TW201643892A - 異向性導電膜、其製造方法及連接構造體 - Google Patents

異向性導電膜、其製造方法及連接構造體 Download PDF

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Publication number
TW201643892A
TW201643892A TW105100669A TW105100669A TW201643892A TW 201643892 A TW201643892 A TW 201643892A TW 105100669 A TW105100669 A TW 105100669A TW 105100669 A TW105100669 A TW 105100669A TW 201643892 A TW201643892 A TW 201643892A
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Taiwan
Prior art keywords
anisotropic conductive
metal particles
conductive film
flux
insulating film
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TW105100669A
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English (en)
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TWI691976B (zh
Inventor
Kenichi Haga
Tomoyuki Ishimatsu
Yasushi Akutsu
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Dexerials Corp
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Publication of TW201643892A publication Critical patent/TW201643892A/zh
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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Abstract

一種異向性導電膜，其將於表面具有氧化被膜的焊料粒子等金屬粒子作為異向性導電連接用之導電粒子，該異向性導電膜於絕緣膜內具備金屬粒子，金屬粒子於俯視下規則排列。於金屬粒子之異向性導電膜表面側端部或異向性導電膜背面側端部之至少任一端部，以接觸或是接近之方式配置有助焊劑(flux)。較佳之金屬粒子為焊料粒子。較佳為絕緣膜成為2層結構，於其層間配置有金屬粒子。

Description

異向性導電膜、其製造方法及連接構造體
本發明係關於一種金屬粒子與助焊劑(flux)於膜內接觸或接近存在之異向性導電膜。
將IC晶片構裝於基板時，提出有使用將導電粒子等分散於絕緣性接著劑組成物之異向性導電膜，該導電粒子等在樹脂心(resin core)之表面形成有鎳/金鍍層(專利文獻1)。此情形時，導電粒子在IC晶片之端子與基板之端子間壓碎，或導電粒子擠入各端子而確保傳導，絕緣性接著劑組成物固定了IC晶片、基板與導電粒子。
然而，導電粒子不會於IC晶片之端子與基板之端子之間形成金屬鍵結，故於將利用異向性導電膜使IC晶片連接於基板而得之連接構造體保管於高溫高壓或高溫高濕環境下之情形時，存在傳導可靠性降低之問題。
此處，作為異向性導電膜之導電粒子，可考慮採用與一般作為IC晶片之端子材料的銅或鋁等金屬相較，於較低溫與銅等形成金屬鍵結的焊料粒子。
