TWI691976B - 異向性導電膜、其製造方法及連接構造體 - Google Patents

異向性導電膜、其製造方法及連接構造體 Download PDF

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Publication number
TWI691976B
TWI691976B TW105100669A TW105100669A TWI691976B TW I691976 B TWI691976 B TW I691976B TW 105100669 A TW105100669 A TW 105100669A TW 105100669 A TW105100669 A TW 105100669A TW I691976 B TWI691976 B TW I691976B
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Taiwan
Prior art keywords
anisotropic conductive
metal particles
conductive film
flux
insulating film
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TW105100669A
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English (en)
Chinese (zh)
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TW201643892A (zh
Inventor
芳賀賢一
石松朋之
阿久津恭志
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日商迪睿合股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H10W72/30—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H10W72/013—
    • H10W72/0198—
    • H10W72/072—
    • H10W72/073—
    • H10W72/07332—
    • H10W72/07338—
    • H10W72/07339—
    • H10W72/074—
    • H10W72/241—
    • H10W72/252—
    • H10W72/261—
    • H10W72/322—
    • H10W72/325—
    • H10W72/351—
    • H10W72/352—
    • H10W72/353—
    • H10W72/354—
    • H10W90/732—
    • H10W90/734—
    • H10W99/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Thermal Sciences (AREA)
  • Non-Insulated Conductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
TW105100669A 2015-01-13 2016-01-11 異向性導電膜、其製造方法及連接構造體 TWI691976B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2015-004592 2015-01-13
JP2015004592A JP6458503B2 (ja) 2015-01-13 2015-01-13 異方性導電フィルム、その製造方法及び接続構造体

Publications (2)

Publication Number Publication Date
TW201643892A TW201643892A (zh) 2016-12-16
TWI691976B true TWI691976B (zh) 2020-04-21

Family

ID=56405707

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105100669A TWI691976B (zh) 2015-01-13 2016-01-11 異向性導電膜、其製造方法及連接構造體

Country Status (6)

Country Link
US (1) US10575410B2 (enExample)
JP (1) JP6458503B2 (enExample)
KR (1) KR102028900B1 (enExample)
CN (1) CN107112657B (enExample)
TW (1) TWI691976B (enExample)
WO (1) WO2016114160A1 (enExample)

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CN113078486B (zh) * 2016-10-24 2023-10-20 迪睿合株式会社 各向异性导电膜的制造方法
JP6935702B2 (ja) * 2016-10-24 2021-09-15 デクセリアルズ株式会社 異方性導電フィルム
JP7077963B2 (ja) * 2017-01-27 2022-05-31 昭和電工マテリアルズ株式会社 絶縁被覆導電粒子、異方導電フィルム、異方導電フィルムの製造方法、接続構造体及び接続構造体の製造方法
JP2019029135A (ja) * 2017-07-27 2019-02-21 日立化成株式会社 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法
JP7042121B2 (ja) * 2018-03-14 2022-03-25 デクセリアルズ株式会社 異方導電性シート、及び異方導電性シートの製造方法
US12172240B2 (en) 2018-06-26 2024-12-24 Resonac Corporation Solder particles
TWI826476B (zh) 2018-06-26 2023-12-21 日商力森諾科股份有限公司 各向異性導電膜及其製造方法以及連接結構體的製造方法
CN110767348A (zh) * 2019-11-12 2020-02-07 业成科技（成都）有限公司 异方性导电膜及其制作方法
JP2021153049A (ja) * 2020-03-19 2021-09-30 デクセリアルズ株式会社 接続体、及び接続体の製造方法
US12418130B2 (en) 2020-03-19 2025-09-16 Dexerials Corporation Connection body and method for manufacturing connection body
KR20230107273A (ko) * 2020-11-12 2023-07-14 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그 제조 방법, 및 접속 구조체 및 그 제조 방법
WO2022191110A1 (ja) * 2021-03-09 2022-09-15 日東電工株式会社 接合シート
CN117296109A (zh) 2021-05-12 2023-12-26 积水化学工业株式会社 导电粒子、导电材料及连接结构体
JP2024136139A (ja) * 2023-03-23 2024-10-04 デクセリアルズ株式会社 フィラー含有フィルム、接続体及びその製造方法

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US20110127068A1 (en) * 2008-07-31 2011-06-02 Takuya Wada Polymer particle, conductive particle, anisotropic conductive material and connection structure
TW201140623A (en) * 2010-04-22 2011-11-16 Sekisui Chemical Co Ltd Anisotropic conductive material and connection structure
WO2014088095A1 (ja) * 2012-12-06 2014-06-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
TW201431674A (zh) * 2012-08-24 2014-08-16 迪睿合股份有限公司 異向性導電膜及其製造方法

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JP4130747B2 (ja) 2002-03-28 2008-08-06 旭化成エレクトロニクス株式会社 異方導電性接着シートおよびその製造方法
JP4822322B2 (ja) * 2003-12-04 2011-11-24 旭化成イーマテリアルズ株式会社 異方導電性接着シートの製造方法
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JP2009152160A (ja) * 2007-12-25 2009-07-09 Tokai Rubber Ind Ltd 粒子転写型およびその製造方法、粒子転写膜の製造方法ならびに異方性導電膜
JP5268515B2 (ja) 2008-09-17 2013-08-21 積水化学工業株式会社 フラックス内包カプセル含有導電性粒子、異方性導電材料及び接続構造体
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JP5445558B2 (ja) * 2011-10-24 2014-03-19 デクセリアルズ株式会社 異方導電性接着シート及び接続方法
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US20110127068A1 (en) * 2008-07-31 2011-06-02 Takuya Wada Polymer particle, conductive particle, anisotropic conductive material and connection structure
TW201140623A (en) * 2010-04-22 2011-11-16 Sekisui Chemical Co Ltd Anisotropic conductive material and connection structure
TW201431674A (zh) * 2012-08-24 2014-08-16 迪睿合股份有限公司 異向性導電膜及其製造方法
WO2014088095A1 (ja) * 2012-12-06 2014-06-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法

Also Published As

Publication number Publication date
JP6458503B2 (ja) 2019-01-30
KR20170057363A (ko) 2017-05-24
JP2016131082A (ja) 2016-07-21
WO2016114160A1 (ja) 2016-07-21
US20170359904A1 (en) 2017-12-14
US10575410B2 (en) 2020-02-25
CN107112657A (zh) 2017-08-29
TW201643892A (zh) 2016-12-16
CN107112657B (zh) 2019-05-17
KR102028900B1 (ko) 2019-10-07

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