TWI797333B - cutting device - Google Patents
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- TWI797333B TWI797333B TW108116728A TW108116728A TWI797333B TW I797333 B TWI797333 B TW I797333B TW 108116728 A TW108116728 A TW 108116728A TW 108116728 A TW108116728 A TW 108116728A TW I797333 B TWI797333 B TW I797333B
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- holding
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- workpiece
- jig
- cutting blade
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
- B23D45/02—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage
- B23D45/021—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage with the saw blade mounted on a carriage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
- B23Q11/0046—Devices for removing chips by sucking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0092—Grinding attachments for lathes or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/01—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor for combined grinding of surfaces of revolution and of adjacent plane surfaces on work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Dicing (AREA)
- Confectionery (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
[課題]提供一種切割裝置,其不用進行治具卡盤台的置換,而能夠容易地執行端面修正。[解決手段]具備:保持台30,其保持工件;切割刀片,其切割被保持在保持台30上的工件;以及,安裝凸緣24,其以端面24C將切割刀片夾持並固定在使切割刀片旋轉的主軸22的前端;其中,保持台30具備:保持治具34,其具有保持工件的保持面34a;多條閃避槽34c,其形成在對應於保持治具34中的工件之分割預定線的位置;以及,多個細孔34d,其形成在由閃避槽34c所劃分的各區域;並且保持台30設有端面修正治具100,其包含:研削磨石101,其在保持治具34上研削安裝凸緣24的端面24C;以及,磨石支撐構件102,其保持研削磨石101。[Problem] To provide a cutting device capable of easily performing end face correction without replacing a chuck table of a jig. [Solution means] equipped with: a holding table 30, which holds the workpiece; a cutting blade, which cuts the workpiece held on the holding table 30; The front end of the main shaft 22 where the blade rotates; wherein, the holding table 30 is equipped with: a holding fixture 34, which has a holding surface 34a for holding the workpiece; and a plurality of fine holes 34d, which are formed in each area divided by the dodging groove 34c; 34 on the end face 24C of the grinding mounting flange 24;
Description
本發明是關於一種切割裝置。The present invention relates to a cutting device.
通常,切割晶圓等工件之切割裝置,是藉由安裝凸緣將切割刀片固定在主軸的前端。安裝凸緣在使環狀的端面接觸切割刀片的一側面之狀態下,藉由固定螺帽夾持切割刀片。在此種安裝凸緣中,若在端面產生附著物或傷痕,則對切割刀片的夾持會變成局部的。因此,切割時切割刀片相對於旋轉軸變得容易晃動或傾斜旋轉,成為工件崩缺或切割刀片破損的原因。於是,定期地或在替換安裝凸緣時,實施所謂端面修正的作業,其使用具有研削磨石的端面修正治具研削安裝凸緣的端面,並使端面成為平整且與旋轉軸垂直的面。Generally, a cutting device for cutting workpieces such as wafers uses a mounting flange to fix the cutting blade on the front end of the main shaft. The mounting flange clamps the cutting blade by the fixing nut in a state where the ring-shaped end surface is in contact with one side surface of the cutting blade. In such a mounting flange, if a deposit or a flaw occurs on the end surface, the clamping of the cutting blade becomes partial. Therefore, the cutting blade tends to vibrate or rotate obliquely with respect to the rotating shaft during cutting, which causes chipping of the workpiece or breakage of the cutting blade. Therefore, periodically or when the mounting flange is replaced, a so-called end surface correction operation is carried out, which uses an end surface correction jig with a grinding stone to grind the end surface of the mounting flange so that the end surface becomes flat and perpendicular to the rotation axis.
