JP6464818B2 - Dicing machine and table for dicing machine - Google Patents

Description

  The present invention relates to a dicing apparatus and a table for the dicing apparatus, and more particularly to a dicing apparatus and a dicing apparatus in which a semiconductor wafer on which a plurality of semiconductor elements are manufactured is sucked and held on the table and the semiconductor elements are cut into chips by a blade. Related to the table.

  In the semiconductor manufacturing process, various processes are performed on the surface of a thin plate-shaped semiconductor wafer to manufacture a plurality of semiconductor elements having electronic devices. Each chip of the semiconductor element is inspected for electrical characteristics by an inspection apparatus, and then cut and separated for each chip by a cutting means such as a blade of a dicing apparatus (also called a dicer) or a laser.

  In the dicing process, as in Patent Document 1, the semiconductor wafer is half-cut with a blade, and then the back surface is ground and cut for each chip. Prior to dicing, the back surface of the semiconductor wafer is ground. A second mode is known in which dicing is performed after processing to reduce the thickness of a semiconductor wafer.

  In the first mode, dicing is performed by generally sucking and holding a disk-shaped semiconductor wafer on a circular suction portion of a table (also referred to as a dicing table). For this reason, the diameter of the adsorption part of the table is configured to be smaller than the diameter of the semiconductor wafer, thereby preventing vacuum leakage of the adsorption surface during dicing.

  On the other hand, in the second embodiment, a tape (also referred to as a dicing tape) is attached to the back surface of the semiconductor wafer before dicing, and the semiconductor wafer is mounted on a ring-shaped frame via the tape, and then dicing is performed. Processing.

  In the second embodiment, the diameter of the suction portion of the table is configured to be larger than the diameter of the semiconductor wafer, thereby preventing occurrence of problems such as chipping during dicing. That is, the entire area of the semiconductor wafer is held via the tape within the area of the suction portion, thereby preventing the chipping of the semiconductor element located particularly on the outer periphery of the semiconductor wafer.

  The table is composed of a suction part made of a porous material and having a flat suction surface, and a metal table body that supports the outer periphery of the suction part. The suction surface of the suction part is connected to the upper surface of the table body. It is arranged on the same plane.

  The first form is sometimes referred to as frameless dicing, and the second form is sometimes referred to as frame dicing.

JP 11-40520 A

  When the table of the first form is used together as the table for the semiconductor wafer of the second form, the following problems occur. First, as a premise, in order to prevent vacuum leakage, the wafer of the first form can be used only by the table of the first form. Therefore, when the semiconductor wafer of the second form is held on the table of the first form and dicing is performed, the following problems occur.

  The semiconductor wafer of the second form is generally larger in diameter than the semiconductor wafer of the first form. For example, the diameter of the semiconductor wafer of the second embodiment is 300 mm, and the diameter of the semiconductor wafer of the first embodiment is 200 mm. In this case, if the semiconductor wafer of the second form is sucked and held on the table of the first form, the outer periphery of the semiconductor wafer of the second form may be located outward from the outer periphery of the suction surface of the table. . That is, dicing may be performed in an unstable state in which the outer peripheral portion of the semiconductor wafer of the second embodiment is not sucked and held on the suction surface via the tape.

  In the second embodiment, dicing is performed while applying tension from the frame to the semiconductor wafer via the tape, and unstable semiconductor elements located on the outer periphery of the semiconductor wafer are cut while being finely moved by the tension. . Due to this phenomenon, since the cut line by the blade deviates from the regular line, there is a problem in that a shape defect occurs in the semiconductor element located on the outer peripheral portion and the quality of the semiconductor element is deteriorated.

  In addition, the tape is tensioned obliquely downward with respect to the upper surface of the table body. At this time, the outer peripheral edge of the upper surface of the table main body comes into contact with the tape, and a phenomenon occurs that the tape in the contact portion, that is, on the suction portion side with respect to the contact portion, swells near the contact portion. Due to this phenomenon as well, there has been a problem that a shape defect occurs in the semiconductor element located on the outer peripheral portion.

  Applying tension to the semiconductor wafer via the tape is an indispensable means for fixing the semiconductor wafer to the table. Therefore, in the conventional dicing apparatus, it has been difficult to solve the above-mentioned problem caused by the tape tension.

