JP5270179B2 - 研削装置 - Google Patents
研削装置 Download PDFInfo
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- JP5270179B2 JP5270179B2 JP2008009739A JP2008009739A JP5270179B2 JP 5270179 B2 JP5270179 B2 JP 5270179B2 JP 2008009739 A JP2008009739 A JP 2008009739A JP 2008009739 A JP2008009739 A JP 2008009739A JP 5270179 B2 JP5270179 B2 JP 5270179B2
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- Prior art keywords
- workpiece
- grinding
- suction
- chuck table
- chuck
- Prior art date
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- 239000000758 substrate Substances 0.000 claims abstract description 19
- 230000002093 peripheral effect Effects 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 11
- 239000011148 porous material Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 abstract description 13
- 238000007664 blowing Methods 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
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Images
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Description
15 搬出機構
20 チャックテーブル
22 チャック板
23 支持基板
26a 内周側吸引吹上げ領域
26b 外周側吸引吹上げ領域
28 吸引吹上げ手段
30 研削手段
60 制御手段
Claims (1)
- 被加工物を吸引保持して回転駆動されるチャックテーブルと、該チャックテーブル上に吸引保持された被加工物に研削液を供給しつつ研削する研削手段と、前記チャックテーブル上で研削された被加工物を保持して搬送する搬出機構とを備える研削装置において、
前記チャックテーブルは、前記被加工物と同等の大きさに形成されかつ多孔質材で構成されて被加工物を吸着保持するチャック板と、該チャック板を支持する支持基板とからなり、
前記支持基板は、平面的に見て内周側吸引吹上げ領域と外周側の領域とに区分けされ、
前記内周側吸引吹上げ領域および前記外周側の領域のそれぞれに負圧または吹上げ圧を作用させることが可能な吸引吹上げ手段を備え、
被加工物の研削時には、前記内周側吸引吹上げ領域にのみ負圧を作用させて前記被加工物を前記チャック板上に吸着保持し、被加工物の搬送時には、前記内周側吸引吹上げ領域および前記外周側の領域に吹上げ圧を作用させて前記チャック板の全面で均一に吹上げ圧を作用させるよう制御する制御手段を備えることを特徴とする研削装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008009739A JP5270179B2 (ja) | 2008-01-18 | 2008-01-18 | 研削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008009739A JP5270179B2 (ja) | 2008-01-18 | 2008-01-18 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009166214A JP2009166214A (ja) | 2009-07-30 |
JP5270179B2 true JP5270179B2 (ja) | 2013-08-21 |
Family
ID=40967988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008009739A Active JP5270179B2 (ja) | 2008-01-18 | 2008-01-18 | 研削装置 |
Country Status (1)
Country | Link |
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JP (1) | JP5270179B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103928368A (zh) * | 2014-03-20 | 2014-07-16 | 上海华力微电子有限公司 | 一种在线实时控制硅片背压的结构及方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101176821B1 (ko) | 2011-03-02 | 2012-08-28 | 주식회사 알피에스 | 온도조절형 웨이퍼용 진공척 제조장치 |
JP6309371B2 (ja) * | 2014-07-01 | 2018-04-11 | 株式会社ディスコ | 板状ワークの搬出方法 |
JP7355688B2 (ja) * | 2020-03-23 | 2023-10-03 | 株式会社ディスコ | 厚み測定装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3252074B2 (ja) * | 1994-03-09 | 2002-01-28 | 日本電信電話株式会社 | 真空吸着装置、真空吸着装置用シール具および真空吸着方法 |
JP2000232083A (ja) * | 1999-02-10 | 2000-08-22 | Okamoto Machine Tool Works Ltd | 半導体ウエハのユニバーサルチャック機構 |
JP2002324831A (ja) * | 2001-04-26 | 2002-11-08 | Takatori Corp | 真空吸着テーブル |
JP2003257909A (ja) * | 2002-03-04 | 2003-09-12 | Nippei Toyama Corp | 半導体ウェーハの加工装置 |
JP2003332410A (ja) * | 2002-05-17 | 2003-11-21 | Tokyo Seimitsu Co Ltd | 真空吸着装置 |
-
2008
- 2008-01-18 JP JP2008009739A patent/JP5270179B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103928368A (zh) * | 2014-03-20 | 2014-07-16 | 上海华力微电子有限公司 | 一种在线实时控制硅片背压的结构及方法 |
CN103928368B (zh) * | 2014-03-20 | 2017-10-03 | 上海华力微电子有限公司 | 一种在线实时控制硅片背压的结构及方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2009166214A (ja) | 2009-07-30 |
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