KR101547755B1 - Printed circuit board substrate having metal post and the method of manufacturing the same - Google Patents

Abstract

A method of manufacturing a PCB according to an embodiment includes the steps of: preparing a main circuit board which includes at least one circuit pattern layer and an insulating layer which insulates the circuit pattern layer, and has a contact pad exposed by an uppermost insulating pattern; forming a metal post on a preliminary substrate; and bonding the metal post on the preliminary substrate to the contact pad on the main circuit board.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed circuit board having a metal post and a method of manufacturing the same,

The present invention relates to a printed circuit board, and more particularly, to a printed circuit board having a metal post and a method of manufacturing the same.

Electronic devices employed in electronic devices include a variety of active and passive circuit components, which may be integrated into semiconductor chips or dies. In addition, the semiconductor chip or die may be provided in the form of an electronic package mounted on a substrate including a circuit wiring such as a printed circuit board (PCB).

On the other hand, when a semiconductor chip is mounted on a printed circuit board and electrically connected, a flip chip connection structure using a connection structure is widely applied to an electronic package. For example, a flip chip connection structure using a bump is advantageous for realizing a laminated structure of various types of semiconductor chips. In addition, the flip chip connection structure is easy to employ a plurality of connection structures in order to secure a large number of input / output (I / O) terminals.

A solder-on-pad (SOP) method is a method of forming such a connection structure. The SOP method is a method in which a solder ball is printed on a connection pad on a top surface of a printed circuit board exposed by a solder mask pattern or a solder ball in a ball shape and then reflowed to form a spherical solder ball Thereby fabricating a connection structure. However, as the degree of integration of the semiconductor chip increases, the size of the semiconductor chip becomes smaller, and there is a problem in that a limitation is imposed on implementing a connection member having a fine pitch by the SOP method.

Recently, a method of introducing a copper post into a connecting member has been proposed. A method of applying a copper post is a method of selectively forming a copper post on a printed circuit board by an electroplating method, and it is relatively easy to implement a fine pitch as compared with a conventional SOP method. Such a method of producing a copper post is disclosed in Korean Patent Publication No. 10-2013-0131849.

SUMMARY OF THE INVENTION The present invention provides a method of simplifying a process in the manufacture of a copper post.

SUMMARY OF THE INVENTION The present invention provides a method of suppressing copper post shape defects and copper post alignment defects caused by a multiple plating process in the production of copper posts.

It is an object of the present invention to provide a method for easily controlling the height of a metal post in the production of a copper post.

A method of manufacturing a printed circuit board having a metal post along one side is disclosed. In the method of manufacturing the printed circuit board, a main circuit board is provided, which has at least one circuit pattern layer and an insulating layer that insulates the circuit pattern layer from each other, and the connection pad is exposed by the uppermost insulating pattern. A metal post is formed on the preliminary substrate. The metal posts on the preliminary substrate are bonded to the connection pads on the main circuit board.

A method of manufacturing a printed circuit board having a metal post according to another aspect is disclosed. In the method of manufacturing the printed circuit board, a main circuit board is provided, which has at least one circuit pattern layer and an insulating layer that insulates the circuit pattern layer from each other, and the connection pad is exposed by the uppermost insulating pattern. Thereby forming a connection structure including a metal post and a solder pattern layer which are sequentially stacked on the preliminary substrate. The connection structure and the connection pad are arranged so as to be adjacent to each other. The solder pattern layer is reflowed to bond the metal posts to the connection pads.

A method of manufacturing a printed circuit board having a metal post according to another aspect is disclosed. In the method of manufacturing the printed circuit board, a main circuit board is provided, which has at least one circuit pattern layer and an insulating layer that insulates the circuit pattern layer from each other, and the connection pad is exposed by the uppermost insulating pattern. A connection structure including a metal post is formed on the preliminary substrate. And a solder pattern layer is formed on the connection pad. The connection structure and the solder pattern layer are arranged so as to be adjacent to each other. The solder pattern layer is reflowed to bond the metal posts to the connection pads.

