JP2010017786A - Holding jig - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding tool (10) capable of flexibly corresponding to change of kinds, sizes, and the number of a plurality of plate-like materials (8), reducing sucking trouble such as clogging during sucking, and allowing the plurality of the plate-like materials to be adsorbed and held on a holding table (12). <P>SOLUTION: The holding jig is composed of a hard plate (22) mounted on the holding table and a surface layer member (24) laminated on the hard plate. A number of holes (26) penetrating the hard plate from the surface to the rear surface are formed at the hard plate. A plurality of openings (23) corresponding to the outer shape of the plate-like material are formed at the surface layer member. The thickness of the surface layer member is less than that of the plate-like material. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a holding jig for sucking and holding a plurality of plate-like objects on a holding table.

  In thinning grinding of plate-like materials and surface polishing of plate-like materials, if the outer diameter of the plate-like material to be ground or polished is relatively small, hold multiple sheets at the same time and perform grinding or polishing. Has been given. As a method for holding a plurality of small-diameter plate-like objects, there is a method of creating a special holding table corresponding to the number and size of the plate-like objects and simultaneously holding the plurality of sheets. However, when processing plates with different numbers or sizes, it is necessary to create a holding table according to the number and size, and it is necessary to replace the holding table as needed. Not efficient. A method of attaching a large number of plate-like objects to the tape and simultaneously grinding or polishing the tape is also employed, but there is a tendency that pressing cracks occur during grinding and polishing due to the elasticity of the adhesive layer of the tape.

Therefore, a technique for adsorbing and holding a free-size wafer by simply exchanging the ceramic mask without exchanging the vacuum chuck table when grinding or polishing wafers having different sizes is proposed in Patent Document 1. . The system of the cited document 1 includes a cup-shaped vacuum chuck base having a suction hole penetrating on the bottom surface and having a recess, an adsorption platform formed of porous ceramic that fits into the recess of the vacuum chuck base, and an adsorption platform. A holding table having an air-impermeable ceramic mask covering between the outer periphery of the silicon wafer placed on the upper surface and the upper surface of the outer peripheral edge of the vacuum chuck base is used. The thickness of the ceramic mask is thinner than the thickness of the silicon wafer, and the free-sized silicon wafer is sucked and held only by exchanging the ceramic mask.
JP 2000-343363 A

  However, even in this method, it is necessary to prepare and store many types of ceramic masks, and it is not economical. In addition, if you want to process a plate or a plate that is not prepared, it is not flexible enough. . Further, when the plate-like object is sucked and held directly on the holding table together with the ceramic mask, there is also a problem that grinding dust enters the suction hole of the holding table through the gap between the ceramic mask and the plate-like object, and the suction hole is blocked. .

  The present invention has been made in view of the above facts, and its main technical problem is that it can flexibly respond to changes in the type, size, and number of plate-like objects, and suction such as clogging during suction. It is to provide a holding jig that can reduce trouble.

  According to the present invention, as a holding jig for achieving the main technical problem, a holding jig for vacuum-sucking a plurality of plate-like objects on a holding table, the hard jig placed on the holding table. It is composed of a plate and a surface layer member laminated on the hard plate, and the hard plate has a plurality of holes penetrating from the front surface to the back surface, and the surface layer member has a plurality corresponding to the outer shape of the plate-like object. There is provided a holding jig characterized in that the thickness of the surface layer member is smaller than the thickness of the plate-like object.

  It is preferable that the surface layer member is formed of a synthetic resin sheet or a synthetic resin film, and that the surface layer member is adhered to the upper surface of the hard plate.

  It is possible to respond flexibly to changes in the type, size, and number of plate-like objects, and it is possible to reduce suction troubles such as clogging during suction. Specifically, when the size and number of plate-like objects are changed, the surface layer member laminated on the hard plate is replaced with a new surface layer member having openings corresponding to the changed size and number. Change it. Therefore, the holding jig can be changed flexibly and easily. In addition, since a plurality of plate-like objects are sucked and held via the hard plate of the holding jig, it is avoided or suppressed that grinding scraps and the like during grinding remain on the surface of the hard plate and penetrate into the holding table. Suction troubles such as clogging of the surface can be reduced.

  Hereinafter, the best mode of the holding jig of the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 shows a main part of a typical example of a grinding apparatus in which the holding jig of the present invention is used. For the entire configuration of the grinding apparatus, see, for example, the description in JP-A-2004-014939. The grinding apparatus includes a grinding means 1 at a predetermined position. The grinding means 1 includes a casing (not shown) and a spindle 2 that is rotatably disposed in the casing by driving a motor (not shown). An annular grinding wheel 6 is disposed at the tip of the spindle 2 via a wheel mount 4. The plurality of plate-like objects 8 are sucked and held on the holding table 12 via the holding jig 10 of the present invention.

  Continuing the description with reference to FIG. 2, the holding table 12 includes a table body 14 and a suction holding chuck 16 disposed on the upper surface of the table body 14. The table main body 14 is formed on a disk by a metal material such as stainless steel, and a circular fitting recess 18 is formed on the upper surface. Then, the suction holding chuck 16 formed by a porous member made of porous ceramics or the like having innumerable suction holes is fitted into the fitting recess 18. The suction holding chuck 16 functions as a holding surface for sucking and holding the holding jig 10. The table body 14 is formed with a communication passage 20 that communicates with the fitting recess 18. A suction means (not shown) communicates with the communication path 20. The table body 14 is rotatably installed and is driven to rotate by an electric motor (not shown).

