JP2019217561A - チャックテーブル、研削装置および研削品の製造方法 - Google Patents
チャックテーブル、研削装置および研削品の製造方法 Download PDFInfo
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- JP2019217561A JP2019217561A JP2018114356A JP2018114356A JP2019217561A JP 2019217561 A JP2019217561 A JP 2019217561A JP 2018114356 A JP2018114356 A JP 2018114356A JP 2018114356 A JP2018114356 A JP 2018114356A JP 2019217561 A JP2019217561 A JP 2019217561A
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- JP
- Japan
- Prior art keywords
- grinding
- ground
- chuck table
- suction
- porous member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/30—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q2703/00—Work clamping
- B23Q2703/02—Work clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q2703/00—Work clamping
- B23Q2703/02—Work clamping means
- B23Q2703/10—Devices for clamping workpieces of a particular form or made from a particular material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
Claims (10)
- 研削対象物を吸着するためのチャックテーブルであって、
前記研削対象物を配置可能な領域を有する本体と、
前記本体における前記研削対象物を配置可能な領域内に設けられる多孔質部材と、
前記本体における前記研削対象物を配置可能な領域内であって、前記多孔質部材の外側に設けられた吸着孔配置領域とを備えた、チャックテーブル。 - 前記本体は凹部を有し、
前記研削対象物を配置可能な領域は、前記凹部の底面上に設けられる、請求項1に記載のチャックテーブル。 - 吸引装置に接続可能な吸引路が前記本体に形成され、
前記多孔質部材および吸着孔配置領域は、前記吸引路に連通する空間上に設けられる、請求項1または請求項2に記載のチャックテーブル。 - 前記多孔質部材の側面が前記吸着孔配置領域の吸着孔に面する、請求項1から請求項3のいずれか1項に記載のチャックテーブル。
- 前記多孔質部材は、連通気孔構造を有する多孔質セラミックス材料からなる、請求項1から請求項4のいずれか1項に記載のチャックテーブル。
- 請求項1から請求項5のいずれか1項に記載のチャックテーブルと、
前記チャックテーブルに吸着された前記研削対象物を研削する研削部とを備えた、研削装置。 - 前記チャックテーブルに吸着された前記研削対象物に研削液を供給する研削液供給部をさらに備えた、請求項6に記載の研削装置。
- 請求項1から請求項5のいずれか1項に記載のチャックテーブルに前記研削対象物を吸着する工程と、
砥石が配置された研削部を回転させ、前記砥石によって研削対象物を研削する工程とを備えた、研削品の製造方法。 - 前記研削する工程において、前記研削対象物の研削面に研削液を供給する、請求項8に記載の研削品の製造方法。
- 前記研削対象物は、支持部材と、前記支持部材上の封止樹脂とを含み、
前記研削対象物を研削する工程は、前記研削対象物の厚さを低減するように少なくとも前記封止樹脂の一部を研削することを含む、請求項8または請求項9に記載の研削品の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018114356A JP7034845B2 (ja) | 2018-06-15 | 2018-06-15 | チャックテーブル、研削装置および研削品の製造方法 |
CN201910475572.8A CN110605636B (zh) | 2018-06-15 | 2019-06-03 | 卡盘台、磨削装置及磨削品的制造方法 |
KR1020190065861A KR102209921B1 (ko) | 2018-06-15 | 2019-06-04 | 척 테이블, 연삭 장치 및 연삭품의 제조 방법 |
TW108120515A TWI700148B (zh) | 2018-06-15 | 2019-06-13 | 夾盤台、磨削裝置及磨削品的製造方法 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2018114356A JP7034845B2 (ja) | 2018-06-15 | 2018-06-15 | チャックテーブル、研削装置および研削品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019217561A true JP2019217561A (ja) | 2019-12-26 |
JP7034845B2 JP7034845B2 (ja) | 2022-03-14 |
Family
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JP2018114356A Active JP7034845B2 (ja) | 2018-06-15 | 2018-06-15 | チャックテーブル、研削装置および研削品の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7034845B2 (ja) |
KR (1) | KR102209921B1 (ja) |
CN (1) | CN110605636B (ja) |