A printed circuit board having a metal post on another side is disclosed. The printed circuit board includes at least one circuit pattern layer and a main circuit board having a connection pad corresponding to the uppermost layer of the circuit pattern layer and selectively exposed by an insulation pattern. The printed circuit board includes a solder layer disposed on the connection pads and a metal post disposed on the solder layer as a connection means with an external device.

According to one embodiment of the present invention, a copper post is fabricated on a separate planar spare substrate and bonded to the main circuit substrate using solder joints. By fabricating the copper posts in advance on the preliminary substrate other than the patterned structure, the copper posts can be manufactured to have a uniform fine pitch and height.

According to an embodiment of the present invention, since the formation of the dry film pattern and the copper plating process do not proceed directly on the main circuit board, it is possible to reduce the defect of the copper post pattern due to the residue of the dry film pattern have.

According to an embodiment of the present invention, a solder layer for bonding may be interposed between the copper posts and the connection pads of the main circuit board. The bonding process using the solder layer can simplify the manufacturing process by replacing the process of manufacturing the copper post layer, which has been duplicated by the conventional dry film pattern formation and plating process.

1A to 1C are cross-sectional views schematically showing a dual plating process for producing a copper post as a comparative example.
2 is a flowchart schematically showing a method of manufacturing a printed circuit board having a metal post according to an embodiment of the present invention.
3A to 3K are cross-sectional views schematically showing a method of manufacturing a printed circuit board having a metal post according to a first embodiment of the present invention.
4A to 4F are cross-sectional views schematically showing a method of manufacturing a printed circuit board having a metal post according to a second embodiment of the present invention.
5 is a cross-sectional view schematically showing a printed circuit board having a copper post manufactured according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. However, the present disclosure may be embodied in many different forms and is not limited to the embodiments described herein. In the drawings, the width, thickness, and the like of the components are enlarged in order to clearly illustrate the components of each device. It is to be understood that when an element is described as being located on another element, it is meant that the element is directly on top of the other element or that additional elements can be interposed between the elements .

Like numbers refer to like elements throughout the several views. It is to be understood that the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise, and the terms "comprise" Or combinations thereof, and does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Further, in carrying out the method or the manufacturing method, the respective steps of the method may take place differently from the stated order unless clearly specified in the context. That is, each process may occur in the same order as described, may be performed substantially concurrently, and may not be excluded in some cases in the reverse order.

The present invention relates to a printed circuit board having a metal post and a solder layer disposed adjacent to the metal post and a method of manufacturing the same. As described above, the industry is demanding that when applying a copper post to a connecting member in accordance with a finer requirement of a connecting member, the copper post has a finer pitch and an increased height. At this time, in order to increase the height of the copper post, the plating process is carried out twice, complicating the process.

1A to 1C are cross-sectional views schematically showing a dual plating process for producing a copper post as a comparative example. The comparative example of Figs. 1A to 1C is a method conventionally applied by the inventor, and has a process weakness in comparison with the embodiments of the present invention described later. Referring to FIG. 1A, a connection pad layer 12 is formed on a laminated substrate 11 having at least one circuit pattern layer (not shown). A solder resist pattern layer 13 is formed on the connection pad layer 12 to expose a part of the connection pad layer 12. The first dry film pattern 15 is formed on the solder resist pattern layer 13 and the first dry film pattern 15 is formed on the connection pad layer 12 exposed in the space between the first dry film patterns 15 by copper plating, Thereby forming a post 14. When the copper plating process is performed, the connection pad layer 12 may be applied as a plating seed layer. After the first copper posts 14 are formed, the first dry film pattern 15 can be removed.

Referring to FIG. 1B, a second dry film pattern 17 is formed on the solder resist pattern layer 13 where the first copper posts 14 are formed. The second copper posts 16 are formed on the first copper posts 14 exposed through the second dry film patterns 17 by copper plating. When the copper plating process is performed, the first copper posts 14 may be applied as a plating seed layer.

Referring to FIG. 1C, the second dry film pattern 17 is removed from the laminated substrate 11. As shown in FIG. As a result, the copper posts 10 electrically connected to the connection pads 12 can be manufactured on the laminated substrate 11. The final height of the copper posts 10 is greater than the height h1 of the first copper posts 14 and the height of the second copper posts 14 And the height (h2) of the second copper post (16).

