TW202305923A - Processing apparatus - Google Patents

Abstract

A processing apparatus includes a holding table including a holding surface that holds a back surface side of a substrate and a processing unit that processes the substrate held on the holding surface. The holding surface includes a holding section that holds a central region of the substrate, a discharge groove that surrounds the holding section, and an outer circumferential groove that surrounds the discharge groove and communicates with a suction source to hold under suction the substrate. The processing apparatus uses the discharge groove to collect processing swarf produced by the processing unit.

Description

Processing device

The invention relates to a processing device with a holding table for holding a substrate.

When the substrate is processed while the substrate is held on the holding table, there is a concern that processing chips or containing Water from processing chips will seep in, and processing chips will adhere to cause pollution. Therefore, Patent Document 1 discloses a cleaning device provided with a groove portion and a communication path. The groove portion is annularly formed on the upper surface of the holding portion with a diameter smaller than the diameter of the wafer to surround the holding surface. The holding portion is formed such that one end communicates with the groove portion and the other end is open to the atmosphere. prior art literature patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2010-177376

The problem to be solved by the invention

In the conventional technology, there is a concern that if the part of the outer periphery of the substrate protruding outward from the holding surface is not attracted by the holding surface, if shaking occurs during the processing of the substrate, processing chips will wrap around the back surface of the substrate and cause damage to the substrate. Deteriorate processing quality. Therefore, in the conventional technology, it is desired to improve the processing quality.

Accordingly, an object of the present invention is to provide a processing device capable of suppressing processing chips from wrapping around the back surface of a substrate and maintaining high processing quality. means to solve problems

According to the present invention, there is provided a processing device characterized in that: a holding table having a holding surface for holding the back side of the substrate; and a processing unit for processing the substrate held on the holding surface, the holding surface It has: a holding part holding the central area of the substrate; a discharge groove surrounding the holding part; Processing chips generated by this processing unit.

Preferably, the processing device further includes a liquid supply unit for supplying liquid to the substrate, and the discharge groove recovers the liquid including the processing waste.

Preferably, the holding surface is formed smaller than the base plate, the processing unit includes a cutting blade rotatably held on the main shaft, the cutting blade is positioned on the outer periphery of the base plate exposed from the holding surface, and the The substrate is supplied with cutting water, which is the liquid, and the holding table and the cutting blade are moved relative to each other, thereby removing the outer peripheral portion of the substrate. Invention effect

The processing device according to the invention of the present application exhibits the following effects: it is possible to suppress the wrapping of processing chips to the back surface of the substrate and maintain high processing quality.

form for carrying out the invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include constituent elements that can be easily assumed by those skilled in the art and substantially the same constituent elements. In addition, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

In the embodiments described below, an XYZ rectangular coordinate system is set, and the positional relationship of each part will be described while referring to this XYZ rectangular coordinate system. Let one direction in the horizontal plane be the X-axis direction, let the direction perpendicular to the X-axis direction in the horizontal plane be the Y-axis direction, and let the directions perpendicular to each of the X-axis direction and the Y-axis direction be the Z-axis direction direction. The XY plane including the X axis and the Y axis is parallel to the horizontal plane. The Z-axis direction perpendicular to the XY plane is the vertical direction.

A processing device according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a processing apparatus according to an embodiment. Fig. 2 is a schematic view for explaining the relationship between the cutting insert and the holding unit shown in Fig. 1 .

As shown in FIG. 1, the processing apparatus 1 of this embodiment is an apparatus which performs arbitrary processing on the board|substrate 100 which is a processing object. In other words, the processing apparatus 1 may be, for example, a processing apparatus that performs processing of the substrate 100 . The substrate 100 includes, for example, a semiconductor wafer or an optical device wafer formed of silicon, sapphire, gallium arsenide, or the like in a disc shape.

In an example shown in FIG. 1 , the processing device 1 is a processing device that cuts a substrate 100 . The processing device 1 includes a holding table 10 , a processing unit 20 , and a control unit 30 . The control unit 30 is electrically connected to the holding table 10 and the processing unit 20 .