在實施此種端面修正作業時,還設想為使端面修正治具吸引保持在切割加工時保持工件的卡盤台上。然而,端面修正治具比卡盤台小,而且卡盤台通常為多孔狀以整面吸附工件的構造。因此,將端面修正治具載置於卡盤台時會發生真空洩漏,而無法充分地吸附保持住端面修正治具。此外,若卡盤台的多孔表面損傷,會影響到工件加工時的平整度。從而,在實施端面修正作業時,已提出一種技術,其置換為在中央形成有真空槽的通用卡盤台,使端面修正治具吸附在此真空槽上(例如,參閱專利文獻1)。When carrying out such end surface correction work, it is also conceivable that the end surface correction jig is sucked and held on the chuck table that holds the workpiece during cutting. However, the end face correction jig is smaller than the chuck table, and the chuck table is usually porous in order to absorb the entire surface of the workpiece. Therefore, when the end surface correction jig is placed on the chuck table, a vacuum leak occurs, and the end surface correction jig cannot be sufficiently sucked and held. In addition, if the porous surface of the chuck table is damaged, it will affect the flatness of the workpiece during processing. Therefore, when carrying out the end surface correction work, a technique has been proposed which replaces it with a general-purpose chuck table with a vacuum groove formed in the center, and adsorbs the end surface correction jig to this vacuum groove (for example, refer to Patent Document 1).
此外,在切割加工用的卡盤台之外,也有提出一種切割裝置,其構成為設有尺寸比該卡盤台小的子卡盤台,並將端面修正治具載置於此子卡盤台之上(例如,參閱專利文獻2)。 [習知技術文獻] [專利文獻]In addition, in addition to the chuck table for cutting processing, there is also a cutting device that is provided with a sub-chuck table smaller in size than the chuck table, and the end surface correction jig is placed on the sub-chuck on the stage (for example, refer to Patent Document 2). [Prior art literature] [Patent Document]
[專利文獻1]日本特開2011-011299號公報 [專利文獻2]日本特開2011-255458號公報[Patent Document 1] Japanese Unexamined Patent Publication No. 2011-011299 [Patent Document 2] Japanese Unexamined Patent Publication No. 2011-255458
[發明所欲解決的課題] 然而,切割所謂的封裝基板作為工件的情況下,此封裝基板是保持在具有切割刀片的閃避槽之治具卡盤台(保持台)上。在此構成中,從通用卡盤台置換為治具卡盤台之後,需要對準閃避槽位置的操作,而有端面修正作業變得煩雜的問題。此外,在切割加工用的卡盤台之外設置子卡盤台的構成中,會有切割裝置的占據面積變大的問題。[Problems to be Solved by the Invention] However, in the case of dicing a so-called package substrate as a workpiece, the package substrate is held on a jig chuck table (holding table) having an escape groove for a dicing blade. In this configuration, after replacing the general-purpose chuck table with the jig chuck table, it is necessary to align the position of the dodging groove, and there is a problem that the end surface correction operation becomes complicated. In addition, in the configuration in which the sub-chuck table is provided in addition to the chuck table for cutting, there is a problem that the occupied area of the cutting device becomes large.
本發明係鑑於上述情況而完成,目的在於提供一種切割裝置,其不用進行治具卡盤台的置換,而能夠容易地執行端面修正。The present invention was made in view of the above circumstances, and an object of the present invention is to provide a cutting device capable of easily performing end surface correction without replacing a jig chuck table.
[解決課題的技術手段] 為解決上述課題並達成目的,本發明之切割裝置具備:保持台,其保持設定有交叉的多條分割預定線的工件;切割刀片,其切割被保持在該保持台上的工件;主軸,其使該切割刀片旋轉;以及,凸緣,其以端面將該切割刀片夾持並固定在該主軸的前端;其中,該保持台構成為包含:保持面,其保持工件;多條切割刀片用閃避槽,其形成在對應於保持在該保持面上的工件之該分割預定線的位置;多個吸引孔,其形成在由該切割刀片用閃避槽劃分的各區域中;負壓傳動部,其將負壓傳動至該吸引孔;研削磨石,其研削該凸緣的該端面;以及,磨石支撐構件,其保持該研削磨石。[Technical means to solve the problem] In order to solve the above problems and achieve the object, the cutting device of the present invention is provided with: a holding table, which holds a workpiece with a plurality of intersecting dividing lines set; a cutting blade, which cuts the workpiece held on the holding table; The cutting blade is rotated; and a flange clamps and fixes the cutting blade on the front end of the main shaft with an end surface; wherein the holding table is configured to include: a holding surface, which holds a workpiece; a plurality of cutting blades avoid a groove formed at a position corresponding to the planned division line of the workpiece held on the holding surface; a plurality of suction holes formed in each area divided by the cutting blade with an avoidance groove; a negative pressure transmission part of which negative pressure is transmitted to the suction hole; a grinding stone grinds the end face of the flange; and a grinding stone support member holds the grinding stone.