On the other hand, in the case of the copper post 10 described above, since the final copper post is manufactured through the above-described double plating process, the process becomes complicated and the manufacturing cost may increase. The copper posts 10 can have different widths W1 and W2 along the height direction, as shown in Fig. 3, since it is not easy to precisely align the first resist pattern 15 and the second resist pattern 17 have. As a result, the structural stability of the copper post 10 may be at risk. In addition, when the copper posts 10 are formed, the process of forming and removing the resist pattern is repeated, so that a portion of the unremoved resist pattern may act as an obstacle in subsequent copper plating, thereby causing plating defects .

Hereinafter, a method of manufacturing a copper post which overcomes the disadvantages of the above-described comparative example is presented.

2 is a flowchart schematically showing a method of manufacturing a printed circuit board having a metal post according to an embodiment of the present invention. The metal post is an example of a copper post, but does not exclude a post of another material.

Referring to FIG. 2, first, in a block 210, a main circuit board is prepared, which has at least one circuit pattern layer and an insulating layer that insulates the circuit pattern layer from each other, and the connection pad is exposed by the uppermost layer insulating pattern. The main circuit board includes a plurality of inner layer circuit patterns, and the outer layer circuit pattern may be provided on the uppermost layer. The connection pad may correspond to a part of the outer layer circuit pattern. The uppermost layer insulating pattern may be formed to cover the remaining outer layer circuit pattern portion except for the conductive layer which needs to be exposed to the outside such as the connection pad.

At block 220, a metal post is formed on the preliminary substrate. The preliminary substrate may be a flat substrate without a pattern structure. As an example, the preliminary substrate may be an insulating substrate including a copper seed layer. The metal posts can be formed by forming a copper pattern layer by plating on the insulating substrate using the copper seed layer.

At 230 blocks, the metal posts on the preliminary substrate are bonded to the connection pads on the main circuit board. As an embodiment of the bonding method, first, a solder pattern layer is formed on the metal post, and the solder pattern layer and the connection pad are arranged so as to be adjacent to each other. Then, the solder pattern layer may be reflowed to bond the metal posts to the connection pads.

As another embodiment of the bonding method, first, a solder pattern layer is formed on the connection pad on the main circuit board. Subsequently, the metal posts and the solder pattern layer are arranged so as to be adjacent to each other. The solder pattern layer may be reflowed to bond the metal posts to the connection pads.

The metal posts may be formed on the main circuit board by separating and removing the preliminary substrate after bonding the metal posts and the connection pads.

By the above-described method, a printed circuit board having a metal post can be manufactured. The manufacturing method according to the embodiment of the present invention employs a method of previously manufacturing the copper posts on the preliminary substrate of a flat structure rather than the pattern structure and bonding the copper posts to the main circuit board. Through this, the copper posts can be manufactured to have a uniform fine pitch and height. At this time, the height of the copper post can be relatively easily controlled.

The manufacturing method according to the embodiment of the present invention does not proceed directly with the formation of the dry film pattern and the plating process for producing the metal posts on the laminated circuit board to reduce the defects of the metal post pattern caused by the residue of the dry film pattern . In the manufacturing method according to the embodiment of the present invention, a solder layer for bonding may be interposed between the metal posts and the connection pads of the printed circuit board. The bonding process using the solder layer can simplify the manufacturing process by replacing the process of manufacturing the metal post layer, which has been duplicated by the conventional dry film pattern formation and plating process.

Hereinafter, each step of the method for manufacturing a printed circuit board having the metal posts according to the embodiment of the present invention will be described in detail. In the following embodiments, a method of manufacturing the metal posts by applying the copper posts as an example is described. However, the present invention is not necessarily limited thereto, and a technique of manufacturing other metals by the plating method is not excluded.

3A to 3K are cross-sectional views schematically showing a method of manufacturing a printed circuit board having a metal post according to a first embodiment of the present invention. Referring to FIG. 3A, a preliminary substrate is prepared. The preliminary substrate may be a flat substrate without a pattern structure.

