TWI700148B - Chuck table, grinding device and manufacturing method of grinding product - Google Patents

Abstract

The present invention is a chuck table for adsorbing a grinding object. The chuck table includes: a main body having an area where the object to be ground can be placed; a porous member provided in the area where the object to be ground can be placed in the main body And the suction hole arrangement area is provided in the area of the main body where the object to be ground can be arranged, and is provided on the outside of the porous member. The chuck table of the present invention can prevent the steps from becoming complicated on the one hand, and on the other hand, it can stably suck and hold the object to be ground, and furthermore, it is possible to prevent the appearance of the ground product from being defective or the occurrence of poor operation. The present invention also provides a grinding device and a manufacturing method of grinding products.

Description

Chuck table, grinding device and manufacturing method of grinding product

The present invention relates to a chuck table, a grinding device and a manufacturing method of grinding products.

Conventionally, the grinding device has been used to grind the grinding object adsorbed on the chuck table. As one form, there is a method of forming an adsorption and holding portion of the grinding object using a porous member.

In Japanese Patent Laid-Open No. 2016-159412 (Patent Document 1), the following technology is disclosed: when a porous member such as porous ceramics (porous ceramics) is used to form an adsorbing and holding portion, it is covered with a sheet for grinding The outer peripheral edge of the packaging substrate of the object sucks and holds the sheet and the packaging substrate to prevent the suction force from leaking between the outer peripheral edge of the packaging substrate and the object to be ground.

In Patent Document 1, it is possible to correct the warpage of the workpiece with a sheet while preventing the suction force from leaking from the holding surface. Therefore, the chuck table can reliably suck and hold the package substrate (see paragraph [0014] of Patent Document 1, etc. ).

However, in the grinding method described in Patent Document 1, it is necessary to additionally perform the step of setting the sheet, so that the step may become complicated. Furthermore, due to the limitation of the durability of the sheet, there are cases where it cannot be used multiple times. When the sheet is damaged or peeled off during the grinding step, the outer periphery of the package substrate cannot be sucked and held, and the package substrate may be damaged. Damage to the package substrate can cause poor appearance and, in turn, poor operation.

The object of the present invention is to provide a chuck table and a grinding device, which can prevent the steps from becoming complicated on the one hand, and stably suck and hold the object to be ground on the other hand, and provide a method for manufacturing a ground product that can suppress the appearance of the product The occurrence of bad or poor operation.

The chuck table of the present invention is a chuck table for adsorbing a grinding object, which includes a main body having an area where the grinding object can be placed; and a porous member provided in the area where the grinding object can be placed. And the suction hole arrangement area is provided in the area of the main body where the object to be ground can be arranged, and is provided on the outside of the porous member.

The grinding device of the present invention includes the chuck table, and a grinding part that grinds a grinding object adsorbed on the chuck table.

The method of manufacturing a ground product of the present invention includes the steps of: sucking an object to be ground on the chuck table; and rotating a grinding part on which a grindstone is arranged, and grinding the object to be ground with the grindstone.

According to the present invention, it is possible to prevent the steps from becoming complicated, and to stably suck and hold the object to be ground. As a result, it is possible to suppress the occurrence of poor appearance or poor operation of the ground product. The objective and other objectives, features, situations, and advantages of the present invention will be clarified by the following detailed description of the present invention understood in conjunction with the accompanying drawings.

Hereinafter, embodiments of the present invention will be described. In addition, the same reference signs are attached to the same or equivalent parts, and the description thereof is not repeated in some cases.

In addition, in the embodiments described below, when talking about the number, amount, etc., the scope of the present invention is not necessarily limited to the number, amount, etc. unless otherwise specified. In addition, in the following embodiments, each constituent element is not necessarily essential to the present invention unless otherwise specified.

Fig. 1 is a diagram showing the overall structure of a grinding device. As shown in FIG. 1, the grinding device includes a base 1, a grinding fluid supply part 2, a grinding wheel 3, a spindle 4, a motor 5, a connection part 6, a column part 7 and a suction device 8.

A chuck table 100 (suction jig) is provided on the base 1. The chuck table 100 can suck the grinding object 100α.

The chuck table 100 is arranged on the base 1 and the column portion 7 at a distance in the X direction (horizontal direction). The chuck table 100 is provided with a grinding object 100α. The grinding fluid supply unit 2 supplies a grinding fluid (for example, pure water) to the grinding surface of the grinding target 100α. The structure of the grinding fluid supply part 2 is not particularly limited as long as the grinding fluid can be supplied to the grinding surface of the grinding target 100α.

