CN110605636A

CN110605636A - Chuck table, grinding device, and method for manufacturing grinding product

Info

Publication number: CN110605636A
Application number: CN201910475572.8A
Authority: CN
Inventors: 高森雄大
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2018-06-15
Filing date: 2019-06-03
Publication date: 2019-12-24
Anticipated expiration: 2039-06-03
Also published as: JP7034845B2; KR102209921B1; KR20190142213A; CN110605636B; TW202000367A; TWI700148B; JP2019217561A

Abstract

The present invention is a chuck table for adsorbing a grinding object, the chuck table including: a main body having a region in which an object to be ground can be placed; a porous member provided in a region of the main body where the grinding object can be disposed; and an adsorption hole arrangement region provided in a region of the body in which the grinding object can be arranged, and outside the porous member. The chuck table of the present invention can stably adsorb and hold a grinding object while suppressing the complexity of the process, and can further suppress the occurrence of appearance defects or running defects of the grinding product. The invention also provides a grinding device and a method for manufacturing the grinding product.

Description

Chuck table, grinding device, and method for manufacturing grinding product

Technical Field

The present invention relates to a chuck table (chuck table), a grinding apparatus, and a method of manufacturing a grinding product.

Background

Conventionally, grinding of a grinding object attached to a chuck table by a grinding device has been carried out. As one embodiment, there is a method of forming a suction holding portion of an object to be ground using a porous member.

Japanese patent laid-open No. 2016-: when the suction holding portion is formed of a porous member such as porous ceramics (ceramic), the outer peripheral edge of the package substrate as an object to be ground is covered with a sheet (sheet), and the sheet and the package substrate are suction-held, whereby leakage of suction force from between the outer peripheral edge of the package substrate and the object to be ground is suppressed.

Disclosure of Invention

In patent document 1, since the suction force can be prevented from leaking from the holding surface while the warpage of the workpiece is corrected by the sheet, the package substrate can be reliably sucked and held by the chuck table (see paragraph [0014] of patent document 1).

However, in the grinding method described in patent document 1, a step of providing a thin sheet is required separately, and the step may become complicated. Further, due to the limitation of durability of the sheet, the sheet may not be used many times. If the sheet is broken or detached in the grinding step, the outer peripheral edge of the package substrate cannot be sucked and held, and the package substrate may be broken. The breakage of the package substrate may lead to poor appearance and poor operation.

The invention aims to provide a chuck table and a grinding device, which can prevent the process from becoming complicated and stably adsorb and hold a grinding object, and provide a method for manufacturing a grinding product, which can prevent the appearance of the product from being poor or the operation from being poor.

The chuck table of the present invention is a chuck table for adsorbing a grinding object, and includes: a main body having a region in which an object to be ground can be placed; a porous member provided in a region of the main body where the grinding object can be disposed; and an adsorption hole arrangement region provided in a region of the body in which the grinding object can be arranged, and outside the porous member.

The grinding device of the invention comprises the chuck table and a grinding part for grinding the grinding object adsorbed on the chuck table.

The method for manufacturing a grinding product of the present invention includes the steps of: adsorbing a grinding object on the chuck table; and rotating the grinding portion on which the grinding stone is disposed, and grinding the grinding object by the grinding stone.

According to the present invention, the grinding object can be stably held by suction while the process is prevented from becoming complicated. As a result, the occurrence of appearance defects or running defects of the grinding product can be suppressed.

These and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description, which is considered in conjunction with the accompanying drawings.

Drawings

Fig. 1 is an overall view of a grinding apparatus to which a chuck table according to an embodiment of the present invention can be attached.

Fig. 2A is a plan view schematically showing a chuck table according to an embodiment of the present invention, and fig. 2B is a sectional view of IIB-IIB of fig. 2A.

Fig. 3 is a perspective view showing a part of the chuck table shown in fig. 2A and 2B.

Fig. 4A is a plan view schematically showing a chuck table of a comparative example, and fig. 4B is a sectional view of IVB-IVB of fig. 4A.

Fig. 5A is a plan view schematically showing a chuck table according to another embodiment of the present invention, and fig. 5B is a cross-sectional view from VB to VB of fig. 5A.

Fig. 6 is a plan view showing a modification of the chuck table shown in fig. 5A and 5B.

Fig. 7 is a flowchart showing a method of manufacturing a ground product by a grinding apparatus including a chuck table according to an embodiment of the present invention.

Fig. 8 is a diagram illustrating an object to be ground.