根據此構成,由於保持台構成為包含研削凸緣之端面的研削磨石以及保持研削磨石的磨石支撐構件,所以不用進行治具卡盤台的置換,即能夠容易地執行端面修正。此外,由於不需要另外準備子卡盤台,所以能夠防止切割裝置的占據面積擴大。According to this configuration, since the holding table includes the grinding stone for grinding the end surface of the flange and the grinding stone support member holding the grinding stone, end surface correction can be easily performed without replacing the jig chuck table. In addition, since it is not necessary to separately prepare a sub-chuck table, it is possible to prevent an increase in the occupied area of the cutting device.
在此構成中,該磨石支撐構件也可以配設在該保持面的高度之下,並以相向於該凸緣之端面的方式固定在該保持台的側面。In this configuration, the grinding stone supporting member may also be arranged below the height of the holding surface, and fixed to the side surface of the holding table so as to face the end surface of the flange.
[發明功效] 根據本發明,由於保持台構成為包含研削凸緣之端面的研削磨石以及保持研削磨石的磨石支撐構件,所以不用進行治具卡盤台的置換,即能夠容易地執行端面修正。此外,由於不需要另外準備子卡盤台,所以能夠防止切割裝置的占據面積擴大。[Efficacy of the invention] According to the present invention, since the holding table includes the grinding stone for grinding the end surface of the flange and the grinding stone supporting member holding the grinding stone, end surface correction can be easily performed without replacing the jig chuck table. In addition, since it is not necessary to separately prepare a sub-chuck table, it is possible to prevent an increase in the occupied area of the cutting device.
說明關於本發明之實施方式的切割裝置。本發明不為以下實施方式所記載之內容所限定。此外,對於以下所記載的構成要素,包含本領域的技術人員能輕易思及或實質相同者。進一步,以下所記載的構成可以作適當的組合。此外,在不脫離本發明主旨的範圍內,可以對構成進行各種的省略、置換或變更。A cutting device according to an embodiment of the present invention will be described. The present invention is not limited by the contents described in the following embodiments. In addition, components described below include those that can be easily conceived by those skilled in the art or that are substantially the same. Furthermore, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes can be made in the configuration without departing from the scope of the present invention.