[專利文獻1]日本特開2014-60150號公報
且說，於藉由焊接將端子之間進行連接之情形時，為了去除 焊料表面之氧化被膜，一般而言助焊劑之使用變得不可或缺。因此，雖考慮以助焊劑被覆焊料粒子之表面，但被助焊劑被覆之焊料粒子於絕緣性接著劑組成物中容易凝聚。因此，於使用含有此種焊料粒子作為異向性導電連接用之粒子的異向性導電膜進行異向性導電連接之情形時，存在容易發生短路之問題。又，若亦考慮將助焊劑相溶或分散於絕緣性接著劑組成物中，但為了將焊料粒子之表面淨化至所欲之程度，必須將大量之助焊劑摻合於絕緣性接著劑組成物，反而存在因助焊劑造成之端子腐蝕進行之問題。此問題亦同樣地產生於含有形成有氧化被膜之金屬粒子作為異向性導電連接用之導電粒子的異向性導電膜。
本發明之目的係解決上述先前之技術的問題點，在將表面具有氧化被膜之焊料粒子等金屬粒子作為異向性導電連接用之導電粒子的異向性導電膜中，使之可抑制短路之發生，且使之可實現高傳導可靠性。
本發明人等發現了如下情形而完成了本發明：在將表面具有氧化被膜之焊料粒子等金屬粒子作為異向性導電連接用之導電粒子的異向性導電膜中，為了抑制短路之發生，並非將金屬粒子隨機地分散於絕緣性接著劑組成物中，而只要使異向性導電膜於俯視時規則排列即可；為了實現高傳導可靠性，只要於膜中使助焊劑以接觸或是接近於金屬粒子之方式存在即可。
1、1a、1b‧‧‧絕緣膜
2‧‧‧金屬粒子
2a、2b‧‧‧金屬粒子之異向性導電膜之表面或背面側端部
3‧‧‧助焊劑
10‧‧‧異向性導電膜
50‧‧‧轉移模之凹部
100、200‧‧‧轉移模
即，本發明提供一種異向性導電膜，其係於絕緣膜內具備金屬粒子之異向性導電膜，於俯視下金屬粒子規則排列，助焊劑被配置成接觸或是接近於金屬粒子之異向性導電膜表面側端部或異向性導電膜背面側 端部之至少任一端部。
又，本發明提供一種製造方法，該製造方法係上述異向性導電膜之製造方法，具有以下步驟(A)~(C)：(A)於具有規則排列之凹部的轉移模之該凹部的至少底部配置助焊劑之步驟；(B)於配置有助焊劑之凹部配置金屬粒子之步驟；及(C)自配置有金屬粒子之轉移模的凹部側使絕緣膜抵接且加熱加壓而將金屬粒子轉移至絕緣膜之步驟。
此製造方法較佳進而含有步驟(D)：(D)將其他絕緣膜熱壓接合至轉移有金屬粒子之絕緣膜的金屬粒子轉移面之步驟。
又，本發明係上述異向性導電膜之其他製造方法，含有以下步驟(a)~(d)：(a)於具有規則排列之凹部的轉移模之該凹部配置金屬粒子之步驟；(b)於轉移模之配置有金屬粒子的凹部形成面配置助焊劑之步驟；(c)自轉移模之助焊劑配置面側使絕緣膜抵接且加熱加壓而將金屬粒子轉移至絕緣膜之步驟；及(d)將其他絕緣膜熱壓接合至轉移有金屬粒子之絕緣膜的金屬粒子轉移面之步驟。
並且，本發明提供一種連接構造體，其中，對配置於第1電子零件之端子與第2電子零件之端子之間的上述異向性導電膜進行配置，藉由加熱加壓而異向性導電連接有第1電子零件與第2電子零件。
於絕緣膜內具備有金屬粒子之本發明之異向性導電膜，由於在俯視下金屬粒子規則排列，故在應用於異向性導電連接之情形時可抑制短路之發生。又，由於助焊劑被配置成接觸或是接近於金屬粒子之異向性導電膜表面側端部或異向性導電膜背面側端部之至少任一端部，故在進行異向性導電時可除去金屬粒子表面之氧化被膜，可實現高傳導可靠性。
[圖1A]圖1A為本發明之異向性導電膜之剖面圖。
[圖1B]圖1B為本發明之異向性導電膜之剖面圖。
[圖1C]圖1C為本發明之異向性導電膜之剖面圖。
[圖2A]圖2A為本發明之異向性導電膜之剖面圖。
[圖2B]圖2B為本發明之異向性導電膜之剖面圖。
[圖2C]圖2C為本發明之異向性導電膜之剖面圖。
[圖3]圖3為本發明之異向性導電膜之剖面圖。
[圖4]圖4為本發明之異向性導電膜之剖面圖。
[圖5]圖5為本發明之異向性導電膜之剖面圖。
