JPS60142536A - Chuck table for semiconductor dicing device - Google Patents

Abstract

PURPOSE:To simplify the detaching work of a semiconductor having an adhesive tape from a chuck table when a full-cut dicing is performed, to prevent the generation of chippings and cracks on a chip, and to contrive maintenance of high quality and reliability by a method wherein the surface of a semiconductor chuck is formed into roughened one by performing a blast processing and the like. CONSTITUTION:A work is performed on the surface 1a of a semiconductor chuck located on a chuck table 1 so that fine recesses and protrusions will be formed. As a result, the closely contacted condition between an adhesive tape 2 and the chuck surface can be removed immediately when vacuum condition is restored to atmospheric pressure. Accordingly, semiconductor chips 4 can be removed from the table 1 easily, a chip 4 does not come in contact with the adjoining chips, and the generation of chippings and cracks can also be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a check table for a semiconductor dicing apparatus↑.

[Prior art]

The chuck table of conventional semiconductor dicing equipment has a smooth finish on the chuck surface that fixes the semiconductor.
Furthermore, the vacuum groove is designed to be vacuum checked.

Recently, semiconductor dicing has been shifting to full-cut dicing, but in this case, semiconductors are generally vacuum chucked onto a check table via adhesive tape. However, when using a conventional chuck table, since the chuck surface is smooth, the adhesive tape sticks to the chuck surface, making it difficult to remove it after dicing, and also causing the acid chips to hit each other. , there were problems with chips chipping and cranking. In order to eliminate this problem, a method of applying fine particles such as powder to the chuck surface of the chuck table was used, but it had to be applied every time, and the powder could adhere to the semiconductor. There were also concerns that this would have a negative impact on quality.

〔the purpose〕

The present invention solves the above-mentioned drawbacks, and aims to facilitate the removal of semiconductors with adhesive tape from the chuck table during full-cut dicing, prevent chips from chipping and cracking, and ensure quality reliability. The purpose is to

〔overview〕

The chuck table of the semiconductor dicing apparatus of the present invention includes:
It is characterized in that the semiconductor chuck surface for chucking the semiconductor is formed into an uneven shape by blasting or the like.

〔Example〕

Hereinafter, the present invention will be described in detail based on examples.

FIGS. 1 and 2 show a conventional embodiment, in which a fully cut semiconductor chip 4 is attached to an adhesive tape 2 attached to a wafer ring 3 and vacuum-adsorbed to a check table 1. FIG. When attempting to remove the semiconductor chip 4 from the check table 1, it is necessary to turn off the vacuum, lift the wafer ring 3'f, and remove the semiconductor chip 4 while it remains stuck to the adhesive tape 2. At this time, chuck table 1
Since the semiconductor cheek surface 1a of the semiconductor cheek 1a is finished smoothly, it remains in close contact with the adhesive tape 2 for a while even when the vacuum is removed, making it impossible to remove it smoothly. As a result, the semiconductor chip 4 comes into contact with an adjacent chip, resulting in chips and cracks.

3 and 4 show an embodiment of the present invention, in which the semiconductor cheek surface 1a of the cheek table 1 is processed into fine irregularities by sandblasting or the like, and when the vacuum is turned off, the adhesive tape 2 The contact status will be canceled immediately. Therefore, the entire semiconductor chip 4 can be easily removed from the jack table 1, and there is no contact with adjacent chips, thereby eliminating chips and cracks.

〔effect〕

As explained above, full-cut dicing using adhesive tape makes it easy to remove semiconductor chips after full cutting, prevents chips from chipping and cracking, and eliminates the need to use powder, making it reliable. In terms of quality, there is no opening or closing at all, so you can use it with confidence. Even in half-cut dicing that does not use adhesive tape, it is easy to remove the semiconductor wafer after half-cutting, improving work efficiency. Defects caused by work errors can be reduced.

[Brief explanation of drawings]

Q11', 2+ is a cross-sectional view of a conventional chuck table with a fully cut semiconductor chip attached. FIG. 2 is a sectional view showing a state Dk in which a semiconductor chip that has been fully cut using a conventional chuck table is removed from the chuck table. FIG. 3 is a sectional view showing a fully cut semiconductor chip attached to the chuck table of the present invention. The third figure is a cross-sectional view showing how a semiconductor chip that has been fully cut using the check table of the present invention is removed from the check table. 1 is a cross-sectional view of the chuck table 1a, the chuck surface 1b is the vacuum groove 2 is the adhesive tape 3 is the semiconductor chip fully cut into the wafer ring 4, etc. Applicant Suwa Seikosha Co., Ltd. Agent Patent Attorney Mogami

Claims (1)

[Claims] A blade is attached to a blade attachment part, and the blade has a -j rotation mechanism, a chuck surface for chucking the semiconductor is flat, and a hollow groove for a real chuck is provided on the semiconductor chuck surface. and a chuck table that vacuum chucks the semiconductor and moves back and forth, chucks the semiconductor on the chuck table by vacuum suction, and cuts the semiconductor by the reciprocating movement of the chuck table and the rotational movement of the blade. 1. A check table for a semiconductor dicing apparatus, characterized in that the semiconductor check surface is formed into an uneven shape by a plastic process or the like.