Description of the symbols

1: base seat

2: grinding fluid supply unit

3: grinding wheel

3A: annular base station

3B: grinding grindstone

4: main shaft

5: motor with a stator having a stator core

6: connecting part

7: column part

8: suction device

100. 200: chuck table

100 alpha: grinding object

101 α: supporting member

102 α: sealing resin

103 α, 104 α: upper surface of

110. 210: body

110A, 210A: grinding object arrangement region

111. 211: suction path

112. 212, and (3): space(s)

113: concave part

120: porous member

130: adsorption hole arrangement region

131. 231: adsorption hole

S1, S2: procedure (ii)

Detailed Description

Hereinafter, embodiments of the present invention will be described. Note that the same or corresponding portions are denoted by the same reference numerals, and a description thereof may not be repeated.

In the embodiments described below, when the number, amount, and the like are mentioned, the scope of the present invention is not necessarily limited to the number, amount, and the like unless otherwise specified. In the following embodiments, each constituent element is not necessarily essential to the present invention unless otherwise specifically described.

Fig. 1 is a diagram showing an overall configuration of a grinding apparatus. As shown in fig. 1, the grinding apparatus includes a base 1, a grinding fluid supply unit 2, a grinding wheel 3, a spindle (spindle)4, a motor 5, a connection unit 6, a column unit 7, and a suction unit 8.

A chuck table 100 (suction jig) is provided on the base 1. The chuck table 100 can adsorb the grinding object 100 α.

The chuck table 100 is disposed on the base 1 at a distance from the column portion 7 in the X direction (horizontal direction). The grinding object 100 α is provided on the chuck table 100. The grinding fluid supply unit 2 supplies a grinding fluid (e.g., pure water) to a grinding surface of the object to be ground 100 α. The grinding fluid supply unit 2 is not particularly limited as long as it can supply the grinding fluid to the grinding surface of the object to be ground 100 α.

The grinding wheel 3 (grinding portion) includes an annular base 3A and a grinding wheel 3B attached to the annular base 3A. The grinding stone 3B is configured by arranging a plurality of grinding stones in a ring shape. The grinding stone 3B is, for example, a diamond grinding stone. The grinding wheel 3 is attached to an end of the spindle 4 opposite to the end on the motor 5 side. The grinding wheel 3 is rotatable about an axis extending in the Z direction.

The main shaft 4 has one end attached to a motor 5 and extends in the Z direction (vertically downward direction). The motor 5 is attached to an end of the coupling portion 6 in the X direction. The connection portion 6 extends in the X direction from an end of the pillar portion 7 opposite to the end on the base 1 side. The pillar portion 7 extends in the Z direction (vertically upward direction) from an area of an end portion of the base 1. The chuck table 100 is connected to a suction device 8 including a vacuum pump and the like. By operating the suction device 8, the grinding object 100 α is sucked and held by the chuck table 100.

Fig. 2A is a plan view schematically showing the chuck table 100, and fig. 2B is a sectional view of IIB-IIB of fig. 2A. Fig. 3 is a perspective view showing a part of the chuck table 100. Since the chuck table 100 is schematically shown in fig. 2A, 2B, and 3, the number, shape, and the like of the suction holes 131 do not necessarily match.

As shown in fig. 2A, 2B, and 3, the chuck table 100 includes a body 110, a porous member 120, and a suction hole arrangement region 130. The body 110 comprises a ceramic material or stainless steel, etc.

The porous member 120 includes a porous ceramic material containing alumina or silicon carbide, and has a connected pore structure in which a plurality of pores are connected. The porous member 120 is a member having a plurality of pores of 100 μm or less. In the example of fig. 2A and 2B, the porous member 120 has a rectangular planar shape, but the planar shape of the porous member 120 is not limited thereto, and may be, for example, a circular or elliptical shape, or a polygonal shape other than a quadrilateral shape. As shown in fig. 3, the corner (corner) portion of the porous member 120 may include a curved portion. In the suction hole arrangement region 130, a plurality of suction holes 131 are formed. In the example of fig. 2A and 2B, three adsorption holes 131 are formed in parallel on the short sides and five adsorption holes 131 are formed in parallel on the long sides of the porous member 120, respectively, but the number of the adsorption holes 131 is not limited thereto. When the porous member 120 has a rectangular shape, for example, three or more adsorption holes 131 are formed in parallel on one side. The plurality of suction holes 131 may be arranged at equal intervals, or some of the suction holes 131 may be arranged at different intervals. The shape of the suction hole 131 may be a semicircular shape, may have a part of an elliptical shape, may be a rectangular shape, or may have another shape. The width or diameter of the adsorption hole 131 is, for example, about 2mm or more. The shape of some of the plurality of suction holes 131 may be different from others.