The holding table 10 has a holding surface 11 for holding the substrate 100 . The holding surface 11 holds the back side of the substrate 100 . The holding table 10 is connected to a suction source (not shown), and the substrate 100 is sucked and held by the negative pressure supplied from the suction source. The holding table 10 is movable in the X-axis direction by an X-axis moving mechanism 41 described later, and is rotatable around the Z-axis by a rotary drive source not shown. The holding table 10 may be, for example, a work clamping table. The holding table 10 is provided with a plurality of (two in this embodiment) jigs for clamping the substrate 100 . The X-axis moving mechanism 41 can be constituted by, for example, a ball screw, a pulse motor, or the like.

In an example shown in FIG. 2 , a holding table 10 includes a holding portion 12 holding a substrate 100 , and a frame body 13 surrounding the holding portion 12 . The holding portion 12 is a disc-shaped suction plate. The holding part 12 is constituted by, for example, a porous holding member or the like, and its upper surface becomes a part of the holding surface 11 that holds the substrate 100 . The holding unit 12 includes, for example, a perforated plate or the like. The holding unit 12 holds the substrate 100 in a state of being in contact with the back surface 120 of the substrate 100 .

The frame body 13 is formed with a recessed portion 14 having an inner diameter larger than an outer diameter of the holding portion 12 at a central portion of the frame body 13 . The concave portion 14 forms a suction path that communicates the holding portion 12 with a suction source (not shown). The holding table 10 can be used by fitting the holding portion 12 into the concave portion 14 of the frame body 13 .

The holding surface 11 of the holding table 10 includes a holding portion 12 and a continuous upper surface (front) extending from the holding portion 12 to the frame body 13 . The holding surface 11 is formed smaller than the substrate 100 . That is, the frame body 13 has an outer diameter smaller than that of the substrate 100 . Therefore, the holding table 10 is configured to suck and hold the substrate 100 in a state where the outer periphery of the substrate 100 protrudes outward from the holding surface 11 . Furthermore, the holding table 10 can also hold a substrate smaller than the holding surface 11 or a substrate having the same size as the holding surface 11 .

The processing unit 20 processes the substrate 100 held on the holding table 10 . That is, the processing unit 20 is an example of a processing unit that processes the substrate 100 held on the holding table 10 . The processing unit 20 has, for example, a cutting blade 21 for cutting the substrate 100 held on the holding surface 11 of the holding table 10 . The cutting blade 21 is an extremely thin blade having a rotating ring shape. The cutting insert 21 is rotatably held by a spindle 212 in a housing 211 . The main shaft 212 can be rotationally driven by an unillustrated motor accommodated in the casing 211 . The cutting insert 21 is detachably mounted on the front end of the main shaft 212 , and is rotated by the rotation of the main shaft 212 .

As shown in FIG. 1 , the processing unit 20 can move along the Y-axis direction through the Y-axis moving mechanism 42 , and can move along the Z-axis direction through the Z-axis moving mechanism 43 . The Y-axis moving mechanism 42 relatively moves the processing unit 20 in the Y-axis direction with respect to the holding surface 11 of the holding table 10 . The Y-axis moving mechanism 42 and the Z-axis moving mechanism 43 can be constituted by, for example, a ball screw, a nut, a pulse motor, or the like.

As shown in FIG. 2 , the processing unit 20 has a nozzle 22 for supplying liquid to the substrate 100 held on the holding surface 11 . The liquid includes, for example, washing water for washing the substrate 100 and the like. The nozzle 22 supplies liquid from above to the upper surface 110 of the substrate 100 held on the holding surface 11 . The nozzle 22 is configured, for example, to supply liquid to a portion of the substrate 100 cut by the cutting blade 21 . The nozzle 22 is provided, for example, near the cutting blade 21 , and is controlled by the control unit 30 to supply liquid. In the present embodiment, the nozzle 22 is an example of a liquid supply unit, and is provided in the processing device 1 .

The control unit 30 is equipped with computing processing devices such as CPU (Central Processing Unit, Central Processing Unit), memory devices such as ROM (Read Only Memory, Read Only Memory) or RAM (Random Access Memory, Random Access Memory), and Input and output interface devices. The control unit 30 is a computer that can execute programs, etc., and the aforementioned programs are used to control the above-mentioned components according to a series of processing steps performed by the processing device 1 using the device.