The preliminary substrate may be an insulating substrate including a copper seed layer. Specifically, the preliminary substrate may include an insulating core layer 310, a copper foil layer 320, and a copper seed layer 330. The copper seed layer 330 may function as a seed layer for the copper plating process. The copper foil layer 320 may function as a carrier layer on the insulating core layer 310 to form a copper post layer using the copper seed layer 330.

The copper foil layer 320 and the copper seed layer 330 may be formed to have a planarized surface on the insulating core layer 310. A release layer (not shown) may be additionally disposed between the copper foil layer 320 and the copper seed layer 330.

Referring to FIG. 3B, a photosensitive resist pattern 340 is formed on the copper seed layer 330. The photosensitive resist pattern 340 may be, for example, a patterned layer of a photosensitive dry film. The photosensitive resist pattern 340 may be patterned to expose at least a portion of the copper seed layer 330. The photosensitive resist pattern 340 can form a contact pattern so as to define a region where a copper post to be described later is to be formed.

Referring to FIG. 3C, the plating process is performed using the copper seed layer 330 exposed by the photosensitive resist pattern 340 to form the copper pattern layer 350. That is, the copper pattern layer 350 has the form of a copper plating pattern. The plating process may be, for example, electroplating, electroless plating, or a combination thereof.

The copper pattern layer 350 may be formed to fill the inside of the contact pattern formed by the photosensitive resist pattern 340. [ In some embodiments, the upper portion of the copper pattern layer 350 may be planarized to match the height of the photosensitive resist pattern 340 after the plating process is completed, in order to uniformly control the height of the copper pattern layer 350. The planarization method may be, for example, a grinding method or a chemical etching method.

Referring to FIG. 3D, a mask pattern layer 360 is disposed on the copper pattern layer 350 and the photosensitive resist pattern 340. The mask pattern layer 360 may have a contact pattern selectively exposing the copper pattern layer 350. As an example, the mask pattern layer 360 may be a shadow mask.

Referring to FIG. 3E, a solder material is provided on the mask pattern layer 360. As a specific example, a method of coating a solder paste on the mask pattern layer 360 may be applied. As a result, the solder paste is coated on the copper pattern layer 350 exposed by the contact pattern, so that the solder pattern layer 370 can be formed on the copper pattern layer 350. The mask pattern layer 360 may then be removed.

Referring to FIG. 3F, the photosensitive resist pattern 340 is removed from the preliminary substrate 300 to expose the copper seed layer 330.

Referring to FIG. 3G, the seed pattern layer 332 can be formed by selectively etching the copper seed layer 330 using the solder pattern layer 370 and the copper pattern layer 350 as an etching mask. The etching process may be, for example, dry etching, wet etching, or a combination thereof.

The copper posts 30 can be formed on the insulating core layer 310 by performing the processes of FIGS. 3A to 3G. The copper posts 30 may include a seed pattern layer 332 and a copper pattern layer 350. The solder pattern layer 370 may be located on the copper pattern layer 350 of the copper post 30. [

Referring to FIG. 3H, a main circuit board 100 is prepared. The main circuit board 100 may include an insulating layer 130 for insulating at least one circuit pattern layer 120 and 125 and the circuit pattern layers 120 and 125 from each other on the insulating core layer 110. In addition, the main circuit board 100 may include a connection pad 140 exposed by the uppermost insulation pattern 150.

Referring again to FIG. 3H, the step of preparing the main circuit board 100 may proceed as follows. First, a circuit board having a plurality of inner layer circuits 120 and outer layer circuits 140 is manufactured. The method for manufacturing the circuit board can be applied to a conventional method for manufacturing a multilayer printed circuit board. Although the inner layer circuit 120, the outer layer circuit 140, and the through vias 125 are illustrated as one layer in the drawings for the sake of convenience, the present invention is not limited thereto. Various numbers of inner layer circuits are possible, Other modifications are possible as far as the structure of the outer layer circuit and the via layer is concerned.

