CN110605636B - 卡盘台、磨削装置及磨削品的制造方法 - Google Patents

卡盘台、磨削装置及磨削品的制造方法 Download PDF

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Publication number
CN110605636B
CN110605636B CN201910475572.8A CN201910475572A CN110605636B CN 110605636 B CN110605636 B CN 110605636B CN 201910475572 A CN201910475572 A CN 201910475572A CN 110605636 B CN110605636 B CN 110605636B
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China
Prior art keywords
grinding
chuck table
region
porous member
suction
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CN201910475572.8A
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English (en)
Chinese (zh)
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CN110605636A (zh
Inventor
高森雄大
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Towa Corp
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Towa Corp
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Publication of CN110605636A publication Critical patent/CN110605636A/zh
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/30Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding plastics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/04Headstocks; Working-spindles; Features relating thereto
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2703/00Work clamping
    • B23Q2703/02Work clamping means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2703/00Work clamping
    • B23Q2703/02Work clamping means
    • B23Q2703/10Devices for clamping workpieces of a particular form or made from a particular material

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
CN201910475572.8A 2018-06-15 2019-06-03 卡盘台、磨削装置及磨削品的制造方法 Active CN110605636B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018114356A JP7034845B2 (ja) 2018-06-15 2018-06-15 チャックテーブル、研削装置および研削品の製造方法
JP2018-114356 2018-06-15

Publications (2)

Publication Number Publication Date
CN110605636A CN110605636A (zh) 2019-12-24
CN110605636B true CN110605636B (zh) 2021-08-24

Family

ID=68890066

Family Applications (1)

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CN201910475572.8A Active CN110605636B (zh) 2018-06-15 2019-06-03 卡盘台、磨削装置及磨削品的制造方法

Country Status (4)

Country Link
JP (1) JP7034845B2 (ko)
KR (1) KR102209921B1 (ko)
CN (1) CN110605636B (ko)
TW (1) TWI700148B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111168564A (zh) * 2020-01-06 2020-05-19 业成科技(成都)有限公司 研磨清洁的改良装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11179638A (ja) * 1997-12-17 1999-07-06 Toshiba Ceramics Co Ltd 半導体ウェーハの製造方法およびその装置
TW556619U (en) * 2003-02-17 2003-10-01 Hotshine Prec Machine Co Ltd Improved vacuum absorbing table board
JP2004319930A (ja) * 2003-04-21 2004-11-11 Okamoto Machine Tool Works Ltd 基板用洗浄・乾燥装置
JP2015085414A (ja) * 2013-10-29 2015-05-07 株式会社ディスコ パッケージ基板の加工方法
CN106217087A (zh) * 2016-06-30 2016-12-14 山东鲁南机床有限公司 一种针对厚胶基片的无损夹持装置
TW201805091A (zh) * 2016-08-12 2018-02-16 鄧榮貴 物件吸載機構

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2664641B2 (ja) * 1994-11-29 1997-10-15 シーケーディ株式会社 真空チャックの吸着プレート
TW500015U (en) * 2001-03-21 2002-08-21 Ultra Tera Corp Grinding machine for workpiece
JP2005169592A (ja) * 2003-12-15 2005-06-30 Okamoto Machine Tool Works Ltd 非磁性ワ−クのチャック機構
JP2008296334A (ja) * 2007-05-31 2008-12-11 Toshiba Corp 真空吸着チャックおよびそれを用いた研削装置
JP5448337B2 (ja) * 2007-12-21 2014-03-19 株式会社東京精密 ウェーハ研削装置およびウェーハ研削方法
KR101610832B1 (ko) * 2010-03-03 2016-04-08 삼성전자주식회사 화학적 기계적 연마 설비
JP6495054B2 (ja) * 2015-03-04 2019-04-03 株式会社ディスコ パッケージ基板の研削方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11179638A (ja) * 1997-12-17 1999-07-06 Toshiba Ceramics Co Ltd 半導体ウェーハの製造方法およびその装置
TW556619U (en) * 2003-02-17 2003-10-01 Hotshine Prec Machine Co Ltd Improved vacuum absorbing table board
JP2004319930A (ja) * 2003-04-21 2004-11-11 Okamoto Machine Tool Works Ltd 基板用洗浄・乾燥装置
JP2015085414A (ja) * 2013-10-29 2015-05-07 株式会社ディスコ パッケージ基板の加工方法
CN106217087A (zh) * 2016-06-30 2016-12-14 山东鲁南机床有限公司 一种针对厚胶基片的无损夹持装置
TW201805091A (zh) * 2016-08-12 2018-02-16 鄧榮貴 物件吸載機構

Also Published As

Publication number Publication date
KR20190142213A (ko) 2019-12-26
JP2019217561A (ja) 2019-12-26
TWI700148B (zh) 2020-08-01
TW202000367A (zh) 2020-01-01
KR102209921B1 (ko) 2021-02-01
JP7034845B2 (ja) 2022-03-14
CN110605636A (zh) 2019-12-24

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