[圖6]圖6為本發明之異向性導電膜之剖面圖。
[圖7A]圖7A為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖7B]圖7B為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖7C]圖7C為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖8A]圖8A為本發明之異向性導電膜之製造方法的步驟 說明圖。
[圖8B]圖8B為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖8C]圖8C為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖8D]圖8D為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖9A]圖9A為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖9B]圖9B為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖9C]圖9C為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖9D]圖9D為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖10A]圖10A為本發明之異向性導電膜之剖面圖。
[圖10B]圖10B為本發明之異向性導電膜之剖面圖。
[圖10C]圖10C為本發明之異向性導電膜之剖面圖。
[圖10D]圖10D為本發明之異向性導電膜之剖面圖。
[圖11A]圖11A為本發明之異向性導電膜之剖面圖。
[圖11B]圖11B為本發明之異向性導電膜之剖面圖。
[圖11C]圖11C為本發明之異向性導電膜之剖面圖。
[圖11D]圖11D為本發明之異向性導電膜之剖面圖。
[圖12A]圖12A為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖12B]圖12B為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖12C]圖12C為本發明之異向性導電膜之製造方法的步驟說明圖。
[圖12D]圖12D為本發明之異向性導電膜之製造方法的步驟說明圖。
<異向性導電膜>
以下，一面參照圖式，一面說明本發明之具體例。
如圖1A、1B、1C所示，本發明之異向性導電膜10係於絕緣膜1內具備金屬粒子2之異向性導電膜。雖未圖示，但金屬粒子於俯視下規則排列。此處，規則排列只要是規則地排列，則無特別限定，較佳可列舉菱形晶格排列、六方晶格排列、正方形晶格排列、矩形晶格排列、平行體晶格(parallelogrammic lattice)排列。其中，較佳為可進行最密堆積之六方晶格排列。
作為絕緣膜1，可自先前公知之異向性導電膜所採用的絕緣膜中適當地選擇而使用。例如，可列舉熱塑性丙烯酸系或環氧系樹脂膜、熱硬化或光硬化丙烯酸系或環氧系樹脂膜等。此種絕緣膜之厚度通常為10~40μm厚。又，絕緣膜1只要至少於異向性導電膜之狀態成為膜即可，於 其製造時亦可為高黏度液體。
進而，於絕緣膜1，亦可視需要添加二氧化矽微粒子、氧化鋁、氫氧化鋁等絕緣性填料。絕緣性填料之大小較佳為平均粒徑0.01~8μm。絕緣性填料之摻合量相對於形成絕緣膜之樹脂100質量份，較佳設為3~40質量份。藉此，變得容易確保異向性導電連接後之傳導可靠性。
作為金屬粒子2，係於異向性導電膜中被利用作為異向性導電連接用之金屬粒子者，可自於表面形成有氧化被膜者之中適當選擇而使用。其中，較佳可舉於藉由影像型之粒度分布計進行測量之情形時，平均粒徑為10~40μm之焊料粒子。