圖1是顯示本實施方式之切割裝置之構成的外觀立體圖。圖2是示意性顯示工件的俯視圖。圖3是示意性顯示工件的仰視圖。切割裝置1是對工件11進行切割加工、將工件11分割為一個個晶片的裝置。在本實施方式中,工件11是所謂的元件封裝(封裝基板),如圖2及圖3所示,包含在俯視中形成為大致矩形的框體13。框體13是由例如銅等金屬、樹脂或者陶瓷等所構成,包含多個(本實施方式中為3個)元件區域15以及圍繞各元件區域15的外周剩餘區域17。FIG. 1 is an external perspective view showing the configuration of a cutting device according to this embodiment. Fig. 2 is a plan view schematically showing a workpiece. Fig. 3 is a bottom view schematically showing a workpiece. The
元件區域15被以交叉的多條切割道(分割預定線)19進一步劃分為多個區域(本實施方式中為48個區域),各區域中配置有IC、LSI或者LED等元件(未圖示)。此外,在框體13的背面13b側設置有樹脂12,其覆蓋住各元件區域15的整個背面13b側,且將多個元件密封。此樹脂12形成為預定厚度,並從框體13的背面13b突出。此外,在框體13的正面13a側,設置有對應各元件的多個平台14。在各平台14的周圍,形成有多個電極焊墊(未圖示)。
The
工件11例如是從框體13的背面13b側將元件配置於各平台14上,並以金屬導線(未圖示)等將各元件的電極與配置在平台14周圍的電極焊墊連接之後,再以樹脂12將背面13b密封所得。藉由沿著切割道19將此工件11分割,能夠形成以樹脂密封的多個晶片。另外,工件11並不限於元件封裝(封裝基板),也包含陶瓷基板、玻璃基板、半導體晶圓、光學元件晶圓等。
For the
如圖1所示,切割裝置1具備:保持台(也稱作治具卡盤台)30,其吸引保持工件11;切割單元20,其將切割水供給至保持在保持台30上的工件11,同時以切割刀片21切割(加工)該工件11;加工進給單元(未圖示),其使保持台30在X軸方向(加工進給方向)上移動;分度進給單元40,其使切割單元20在與X軸方向正交的Y軸方向(分度進給方向)上移動;以及,切入進給單元50,其使切割單元20在分別與X軸方向和Y軸方向正交的Z軸方向(垂直方向)上移動。
As shown in FIG. 1 , the
切割裝置1具備長方體狀的裝置本體2,在其上表面形成有在X軸方向延長的矩形開口2a。在此開口2a內,設置有保持台30、加工進給單元、覆蓋此加工進給單元的防水蓋3、以及連結此防水蓋3的一對蛇腹部4。保持台30具備:治具基座32,其具備2種吸引口;以及,保持治具34,其被裝設在此治具基座32的上表面32a並吸引保持工件11。此外,保持台30藉由未圖示的加工進給單元,在裝置本體2的上表面於X軸方向上移動自如,並且藉由未圖示的旋轉驅動源繞與Z軸方向平行的軸心旋轉自如。如圖5及圖6所示,保持治具34形成為大致矩形的平板狀,其上表面成為吸引保持工件11的保持面34a。
The
在保持面34a上,在對應工件11之切割道19的位置形成有閃避槽(切割刀片用閃避槽)34c。藉由此閃避槽34c,保持治具34的保持面34a被劃分為對應從工件11中分割出來的各晶片之多個區域。閃避槽34c的寬度比切割刀片21的寬度寬,且閃避槽34c的深度比切割刀片21的切入深度深。因此,在沿著切割道19切割工件11時,即使讓切割刀片21深深地切入,切割刀片21也不會與保持治具34干涉。另外,保持治具34形成為比閃避槽34c的深度厚。
On the
在藉由閃避槽34c劃分的各區域中,形成有上下貫穿保持治具34且開口於保持面34a上的細孔(吸引孔)34d。如圖5所示,當將保持治具34
放置於治具基座32的上表面32a時,各細孔34d與形成在治具基座32上表面32a側的中央部分之第1吸引口32b連通。
In each area partitioned by the