The control unit 30 controls and drives each mechanism (the X-axis moving mechanism 41 , the Y-axis moving mechanism 42 , and the Z-axis moving mechanism 43 ) of the processing device 1 , the processing unit 20 and the like. The control unit 30 controls each part of the processing device 1 to realize processing performed by the processing device 1 . The control unit 30 controls each part of the processing device 1 including the holding table 10 or the processing unit 20 by executing a program, for example, to realize processing of the substrate 100 . The control unit 30 executes the process of cutting the substrate 100 using liquid while the substrate 100 is held on the holding surface 11 of the holding table 10 by controlling the processing unit 20 . The control unit 30 positions the cutting blade 21 on the outer peripheral portion of the substrate 100 exposed from the holding surface 11, and moves the holding table 10 and the cutting blade 21 relatively while supplying the cutting water, which is the liquid, to the substrate 100. , and a process of removing the outer peripheral portion of the substrate 100 is performed.

The processing device 1 controls the processing of the substrate 100 held on the holding table 10 by using the X-axis moving mechanism 41 , the Y-axis moving mechanism 42 and the Z-axis moving mechanism 43 to move the holding table 10 and the processing unit 20 relative to each other. Location. The processing apparatus 1 cuts the substrate 100 with the cutting blade 21 while supplying a liquid to the cutting place while holding the substrate 100 on the holding surface 11 of the holding table 10 .

Furthermore, the processing unit 20 included in the processing device 1 is not limited to a cutting unit for cutting the substrate 100 with a cutting blade. For example, the processing unit 20 may also be a grinding unit that grinds the same substrate 100 with a grinding stone or the like, or a grinding unit that grinds the same substrate 100 with a polishing pad or the like, or a grinding unit that grinds the same substrate 100 with a grinding pad or the like. 100 A laser processing unit for performing laser processing by irradiating laser beams, etc.

(Example of the configuration of the holding table) A configuration example related to the holding surface 11 of the holding table 10 of the embodiment will be described. FIG. 3 is a top view showing an example of the holding surface 11 of the holding table 10 shown in FIG. 1 . FIG. 4 is a schematic cross-sectional view showing part of the configuration of the holding table 10 shown in FIG. 1 .

For example, the processing apparatus 1 performs a process of removing the outer peripheral portion of the substrate 100 in full cut trimming of the substrate 100 . In the machining device 1 , the holding surface 11 of the holding table 10 is formed smaller than the base plate 100 so that the cutting insert does not collide with the holding table 10 . Full cut trimming is a process of removing unnecessary portions of the substrate 100 in a state where the outer peripheral portion of the substrate 100 protrudes from the holding surface 11 and the holding table 10 does not hold the outer peripheral portion. When the processing device 1 performs full-cut trimming, cutting water containing cutting chips may flow around into the holding surface 11 from the outer periphery of the substrate 100 and the cutting chips may be attracted to the holding portion 12 . In addition, in the processing apparatus 1 , there is a possibility that cutting chips adhere to the back surface of the substrate 100 held on the holding table 10 to cause contamination. Therefore, the processing apparatus 1 of the present embodiment realizes the following situation: while preventing chips or liquid containing chips from wrapping around the back surface of the substrate 100, the processing quality is maintained at a high level.

As shown in this embodiment, the processing device 1 is an example of processing while supplying cutting water, and since the liquid containing processing chips makes it easier for the processing chips to wrap around the back surface of the substrate 100 held on the holding table 10, therefore The effect is greater. However, even in processing that does not use liquid water, there is a possibility that processing chips will be generated and adhere to the back surface of the substrate 100 that has been held on the holding table 10 to cause contamination. Therefore, when the processing device 1 does not use liquid water, is also valid.

As shown in FIG. 3 , the above-mentioned holding portion 12 , a plurality of discharge grooves 15 , and outer peripheral grooves 18 are provided on the holding surface 11 of the holding table 10 . The holding part 12 holds the central area of the substrate 100 . The central region of the substrate 100 is, for example, a region on the rear side of the substrate 100 including the center, the vicinity of the center, and the like of the disc-shaped substrate 100 .

The holding surface 11 is the front (upper surface) of the frame 13 in which a plurality of discharge grooves 15 are formed between the outer periphery of the holding portion 12 and the outer peripheral groove 18 . A plurality of discharge grooves 15 are arranged at predetermined intervals along the outer periphery of the holding portion 12 . The drain groove 15 is a groove that allows the cutting water flowing between the substrate 100 and the holding surface 11 to flow inside instead of toward the holding surface 11 , and drains the water to the outside of the frame body 13 .

