TWI700767B - 用於將設有凸塊的半導體晶片安裝在基板的基板定位的方法 - Google Patents

用於將設有凸塊的半導體晶片安裝在基板的基板定位的方法 Download PDF

Info

Publication number
TWI700767B
TWI700767B TW105127781A TW105127781A TWI700767B TW I700767 B TWI700767 B TW I700767B TW 105127781 A TW105127781 A TW 105127781A TW 105127781 A TW105127781 A TW 105127781A TW I700767 B TWI700767 B TW I700767B
Authority
TW
Taiwan
Prior art keywords
camera
substrate
optical mark
flip chip
cavity
Prior art date
Application number
TW105127781A
Other languages
English (en)
Chinese (zh)
Other versions
TW201735227A (zh
Inventor
弗羅里安 史貝爾
Original Assignee
瑞士商貝西瑞士股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞士商貝西瑞士股份有限公司 filed Critical 瑞士商貝西瑞士股份有限公司
Publication of TW201735227A publication Critical patent/TW201735227A/zh
Application granted granted Critical
Publication of TWI700767B publication Critical patent/TWI700767B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0614—Marking devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/099—Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW105127781A 2015-08-31 2016-08-30 用於將設有凸塊的半導體晶片安裝在基板的基板定位的方法 TWI700767B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CH12482015 2015-08-31
CH01248/15 2015-08-31
CH01404/15A CH711536B1 (de) 2015-08-31 2015-09-28 Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats.
CH01404/15 2015-09-28

Publications (2)

Publication Number Publication Date
TW201735227A TW201735227A (zh) 2017-10-01
TWI700767B true TWI700767B (zh) 2020-08-01

Family

ID=58264157

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105127781A TWI700767B (zh) 2015-08-31 2016-08-30 用於將設有凸塊的半導體晶片安裝在基板的基板定位的方法

Country Status (7)

Country Link
JP (1) JP6868982B2 (cg-RX-API-DMAC7.html)
KR (1) KR102597252B1 (cg-RX-API-DMAC7.html)
CN (1) CN106486400B (cg-RX-API-DMAC7.html)
CH (1) CH711536B1 (cg-RX-API-DMAC7.html)
MY (1) MY176667A (cg-RX-API-DMAC7.html)
SG (1) SG10201606167WA (cg-RX-API-DMAC7.html)
TW (1) TWI700767B (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7164314B2 (ja) * 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
CN109079367B (zh) * 2018-07-23 2020-07-24 中电科技（合肥）博微信息发展有限责任公司 一种芯片智能焊接方法
JP7582928B2 (ja) * 2021-11-25 2024-11-13 キヤノン株式会社 接合装置および接合方法
CN117146731B (zh) * 2022-11-02 2026-07-03 绍兴文理学院 一种基于多相机协同下运动纱线检测装置及图像对齐方法
CN121398664B (zh) * 2025-10-24 2026-07-17 广东台进半导体科技有限公司 一种嵌入式芯片封装方法及封装设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0684644B1 (en) * 1994-05-25 2002-02-06 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device
TW200603304A (en) * 2004-05-17 2006-01-16 Matsushita Electric Industrial Co Ltd Component supply head apparatus and component mount head apparatus
US20110092066A1 (en) * 1997-05-27 2011-04-21 Mackay John Bumping Electronic Components Using Transfer Substrates