第1吸引口32b通過第1電磁閥36a連接於吸引源(負壓傳動部)38。此吸引源38通過第1吸引口32b將負壓傳動到各細孔34d。因此,將工件11重疊在放置於治具基座32上表面32a之狀態下的保持治具34之保持面34a上,並將對應工件11之各晶片的區域對齊於各細孔34d之後,開啟第1電磁閥36a時,能夠以保持台30吸引保持工件11。此外,在治具基座32之上表面32a的外周部分,形成有用以將保持治具34裝設在治具基座32上的第2吸引口32c。此第2吸引口32c通過第2電磁閥36b連接於吸引源38。因此,使保持治具34的下表面34b接觸治具基座32的上表面32a,並開啟第2電磁閥36b時,能夠將保持治具34裝設在治具基座32的上表面32a上。
The
在裝置本體2的上表面,如圖1所示,設有沿著Y軸方向延伸並且跨過保持台30而配置的門型支撐構造5。分度進給單元40以及切入進給單元50設置於上述支撐構造5。分度進給單元40是藉由使切割單元20在與保持台30的保持面34a平行且與X軸方向正交的分度進給方向,即Y軸方向上移動,以將保持台30與切割單元20相對地沿著Y軸方向分度進給。如圖1所示,分度進給單元40具備:一對導軌41,其配置於支撐構造5上且在Y軸方向上延伸;滾珠螺桿42,其與該對導軌41平行地配設;以及,刀片移動基台43,其內部具有螺合於該滾珠螺桿42的螺帽(未圖示),並沿著導軌41移動。在滾珠螺桿42的一端,連結有使該滾珠螺桿42旋轉的脈衝馬達(未圖示),藉由滾珠螺桿42的旋轉,刀片移動基台43沿著導軌41在Y軸方向上移動。
On the upper surface of the device
切入進給單元50藉由使切割單元20在與保持台30的保持面34a正交的切入進給方向,即Z軸方向上移動,以將保持台30與切割單元20相對地沿著Z軸方向切入進給。切入進給單元50具備:一對導軌51,其配置於刀片移動基台43上且在Z軸方向上延伸;滾珠螺桿52,其與該對導軌51平行地配設;以及,切入移動基台53,其內部具有螺合於該滾珠螺桿52的螺帽(未圖示),並沿著導軌51移動。在此切入移動基台53上支撐著上述切割單元20。此外,在滾珠螺桿52的一端,連結有使該滾珠螺桿52旋轉的脈衝馬達54,藉由滾珠螺桿52的旋轉,切入移動基台53沿著導軌51在Z軸方向上移動。The cutting
切割單元20藉由分度進給單元40以及切入進給單元50,可以將切割刀片21定位在保持台30之保持面34a的任意位置。如圖6所示,切割單元20具備外殼23、主軸22、安裝凸緣(凸緣)24、切割刀片21以及固定螺帽25。此外,雖省略了圖式,但切割單元20具備有在切割加工時分別朝向切割刀片21的刀鋒和加工點供給切割水的噴嘴。The cutting
切割刀片21為所謂的輪轂型(hub)刀片,固定在以金屬(例如鋁)所形成的圓盤狀基台21A之外周,並具備切割工件11之圓環狀的切割刃21B。切割刃21B由金剛石或CBN(Cubic Boron Nitide;立方氮化硼)等的磨粒與金屬或樹脂等的黏合材(結合材)所組成並形成預定的厚度。另外,作為切割刀片,亦可使用僅以切割刃構成的墊圈型(washer)刀片。The
主軸22是藉由使切割刀片21旋轉以切割工件11。主軸22容納於主軸外殼23內,此外殼23被切入進給單元50的切入移動基台53所支撐。切割單元20的主軸22以及切割刀片21的軸心設定成與Y軸方向平行。此外,主軸22的一端側自外殼23的一端部向外部突出,並且在主軸22的另一端側,連結有用以使該主軸22旋轉的馬達(未圖示)。又,在主軸22的一端部(前端)的外周上裝設有安裝凸緣24。The
安裝凸緣24支撐切割刀片21。安裝凸緣24為金屬製,具備有裝設在主軸22一端部的外周上的圓筒狀的凸起部24A,以及從凸起部24A的外周面向徑方向外側延伸的凸緣部24B。安裝凸緣24是利用主軸22的一端部嵌入凸起部24A內,且螺栓26擰入主軸22的一端部,而固定在主軸22上。此外,切割刀片21嵌入於凸起部24A的外周部,且固定螺帽25螺合於此凸起部24A的外周。藉此,以固定螺帽25和安裝凸緣24將切割刀片21的基台21A夾持並固定。在安裝凸緣24的凸緣部24B上,形成有與切割刀片21的基台21A抵接以支撐切割刀片21的端面24C。此外,如圖1所示,切割單元20上固定有拍攝工件11上表面的攝像部29,以一體地移動。攝像部29具備CCD攝影機,其拍攝被保持在保持台30上的加工前的工件11的應分割區域。CCD攝影機拍攝被保持在保持台30的工件11,以得到用以執行對準的影像,該對準是進行工件11與切割刀片21的對位。The mounting