  Therefore, conventionally, when the semiconductor wafers of the first and second forms are diced by the same dicing apparatus, it is necessary to replace them with a table suitable for the semiconductor wafers of the first and second forms. there were.

  However, replacing the table requires time and labor for attaching and detaching the suction system to and from the table, and the table is also a very expensive member, so it has been desired to use the table together.

  The present invention has been made in view of such circumstances, and in a form in which a semiconductor wafer is attached to a tape and diced, a semiconductor wafer having a diameter larger than the diameter of the adsorption portion of the table is satisfactorily cut. An object of the present invention is to provide a dicing apparatus and a table for the dicing apparatus that can be used.

  One aspect of the dicing apparatus of the present invention is a dicing apparatus in which a semiconductor wafer is sucked and held on a table and a semiconductor element of the semiconductor wafer is cut for each chip by a cutting means in order to achieve the object of the present invention. An adsorbing part for adsorbing and holding a semiconductor wafer, a ring-shaped main body arranged outside the adsorbing part to support the adsorbing part, an upper surface of the main body arranged on the same surface as the adsorbing surface of the adsorbing part, and a main body And a suction means connected to the suction port.

  One aspect of a table for a dicing apparatus of the present invention is a table for a dicing apparatus that sucks and holds a semiconductor wafer in order to achieve the object of the present invention. A ring-shaped main body that is arranged outside the unit and supports the suction part, a top surface of the main body that is disposed on the same surface as the suction surface of the suction part, a suction port formed on the top surface of the main body, and suction And suction means connected to the mouth.

  According to one aspect of the present invention, a suction port is formed on the upper surface of the main body of the table, and the suction port has the same suction function as the suction portion. Thereby, when the semiconductor wafer of the second form is held on the table, the outer peripheral portion of the semiconductor wafer is sucked and held by the suction port via the tape, so that the outer peripheral portion of the semiconductor wafer is stabilized on the table. Held.

  Thereby, the problem caused by the tension of the tape, that is, the problem of fine movement of the semiconductor element during the dicing process and the problem of the swelling of the tape can be solved by the suction action by the suction port.

  Therefore, according to one aspect of the present invention, a semiconductor wafer having a diameter larger than the diameter of the adsorption portion of the table can be satisfactorily cut in a form in which the semiconductor wafer is attached to a tape and diced. Therefore, the table for the semiconductor wafer of the first form can be used together as the table for the semiconductor wafer of the second form. This eliminates the need to change the table along with the change of the semiconductor wafer, thereby improving the processing efficiency of the semiconductor wafer and improving the production efficiency of the semiconductor element.

  In one embodiment of the present invention, the suction port is preferably disposed around the suction portion.

  According to one aspect of the present invention, by arranging the suction port around the suction portion, the outer peripheral portion of the semiconductor wafer can be stably held on the table via the tape.

  In one embodiment of the present invention, the suction port is preferably arranged along the outer periphery of the suction part having a circular shape in plan view.

  According to one aspect of the present invention, in the case of a suction part having a circular shape in plan view, the suction port is arranged along the outer periphery of the suction part. Thereby, the outer peripheral part of a semiconductor wafer can be stably hold | maintained on a table via a tape. Further, when the shape of the suction portion in plan view is not circular, a single or a plurality of suction ports may be arranged outside the suction portion.

  In one embodiment of the present invention, the suction port preferably has a curved or straight groove shape.

  According to one aspect of the present invention, the suction port has a groove shape, and the shape is preferably curved or linear. Thereby, the outer peripheral part of a semiconductor wafer can be stably hold | maintained on a table via a tape.

  According to the dicing apparatus and the table for the dicing apparatus of the present invention, in the form in which the semiconductor wafer is bonded to the tape and diced, the semiconductor wafer having a diameter larger than the diameter of the adsorption portion of the table is cut well. be able to.

The perspective view which showed the appearance of the dicing device of an embodiment Top view of the table for dicing devices of an embodiment FIG. 3 is a vertical cross-sectional view of the main part of the table of FIG. An explanatory diagram of the semiconductor wafer held on the table by directly adsorbing the back side The top view of the table which showed the 1st modification of the table of embodiment The top view of the table which showed the 2nd modification of the table of embodiment

  Hereinafter, preferred embodiments of a dicing apparatus and a table for the dicing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

[Configuration of Dicing Device 10]
FIG. 1 is a perspective view illustrating an appearance of a dicing apparatus 10 according to an embodiment.

