TWI700148B - 夾盤台、磨削裝置及磨削品的製造方法 - Google Patents

夾盤台、磨削裝置及磨削品的製造方法 Download PDF

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Publication number
TWI700148B
TWI700148B TW108120515A TW108120515A TWI700148B TW I700148 B TWI700148 B TW I700148B TW 108120515 A TW108120515 A TW 108120515A TW 108120515 A TW108120515 A TW 108120515A TW I700148 B TWI700148 B TW I700148B
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TW
Taiwan
Prior art keywords
grinding
chuck table
ground
area
porous member
Prior art date
Application number
TW108120515A
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English (en)
Chinese (zh)
Other versions
TW202000367A (zh
Inventor
高森雄大
Original Assignee
日商Ｔｏｗａ股份有限公司
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Filing date
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Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW202000367A publication Critical patent/TW202000367A/zh
Application granted granted Critical
Publication of TWI700148B publication Critical patent/TWI700148B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/30—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2703/00—Work clamping
    • B23Q2703/02—Work clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2703/00—Work clamping
    • B23Q2703/02—Work clamping means
    • B23Q2703/10—Devices for clamping workpieces of a particular form or made from a particular material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW108120515A 2018-06-15 2019-06-13 夾盤台、磨削裝置及磨削品的製造方法 TWI700148B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-114356 2018-06-15
JP2018114356A JP7034845B2 (ja) 2018-06-15 2018-06-15 チャックテーブル、研削装置および研削品の製造方法

Publications (2)

Publication Number Publication Date
TW202000367A TW202000367A (zh) 2020-01-01
TWI700148B true TWI700148B (zh) 2020-08-01

Family

ID=68890066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108120515A TWI700148B (zh) 2018-06-15 2019-06-13 夾盤台、磨削裝置及磨削品的製造方法

Country Status (4)

Country Link
JP (1) JP7034845B2 (ko)
KR (1) KR102209921B1 (ko)
CN (1) CN110605636B (ko)
TW (1) TWI700148B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111168564A (zh) * 2020-01-06 2020-05-19 业成科技（成都）有限公司 研磨清洁的改良装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW500015U (en) * 2001-03-21 2002-08-21 Ultra Tera Corp Grinding machine for workpiece
TW556619U (en) * 2003-02-17 2003-10-01 Hotshine Prec Machine Co Ltd Improved vacuum absorbing table board
TW200940255A (en) * 2007-12-21 2009-10-01 Tokyo Seimitsu Co Ltd Wafer grinding machine and wafer grinding method
TW201805091A (zh) * 2016-08-12 2018-02-16 鄧榮貴 物件吸載機構

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2664641B2 (ja) * 1994-11-29 1997-10-15 シーケーディ株式会社 真空チャックの吸着プレート
JPH11179638A (ja) * 1997-12-17 1999-07-06 Toshiba Ceramics Co Ltd 半導体ウェーハの製造方法およびその装置
JP2004319930A (ja) * 2003-04-21 2004-11-11 Okamoto Machine Tool Works Ltd 基板用洗浄・乾燥装置
JP2005169592A (ja) * 2003-12-15 2005-06-30 Okamoto Machine Tool Works Ltd 非磁性ワ−クのチャック機構
JP2008296334A (ja) * 2007-05-31 2008-12-11 Toshiba Corp 真空吸着チャックおよびそれを用いた研削装置
KR101610832B1 (ko) * 2010-03-03 2016-04-08 삼성전자주식회사 화학적 기계적 연마 설비
JP2015085414A (ja) * 2013-10-29 2015-05-07 株式会社ディスコ パッケージ基板の加工方法
JP6495054B2 (ja) * 2015-03-04 2019-04-03 株式会社ディスコ パッケージ基板の研削方法
CN106217087A (zh) * 2016-06-30 2016-12-14 山东鲁南机床有限公司 一种针对厚胶基片的无损夹持装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW500015U (en) * 2001-03-21 2002-08-21 Ultra Tera Corp Grinding machine for workpiece
TW556619U (en) * 2003-02-17 2003-10-01 Hotshine Prec Machine Co Ltd Improved vacuum absorbing table board
TW200940255A (en) * 2007-12-21 2009-10-01 Tokyo Seimitsu Co Ltd Wafer grinding machine and wafer grinding method
TW201805091A (zh) * 2016-08-12 2018-02-16 鄧榮貴 物件吸載機構

Also Published As

Publication number Publication date
CN110605636A (zh) 2019-12-24
KR20190142213A (ko) 2019-12-26
CN110605636B (zh) 2021-08-24
KR102209921B1 (ko) 2021-02-01
JP7034845B2 (ja) 2022-03-14
JP2019217561A (ja) 2019-12-26
TW202000367A (zh) 2020-01-01

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