WO2010101236A1 - バンプ及び該バンプの形成方法並びに該バンプが形成された基板の実装方法 - Google Patents

バンプ及び該バンプの形成方法並びに該バンプが形成された基板の実装方法 Download PDF

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WO2010101236A1
WO2010101236A1 PCT/JP2010/053615 JP2010053615W WO2010101236A1 WO 2010101236 A1 WO2010101236 A1 WO 2010101236A1 JP 2010053615 W JP2010053615 W JP 2010053615W WO 2010101236 A1 WO2010101236 A1 WO 2010101236A1
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Prior art keywords
bump
layer
bump layer
conductive metal
substrate
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PCT/JP2010/053615
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English (en)
French (fr)
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俊典 小柏
正幸 宮入
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田中貴金属工業株式会社
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Application filed by 田中貴金属工業株式会社 filed Critical 田中貴金属工業株式会社
Priority to US13/144,411 priority Critical patent/US8492894B2/en
Priority to CN201080008016.7A priority patent/CN102318052B/zh
Priority to EP10748829.8A priority patent/EP2405474A4/en
Publication of WO2010101236A1 publication Critical patent/WO2010101236A1/ja
Priority to US13/912,826 priority patent/US8962471B2/en

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Definitions

  • the present invention relates to a bump formed on a semiconductor chip or the like and a method for forming the bump. Specifically, the present invention relates to a bump manufactured using a metal paste, which can compensate for its flatness and does not require excessive pressure during mounting.
  • the flip chip method is increasingly applied as a mounting method.
  • the electrodes (bumps) formed on the substrate are directly bonded to the circuit board, but as a method for forming the bumps, a plating method is mainly used.
  • the plating method can stably produce dense electrodes, and can control the film thickness (bump height) and form a fine pattern by setting appropriate conditions.
  • the condition settings are adjusted, it is difficult to form a completely uniform film thickness, and it cannot be avoided that the bump height slightly varies. If the bump height varies, bumps that cause poor contact occur during mounting.
  • Patent Document 1 discloses a method in which a resin is coated on the surface of a substrate after bump formation, and this is ground until the bumps are exposed to flatten the bumps. As a result, conduction stability is ensured, and mounting at a low pressure is possible, so there is no risk of residual distortion in the bumps.
  • the applicant of the present application has proposed a method for solving the problem of the plating bump from a viewpoint different from the above (Patent Document 2).
  • the bump configuration is changed, and a metal powder having a predetermined particle diameter and purity is sintered to form the bump.
  • the bump made of this sintered body is more porous and relatively soft and elastic than a dense bulk metal formed by plating or the like.
  • the present invention has been made based on the background as described above, and is a bump on a substrate used in the flip chip method, which can solve the problem due to the variation in bump height, and this. It is an object of the present invention to provide a method for mounting a used substrate.
  • the present inventors have intensively studied to solve the above-mentioned problems, and as a new bump structure, a layer made of a bulk metal for securing the rigidity of the bump and a bump height variation absorption It has been found that a two-layer structure composed of a sintered body is used. That is, the present invention is a bulk body of a first conductive metal that is formed on a substrate in a predetermined pattern and is made of a conductive metal, and is formed on the substrate and is one of gold, copper, and nickel. And a second bump layer formed on the first bump layer and made of a sintered body of a second conductive metal powder that is either gold or silver.
  • a bulk body having a structure and constituting the first bump layer is formed by any one of a plating method, a sputtering method, and a CVD method,
  • the sintered body constituting the second bump layer sinters metal powder made of a second conductive metal having a purity of 99.9% by weight or more and an average particle diameter of 0.005 ⁇ m to 1.0 ⁇ m.
  • the Young's modulus of the second bump layer is 0.1 to 0.4 times the Young's modulus of the first bump layer.
  • the bulk metal is used as the main part of the bump while paying attention to the elasticity of the bump made of the sintered body by the applicant as described above, and this is arranged at the tip of the bump.
  • the rigidity of the bump according to the present invention is secured by the first bump layer, and the pitch can be maintained by suppressing the deformation of the bump in the lateral direction at the time of flip chip bonding.
  • the upper second bump layer has elasticity, it can be deformed following the variation in bump height, so that it is possible to bond with good flatness at low pressure.