  The dicing apparatus 10 has a load port 12 for transferring a cassette containing a plurality of disk-shaped semiconductor wafers W to and from an external apparatus, and a suction pad 14, and transports the semiconductor wafers W to each part of the apparatus. Means 16, a table 18 for sucking and holding the semiconductor wafer W, a processing unit 20 for dicing the semiconductor wafer W, and a spinner 22 for cleaning and drying the semiconductor wafer W after the dicing processing are provided. The operation of each part of the dicing apparatus 10 is controlled by a controller 24 as control means.

<Processing part 20>
The processing unit 20 is provided with a camera 26 that images the surface of the semiconductor wafer W. A high-frequency motor built-in type in which a pair of disk-shaped blades 28 (one blade 28 is not shown) disposed as opposed to each other as cutting means and a wheel cover 30 that protects the blades 28 are attached inside the processing unit 20. The spindle 32 is provided.

  The spindle 32 is rotated at a high speed of 30000 rpm to 80000 rpm, and an index feed in the Y direction and a cut feed in the Z direction in FIG. Further, the table 18 for sucking and holding the semiconductor wafer W is configured to be ground and fed in the X direction of FIG. 1 by a moving shaft (not shown). By these operations, the processing point (the lowest point) of the blade 28 that rotates at high speed comes into contact with the semiconductor wafer W, and the semiconductor wafer W is diced in the X and Y directions. Thereby, the semiconductor element is cut | disconnected from the semiconductor wafer W for every chip | tip.

  As the blade 28, a metal resin bond blade in which diamond abrasive grains or CBN abrasive grains are electrodeposited with nickel, or a resin mixed with metal powder is used.

[Operation of Dicing Device 10]
In the dicing apparatus 10, first, a cassette that stores a plurality of semiconductor wafers W is placed on the load port 12 (not shown) or manually. The semiconductor wafer W is taken out from the placed cassette and placed on the upper surface of the table 18 by the transport means 16. The rear surface side of the semiconductor wafer W is vacuum-sucked and held by a suction part 34 (see FIG. 2) made of a porous table 18. The table 18 will be described later.

  The surface of the semiconductor wafer W sucked and held on the table 18 is imaged by the camera 26 of FIG. 1, and the position of the cut line formed on the surface of the semiconductor wafer W and the blade 28 is not shown. The table 18 is adjusted by the X, Y, and θ movement axes.

  When alignment is completed and dicing is started, the spindle 32 discloses rotation, the blade 28 rotates at a high speed, and cutting fluid is supplied from a nozzle (not shown) to the machining point. In this state, the semiconductor wafer W is processed and fed in the X direction shown in FIG. 1 by a moving shaft (not shown) together with the table 18 and the spindle 32 is lowered to the predetermined height in the Z direction for dicing.

[Suction Form of Semiconductor Wafers W1, W2 on Table 18]
FIG. 2 is a plan view of the table 18.

  FIG. 3 is a longitudinal sectional view of an essential part of the table 18 in FIG. 2, and is an explanatory view in which the semiconductor wafer W1 having the back surface attached to the tape 36 is sucked and held by the suction part 34 of the table 18 via the tape 36. . The outer peripheral portion of the tape 36 is fixed to a ring-shaped frame 38, whereby the semiconductor wafer W 1 is mounted on the frame 38 via the tape 36. The semiconductor wafer W1 is fixed to the table 18 in a state where a tension is applied via a tape 36 by a tensioning device (not shown) that pushes the frame 38 downward (in the direction of arrow Z).

  That is, the semiconductor wafer W1 in FIG. 3 corresponds to the semiconductor wafer of the second embodiment. That is, the semiconductor wafer W1 is a semiconductor wafer whose thickness is reduced by grinding the back surface prior to dicing. The diameter of the semiconductor wafer W1 is larger than the diameter of the suction portion 34, and the outer peripheral portion of the semiconductor wafer W1 is located outward from the outer periphery of the suction surface 34A of the suction portion 34.

  FIG. 4 is an explanatory diagram in which the semiconductor wafer W2 is directly held by suction on the suction portion 34 of the table 18.