Subsequently, a solder resist layer 150 is formed to cover the outer layer circuit 140 so that a part of the outer layer circuit functioning as the connection pad 140 is exposed by the solder resist layer 150.

Referring to FIG. 3I, a preliminary substrate 300 including a copper post 30 on which a solder pattern layer 370 is formed, which is manufactured through the processes of FIGS. 3A to 3G, is aligned do. Specifically, the solder pattern layer 370 of the copper posts and the connection pads 140 of the main circuit board 100 are arranged so as to be adjacent to each other. At this time, the solder pattern layer 370 may be placed in contact with the connection pad 140 or spaced apart at a predetermined interval.

Referring to FIG. 3J, the solder pattern layer 370 is heated and reflowed. The solder pattern layer 370 to be reflowed may be deformed into a predetermined shape to solder bond the copper posts 30 and the connection pads 140. As shown, the solder pattern layer 370 may be deformed into a solder layer 372 after reflow and interposed between the copper posts 30 and the connection pads 140.

Referring to FIG. 3K, the seed pattern layer 332 of the copper post 30 and the copper foil layer 320 of the preliminary substrate 300 are separated. As one example, a separation method may be applied by applying a physical force to separate the release layer located between the seed pattern layer 332 and the copper foil layer 320.

Through the above-described method, the copper posts 30 can be manufactured on the main circuit board 100.

4A to 4F are cross-sectional views schematically showing a method of manufacturing a printed circuit board having a metal post according to a second embodiment of the present invention. Referring to FIG. 4A, a process substantially identical to the process described with reference to FIGS. 3A to 3C of the first embodiment of the present invention is performed on the preliminary substrate 300. FIG.

That is, a photosensitive resist pattern 340 is disposed on the copper seed layer 330, and a plating process is performed to form a copper pattern layer 350 filling a space between the photosensitive resist patterns 340.

Referring to FIG. 4B, the photosensitive resist pattern 340 is removed from the preliminary substrate 300 to expose the copper seed layer 330.

Referring to FIG. 4C, the seed pattern layer 332 can be formed by selectively etching the copper seed layer 330 using the copper pattern layer 350 as an etching mask. The etching process may be, for example, dry etching, wet etching, or a combination thereof.

Thus, the copper posts 30 can be formed on the insulating core layer 310 by proceeding with the steps of FIGS. 4A to 4C. The copper posts 30 may include a seed pattern layer 332 and a copper pattern layer 350. Unlike in the first embodiment of the present invention, the solder pattern layer is not located on the copper pattern layer 350 of the copper post 30.

Referring to FIG. 4D, a main circuit board 200 is prepared. The main circuit board 200 is substantially the same as the main circuit board 100 of the first embodiment of the present invention. Therefore, a detailed description of the structure will be omitted in order to exclude duplication.

The solder resist layer 150 is formed so as to cover the outer layer circuit 140 of the main circuit board 200. The connection pad 140 may be exposed to the outside as a part of the outer layer circuit 140 at this time.

Referring again to FIG. 4D, a solder pattern layer 170 is formed on the connection pad 140. As a method of forming the solder pattern layer 170, a method of providing a solder material using the mask pattern layer 360 described with reference to FIGS. 3D and 3E of the first embodiment of the present invention is applied .

Referring to FIG. 4E, a preliminary substrate 300 including a copper post 30, which is manufactured through the processes of FIGS. 4A to 4C, is aligned on the solder pattern layer 170. Specifically, the copper posts 30 are aligned and disposed adjacent to the solder pattern layer 170. At this time, the copper posts 30 may be placed in contact with the solder pattern layer 170 or spaced apart at a predetermined interval.

Then, the solder pattern layer 170 is heated and reflowed. The solder pattern layer 170 to be reflowed may be deformed into a predetermined shape to solder bond the copper posts 30 and the connection pads 140. As shown, the solder pattern layer 170 may be deformed into a solder layer 172 after reflow and interposed between the copper posts 30 and the connection pad 140.

Referring to FIG. 4F, the seed pattern layer 332 of the copper posts 30 is separated from the copper foil layer 320 of the preliminary substrate 300. As one example, a separation method may be applied by applying a physical force to separate the release layer located between the seed pattern layer 332 and the copper foil layer 320.