本發明之異向性導電膜中，助焊劑3被配置成接觸或是接近於金屬粒子之異向性導電膜表面側端部或異向性導電膜背面側端部之至少任一端部。例如圖1A所示之態樣中，助焊劑3被配置成接觸金屬粒子2之異向性導電膜表面側端部2a。圖1B所示之態樣中，助焊劑3被配置成接觸金屬粒子2之異向性導電膜背面側端部2b。圖1C所示之態樣中，助焊劑3被配置成接觸金屬粒子2之異向性導電膜表面側端部2a與異向性導電膜背面側端部2b。如該等般，若金屬粒子2與助焊劑3接觸，則藉進行異向性導電連接時之熱，以助焊劑3去除金屬粒子2之表面的氧化被膜，於金屬粒子2與待連接之端子間形成金屬鍵。
金屬粒子2與助焊劑3接近之程度，係指其等相隔之最短距離未達2μm。若相隔此距離以上，則有進行異性導電連接時兩者之接觸受到妨礙之疑慮。
作為使金屬粒子2與助焊劑3接近配置之方法，例如可藉由 混合助焊劑與絕緣性填料而進行。其原因在於絕緣性填料可發揮作為使金屬粒子2與助焊劑3隔離之間隔物(spacer)的功能。作為此種絕緣性填料，可舉平均一次粒徑為1~1000nm之燻矽(fumed silica)。
再者，關於金屬粒子2與接觸或接近於其之助焊劑3的量之關係，相對於金屬粒子2之平均粒徑，助焊劑3之厚度為0.001~0.4倍以下。若為此範圍，則可淨化金屬粒子2之表面，且不會發生異向性導電連接物之腐蝕。
於使助焊劑3接觸或接近於金屬粒子2而進行配置之情形時，只要將助焊劑稀釋(較佳稀釋倍率：相對於溶劑，為0.1~40wt%)於溶劑中而成者如後述般藉由公知之塗佈法塗佈於轉移模或附著有金屬粒子之絕緣膜，並視需要進行乾燥即可。
又，助焊劑3於進行異向性導電連接時之加熱條件下會去除金屬粒子2之表面的氧化被膜。作為此種助焊劑3，可依據金屬粒子2之材料應用公知之助焊劑。
再者，圖1A~圖1C之態樣中，金屬粒子2係自絕緣膜1之表面乃至背面隔離而存在，但亦可露出於絕緣膜1之表面或背面。例如圖1A之態樣亦能夠以如下之方式變形：如圖2A所示，金屬粒子2之端部2a的相反側之端部露出於絕緣膜1的背面。於此情形時，助焊劑3被配置成接觸端部2a。圖1B之態樣亦能夠以如下之方式變形：如圖2B所示，露出被配置成接觸於端部2b之助焊劑3。圖1C之態樣亦能夠如圖2C般變形。
圖1A~圖1C以及圖2A~圖2C中，絕緣膜1為單層，但亦可如圖3般，將絕緣膜1設為2層結構(1a與1b)，於其等之層間配置金屬粒 子2。若設為此種2層結構，則可擴大製造上之自由度。
又，如圖4所示，本發明之異向性導電膜10亦包含金屬粒子2的表面之一部分未與助焊劑3接觸之態樣。圖4中，金屬粒子2之未與助焊劑3接觸的表面部分雖面向於膜之側面方向，但亦可面向膜之表面側，亦可面向背面側。尤其，如圖5所示，較佳為金屬粒子2之未與助焊劑3接觸的表面部分配置於與助焊劑接觸之金屬粒子的表面部分之相反側。
又，如圖6所示，於本發明之異向性導電膜10之面方向，亦可在相鄰之金屬粒子2之間配置有助焊劑3。此種異向性導電膜10於進行異向性導電連接時，由於配置於相鄰之金屬粒子2之間的助焊劑3被金屬粒子2吸引，故可藉充足之量的助焊劑淨化金屬粒子之表面，且亦不會發生2層結構間之絕緣膜之層間剝離。於此情形時，較佳配置於金屬粒子2之異向性導電膜表面側端部2a或異向性導電膜背面側端部2b之至少任一端部的每單位面積之助焊劑量大於配置在相鄰之金屬粒子間的每單位面積之助焊劑量。
<異向性導電膜之製造方法>
本發明之異向性導電膜可藉由具有以下步驟(A)~(C)之製造方法而製造。
(步驟(A))
首先，如圖7A~7C所示，於具有規則排列之凹部50的轉移模100之該凹部50之至少底部配置助焊劑3。具體而言，如圖7A所示，可將助焊劑3僅配置於凹部50之底部，亦可如圖7B所示，將助焊劑3配置於凹部50之包含底部的內壁面整體。又，亦可如圖7C所示，將助焊劑3配置於凹部 50之底部與轉移模100之相鄰的凹部50之間的表面。於圖7C之情形時，較佳凹部50之底部的每單位面積之助焊劑量大於相鄰的凹部50之間的表面之每單位面積的助焊劑量。