The grinding object 100 α is disposed in a grinding object disposition area 110A on the main body 110. The porous member 120 is provided at a first portion near the center of the grinding object disposition region 110A. The adsorption hole arrangement region 130 is located outside the porous member 120. The side surface of the porous member 120 faces the adsorption hole 131. That is, the pores of the porous member 120 communicate with the adsorption pores 131.

The body 110 includes a suction path 111 and a space 112. The suction path 111 is connected to the suction device 8. The porous member 120 and the adsorption hole 131 are provided in the space 112 communicating with the suction path 111. The grinding object 100 α is adsorbed by the porous member 120 and the adsorption holes 131. The side surface of the porous member 120 faces the adsorption holes 131, and therefore even if the openings of the pore ends communicating with the pores are located on the side surface of the porous member 120, the suction force can be used for adsorption of the grinding object 100 α without being wasted as a leakage component.

On the porous member 120, the suction force is easily dispersed. The suction holes 131 can suck and fix the object to be ground 100 α with a stronger suction force than the porous member 120. In the chuck table 100 shown in fig. 2A, 2B, and 3, suction can be performed more strongly by the suction holes 131 in the region near the outer peripheral edge of the grinding target arrangement region 110A while dispersing the suction force in the region near the center of the grinding target arrangement region 110A. This can suppress the warpage of the object to be ground 100 α and the floating of the end of the object to be ground 100 α caused by the ejection of the grinding liquid, thereby performing stable adsorption, and obtaining a flatter ground product.

Fig. 4A is a plan view schematically showing a chuck table 200 of a comparative example, and fig. 4B is a sectional view of IVB-IVB of fig. 4A.

The chuck table 200 of the comparative example shown in fig. 4A and 4B includes a main body 210 and a plurality of suction holes 231, the main body 210 has a grinding object disposition region 210A, a suction path 211, and a space 212, and the plurality of suction holes 231 are formed over the entire area of the grinding object disposition region 210A.

In the comparative example of fig. 4A and 4B, since the suction holes 231 are sucked through the entire area of the grinding object disposition area 210A without using a porous member, the part sucked through the suction holes 231 is in a stretched state, and if the grinding object is ground in this state, the part on the suction holes 231 becomes relatively thick, and a suction mark transferred to the suction holes 231 remains after grinding, which becomes one cause of poor appearance.

Further, since the distance from the suction hole 231 to the edge of the grinding object disposition region 210A is larger than the examples of fig. 2A, 2B, and 3, for example, the following may occur: the thickness of the end portion after grinding is reduced and the end portion is damaged due to warpage of the grinding object caused by the difference in thermal shrinkage rates between the substrate and the mold resin and floating of the end portion of the grinding object caused by ejection of the grinding liquid. The breakage of the end portion of the grinding object may cause a defective appearance of the product and may cause a defective operation.

In contrast, in the chuck table 100 of the present embodiment, while the suction force is dispersed in the region near the center of the grinding object disposition region 110A, strong suction is performed in the region near the outer peripheral edge of the grinding object disposition region 110A, and floating of the end portion can be suppressed.

Fig. 5A is a plan view schematically showing a chuck table 100 according to another embodiment, and fig. 5B is a cross-sectional view from VB to VB of fig. 5A. In the example shown in fig. 5A, 5B, the body 110 has a recess 113. The grinding object disposition region 110A is provided on the bottom surface of the recess 113. Other points are the same as those in fig. 2A, 2B, and 3, and thus detailed description thereof will not be repeated.

In the example shown in fig. 5A and 5B, the concave portion 113 is provided so that the porous member 120 and the suction hole arrangement region 130 are recessed from the outer portion. The grinding object 100 α is fitted into the recess 113. The recessed portion 113 can improve the effect of suppressing the grinding fluid supplied during grinding from penetrating from the end of the object to be ground 100 α.

Fig. 6 is a plan view showing a modification of the chuck table 100 shown in fig. 5A and 5B. In the modification shown in fig. 6, the recess 113 is formed over the entire diameter of the body 110.

Fig. 7 is a flowchart showing a method for manufacturing a ground product by a grinding apparatus including the chuck table 100 according to the present embodiment.