  • the first bump layer is a dense bulk metal having rigidity, and is formed by any one of a plating method, a sputtering method, and a CVD method.
  • the second bump layer made of a sintered body formed on the first bump layer has a purity of 99.9% by weight or more and an average particle size of 0.005 ⁇ m to 1.0 ⁇ m.
  • the metal powder which consists of 2 electroconductive metals is sintered. The reason why the purity of the metal powder is set to a high purity of 99.9% by weight or more is that when the purity is low, the hardness of the powder increases, and it becomes difficult to plastically deform and the elasticity is lowered.
  • the average particle size of the metal powder is because it becomes difficult to sinter with metal powder having a particle size exceeding 1.0 ⁇ m, and the lower limit is set to 0.005 ⁇ m in consideration of its handleability. It is.
  • the second bump layer needs to have a Young's modulus lower than that of the first bump layer.
  • the Young's modulus of the second bump layer is 0.1 to 0.4 times the Young's modulus of the first bump layer. If it is less than 0.1 times, the second bump layer is too soft and deformation at the time of joining may cause a problem in the shape of the bump. If it exceeds 0.4 times, the first bump layer is deformed. This is because there is a risk of occurrence.
  • the first and second conductive metals constituting the first and second bump layers are required to have conductivity as electrodes, and the bulk body and the sintered body are described above. A combination of metals that can have a Young's modulus ratio is required. From these viewpoints, gold, copper, or nickel is selected as the first conductive metal. In addition, as the second conductive metal, either gold or silver is selected.
  • the same metal may be selected as the first conductive metal and the second conductive metal, and the gold plating layer is used as the first bump layer, and gold powder is sintered thereon. May be formed as the second bump layer.
  • the first conductive metal and the second conductive metal may be different types of metals. For example, a nickel or copper plating layer may be used as the first bump layer, and a gold powder sintered thereon may be formed as the second bump layer.
  • the height ratio of the first bump layer to the entire bumps is preferably 0.1 to 0.9. This is to ensure the rigidity of the bump and to exert the function of the second bump layer.
  • the height ratio of the first bump layer to the whole is more preferably 0.5 to 0.9.
  • each bump layer is made of a different metal
  • a copper plating layer is used as a first bump layer
  • gold is plated thereon to form an intermediate layer
  • gold powder is sintered as a second bump layer.
  • These bulk intermediate layers are preferably formed by plating (electrolytic plating, electroless plating), sputtering, CVD, or the like.
  • the metal constituting the intermediate layer needs to be a conductive metal, but preferably gold, silver, platinum, palladium, titanium, chromium, copper, and nickel.
  • the intermediate layer may be provided in multiple layers, or a plurality of intermediate layers made of a plurality of types of metals may be formed.
  • the intermediate layer is preferably made of the same conductive metal as the second conductive metal at least in contact with the second bump layer. Therefore, in the case of a single-layered intermediate layer, the whole is preferably made of the second conductive metal, and for the multilayered intermediate layer, the uppermost layer is preferably made of the second conductive metal.
  • the thickness of the intermediate layer is preferably 5 to 1000 nm as a whole. The intermediate layer is intended to ensure adhesion, and does not need to be so thick.
  • the bump manufacturing method includes a step of forming a first bump layer on a substrate by any one of a plating method, a sputtering method, and a CVD method, and a purity of 99.9% by weight on the first bump layer.
  • the metal paste containing the second conductive metal powder having an average particle diameter of 0.005 ⁇ m to 1.0 ⁇ m is applied, and the metal paste is dried, and then at a temperature of 70 to 320 ° C. Forming a second bump layer by heating and sintering.
  • the conditions of the plating method, sputtering method, and CVD method for forming the first bump layer are not particularly limited, and the conditions and methods for bump formation generally applied to these methods are applied. it can.
  • the metal paste applied for forming the second bump layer is a slurry in which the metal powder having the above characteristics is dispersed in an appropriate dispersion medium.
  • the reason why the metal paste is applied is to ensure the handleability of the metal powder.
  • the metal powder (second conductive metal) in the metal paste has a purity of 99.9% by weight or more and an average particle size of 0.005 ⁇ m to 1.0 ⁇ m.