The grinding wheel 3 (grinding part) includes an annular base 3A and a grinding stone 3B attached to the annular base 3A. The grinding grindstone 3B is configured by arranging a plurality of grindstones in a ring shape. The grinding grindstone 3B is, for example, a diamond grindstone. The grinding wheel 3 is attached to the end on the side opposite to the motor 5 side of the main shaft 4. The grinding wheel 3 can rotate around an axis extending in the Z direction.

The main shaft 4 has one end attached to the motor 5 and extends in the Z direction (vertical downward direction). The motor 5 is attached to the end of the connecting portion 6 in the X direction. The connecting portion 6 extends in the X direction from the end portion of the column portion 7 on the opposite side to the end portion on the base 1 side. The column portion 7 extends in the Z direction (vertical upward direction) from the area of the end portion of the base 1. The chuck table 100 is connected to a suction device 8 including a vacuum pump and the like. By operating the suction device 8, the grinding object 100α is sucked and held on the chuck table 100.

2A is a plan view schematically showing the chuck table 100, and FIG. 2B is a cross-sectional view taken along the line IIB-IIB in FIG. 2A. FIG. 3 is a perspective view showing a part of the chuck table 100. Furthermore, FIG. 2A, FIG. 2B, and FIG. 3 schematically show the chuck table 100, so the number or shape of the suction holes 131 may not necessarily be the same.

As shown in FIGS. 2A, 2B, and 3, the chuck table 100 includes a main body 110, a porous member 120, and a suction hole arrangement area 130. The body 110 includes ceramic material, stainless steel, or the like.

The porous member 120 includes a porous ceramic material containing alumina or silicon carbide, and has a connected pore structure with a plurality of pores communicating. The porous member 120 is a member having a plurality of pores of 100 μm or less. In the example of FIGS. 2A and 2B, the porous member 120 has a rectangular planar shape, but the planar shape of the porous member 120 is not limited to this, and may be, for example, a circular, elliptical, or polygonal shape other than a quadrilateral. In addition, as shown in FIG. 3, the corner portion of the porous member 120 may include a portion formed in a curved shape. In the suction hole arrangement area 130, a plurality of suction holes 131 are formed. In the example of FIGS. 2A and 2B, three adsorption holes 131 are formed side by side on the short side of the porous member 120, and five adsorption holes 131 are formed side by side on the long side. However, the number of adsorption holes 131 is not limited to this. When the porous member 120 has a rectangular shape, as an example, three or more suction holes 131 are formed side by side on one side. The plurality of adsorption holes 131 may all be arranged at equal intervals, or some of the adsorption holes 131 may be arranged at different intervals. The shape of the suction hole 131 may be a semicircular shape, a part of an elliptical shape, a rectangular shape, or other shapes. The width or diameter of the suction hole 131 is, for example, about 2 mm or more. The shape of a part of the adsorption holes 131 among the plurality of adsorption holes 131 may also be different from others.

The grinding object 100α is arranged in the grinding object arrangement area 110A on the main body 110. The porous member 120 is provided in the first part close to the center of the grinding object placement area 110A. The suction hole arrangement area 130 is located outside the porous member 120. The side surface of the porous member 120 faces the adsorption hole 131. That is, the pores of the porous member 120 communicate with the adsorption holes 131.

The main body 110 includes a suction path 111 and a space 112. The suction path 111 is connected to the suction device 8. The porous member 120 and the adsorption hole 131 are provided on the space 112 communicating with the suction path 111. The porous member 120 and the suction holes 131 adsorb the grinding object 100α. The side surface of the porous member 120 faces the suction hole 131. Therefore, even if the opening of the pore end communicating with the pore is located on the side surface of the porous member 120, the suction force can be used to adsorb the grinding object 100α without being wasted as a leakage component.

On the porous member 120, the suction force is easily dispersed. The suction hole 131 can suck and fix the grinding object 100α with a stronger suction force than the porous member 120. In the chuck table 100 shown in FIGS. 2A, 2B, and 3, it is possible to disperse the suction force in the area near the center of the grinding object placement area 110A, and at the same time to disperse the suction force in the area near the grinding object placement area. In the area of the outer peripheral edge of 110A, the suction holes 131 perform stronger suction. Thereby, the warpage of the grinding object 100α or the floating of the end of the grinding object 100α caused by the spraying of the grinding liquid can be suppressed, and stable suction can be performed, so that a flatter grinding product can be obtained.

4A is a plan view schematically showing a chuck table 200 of a comparative example, and FIG. 4B is a cross-sectional view taken along the line IVB-IVB in FIG. 4A.

