TWI726230B - 保持構件、保持構件的製造方法、保持機構以及製品的製造裝置 - Google Patents

保持構件、保持構件的製造方法、保持機構以及製品的製造裝置 Download PDF

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Publication number
TWI726230B
TWI726230B TW107128275A TW107128275A TWI726230B TW I726230 B TWI726230 B TW I726230B TW 107128275 A TW107128275 A TW 107128275A TW 107128275 A TW107128275 A TW 107128275A TW I726230 B TWI726230 B TW I726230B
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TW
Taiwan
Prior art keywords
holding member
holding
resin
bga
manufacturing
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TW107128275A
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English (en)
Chinese (zh)
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TW201914797A (zh
Inventor
石橋幹司
尾関貴俊
Original Assignee
日商Ｔｏｗａ股份有限公司
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Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW201914797A publication Critical patent/TW201914797A/zh
Application granted granted Critical
Publication of TWI726230B publication Critical patent/TWI726230B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW107128275A 2017-09-15 2018-08-14 保持構件、保持構件的製造方法、保持機構以及製品的製造裝置 TWI726230B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017177223A JP6861602B2 (ja) 2017-09-15 2017-09-15 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
JP2017-177223 2017-09-15

Publications (2)

Publication Number Publication Date
TW201914797A TW201914797A (zh) 2019-04-16
TWI726230B true TWI726230B (zh) 2021-05-01

Family

ID=65745574

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107128275A TWI726230B (zh) 2017-09-15 2018-08-14 保持構件、保持構件的製造方法、保持機構以及製品的製造裝置

Country Status (4)

Country Link
JP (1) JP6861602B2 (ko)
KR (1) KR102157533B1 (ko)
CN (1) CN109509708B (ko)
TW (1) TWI726230B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6952737B2 (ja) * 2019-05-24 2021-10-20 Ｔｏｗａ株式会社 保持部材、検査機構、切断装置、保持対象物の製造方法及び保持部材の製造方法
CN110853507B (zh) * 2019-06-14 2022-08-09 荣耀终端有限公司 一种显示屏和电子设备
WO2022195931A1 (ja) * 2021-03-18 2022-09-22 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
JP7464575B2 (ja) * 2021-12-14 2024-04-09 Ｔｏｗａ株式会社 切断装置、及び切断品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10209260A (ja) * 1997-01-20 1998-08-07 Kyokuto Shokai:Kk シンジオタクチックスポリスチレンを用いた半導体用搬送トレー
TW201040005A (en) * 2009-04-03 2010-11-16 Chao-Chi Chang Methods and devices for manufacturing an array of lenses
TW201341107A (zh) * 2012-02-23 2013-10-16 Towa Corp 固定治具之製造方法及固定治具

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2801655B2 (ja) 1989-07-03 1998-09-21 電気化学工業株式会社 半導体集積回路装置搬送用トレーの製造法
JP3771084B2 (ja) 1999-04-30 2006-04-26 Ｎｅｃエレクトロニクス株式会社 半導体集積回路装置用トレイ
JP2001139089A (ja) 1999-11-17 2001-05-22 Nec Corp 半導体パッケージの収納トレー
JP5366452B2 (ja) * 2008-06-23 2013-12-11 東芝機械株式会社 被成型品の成型方法および成型装置
JP5250868B2 (ja) * 2008-08-04 2013-07-31 セイコーＮｐｃ株式会社 チップ収納トレイ
KR20130066234A (ko) * 2011-12-12 2013-06-20 삼성전자주식회사 반도체 장치의 제조 방법 및 이에 사용되는 반도체 장치의 픽업 장치
JP5918003B2 (ja) * 2012-04-27 2016-05-18 Ｔｏｗａ株式会社 個片化装置用真空吸着シート及びそれを用いた固定治具の製造方法
JP6000902B2 (ja) * 2013-06-24 2016-10-05 Ｔｏｗａ株式会社 電子部品用の収容治具、その製造方法及び個片化装置
JP6333648B2 (ja) * 2014-07-16 2018-05-30 Ｔｏｗａ株式会社 個片化物品の移送方法、製造方法及び製造装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10209260A (ja) * 1997-01-20 1998-08-07 Kyokuto Shokai:Kk シンジオタクチックスポリスチレンを用いた半導体用搬送トレー
TW201040005A (en) * 2009-04-03 2010-11-16 Chao-Chi Chang Methods and devices for manufacturing an array of lenses
TW201341107A (zh) * 2012-02-23 2013-10-16 Towa Corp 固定治具之製造方法及固定治具

Also Published As

Publication number Publication date
CN109509708B (zh) 2022-07-12
CN109509708A (zh) 2019-03-22
KR102157533B1 (ko) 2020-09-18
TW201914797A (zh) 2019-04-16
JP2019051645A (ja) 2019-04-04
KR20190031130A (ko) 2019-03-25
JP6861602B2 (ja) 2021-04-21

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