此外,如上所述,切割刀片21是以固定螺帽25和安裝凸緣24的端面24C將切割刀片21的基台21A夾持以固定。在此,例如,在由於形成基台21A的鋁金屬之部分附著在安裝凸緣24的端面24C上,而使安裝凸緣24的端面24C不平整的情況下,或是當端面24C與主軸22的軸心間的角度非直角的情況下,在主軸22旋轉時有可能會產生切割刀片21晃動、無法精密地切割的問題。因此,切割裝置1具備修正安裝凸緣24之端面24C的端面修正治具100。此端面修正治具100定期地,或在替換安裝凸緣24時,研削此安裝凸緣24的端面24C,以將此端面24C與主軸22的軸心間的角度修正為直角的平面。In addition, as described above, the
在本實施方式中,如圖4所示,端面修正治具100設置於保持台30的保持治具34上。具體而言,端面修正治具100設置於保持治具34中未形成閃避槽34c的一角部34f,以成為不會與閃避槽34c干涉。端面修正治具100構成為具備:研削磨石101,其研削安裝凸緣24的端面24C;磨石支撐構件102,其支撐(保持)此研削磨石101;以及,固定螺絲103,其將該些研削磨石101和磨石支撐構件102固定於保持治具34。In this embodiment, as shown in FIG. 4 , the end
在保持治具34的一角部34f,如圖7所示,形成有比保持面34a低的段部34g,藉由此段部34g與磨石支撐構件102夾持研削磨石101。此磨石支撐構件102以相向於安裝凸緣24的端面24C的方式,固定在保持治具34(保持台30)的側面。此外,在本實施方式中,將磨石支撐構件102固定在段部34g時,磨石支撐構件102的上表面102a與保持面34a齊平或比保持面低。因此,能夠防止磨石支撐構件102阻礙到將工件11保持在保持治具34的保持面34a,並對工件11施行切割加工的一系列操作。此外,固定螺絲103通過形成在磨石支撐構件102的貫穿孔(未圖示)而固定在段部34g。由於固定螺絲103的頭部容納在該貫穿孔內,因此能夠防止此頭部阻礙對工件11施行切割加工的一系列操作。此外,磨石支撐構件也可以具備夾持研削磨石101的上部塊與下部塊,以將研削磨石101夾持在與該上部塊之間的狀態將下部塊固定在段部34g。根據此構成,變得容易在保持治具34的保持面34a上形成上述段部34g。At one
接著,說明本實施方式的端面修正之作業流程。端面修正是定期地,或在替換切割單元20的安裝凸緣24時進行。操作員停止切割裝置1的運轉,並卸除切割單元20的固定螺帽25和切割刀片21(圖6)。此外,也可以是從主軸22卸除安裝凸緣24,並將新的安裝凸緣24裝設在主軸22上的狀態。在這些狀態中,如圖7所示,安裝凸緣24成為端面24C露出的狀態。Next, the operation flow of the end face correction in this embodiment will be described. Face correction is performed periodically, or when the mounting
接著,使分度進給單元40與切入進給單元50動作,並將切割單元20定位在面對端面修正治具100的研削磨石101的位置。然後,使分度進給單元40動作,如圖7所示,使切割單元20在Y軸方向上分度進給,直到安裝凸緣24的端面24C與研削磨石101接觸的預定位置為止。
Next, the
接著,使主軸22旋轉,並且以分度進給單元40將安裝凸緣24在Y軸方向上僅進給預先設定的研削距離。再來,藉由加工進給單元,使保持台30即研削磨石101在X軸方向上能接觸到端面24C的預定範圍內來回移動,同時以研削磨石101研削安裝凸緣24的端面24C。如此一來,能夠使安裝凸緣24的端面24C平整並且將與主軸22的軸心間的角度修正為直角。
Next, while the