The chuck table 200 of the comparative example shown in FIGS. 4A and 4B includes a main body 210 and a plurality of suction holes 231. The main body 210 has a grinding object arrangement area 210A, a suction path 211 and a space 212, and the plurality of suction holes 231 is formed over the entire area of the grinding object placement area 210A.

In the comparative example of FIGS. 4A and 4B, the porous member is not used, and the entire area of the grinding object placement area 210A is adsorbed by the suction holes 231, so the part sucked by the suction holes 231 becomes stretched If the object to be ground is ground in this state, the portion on the suction hole 231 will be relatively thick, and after grinding, the suction trace transferred to the suction hole 231 will remain, which will cause poor appearance One reason for this.

In addition, the distance from the suction hole 231 to the edge of the grinding object placement area 210A is larger than the example shown in FIGS. 2A, 2B, and 3, and therefore, for example, there may be the following: The warpage of the object to be ground caused by the difference or the floating of the end of the object to be ground caused by the jetting of the grinding fluid reduces the thickness of the end after the grinding and breaks. Damage to the end of the object to be ground may cause poor appearance of the product, and may also cause poor operation.

On the other hand, in the chuck table 100 of the present embodiment, the suction force can be dispersed in the area close to the center of the grinding object placement area 110A while being close to the outer periphery of the grinding object placement area 110A. Strong suction is performed in the area to suppress the floating of the end.

FIG. 5A is a plan view schematically showing a chuck table 100 according to another embodiment, and FIG. 5B is a cross-sectional view taken along the line VB-VB in FIG. 5A. In the example shown in FIGS. 5A and 5B, the body 110 has a recess 113. The grinding object placement area 110A is provided on the bottom surface of the recess 113. The other aspects are the same as the examples in FIGS. 2A, 2B, and 3, so detailed descriptions will not be repeated.

In the example shown in FIGS. 5A and 5B, the recessed part 113 is provided so that the porous member 120 and the suction hole arrangement area 130 may be recessed from the outer side part. The object to be ground 100α is fitted into the recess 113. The concave portion 113 can improve the effect of suppressing the penetration of the grinding fluid supplied during the grinding process from the end of the grinding object 100α.

Fig. 6 is a plan view showing a modification of the chuck table 100 shown in Figs. 5A and 5B. In the modification shown in FIG. 6, the recess 113 is formed across the entire diameter direction of the main body 110.

FIG. 7 is a diagram showing a flow of a method of manufacturing a ground product by the grinding device including the chuck table 100 of the present embodiment.

As shown in FIG. 7, the method of manufacturing a ground product includes: step (S1), sucking the object to be ground 100α on the chuck table 100; and step (S2), making the grinding wheel 3 provided with the grinding stone 3B By rotating, the grinding object 100α is ground by the grinding grindstone 3B. In the grinding step (S2), the grinding liquid is supplied to the grinding surface of the grinding target 100α.

Fig. 8 is a diagram showing a grinding object 100α. In one example, the object to be ground 100α includes a supporting member 101α and a sealing resin 102α on the supporting member 101α. In the step (S2) of grinding the grinding object 100α, at least a part of the sealing resin 102α is ground so as to reduce the thickness of the grinding object 100α. That is, the upper surface 103α of the sealing resin 102α is ground. After grinding, the upper surface 104α is exposed.

For semiconductor packages containing the sealing resin 102α, the demand for thickness reduction is increasing year by year, but the mold process itself may not necessarily achieve sufficient thickness reduction. Furthermore, the grinding object 100α tends to increase in size. In addition, there is also a demand for suppressing poor appearance of the product after grinding. By using the chuck table 100 of this embodiment, even a relatively large object to be ground can be sucked and held stably in a flat state, so it is possible to prevent the end of the object to be ground from being excessively ground. damaged. In addition, at the portion located on the porous member 120, no adsorption marks caused by the adsorption holes are generated. As a result of the above, according to the chuck table 100 of the present embodiment, on the one hand, it is possible to suppress the appearance of the product or the occurrence of poor operation, and on the other hand, to produce a sufficiently flat and thin semiconductor package. Furthermore, according to the chuck table 100 of the present embodiment, it is possible to stably suck and hold the object to be ground without particularly providing an additional step. Therefore, it is also possible to suppress the complexity of the steps for stable suction and holding.

Supporting member 101α is a member that supports semiconductor wafers, films, etc., including lead frame, substrate, interposer, semiconductor wafer (silicon wafer, etc.), metal substrate, glass substrate , Ceramic substrates, resin substrates, wiring substrates, etc. The supporting member 101α may be a member to which wiring is applied, or may be a member to which wiring is not applied.