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5372294A (en) * 1994-01-27 1994-12-13 Motorola, Inc. Method of preparing a component for automated placement
JPH10209208A (ja) * 1997-01-23 1998-08-07 Hitachi Ltd 半導体製造方法および装置
JP2001060795A (ja) * 1999-08-20 2001-03-06 Matsushita Electric Ind Co Ltd 電子部品実装装置
US7033842B2 (en) * 2002-03-25 2006-04-25 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
JP4334892B2 (ja) * 2003-03-20 2009-09-30 パナソニック株式会社 部品実装方法
JP2007173801A (ja) * 2005-12-22 2007-07-05 Unaxis Internatl Trading Ltd フリップチップを基板に取り付ける方法
JP2008168225A (ja) * 2007-01-12 2008-07-24 Fujifilm Corp スリット塗布方法及び装置、並びにカラーフィルタの製造方法
CH698718B1 (de) * 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag Vorrichtung für die Montage eines Flipchips auf einem Substrat.
CH698720B1 (de) * 2007-02-14 2009-10-15 Oerlikon Assembly Equipment Ag Verfahren und Montageautomat für die Montage von Halbleiterchips als Flipchip auf einem Substrat.
CH698334B1 (de) * 2007-10-09 2011-07-29 Esec Ag Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
JP5030843B2 (ja) * 2008-04-14 2012-09-19 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP4983737B2 (ja) * 2008-06-30 2012-07-25 株式会社日立プラントテクノロジー ハンダボール検査リペア装置およびハンダボール検査リペア方法
JP4766144B2 (ja) * 2009-04-08 2011-09-07 パナソニック株式会社 電子部品実装装置
KR101120129B1 (ko) * 2009-08-31 2012-03-23 (주) 에스에스피 기준값을 응용한 작업위치 자동 조정방법 및 이를 위한 자동화 장비
JP2011181675A (ja) * 2010-03-01 2011-09-15 Nec Corp 回路部品の実装装置
CH705802B1 (de) * 2011-11-25 2016-04-15 Esec Ag Einrichtung für die Montage von Halbleiterchips.
JP6000626B2 (ja) * 2012-05-01 2016-10-05 新光電気工業株式会社 電子装置の製造方法及び電子部品搭載装置
JP6391225B2 (ja) * 2013-09-13 2018-09-19 ファスフォードテクノロジ株式会社 フリップチップボンダ及びフリップチップボンディング方法
JP6200737B2 (ja) * 2013-09-17 2017-09-20 ファスフォードテクノロジ株式会社 ダイボンダ用ディッピング機構及びフリップチップボンダ
JP2015076411A (ja) * 2013-10-04 2015-04-20 株式会社日立ハイテクインスツルメンツ ダイボンダ
JP6324772B2 (ja) * 2014-03-14 2018-05-16 ファスフォードテクノロジ株式会社 ダイボンダ用ディッピング機構及びフリップチップボンダ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0684644B1 (en) * 1994-05-25 2002-02-06 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device
US20110092066A1 (en) * 1997-05-27 2011-04-21 Mackay John Bumping Electronic Components Using Transfer Substrates
TW200603304A (en) * 2004-05-17 2006-01-16 Matsushita Electric Industrial Co Ltd Component supply head apparatus and component mount head apparatus

Also Published As

Publication number Publication date
KR102597252B1 (ko) 2023-11-01
KR20170026136A (ko) 2017-03-08
CH711536A1 (de) 2017-03-15
CN106486400B (zh) 2021-10-29
JP6868982B2 (ja) 2021-05-12
CH711536B1 (de) 2019-02-15
CN106486400A (zh) 2017-03-08
JP2017050533A (ja) 2017-03-09
TW201735227A (zh) 2017-10-01
MY176667A (en) 2020-08-19
SG10201606167WA (en) 2017-03-30

Similar Documents

Publication Publication Date Title
US9721819B2 (en) Method for mounting semiconductors provided with bumps on substrate locations of a substrate
US9431365B2 (en) Apparatus for bonding semiconductor chips
JP7164314B2 (ja) 部品を基板上に搭載する装置及び方法
CN106486400B (zh) 用于在基板的基板定位上安装设有凸块的半导体的方法
JP7436251B2 (ja) ダイボンディング装置および半導体装置の製造方法
CN105531809B (zh) 用于将半导体芯片对于键合头定位的系统和方法、热键合系统和方法
CN108470698B (zh) 一种工件对准贴装装置及其方法
KR20070066946A (ko) 플립칩을 기판에 장착하기 위한 방법
KR101667488B1 (ko) 반도체 소자 이송장치 및 반도체 소자 이송방법
KR101237056B1 (ko) 반도체 패키지 집합체 정렬방법
US10784130B2 (en) Bonding apparatus
KR102738095B1 (ko) 다이 본딩 장치 및 반도체 장치의 제조 방법
KR20130117256A (ko) 플립칩 본딩장치 및 플립칩 본딩방법
JP7285162B2 (ja) ダイボンディング装置および半導体装置の製造方法
JP2012069731A (ja) ダイボンダ及び半導体製造方法
JP5181383B2 (ja) ボンディング装置
HK1230787B (en) Method for mounting semiconductors provided with bumps on substrate locations of a substrate
HK1230787A1 (en) Method for mounting semiconductors provided with bumps on substrate locations of a substrate
HK1230787A (en) Method for mounting semiconductors provided with bumps on substrate locations of a substrate
JP6804905B2 (ja) 基板作業装置
JP6851118B2 (ja) 部品良否判定装置及び電子部品装着機
CN114074235A (zh) 焊接装置以及焊接方法
WO2022168275A1 (ja) ボンディング装置及びボンディング方法
JP2006303341A (ja) 導電性ボール配列装置
CN119343747A (zh) 切断装置和切断品的制造方法