At least a portion of the body-contacting side is exposed through the through hole. A manufacturing method of a printed circuit board attached with a support body, comprising the steps of: forming a conductor pattern layer and an interlayer insulating layer on one side of a carrier substrate; forming a solder resist layer for covering the outermost layer of the conductor pattern layer; forming a mask pattern layer on the solder resist layer; forming a supporting insulating layer for covering the mask pattern layer and the solder resist layer; and removing a part of each of the solder resist layer and the supporting insulating layer to An opening portion exposing a part of the outermost conductor pattern layer is formed. The method for manufacturing a printed circuit board with a support attached as claimed in claim 13, wherein, after the step of forming the support insulating layer, the step of removing the carrier substrate is further included. The method for manufacturing a printed circuit board with a supporting body as claimed in claim 13, wherein the opening comprises: a first opening formed in the solder resist layer; a second opening formed in the the mask pattern layer communicates with the first opening; and a third opening is formed on the support insulating layer and communicates with the second opening and exposes at least a part of the mask pattern layer. The method for manufacturing a printed circuit board to which a support is attached according to claim 15, wherein, in the step of forming the opening, the first opening and the third opening connect the cover to the cover. The screen pattern layer is used as a mask and is formed by sandblasting.

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