As shown in fig. 7, the method of manufacturing the abrasive product includes: a step (S1) of sucking the grinding object 100 α on the chuck table 100; and a step (S2) of rotating the grinding wheel 3 on which the grinding stone 3B is disposed, and grinding the grinding object 100 α with the grinding stone 3B. In the grinding step (S2), the grinding fluid is supplied to the grinding surface of the object to be ground 100 α.

Fig. 8 is a diagram illustrating the object to be ground 100 α. In one example, the grinding object 100 α includes a support member 101 α, and a sealing resin 102 α on the support member 101 α. In the step (S2) of grinding the object to be ground 100 α, at least a part of the sealing resin 102 α is ground so as to reduce the thickness of the object to be ground 100 α. That is, the upper surface 103 α of the sealing resin 102 α is ground. After grinding, the upper surface 104 α is exposed.

Although the demand for thinning semiconductor packages including the sealing resin 102 α has increased year by year, sufficient thinning may not be achieved by mold processing (mold process) itself. Further, the grinding object 100 α tends to be large. There is also a demand for suppressing the appearance defects of the product after grinding. By using the chuck table 100 of the present embodiment, even a relatively large grinding object can be stably held by suction in a flat state, and therefore, the occurrence of damage due to excessive grinding of the end portion of the grinding object can be suppressed. Further, no adsorption mark due to the adsorption hole is generated in the portion located on the porous member 120. As a result, according to the chuck table 100 of the present embodiment, while suppressing the occurrence of the appearance defect or the operation defect of the product, it is possible to manufacture a sufficiently flat and thin semiconductor package. Further, according to the chuck table 100 of the present embodiment, since the grinding object can be stably sucked and held without providing an additional process, complication of the process for stable suction and holding can be suppressed.

The support member 101 α is a member for supporting a semiconductor chip, a film, or the like, and includes a lead frame (lead frame), a substrate (substrate), an interposer (interposer), a semiconductor wafer (silicon wafer or the like), a metal substrate, a glass substrate, a ceramic substrate, a resin substrate, a wiring substrate, or the like. The support member 101 α may be a member to which wiring is applied or a member to which wiring is not applied.

The sealing resin 102 α is a resin that seals at least one surface of the semiconductor chip, the film, or the like supported by the supporting member 101 α.

The grinding target of the grinding apparatus of the present embodiment is not limited to the sealing resin 102 α. Silicon, copper, tin, or the like may be a grinding target in addition to the mold resin (mold resin).

The embodiments of the present invention have been described, but it should be understood that the embodiments disclosed herein are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the appended claims, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein.

Claims

1. A chuck table for adsorbing a grinding object, characterized by comprising:

a main body having a region in which the grinding object can be disposed;

a porous member provided in a region of the main body in which the grinding object can be disposed; and

and an adsorption hole arrangement region provided in a region of the main body in which the grinding object can be arranged, and outside the porous member.

2. The chuck table according to claim 1,

the body is provided with a concave part,

the region where the grinding object can be disposed is provided on the bottom surface of the recess.

3. The chuck table according to claim 1 or claim 2,

a suction path connectable with a suction device is formed in the body,

the porous member and the adsorption hole arrangement region are provided in a space communicating with the suction path.

4. The chuck table according to claim 1 or claim 2,

the side surface of the porous member faces the adsorption holes of the adsorption hole arrangement region.

5. The chuck table according to claim 1 or claim 2,

the porous member comprises a porous ceramic material having a structure of interconnected pores.

6. A grinding apparatus, comprising:

the chuck table according to any one of claims 1 to 5; and

and a grinding section for grinding the grinding object attached to the chuck table.

7. The grinding apparatus of claim 6, further comprising:

and a grinding fluid supply unit configured to supply a grinding fluid to the grinding object attached to the chuck table.

8. A method for manufacturing a grinding product, characterized by comprising the steps of:

adsorbing the grinding object on a chuck table according to any one of claims 1 to 5; and

a grinding portion on which a grinding stone is disposed is rotated, and an object to be ground is ground by the grinding stone.

9. The method of manufacturing a grinding article according to claim 8,

in the grinding step, a grinding fluid is supplied to a grinding surface of the grinding object.

10. The method of manufacturing a grinding article according to claim 8,

the grinding object comprises a support member and a sealing resin on the support member,

the step of grinding the grinding object includes the following operations: and grinding at least a part of the sealing resin so as to reduce the thickness of the grinding object.