Through the above-described method, the copper posts 30 can be manufactured on the main circuit board 200.

5 is a cross-sectional view schematically showing a printed circuit board having a copper post manufactured according to an embodiment of the present invention. 5, the printed circuit board 500 includes at least one circuit pattern layer and a connection pad 140 corresponding to the recoil layer of the circuit pattern layer and selectively exposed by the insulation pattern 150 And includes a main circuit board (100, 200). 5, at least one circuit pattern layer is omitted from the main circuit boards 100 and 200 for the sake of convenience.

And solder layers 172 and 372 are disposed in a space between the solder resist layers 150. The solder resist layer 150 is formed on the upper surface of the connection pad 140, In the comparative example shown in FIGS. 1A-1C, solder layers 172 and 372 are located at the locations where the first copper posts 14 are disposed in the embodiment of the present invention.

The copper posts 30 are disposed on the solder layers 172 and 372 and may be arranged to have a uniform width W3 along the height direction of the copper posts 30. [ In the comparative example shown in Figs. 1A to 1C, the copper posts 10 have different widths W1 and W2 along the height direction, and are compared with each other.

In the embodiment of the present invention, the copper plating process does not proceed directly on the main circuit boards 100 and 200. Therefore, since the step of forming and removing the resist pattern for the copper plating pattern does not proceed, the copper plating failure that may be caused by the unremoved resist pattern may not occur. As a result, the structural reliability of the copper posts 30 can be relatively superior to that of the comparative copper posts 10 shown in Figs. 1A to 1C.

In addition, according to the embodiment of the present invention, the copper posts 30 can be formed on the planarized preliminary substrate 300 through a single copper plating process. In contrast, in the comparative example shown in Figs. 1A to 1C, at least two plating processes may be required to fill the space between the solder resist pattern layers 13.

According to the embodiment of the present invention, since the copper pattern layer 350 is formed as the copper posts 30 on the planarized preliminary substrate 300, the copper posts 10 are formed on the patterned circuit board as in the comparative example Relatively fine pitch and patterning may be possible than when formed. Also, the height control of the copper posts 30 can be relatively easier than the height control of the copper posts 10 in the comparative example.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It can be understood that

10: Copper post, 11: Laminated substrate,
12: connection pad layer, 13: solder resist pattern layer,
14: primary copper post, 15: primary dry film pattern,
16: second copper post, 17: second dry film pattern,
30: Copper post, 100: Main circuit board,
110: insulating core layer, 120 125: circuit pattern layer,
130: insulating layer, 140: connection pad,
150: solder resist layer, 170: solder pattern layer,
172: solder layer, 310: insulating core layer,
320: copper foil layer, 330: copper seed layer,
332: seed pattern layer, 340: photosensitive resist pattern,
350: copper pattern layer, 360: mask pattern layer,
370: solder pattern layer, 372: solder layer.

Claims (19)