作為轉移模100，可採用利用公知之方法而製成者。例如，可將金屬板加工而製成原盤，將硬化性樹脂組成物塗佈於該原盤，使該樹脂組成物硬化而製成。具體而言，藉由如下方式獲得轉移模：將平坦之金屬板進行切削加工，而亦製成轉移模原盤，該轉移模原盤形成有對應於凹部之凸部，於此原盤之凸部形成面塗佈構成轉移模之硬化性樹脂組成物，使該硬化性樹脂組成物硬化後，自原盤分離。
又，作為將助焊劑3配置於凹部50之至少底部的方法，可採用公知之方法，例如，可藉由網版印刷將助焊劑塗佈於轉移模之整面，視需要以刮刀刮取最表面之助焊劑。
(步驟(B))
繼而，如圖8A~8C所示，於配置有助焊劑3之凹部50配置金屬粒子2。作為配置金屬粒子2之方法，可採用公知之方法。例如，可將金屬粒子散布於轉移模之表面，將存在於凹部以外之轉移模表面的金屬粒子利用送風(air blow)或刮刀去除。又，亦可藉由微量分注器(microdispenser)於凹部一個一個地供給金屬粒子。
再者，如圖8所示，將金屬粒子供給至轉移模之凹部後，亦可如圖8D所示，利用公知之方法將助焊劑3配置於金屬粒子2之表面。
(步驟(C))
繼而，如圖9A~9D所示，自配置有金屬粒子2之圖8A~圖8D之轉移 模100(圖8A~圖8D)之凹部50側，使絕緣膜1抵接並加熱加壓，而將金屬粒子2轉移至絕緣膜1。此狀態下，若將絕緣膜1捲封至輥，則自圖9A之態樣獲得圖10A之異向性導電膜10，自圖9B之態樣獲得圖10B之異向性導電膜10，自圖9C之態樣獲得圖10C之異向性導電膜10，自圖9D之態樣獲得圖10D之異向性導電膜10。
又，本發明之製造方法中，為了將絕緣膜2設為2層結構，較佳進而具有以下之步驟(D)。
(步驟(D))
即，將其他絕緣膜熱壓接合於轉移有金屬粒子之絕緣膜(圖9A~圖9D)之金屬粒子轉移面，藉此自圖9A之態樣獲得具有2層結構之絕緣膜1(1a與1b)之圖11A的異向性導電膜10，自圖9B之態樣獲得具有2層結構之絕緣膜1(1a與1b)之圖11B的異向性導電膜10，自圖9C之態樣獲得具有2層結構之絕緣膜1(1a與1b)之圖11C的異向性導電膜10，自圖9D之態樣獲得具有2層結構之絕緣膜1(1a與1b)之圖11D的異向性導電膜10。
又，本發明之異向性導電膜亦可藉由具有以下之步驟(a)~(c)之其他製造方法製造。
(步驟(a))
首先，如圖12A所示，於具有規則排列之凹部50的轉移模200之該凹部50配置金屬粒子2。
(步驟(b))
繼而，如圖12B所示，於配置有轉移模200之金屬粒子2的凹部形成面配置助焊劑3。
(步驟(c))
繼而，如圖12C所示，自配置有金屬粒子2之轉移模200之凹部50側使絕緣膜1a抵接且加熱加壓，從而將助焊劑3與金屬粒子2一同轉移至絕緣膜1a。
(步驟(d))
繼而，如圖12D所示，將其他之絕緣膜1b熱壓接合於轉移有金屬粒子2之絕緣膜1a的金屬粒子轉移面。藉此，獲得在2層結構之絕緣膜1a與其他絕緣膜1b之間配置有助焊劑3之異向性導電性10。
<連接構造體>
本發明之異向性導電膜對於被配置於IC晶片、半導體晶圓等第1電子零件之端子與配線基板或半導體晶圓等第2電子零件之端子之間，藉由進行加熱加壓而異向性導電連接第1電子零件與第2電子零件之連接構造體之製造有用。此種連接構造體亦為本發明之一種態樣。
[實施例]
以下，藉由實施例具體地說明本發明。
實施例1
準備厚度2mm之鎳板，以四方格子圖案形成圓柱狀之凸部(外徑25μm，高度20μm)，製成轉移體原盤。相鄰凸部之中心間距離為40μm。因此，凸部之密度為625個/mm2。
於所獲得之轉移體原盤，以乾燥厚度成為30μm之方式塗佈含有苯氧基樹脂(YP-50，新日鐵住金化學股份有限公司)60質量份、丙烯酸酯樹脂(M208，東亞合成股份有限公司)29質量份、光聚合起始劑 (IRGACURE184，BASF JAPAN股份有限公司)2質量份之光聚合性樹脂組成物，於80℃乾燥5分鐘後，利用高壓水銀燈照射1000mJ之光，藉此製成轉移體。
