JPS6056461U - polishing jig - Google Patents

polishing jig

Info

Publication number
JPS6056461U
JPS6056461U JP1983148136U JP14813683U JPS6056461U JP S6056461 U JPS6056461 U JP S6056461U JP 1983148136 U JP1983148136 U JP 1983148136U JP 14813683 U JP14813683 U JP 14813683U JP S6056461 U JPS6056461 U JP S6056461U
Authority
JP
Japan
Prior art keywords
plate
polishing jig
hole
elastic layer
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983148136U
Other languages
Japanese (ja)
Inventor
南山　隆幸
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1983148136U priority Critical patent/JPS6056461U/en
Publication of JPS6056461U publication Critical patent/JPS6056461U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の研磨治具及びこの研磨治具
に対するウェーハの着脱に用いられる装置の分解図、第
２図は第１図の研磨治具の要部断面図である。 １：リファしンスープレート、２：シート（弾性層）、
３：テンプレート、４：円孔（透孔）、５．６：小孔（
貫通小孔）。FIG. 1 is an exploded view of a polishing jig according to an embodiment of the present invention and a device used for attaching and removing a wafer to and from the polishing jig, and FIG. 2 is a sectional view of a main part of the polishing jig shown in FIG. 1. 1: Reference soup plate, 2: Sheet (elastic layer),
3: Template, 4: Circular hole (through hole), 5.6: Small hole (
small through hole).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 板状のリファレンスＯプレートと、このリファレンス・
プレートの一方の主面上に形成された弾性層と、この弾
性層に取着され透孔が穿設されたテンプレートとを備え
、上記リファレンス・プレート及び上記弾性層の少な′
くとも上記透孔配設位置に対応する部分には複数の貫通
小孔が分散して穿設されていることを特徴とする研磨治
具。A plate-shaped reference O plate and this reference
The reference plate includes an elastic layer formed on one main surface of the plate, and a template attached to the elastic layer and having a through hole formed therein.
A polishing jig characterized in that a plurality of small through-holes are formed in a distributed manner at least in a portion corresponding to the position where the through-hole is provided.
JP1983148136U 1983-09-27 1983-09-27 polishing jig Pending JPS6056461U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983148136U JPS6056461U (en) 1983-09-27 1983-09-27 polishing jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983148136U JPS6056461U (en) 1983-09-27 1983-09-27 polishing jig

Publications (1)

Publication Number Publication Date
JPS6056461U true JPS6056461U (en) 1985-04-19

Family

ID=30329216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983148136U Pending JPS6056461U (en) 1983-09-27 1983-09-27 polishing jig

Country Status (1)

Country Link
JP (1) JPS6056461U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09103957A (en) * 1995-06-29 1997-04-22 Delco Electronics Corp Apparatus and process for grinding back side of wafer with no coating film
JP2010017786A (en) * 2008-07-09 2010-01-28 Disco Abrasive Syst Ltd Holding jig

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840338B2 (en) * 1976-03-19 1983-09-05 松下電器産業株式会社 Manufacturing method for semiconductor devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840338B2 (en) * 1976-03-19 1983-09-05 松下電器産業株式会社 Manufacturing method for semiconductor devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09103957A (en) * 1995-06-29 1997-04-22 Delco Electronics Corp Apparatus and process for grinding back side of wafer with no coating film
JP2010017786A (en) * 2008-07-09 2010-01-28 Disco Abrasive Syst Ltd Holding jig

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