如以上所述,本實施方式的切割裝置1具備:保持台30,其保持設定有交叉的多條切割道19之工件11;切割刀片21,其切割被保持在保持台30上的工件11;主軸22,其使切割刀片21旋轉;以及,安裝凸緣24,其以端面24C將切割刀片21夾持並固定在主軸22的前端;其中,保持台30具備:保持治具34,其具有保持工件11的保持面34a;多條閃避槽34c,其形成在對應於保持在保持面34a上的工件11之切割道19的位置;多個細孔34d,其形成在由閃避槽34c所劃分的各區域;以及,吸引源38,其將負壓傳動至細孔34d;並且保持台30構成為設有端面修正治具100,該端面修正治具100包含:研削磨石101,其在保持治具34上研削安裝凸緣24的端面24C;以及,磨石支撐構件102,其保持研削磨石101。
As described above, the
根據此構成,由於設置有端面修正治具100,其包含在保持治具34上研削安裝凸緣24的端面24C之研削磨石101以及保持研削磨石101之磨石支撐構件102,所以不用進行具有保持治具34的保持台30的置換,即能夠容易地執行安裝凸緣24的端面24C的修正。此外,由於不需要如同以往的構成,例如另外準備保持端面修正治具的子卡盤台,所以能夠防止切割裝置1的占據面積擴大。
According to this configuration, since the end
此外,根據本實施方式,磨石支撐構件102配設在保持治具34的保持面34a的高度之下,由於是以相向於安裝凸緣24的端面24C的方式固定在保持治具34的側面,所以能夠防止磨石支撐構件102(端面修正治具100)阻礙對於被保持在保持面34a上的工件施行切割加工的一系列操作。因此,能夠在將磨石支撐構件102(端面修正治具100)裝設在保持治具34上的狀態下,進行工件11的切割加工。In addition, according to the present embodiment, the
接著,說明另一實施方式。圖8是顯示利用另一實施方式之端面修正治具進行安裝凸緣的端面修正之狀態的側視圖。在上述實施方式中,端面修正治具100是構成為設在保持台30的保持治具34上,但在另一實施方式中,端面修正治具100A是設在保持台30的治具基座32上。由於端面修正治具100A的構成構件與上述構成相同,所以附上相同符號並省略說明。Next, another embodiment will be described. Fig. 8 is a side view showing a state in which an end surface correction of a mounting flange is performed using an end surface correction jig according to another embodiment. In the above-mentioned embodiment, the end
在另一實施方式中,端面修正治具100A設在治具基座32的一角部32f。此一角部32f對應於保持治具34之一角部34f的位置。在治具基座32的一角部32f,如圖8所示,形成有比治具基座32的上表面32a低的段部32g,藉由此段部32g與磨石支撐構件102夾持研削磨石101。此磨石支撐構件102以相向於安裝凸緣24的端面24C的方式,固定在治具基座32(保持台30)的側面。此外,在本實施方式中,將磨石支撐構件102固定在段部32g時,磨石支撐構件102的上表面102a與治具基座32的上表面32a齊平。因此,能夠防止磨石支撐構件102(端面修正治具100A)阻礙對治具基座32的上表面32a裝設保持治具34。此外,固定螺絲103通過形成在磨石支撐構件102的貫穿孔(未圖示)而固定在段部32g。由於固定螺絲103的頭部容納在該貫穿孔內,因此能夠防止此頭部阻礙對治具基座32的上表面32a裝設保持治具34。In another embodiment, the end
另外,本發明非限定於上述實施方式。亦即,在未超出本發明精神的範圍內可以實施各種變形。In addition, this invention is not limited to the said embodiment. That is, various modifications can be made within the scope not departing from the spirit of the present invention.