於自轉移模原盤剝下之轉移模，使用刮刀塗佈利用甲苯稀釋至5wt%之助焊劑(ESR-250T4，千住金屬工業股份有限公司)，於乾燥後使凹部內之助焊劑厚度成為1μm，刮取轉移模之表面的助焊劑。
對此轉移模散布平均粒徑20μm之焊料粒子(微粉焊料粉，三井金屬鑛業股份有限公司)後，藉由送風將焊料粒子填充至凹部。
對於附著有導電粒子之轉移模的焊料粒子附著面，使其擔載厚度20μm之絕緣膜(由苯氧基樹脂(YP-50，新日鐵住金化學股份有限公司)60質量份、環氧樹脂(jER828，三菱化學股份有限公司)40質量份及陽離子系硬化劑(SI-60L，三新化學工業股份有限公司)2質量份組成之膜)，以溫度50℃，壓力0.5MPa進行壓製，藉此將焊料粒子轉移至絕緣膜。
於所獲得之絕緣膜的焊料粒子轉移面，重疊其他厚度5μm之絕緣膜(由苯氧基樹脂(YP-50，新日鐵住金化學股份有限公司)60質量份、環氧樹脂(jER828，三菱化學股份有限公司)40質量份及陽離子系硬化劑(SI-60L，三新化學工業股份有限公司)2質量份組成之膜)，以溫度60℃，壓力2MPa進行積層，獲得異向性導電膜。
實施例2
準備與實施例1相同之轉移模，對此轉移模散布平均粒徑20μm之焊料粒子(微粉焊料粉，三井金屬鑛業股份有限公司)後，藉由送風將焊料粒子填充至凹部。
於填充有焊料粒子之轉移模的表面，使用刮刀，以乾燥後之助焊劑厚度成為1μm之方式，塗佈利用甲苯稀釋至20wt%之助焊劑(ESR-250T4，千住金屬工業股份有限公司)。
對此助焊劑面，擔載厚度20μm之絕緣膜(由苯氧基樹脂(YP-50，新日鐵住金化學股份有限公司)60質量份、環氧樹脂(jER828，三菱化學股份有限公司)40質量份及陽離子系硬化劑(SI-60L，三新化學工業股份有限公司)2質量份組成之膜)，以溫度50℃，壓力0.5MPa進行壓製，藉此使焊料粒子轉移至絕緣膜。
於所獲得之絕緣膜的焊料粒子轉移面，重疊其他厚度5μm之絕緣膜(由苯氧基樹脂(YP-50，新日鐵住金化學股份有限公司)60質量份、環氧樹脂(jER828，三菱化學股份有限公司)40質量份及陽離子系硬化劑(SI-60L，三新化學工業股份有限公司)2質量份組成之膜)，以溫度60℃，壓力2MPa進行積層，獲得異向性導電膜。
比較例1
除了不使用助焊劑以外，重覆實施例1，藉此獲得異向性導電膜。
實施例3
準備與實施例1相同之轉移模，與實施例1同樣地將助焊劑配置於轉移模之凹部的底部後，將焊料粒子填充於此凹部。於此轉移模之表面，再次使用刮刀塗佈利用甲苯稀釋至5wt%之助焊劑(ESR-250T4，千住金屬工業股份有限公司)。然後，重覆與實施例1相同之操作，藉此獲得異向性導電膜。助焊劑之乾燥後的塗佈厚度在焊料粒子之膜界面側的端部為1μm，於焊料粒子間為未達1μm。
實施例4
於實施例1中，將利用甲苯進行之助焊劑(ESR-250T4，千住金屬工業股份有限公司)之稀釋由5wt%變更為10wt%，將乾燥後之塗佈厚度設為2μm，除此之外，重覆實施例1，藉此獲得異向性導電膜。
(評價)
使用所獲得之異向性導電膜，以溫度180℃，壓力40mPa，加熱加壓時間20秒之條件，將形成有100μm×100μm×15μm(高度)尺寸的金凸塊之試驗用IC晶片異向性導電連接於IC構裝用玻璃環氧基板(材質：FR4)，獲得連接構造體。針對所獲得之連接構造體，測量初期傳導電阻(conduction resistance)值、耐濕性測試(PCT，Pressure Cooker Test)(試驗條件：於溫度121℃，壓力2atm之環境下放置200小時)後之傳導電阻值，以及高溫高濕bias試驗(試驗條件：於溫度85℃，濕度85%之環境下施加50v)後之傳導電阻值。將所獲得之結果示於表1。