As shown in FIG. 4, the discharge groove 15 is formed to have a concave cross section so that cutting chips contained in cutting water can enter inside. The bottom 151 of the discharge groove 15 communicates with the discharge passage 17 . In the example shown in FIG. 4, although the cross-sectional shape of the discharge groove 15 is square, it may be other shapes such as an ellipse or a taper. One end of the discharge path 17 communicates with a part of the discharge groove 15 , and the other end communicates with a discharge port of the frame body 13 (not shown). The cutting water that has flowed into the discharge groove 15 flows to the discharge path 17 by gravity or, when the suction source is connected, by the attraction formed by suction, and flows from the discharge path 17 to the outside of the frame body 13. discharge.

As shown in FIG. 3 , on the upper surface 131 of the frame body 13 of the holding surface 11 , connecting portions 16 are formed between adjacent discharge grooves 15 . On the holding surface 11 , the discharge grooves 15 and the connection portions 16 are alternately arranged along the outer periphery of the holding portion 12 . The holding surface 11 maintains the strength of the frame body 13 even if the width of the discharge groove 15 in the radial direction is widened by providing a plurality of discharge grooves 15 and the connecting portion 16 . Moreover, the holding surface 11 can form the suction path 19 etc. which communicate with the outer peripheral groove 18 mentioned later in the inside of the frame body 13 in which the connection part 16 was formed by having the connection part 16.

The outer peripheral groove 18 surrounds the plurality of discharge grooves 15 and communicates with a suction source to suck and hold the substrate 100 . The outer peripheral groove 18 is formed in the frame body 13 as an annular groove along the entire outer periphery of the frame body 13 . The outer peripheral groove 18 is an annular groove having a diameter smaller than that of the substrate 100 and is formed on the front (upper surface) of the frame 13 between the plurality of discharge grooves 15 and the outer edge of the frame 13 . The outer peripheral groove 18 may not be annular, but may be formed in plural discontinuously at intervals.

As shown in FIG. 4 , the outer peripheral groove 18 communicates with the suction path 19 formed inside the frame body 13 . The suction path 19 is configured to be switchable by a solenoid valve 191 and to connect a suction source 192 and an air supply source 193 . When the outer peripheral groove 18 is connected to the suction source 192 under the control of the control unit 30 , the substrate 100 is sucked and held by the negative pressure supplied from the suction source 192 . In the case where the peripheral groove 18 has been connected to the air supply source 193 by the control of the control unit 30, by supplying pressurized air from the air supply source 193, the air will be blown upward to the outside of the frame body 13, and The substrate can be easily unloaded from the holding table 10 . The suction passage 19 communicates with the holding unit 12 and supplies negative pressure from the suction source 192 to the holding unit 12 .

Fig. 5 is a diagram showing an example of the discharge operation of the processing apparatus 1 according to the embodiment. As shown in FIG. 5 , in the processing apparatus 1 , the holding portion 12 of the holding table 10 sucks and holds the central region of the substrate 100 , and the outer peripheral groove 18 sucks and holds the substrate 100 near the outer periphery of the frame body 13 . Thereby, since the processing apparatus 1 holds the table 10 to attract and hold the substrate 100 by the holding portion 12 and the peripheral groove 18 , the peripheral portion 130 of the substrate 100 can be prevented from floating from the holding surface 11 and shaking during processing.

The processing apparatus 1 moves the holding table 10 and the cutting blade 21 relative to each other while supplying the cutting water 500 , which is a liquid, to the substrate 100 in a state where the substrate 100 is sucked and held on the holding table 10 , thereby removing the substrate 100 . Peripheral portion 130 . In this case, if the cutting water 500 enters from the outer peripheral portion 130 toward the central area of the holding portion 12 through the gap between the substrate 100 being processed and the holding table 10 , the processing device 1 will discharge the cutting water 500 through the groove 15 It is recovered and discharged from the discharge path 17 to the outside of the frame body 13 . Thereby, since the processing apparatus 1 recovers the cutting water 500 through the discharge groove 15 , it is possible to prevent contamination of the central region of the substrate 100 inside the discharge groove 15 or the center of the holding surface 11 .