1‧‧‧切割裝置
11‧‧‧工件
19‧‧‧切割道(分割預定線)
20‧‧‧切割單元
21‧‧‧切割刀片
22‧‧‧主軸
23‧‧‧外殼
24‧‧‧安裝凸緣(凸緣)
24C‧‧‧端面
30‧‧‧保持台
32‧‧‧治具基座
32a‧‧‧上表面
32f‧‧‧一角部
32g‧‧‧段部
34‧‧‧保持治具
34a‧‧‧保持面
34c‧‧‧閃避槽(切割刀片用閃避槽)
34d‧‧‧細孔(吸引孔)
34f‧‧‧一角部
34g‧‧‧段部
38‧‧‧吸引源(負壓傳動部)
40‧‧‧分度進給單元
50‧‧‧切入進給單元
100、100A‧‧‧端面修正治具
101‧‧‧研削磨石
102‧‧‧磨石支撐構件
102a‧‧‧上表面
103‧‧‧固定螺絲1‧‧‧
圖1是顯示本實施方式之切割裝置之構成的外觀立體圖。 圖2是示意性顯示工件的俯視圖。 圖3是示意性顯示工件的仰視圖。 圖4是示意性顯示保持治具的俯視圖。 圖5是示意性顯示載置於治具基座狀態下的保持治具的側剖面圖。 圖6是顯示切割裝置的切割單元之構成的分解立體圖。 圖7是顯示利用本實施方式之端面修正治具進行安裝凸緣的端面修正之狀態的側視圖。 圖8是顯示利用另一實施方式之端面修正治具進行安裝凸緣的端面修正之狀態的側視圖。FIG. 1 is an external perspective view showing the configuration of a cutting device according to this embodiment. Fig. 2 is a plan view schematically showing a workpiece. Fig. 3 is a bottom view schematically showing a workpiece. Fig. 4 is a plan view schematically showing the holding jig. Fig. 5 is a side sectional view schematically showing the holding jig placed on the jig base. Fig. 6 is an exploded perspective view showing the configuration of a cutting unit of the cutting device. Fig. 7 is a side view showing a state in which the end surface correction of the mounting flange is performed using the end surface correction jig of this embodiment. Fig. 8 is a side view showing a state in which an end surface correction of a mounting flange is performed using an end surface correction jig according to another embodiment.
20‧‧‧切割單元 20‧‧‧cutting unit
22‧‧‧主軸 22‧‧‧Spindle
23‧‧‧外殼 23‧‧‧Shell
24‧‧‧安裝凸緣(凸緣) 24‧‧‧Mounting flange (flange)
24C‧‧‧端面 24C‧‧‧end face
30‧‧‧保持台 30‧‧‧Holding table
32‧‧‧治具基座 32‧‧‧Jig base
32a‧‧‧上表面 32a‧‧‧upper surface
32b‧‧‧第1吸引口 32b‧‧‧The first suction port
32c‧‧‧第2吸引口 32c‧‧‧The second suction port
34‧‧‧保持治具 34‧‧‧Retention fixture
34a‧‧‧保持面 34a‧‧‧Retaining surface
34b‧‧‧下表面 34b‧‧‧lower surface
34c‧‧‧閃避槽(切割刀片用閃避槽) 34c‧‧‧Dodge slot (dodge slot for cutting blade)
34d‧‧‧細孔(吸引孔) 34d‧‧‧pore (suction hole)
34f‧‧‧一角部 34f‧‧‧one corner
34g‧‧‧段部 34g‧‧‧section
36a‧‧‧第1電磁閥 36a‧‧‧1st solenoid valve
36b‧‧‧第2電磁閥 36b‧‧‧Second solenoid valve
38‧‧‧吸引源(負壓傳動部) 38‧‧‧Attraction source (negative pressure transmission part)
100‧‧‧端面修正治具 100‧‧‧End face correction jig
101‧‧‧研削磨石 101‧‧‧Grinding grindstone
102‧‧‧磨石支撐構件 102‧‧‧Millstone support member
102a‧‧‧上表面 102a‧‧‧upper surface
103‧‧‧固定螺絲 103‧‧‧fixing screw
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