  That is, the semiconductor wafer W2 in FIG. 4 corresponds to the semiconductor wafer of the first embodiment. That is, the semiconductor wafer W1 is a semiconductor wafer that is half-cut by the blade 28 and then ground on the back surface and is cut for each chip. Further, the diameter of the semiconductor wafer W2 is larger than the diameter of the suction portion 34, and the outer peripheral portion of the semiconductor wafer W2 is located outward from the outer periphery of the suction surface 34A of the suction portion 34, thereby preventing vacuum leakage of the suction portion 34. Has been.

  3, the cutting groove 40 has already been processed by the blade 28 (see FIG. 1), and the cutting groove 42 has already been processed by the blade 28 in the semiconductor wafer W2 of FIG. . The depth of the cutting grooves 40 and 42 is set based on the characteristics of the semiconductor wafers W1 and W2.

[Configuration of Table 18]
As shown in FIGS. 2 to 4, the table 18 sucks and holds the semiconductor wafers W <b> 1 and W <b> 2 and has a circular suction part 34 in plan view, and a ring in plan view that is disposed outside the suction part 34 and supports the suction part 34. The main body 44 is provided.

  The suction surface 34A of the suction part 34 and the upper surface 44A of the main body 44 are disposed on the same surface. A suction port 46 is formed on the upper surface 44 </ b> A of the main body 44 and around the suction portion 34.

  As shown in FIG. 2, the suction port 46 has a ring-like groove shape centered on the rotation shaft 18 </ b> A of the table 18. Similarly, the suction surface 34A of the suction portion 34 is also formed in a circular shape centered on the rotation shaft 18A. That is, the suction port 46 is disposed along the outer periphery of the suction part 34 having a circular shape in plan view.

  As shown in FIGS. 3 and 4, the suction port 46 is a tapered groove whose width increases toward the upper surface 44 </ b> A. The suction port 46 is connected to a vacuum pump 50 that is a suction means through a plurality of vent holes 48 penetrating the main body 44. Therefore, when the vacuum pump 50 is driven, the air in the vent hole 48 is sucked, so that the suction port 46 functions as a suction means similar to the suction portion 34. Therefore, as shown in FIG. 3, the tape 36 positioned outside the suction portion 34 is sucked and held by the suction port 46, whereby the outer peripheral portion of the semiconductor wafer W <b> 1 positioned outside the suction portion 34 is interposed via the tape 36. The table 18 is stably sucked and held. A part of the tape 36 adsorbed by the suction port 46 is sucked by the suction port 46 and deformed into a concave shape, but a part from the outer periphery of the suction part 34 to the suction port 46 is formed on the upper surface 44A of the main body 44. It is in close contact and held flat, and its position does not deviate. Therefore, in order to prevent the tape 36 from bulging, the position of the suction port 46 is preferably close to the outer peripheral edge of the main body 44. Although not shown, the suction portion 34 is also connected to the suction means, and the vacuum pump 50 may be used as this suction means, or a separate suction means may be provided.

[Features of dicing apparatus 10 and table 18]
According to the dicing apparatus 10 and the table 18 of the embodiment, the suction port 46 is formed on the upper surface 44 </ b> A of the main body 44 of the table 18, and the suction port 46 has the same suction function as the suction unit 34.

  Thus, when the semiconductor wafer W1 of the second form is held on the table 18 for the semiconductor wafer W2 of the first form, the outer peripheral portion of the semiconductor wafer W1 is sucked through the tape 36 as shown in FIG. Therefore, the outer peripheral portion of the semiconductor wafer W1 is stably held on the table 18.

  The suction and holding action of the tape 36 by the suction port 46 eliminates the problem caused by the tension of the tape 36, that is, the problem of fine movement of the semiconductor element during dicing and the problem of swelling of the tape 36. Can be prevented.

  Therefore, according to the dicing apparatus 10 of the embodiment, in the form in which the semiconductor wafer W1 is bonded to the tape 36 and is diced, the semiconductor wafer W1 having a diameter larger than the diameter of the suction portion 34 of the table 18 is satisfactorily obtained. Can be cut.

  Due to the above effects, the table 18 for the semiconductor wafer W2 of the first form can be used together for the semiconductor wafer W1 of the second form. Accordingly, the work of changing the table accompanying the change of the semiconductor wafers W1 and W2 becomes unnecessary, so that the processing efficiency of the semiconductor wafers W1 and W2 is improved and the production efficiency of the semiconductor elements is improved.