Through the above, the processing apparatus 1 can suppress the cutting water 500 from going around the back surface of the substrate 100 and maintain high processing quality. Also, since the holding surface 11 is smaller than the substrate 100, the outer peripheral portion 130 of the substrate 100 is exposed from the holding surface 11, and in the full-cut trimming for removal, positioning cutting is performed next to the outer peripheral portion of the holding surface 11. Therefore, it is easier to allow the cutting water 500 used for machining to go around the back side of the substrate 100 from the side of the holding surface 11 than in the conventional processing in which the cutting insert is positioned above the holding surface. Therefore, the machining device 1 of the embodiment can be effectively used for full-cut trimming.

Although the processing device 1 of the embodiment has been described as a cutting device for cutting, it is not limited to the processing device of the above embodiment, and various modifications can be made without departing from the gist of the present invention. For example, the processing device 1 may be a grinding device or a laser processing device other than a cutting device.

In the processing apparatus 1 of the embodiment, although the discharge groove 15 is independently formed with a plurality of through grooves, it may be formed as an annular groove. In this case, since the connecting portion 16 including the flow path for sucking/supplying air to the outer peripheral groove 18 is not included, the processing device 1 only needs to separately form a flow path communicating with the outer peripheral groove 18 inside the frame body 13. .

In the processing apparatus 1 of the embodiment, the holding portion 12 holding the central region of the substrate 100 may be a plate-shaped object such as a porous plate or SUS having a suction groove communicating with the suction path on the front surface. Although the holding part 12 formed with the suction groove is easy to remove the cutting chips that have entered the groove by washing, but the cutting chips in the porous plate will block the pores and reduce the suction force. Therefore, the processing apparatus 1 of the embodiment is particularly effective in the case of having the holding part 12 of a perforated plate.

Although the processing device 1 of the embodiment describes the case where the processing unit is realized by cooperation of the control unit 30 and the processing unit 20, it is not limited thereto. For example, the processing device 1 may be realized by forming the processing unit 20 and the control unit 30 as one processing unit.

1: Processing device 10: Hold the workbench 11: keep the surface 12: Holding part 13: frame 14: Concave 15: discharge ditch 16: Connection part 17: discharge way 18: Peripheral groove 19: Attraction Road 20: Processing unit 21: Cutting blade 22: Nozzle 30: Control unit 41: X-axis moving mechanism 42: Y-axis moving mechanism 43: Z-axis moving mechanism 100: Substrate 110: upper surface 120: back 130: peripheral part 131: upper surface 151: bottom 191: Solenoid valve 192: source of attraction 193: Air supply source 211: shell 212:Spindle 500: cutting water X, Y, Z: direction

Fig. 1 is a perspective view showing a configuration example of a processing apparatus according to an embodiment. Fig. 2 is a schematic view for explaining the relationship between the cutting insert and the holding unit shown in Fig. 1 . Fig. 3 is a top view showing an example of a holding surface of the holding table shown in Fig. 1 . Fig. 4 is a schematic sectional view showing part of the configuration of the holding table shown in Fig. 1 . Fig. 5 is a schematic diagram showing an example of the discharge operation of the processing apparatus according to the embodiment.

10: Hold the workbench

11: keep the surface

12: Holding part

13: frame

14: Concave

15: discharge ditch

17: discharge way

18: Peripheral groove

19: Attraction Road

100: Substrate

130: peripheral part

151: bottom

191: Solenoid valve

192: source of attraction

193: Air supply source

Claims (3)

A processing device, characterized in that: have: The holding table has a holding surface for holding the back side of the substrate; and a processing unit for processing the substrate held on the holding surface, The keep mask has: a holding part, holding the central area of the substrate; a drain surrounding the retaining portion; and a peripheral groove surrounding the drain groove and communicating with a suction source to attract and hold the substrate, The aforementioned processing device uses the discharge groove to recover the processing chips generated by the processing unit. The processing device according to claim 1, further comprising a liquid supply unit for supplying liquid to the substrate, The discharge ditch recovers the liquid containing the machining chips. The processing device according to claim 2, wherein the holding surface is formed smaller than the substrate, The machining unit comprises a cutting insert rotatably held on a spindle, The cutting blade is positioned on the outer peripheral portion of the substrate exposed from the holding surface, and the cutting water, which is the liquid, is supplied to the substrate while moving the holding table and the cutting blade relative to each other, thereby removing the substrate. the peripheral portion.

Images