TW (1) | TWI700148B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111168564A (zh) * | 2020-01-06 | 2020-05-19 | 业成科技(成都)有限公司 | 研磨清洁的改良装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08153992A (ja) * | 1994-11-29 | 1996-06-11 | Ckd Corp | 真空チャックの吸着プレート |
JPH11179638A (ja) * | 1997-12-17 | 1999-07-06 | Toshiba Ceramics Co Ltd | 半導体ウェーハの製造方法およびその装置 |
JP2004319930A (ja) * | 2003-04-21 | 2004-11-11 | Okamoto Machine Tool Works Ltd | 基板用洗浄・乾燥装置 |
JP2005169592A (ja) * | 2003-12-15 | 2005-06-30 | Okamoto Machine Tool Works Ltd | 非磁性ワ−クのチャック機構 |
JP2008296334A (ja) * | 2007-05-31 | 2008-12-11 | Toshiba Corp | 真空吸着チャックおよびそれを用いた研削装置 |
US20110217910A1 (en) * | 2010-03-03 | 2011-09-08 | Chang One-Moon | Chemical mechanical polishing apparatus |
JP2015085414A (ja) * | 2013-10-29 | 2015-05-07 | 株式会社ディスコ | パッケージ基板の加工方法 |
JP2016159412A (ja) * | 2015-03-04 | 2016-09-05 | 株式会社ディスコ | パッケージ基板の研削方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW500015U (en) * | 2001-03-21 | 2002-08-21 | Ultra Tera Corp | Grinding machine for workpiece |
TW556619U (en) * | 2003-02-17 | 2003-10-01 | Hotshine Prec Machine Co Ltd | Improved vacuum absorbing table board |
JP5448337B2 (ja) * | 2007-12-21 | 2014-03-19 | 株式会社東京精密 | ウェーハ研削装置およびウェーハ研削方法 |
CN106217087A (zh) * | 2016-06-30 | 2016-12-14 | 山东鲁南机床有限公司 | 一种针对厚胶基片的无损夹持装置 |
TWI629125B (zh) * | 2016-08-12 | 2018-07-11 | 鄧榮貴 | Object suction mechanism |
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2018
- 2018-06-15 JP JP2018114356A patent/JP7034845B2/ja active Active
-
2019
- 2019-06-03 CN CN201910475572.8A patent/CN110605636B/zh active Active
- 2019-06-04 KR KR1020190065861A patent/KR102209921B1/ko active IP Right Grant
- 2019-06-13 TW TW108120515A patent/TWI700148B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08153992A (ja) * | 1994-11-29 | 1996-06-11 | Ckd Corp | 真空チャックの吸着プレート |
JPH11179638A (ja) * | 1997-12-17 | 1999-07-06 | Toshiba Ceramics Co Ltd | 半導体ウェーハの製造方法およびその装置 |
JP2004319930A (ja) * | 2003-04-21 | 2004-11-11 | Okamoto Machine Tool Works Ltd | 基板用洗浄・乾燥装置 |
JP2005169592A (ja) * | 2003-12-15 | 2005-06-30 | Okamoto Machine Tool Works Ltd | 非磁性ワ−クのチャック機構 |
JP2008296334A (ja) * | 2007-05-31 | 2008-12-11 | Toshiba Corp | 真空吸着チャックおよびそれを用いた研削装置 |
US20110217910A1 (en) * | 2010-03-03 | 2011-09-08 | Chang One-Moon | Chemical mechanical polishing apparatus |
JP2015085414A (ja) * | 2013-10-29 | 2015-05-07 | 株式会社ディスコ | パッケージ基板の加工方法 |
JP2016159412A (ja) * | 2015-03-04 | 2016-09-05 | 株式会社ディスコ | パッケージ基板の研削方法 |
Also Published As
Publication number | Publication date |
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KR20190142213A (ko) | 2019-12-26 |
KR102209921B1 (ko) | 2021-02-01 |
CN110605636B (zh) | 2021-08-24 |
CN110605636A (zh) | 2019-12-24 |
TW202000367A (zh) | 2020-01-01 |
JP7034845B2 (ja) | 2022-03-14 |
TWI700148B (zh) | 2020-08-01 |
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