The sealing resin 102α is a resin that seals at least one surface of a semiconductor wafer, a film, or the like supported by the supporting member 101α.

The grinding target of the grinding device of this embodiment is not limited to the sealing resin 102α. In addition to mold resin (mold resin), silicon, copper, tin, etc. can also be ground.

The embodiment of the present invention has been described, but it should be considered that the embodiment disclosed this time is an illustration in all aspects and is not intended to be limiting. The scope of the present invention is expressed by the scope of patent application, and intends to include the meaning equivalent to the scope of patent application and all changes within the scope.

1‧‧‧Base 2‧‧‧Grinding fluid supply part 3‧‧‧Grinding wheel 3A‧‧‧Circular abutment 3B‧‧‧Grinding stone 4‧‧‧Spindle 5‧‧‧Motor 6‧‧‧Connecting part 7‧‧‧Column 8‧‧‧Suction device 100、200‧‧‧Chuck table 100α‧‧‧Grinding object 101α‧‧‧Supporting member 102α‧‧‧Sealing resin 103α、104α‧‧‧Upper surface 110、210‧‧‧Main body 110A, 210A‧‧‧Grinding object placement area 111、211‧‧‧Suction path 112, 212‧‧‧Space 113‧‧‧Concave 120‧‧‧Porous component 130‧‧‧Adsorption hole configuration area 131、231‧‧‧Adsorption hole S1, S2‧‧‧Step

Fig. 1 is an overall view of a grinding device capable of mounting a chuck table according to an embodiment of the present invention. 2A is a plan view schematically showing a chuck table according to an embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along the line IIB-IIB in FIG. 2A. Fig. 3 is a perspective view showing a part of the chuck table shown in Figs. 2A and 2B. 4A is a plan view schematically showing a chuck table of a comparative example, and FIG. 4B is a cross-sectional view taken along the line IVB-IVB in FIG. 4A. Fig. 5A is a plan view schematically showing a chuck table according to another embodiment of the present invention, and Fig. 5B is a VB-VB sectional view of Fig. 5A. Fig. 6 is a plan view showing a modification of the chuck table shown in Figs. 5A and 5B. Fig. 7 is a diagram showing a flow of a method of manufacturing a ground product performed by a grinding device including a chuck table according to an embodiment of the present invention. Fig. 8 is a diagram showing an object to be ground.

100‧‧‧Chuck table

110‧‧‧Ontology

110A‧‧‧Grinding object placement area

120‧‧‧Porous component

130‧‧‧Adsorption hole configuration area

131‧‧‧Adsorption hole

Claims (9)

A chuck table for adsorbing a grinding object, comprising: a main body having an area where the grinding object can be arranged; a porous member provided in the area where the grinding object can be arranged of the main body; And the suction hole arrangement area is provided in the area of the main body where the grinding object can be arranged, and is provided on the outside of the porous member, and the side surface of the porous member faces the suction hole arrangement area. hole. The chuck table described in claim 1, wherein the main body has a recessed portion, and the area where the object to be ground can be placed is provided on the bottom surface of the recessed portion. The chuck table described in item 1 or item 2 of the scope of patent application, wherein a suction path connectable with a suction device is formed in the body, and the porous member and the suction hole arrangement area are provided in In the space communicating with the suction path. The chuck table as described in item 1 or item 2 of the scope of patent application, wherein the porous member comprises a porous ceramic material having a structure of communicating pores. A grinding device, comprising: the chuck table according to any one of items 1 to 4 in the scope of the patent application; and a grinding part that performs the grinding of the object to be ground adsorbed on the chuck table Grinding. The grinding device as described in item 5 of the scope of patent application, which further includes: The grinding fluid supply unit supplies the grinding fluid to the grinding target adsorbed on the chuck table. A method of manufacturing a grinding product, comprising the steps of: adsorbing the grinding object on the chuck table as described in any one of items 1 to 4 of the scope of patent application; and making a grinding stone equipped The grinding part rotates, and the grinding object is ground by the grinding stone. The method for manufacturing a ground product as described in claim 7, wherein in the step of grinding, a grinding fluid is supplied to the grinding surface of the object to be ground. The method of manufacturing a ground product according to claim 7, wherein the object to be ground includes a supporting member and a sealing resin on the supporting member, and the step of grinding the object to be ground The operation includes grinding at least a part of the sealing resin to reduce the thickness of the object to be ground.

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