And an insulating layer for insulating at least one of the circuit pattern layers and the circuit pattern layer from each other, wherein the outer layer circuit disposed on the insulating layer is formed by exposing the uppermost layer insulating pattern on the insulating layer, Preparing a substrate;
Forming a metal post on the preliminary substrate;
And joining the metal posts on the preliminary substrate and the connection pads on the main circuit board using a solder pattern layer
A method of manufacturing a printed circuit board having a metal post. The method according to claim 1,
The step of preparing the main circuit board
Preparing a circuit board having a plurality of inner layer circuits and outer layer circuits;
Forming a solder resist layer as the uppermost layer insulating pattern so as to cover the outer layer circuit so that a portion of the outer layer circuit functioning as the connection pad is exposed to the outside by the solder resist layer
A method of manufacturing a printed circuit board having a metal post. The method according to claim 1,
The step of forming a metal post on the preliminary substrate
Preparing an insulating substrate comprising a copper seed layer; And
And forming a copper pattern layer on the insulating substrate by a plating method using the copper seed layer
A method of manufacturing a printed circuit board having a metal post. The method according to claim 1,
The pre-
An insulating core layer;
A copper foil layer stacked on the insulating core layer and functioning as a carrier layer;
A copper seed layer disposed on the copper foil layer and serving as a seed layer for a copper plating process; And
And a release layer interposed between the copper foil layer and the copper seed layer
A method of manufacturing a printed circuit board having a metal post. The method of claim 3,
The step of forming the copper pattern layer
Forming a photosensitive resist pattern on the copper seed layer;
Forming a copper plating pattern by performing plating using the copper seed layer exposed between the photosensitive resist patterns;
Removing the photosensitive resist pattern from the insulating substrate; And
And removing the exposed copper seed layer by removing the photosensitive resist pattern
A method of manufacturing a printed circuit board having a metal post. The method of claim 3,
The step of forming the copper pattern layer
Forming a photosensitive resist pattern on the copper seed layer;
Forming a copper plating pattern by performing plating using the copper seed layer exposed between the photosensitive resist patterns;
Disposing a mask pattern layer selectively exposing the copper plating pattern;
Providing a solder material on the mask pattern layer to form a solder pattern layer on the exposed copper plating pattern;
Removing the mask pattern layer and the photosensitive resist pattern from the insulating substrate; And
And removing the exposed copper seed layer by removing the photosensitive resist pattern
A method of manufacturing a printed circuit board having a metal post. The method according to claim 1,
The step of bonding the metal posts on the preliminary substrate to the connection pads on the main circuit board
Forming the solder pattern layer on the metal posts;
Aligning and arranging the solder pattern layer and the connection pad adjacent to each other; And
And reflowing the solder pattern layer to solder-bond the metal posts and the connection pads
A method of manufacturing a printed circuit board having a metal post. The method according to claim 1,
The step of bonding the metal posts on the preliminary substrate to the connection pads on the main circuit board
Forming the solder pattern layer on the connection pad;
Aligning and arranging the metal posts and the solder pattern layer adjacent to each other; And
And reflowing the solder pattern layer to solder bond the metal posts and the connection pad
A method of manufacturing a printed circuit board having a metal post. 9. The method of claim 8,
The step of forming a solder pattern layer on the connection pad
Forming a mask pattern layer selectively exposing the connection pad on the connection pad and the uppermost insulating pattern;
Coating a solder paste on the mask pattern layer to form a solder film on the exposed connection pads; And
And removing the mask pattern layer from the main circuit board
A method of manufacturing a printed circuit board having a metal post. 9. The method according to claim 7 or 8,
The solder pattern layer is reflowed to fill an upper space of the connection pads exposed between the uppermost layer insulating patterns
A method of manufacturing a printed circuit board having a metal post. The method according to claim 1,
After the bonding of the metal posts and the connection pads, separating the metal posts and the preliminary substrate
A method of manufacturing a printed circuit board having a metal post. And an insulating layer for insulating at least one of the circuit pattern layers and the circuit pattern layer from each other, wherein the outer layer circuit disposed on the insulating layer is formed by exposing the uppermost layer insulating pattern on the insulating layer, Preparing a substrate;
Forming a connection structure having a metal post and a solder pattern layer sequentially deposited on a preliminary substrate;
Aligning and arranging the connection structure and the connection pad adjacent to each other; And
And reflowing the solder pattern layer to bond the metal posts to the connection pad
A method of manufacturing a printed circuit board having a metal post. And an insulating layer for insulating at least one of the circuit pattern layers and the circuit pattern layer from each other, wherein the outer layer circuit disposed on the insulating layer is formed by exposing the uppermost layer insulating pattern on the insulating layer, Preparing a substrate;
Forming a connection structure including a metal post on the preliminary substrate;
Forming a solder pattern layer on the connection pad;
Aligning and arranging the connection structure and the solder pattern layer adjacent to each other; And
And reflowing the solder pattern layer to bond the metal posts to the connection pad
A method of manufacturing a printed circuit board having a metal post. The method according to claim 12 or 13,
The solder pattern layer is reflowed to fill an upper space of the connection pads exposed between the uppermost layer insulating patterns
A method of manufacturing a printed circuit board having a metal post. delete delete delete delete delete

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