再者，實用上初期傳導電阻值必須未達1Ω，PCT後以及高溫高濕bias試驗後之傳導電阻值必須未達15Ω。
由表1可知，實施例1~4之異向性導電膜由於焊料粒子與助焊劑於膜中被接觸配置，故任一評價項目均獲得良好的結果。相對於此，比較例1中，由於焊料粒子與助焊劑於膜中未被接觸配置，故於PCT試驗後與高溫高濕bias試驗後傳導電阻值大幅地上升。
實施例5
作為轉移焊料粒子之厚度20μm之絕緣膜，使用由苯氧基樹脂(YP-50，新日鐵住金化學股份有限公司)60質量份、環氧樹脂(jER828，三菱化學股份有限公司)40質量份、燻矽(R200，日本Aerosil股份有限公司)10質量份及陽離子系硬化劑(SI-60L，三新化學工業股份有限公司)2質量份組成之膜，除此之外，重覆實施例1之操作，藉此獲得異向性導電膜。所獲得之異向性導電膜與實施例1之異向性導電膜相同，任一評估項目均獲得良好的結果。
本發明之異向性導電膜可抑制使用其進行異向性導電連接而得之連接構造體之短路的發生，且不僅可抑制初期傳導電阻值為低，亦可抑制PCT後及高溫高濕bias試驗後之傳導電阻值為低，因此於將IC晶片構裝於配線基板時等有用。
1‧‧‧絕緣膜
2‧‧‧金屬粒子
2a‧‧‧異向性導電膜表面側端部
3‧‧‧助焊劑
10‧‧‧異向性導電膜

Claims (12)

  1. 一種異向性導電膜，其於絕緣膜內具備金屬粒子，於俯視下金屬粒子規則排列，助焊劑(flux)被配置成接觸或是接近於金屬粒子之異向性導電膜表面側端部或異向性導電膜背面側端部之至少任一端部。
  2. 如申請專利範圍第1項之異向性導電膜，其中，金屬粒子為焊料粒子。
  3. 如申請專利範圍第1或2項之異向性導電膜，其中，絕緣膜成為2層結構，於其層間配置有金屬粒子。
  4. 如申請專利範圍第1至3項中任一項之異向性導電膜，其中，金屬粒子之表面的一部分未與助焊劑接觸。
  5. 如申請專利範圍第1至4項中任一項之異向性導電膜，其中，金屬粒子之未與助焊劑接觸的表面部分被配置於金屬粒子之與助焊劑接觸的表面部分之相反側。
  6. 如申請專利範圍第1至5項中任一項之異向性導電膜，其中，於異向性導電膜之面方向，在相鄰之金屬粒子間配置有助焊劑。
  7. 如申請專利範圍第6項之異向性導電膜，其中，配置於相鄰的金屬粒子間之助焊劑被配置於2層結構之絕緣膜之層間。
  8. 如申請專利範圍第6或7項之異向性導電膜，其中，配置於金屬粒子之異向性導電膜表面側端部或異向性導電膜背面側端部之至少任一端部的每單位面積之助焊劑量，大於配置於相鄰之金屬粒子間的每單位面積之助焊劑量。
  9. 一種申請專利範圍第1項之異向性導電膜之製造方法，其具有以下 步驟(A)~(C)：(A)於具有規則排列之凹部的轉移模之該凹部的至少底部配置助焊劑之步驟；(B)於配置有助焊劑之凹部配置金屬粒子之步驟；以及(C)自配置有金屬粒子之轉移模的凹部側使絕緣膜抵接並加熱加壓而將金屬粒子轉移至絕緣膜之步驟。
  10. 如申請專利範圍第9項之製造方法，其進而含有步驟(D)：(D)將其他絕緣膜熱壓接合至轉移有金屬粒子之絕緣膜的金屬粒子轉移面之步驟。
  11. 一種申請專利範圍第1項之異向性導電膜之製造方法，其含有以下步驟(a)~(d)：(a)於具有規則排列之凹部的轉移模之該凹部配置金屬粒子之步驟；(b)於轉移模之配置有金屬粒子的凹部形成面配置助焊劑之步驟；(c)自轉移模之助焊劑配置面側使絕緣膜抵接並加熱加壓而將金屬粒子轉移至絕緣膜之步驟；以及(d)將其他絕緣膜熱壓接合至轉移有金屬粒子之絕緣膜的金屬粒子轉移面之步驟。
  12. 一種連接構造體，將配置於第1電子零件之端子與第2電子零件之端子之間的申請專利範圍第1項之異向性導電膜進行配置，藉由加熱加壓而異向性導電連接有第1電子零件與第2電子零件。
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