  Further, by arranging the suction port 46 around the suction portion 34, the outer peripheral portion of the semiconductor wafer W 1 can be stably held on the table 18 via the tape 36.

  Further, since the ring-shaped suction port 46 is disposed along the outer periphery of the suction part 34 having a circular shape in plan view, the outer peripheral part of the semiconductor wafer W1 can be more stably held on the table 18 via the tape 36. it can.

  Furthermore, the suction action of the tape 36 by the suction port 46 can prevent the cutting fluid from entering the suction portion 34 in the dicing process, so that the suction of the semiconductor wafer by the suction portion 34 and the suction portion 34 are clogged. In addition, the suction part 34 can be easily maintained.

  In addition, when the shape of the suction part 34 in plan view is not circular, for example, a rectangular shape or an elliptical shape, a single or a plurality of suction ports 46 may be arranged outside the suction part 34.

[Modification of Table 18]
FIG. 5 is a plan view of the table 18 showing a first modification of the table 18.

  According to FIG. 5, the suction port 46 has a shape of four straight grooves arranged around the suction portion 34. As shown in FIG. 5, the four suction ports 46 may be independent suction ports without communicating the end portions, but are configured as a rectangular groove shape in which each end portion is communicated. Also good.

  Moreover, the form of the suction port 46 is not limited to FIG. 2, FIG.

  For example, as shown in a second modification of the table 18 in FIG. 6, a plurality of linear or curved grooves configured radially around the rotation shaft 18 </ b> A of the table 18 may be used.

  W ... Semiconductor wafer, 10 ... Dicing machine, 12 ... Load port, 14 ... Suction pad, 16 ... Transport means, 18 ... Table, 20 ... Processing part, 22 ... Spinner, 24 ... Controller, 26 ... Camera, 28 ... Blade, DESCRIPTION OF SYMBOLS 30 ... Wheel cover, 32 ... Spindle, 34 ... Adsorption part, 36 ... Tape, 38 ... Frame, 40 ... Cutting groove, 42 ... Cutting groove, 44 ... Main body, 46 ... Suction port, 48 ... Vent hole, 50 ... Vacuum pump

Claims (5)

In a dicing apparatus that holds a semiconductor wafer by suction on a table and cuts the semiconductor element of the semiconductor wafer for each chip by a cutting means,
The table is a first semiconductor wafer table used for half-cut dicing the first semiconductor wafer before grinding the back surface of the first semiconductor wafer.
The table is
A suction portion configured to suck and hold the first semiconductor wafer ; and configured to be smaller than the diameter of the first semiconductor wafer;
A ring-shaped main body in plan view that is disposed outside the suction portion and supports the suction portion;
An upper surface of the main body disposed on the same surface as the suction surface of the suction portion;
A suction port formed on the upper surface of the main body;
Suction means connected to the suction port;
Equipped with a,
A dicing apparatus characterized in that the table is also used as a second semiconductor wafer table for full-cut dicing of a second semiconductor wafer mounted on a frame via a tape . The dicing apparatus according to claim 1, wherein the suction port has a ring-like groove shape disposed along an outer periphery of the suction portion. 2. The dicing apparatus according to claim 1, wherein the suction port has a plurality of linear groove shapes arranged to face each other across the suction portion . The dicing apparatus according to claim 1, wherein the suction port has a plurality of radial curved groove shapes curved toward the center of the suction portion . In a table for a dicing machine that holds a semiconductor wafer by suction,
The table is a first semiconductor wafer table used for half-cut dicing the first semiconductor wafer before grinding the back surface of the first semiconductor wafer.
The table is
A suction portion configured to suck and hold the first semiconductor wafer ; and configured to be smaller than the diameter of the first semiconductor wafer;
A ring-shaped main body in plan view that is disposed outside the suction portion and supports the suction portion;
An upper surface of the main body disposed on the same surface as the suction surface of the suction portion;
A suction port formed on the upper surface of the main body;
Suction means connected to the suction port;
Equipped with a,
A table for a dicing apparatus, wherein the table is also used as a second semiconductor wafer table for full-cut dicing of a second semiconductor wafer mounted on a frame via a tape .

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