  Next, the configuration of the holding jig of the present invention will be described with reference to FIG. The holding jig 10 has a disk shape that is slightly larger than the outer diameter size of the suction holding chuck 16 and smaller than the outer diameter of the table body, and is a hard plate 22 and a surface layer laminated on the surface layer side of the hard plate 22. It is formed from the member 24.

  It is important that the hard plate 22 is made of a hard material having a Young's modulus of 40 GPa or more. This hardness is a hardness at which the hard plate 22 is not elastically substantially deformed or displaced even when a plate-like object placed on the upper surface of the hard plate 22 is pressed by a processing tool during grinding or polishing. is there. Specifically, it is preferably formed from a hard material such as metal, ceramic, glass, sapphire having a Young's modulus of 40 GPa or more. Particularly, a metal of 60 GPa or more, more preferably a stainless steel plate of 200 GPa or more is optimal, and when it is formed of a metal having excellent thermal conductivity, the effect of improving the processing quality when grinding or polishing difficult-to-cut materials. Also play. In FIG. 3, it is formed from a disk-shaped stainless steel plate having a thickness of about 1 mm, for example, and has a large number of through holes 26 penetrating from the front surface to the back surface. The through holes 26 are holes having an inner diameter of about 100 μm and are formed in a large number of radial shapes passing through the center of the hard plate 22. The through-holes 22 are not limited to this embodiment, and may be formed evenly on the entire disk shape. The thickness suitable for the hard plate 22 is preferably a thickness that can maintain the flatness to some extent, and is about 1 mm according to experiments by the present inventors.

  The surface layer member 24 is formed by cutting a synthetic resin sheet or film having a thickness of several tens to several hundreds of μm into the size of the hard plate 22. The lower surface of the synthetic resin sheet or film is preferably coated with an adhesive that is advantageously UV curable. Further, if the grinding wheel 6 grinds the synthetic resin sheet or film during grinding, the tip of the grinding wheel 6 may be clogged due to the influence of the synthetic resin sheet or film. The thickness is preferably thinner than the desired thickness after grinding the plate-like material. In the surface layer member 24 formed in such a form, an opening 23 corresponding to the outer diameter of the plate-like object to be held and the position to be placed is formed and attached to the upper surface of the hard plate 22.

  Further, the grinding operation using the holding jig of the present invention will be described with reference to FIG. A plurality of workpieces, that is, plate-like objects 8 are placed on the holding table 12 in a state where they are placed in the openings 23 on the holding jig 10. At this time, since the opening 23 is approximately the same size as the plate-like object 8, the side surface of the plate-like object 8 is restrained by the surface layer member 24, and if it is handled horizontally, it is mounted without moving. Is placed. When the holding jig 10 is placed on the holding means, the suction means (not shown) is operated. The holding jig 10 is vacuum-sucked by the suction chuck 26 by a vacuum suction action from the suction-holding chuck 26 and suction-holds the plurality of plate-like objects 8 placed thereon.

  Thereafter, the plate-like object 8 is ground by the grinding means 1. During grinding, the annular grinding wheel 6 is positioned at the rotation center of the holding table 12 and the grinding wheel 6 is gradually cut and ground from the surface position of the plate-like object 8 while rotating the grinding wheel 6 and the holding table 12. I do. When the desired grinding thickness is reached, the grinding operation is terminated, the suction means is deactivated, the vacuum suction is released, the holding jig 10 is removed from the holding table 12, and the plurality of plate-like objects 8 are removed from the holding jig 10. Remove. Thereafter, a new plate-like object is placed in the opening 23 and a grinding process is performed. In order to suck and hold the plurality of plate-like objects 8 via the hard plate 22 of the holding jig 10, grinding scraps and the like during grinding remain on the surface of the surface layer member 24 or the surface of the hard plate 22, and the suction holding chuck of the holding table 12. Intrusion up to 16 is sufficiently avoided or suppressed, and therefore suction troubles such as clogging of the suction holding chuck 16 of the holding table 12 can be reduced.

  Here, a method of changing the holding jig 10 for different types and sizes of plate-like objects will be described. For example, when the surface layer member 24 is made from a synthetic resin sheet or film having a UV curable adhesive applied to the lower surface, first, the adhesive layer is UV cured, and the surface layer member 24 is peeled from the hard plate 22. Then, a desired holding jig 10 can be easily created by forming a desired size and number of openings 23 in a required mounting position in a new surface layer member 24 and attaching the openings 23 to the hard plate 22 again. it can. As described above, in the holding jig of the present invention, it is possible to change the size and number of desired plate-like objects only by changing the surface layer member 24 formed of a synthetic resin sheet or film. 10 can be changed flexibly.

The principal part perspective view which shows the state which uses the holding jig of this invention in a grinding device. Sectional drawing which shows the state which vacuum-sucks the plate-shaped object to the holding table via the holding jig. The disassembled perspective view of the holding jig of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cutting device 6 Grinding wheel 8 Plate-shaped object 10 Holding jig 12 Holding table 22 Hard plate 23 Opening part 24 Surface layer member 26 Through-hole

Claims (3)

  A holding jig for vacuum adsorbing a plurality of plate-like objects on a holding table, comprising a hard plate placed on the holding table and a surface layer member laminated on the hard plate, The hard plate has a large number of holes penetrating from the front surface to the back surface, and the surface layer member has a plurality of openings corresponding to the outer shape of the plate-like material, and the thickness of the surface layer member Is smaller than the thickness of the plate-like object.   The holding jig according to claim 1, wherein the surface layer member is formed of a synthetic resin sheet or a synthetic resin film.   The holding jig according to claim 1, wherein the surface layer member is attached to the upper surface of the hard plate.

Images