  • an organic solvent is usually used, and examples thereof include ester alcohol, terpineol, pine oil, butyl carbitol acetate, butyl carbitol, carbitol and the like.
  • ester alcohol terpineol
  • pine oil pine oil
  • butyl carbitol acetate butyl carbitol
  • carbitol carbitol
  • the like examples thereof include ester alcohol, terpineol, pine oil, butyl carbitol acetate, butyl carbitol, carbitol and the like.
  • 2,2,4-trimethyl-3-hydroxypentaisobutyrate C 12 H 24 O 3
  • this metal paste may contain 1 or more types selected from an acrylic resin, a cellulose resin, and an alkyd resin as an additive.
  • acrylic resins include methyl methacrylate polymers
  • examples of cellulose resins include ethyl cellulose
  • examples of alkyd resins include phthalic anhydride resins. Of these, ethyl cellulose is particularly preferable.
  • various methods are used according to the target bump size and pattern, such as a spin coating method, a screen printing method, an ink jet method, and a method of spreading the paste with a spatula after dropping. be able to.
  • the reason why the applied metal paste is dried is to remove the organic solvent in the paste.
  • This drying is preferably performed at -20 ° C or higher and 5 ° C or lower.
  • the atmosphere in the drying process may be a reduced pressure atmosphere. Thereby, it is possible to prevent moisture in the atmosphere from condensing on the surface of the metal powder during the drying process.
  • the pressure is preferably 100 Pa or less, more preferably 10 Pa or less, but the degree of vacuum in this atmosphere is set according to the volatility of the organic solvent in the metal paste.
  • the metal paste After the metal paste is dried, it is sintered to form a sintered body in which the metal particles in the paste are in close contact with each other between the surface of the first bump layer and the metal particles. .
  • the sintering temperature depends on the type of metal (first conductive metal) constituting the first bump layer, but is in the range of 70 to 320 ° C. If it is less than 70 degreeC, sintering is incomplete and it cannot endure use as a bump.
  • the bump according to the present invention needs to have a predetermined Young's modulus ratio between the first bump layer and the second bump layer, but at a temperature below the lower limit, the second bump layer is too soft and the Young's ratio.
  • the second bump layer is significantly deformed at the time of bonding, and a problem may occur in the shape of the bump. Further, at a temperature exceeding the upper limit value, the second bump layer becomes too hard and the Young's ratio cannot be maintained properly, and the first bump layer may be deformed at the time of bonding.
  • the specific range of the sintering temperature corresponding to the constituent metal of the first bump layer is 70 to 300 ° C. when the first bump layer is gold, 80 to 300 ° C. when the first bump layer is copper, In this case, the temperature is 90 to 320 ° C. In this way, the sintering temperature is adjusted by the constituent metal of the first bump layer in consideration of the difference in Young's modulus of each metal in the bulk body.
  • the heating time during sintering is preferably 10 to 60 minutes. This is because the temperature of the sintering furnace is not stabilized in a short time and sufficient sintering cannot be performed, and productivity is impaired if the time is too long.
  • This sintering is preferably performed without pressure.
  • a photoresist before the above 1st and 2nd bump layer formation.
  • the application of a photoresist is usually used for forming a fine pattern.
  • middle layer is included.
  • plating, sputtering, CVD, or the like can be applied, but plating, particularly electroless plating is preferable. This is because a thin thin film can be manufactured at low cost.
  • the second bump layer is heated in one or both directions while being heated. Join the bumps.
  • the sintered body which is the second bump layer of the bump according to the present invention, is subjected to plastic deformation at the contact portion when pressed, and a bond between metal atoms is generated at the deformation interface, resulting in a dense joint portion.
  • This pressurization may be performed in one direction or in both directions. Moreover, it is preferable to make the pressure at the time of pressurization larger than the yield strength of a sintered compact for densification of a junction part.
  • the heating temperature at this time is preferably 70 to 300 ° C. This is because bonding cannot be performed at a temperature lower than 70 ° C., and the effect of thermal strain during cooling increases when the temperature exceeds 300 ° C.
  • ultrasonic waves may be applied in addition to heating.
  • the heating temperature can be lowered.
  • the conditions are preferably an amplitude of 0.5 to 5 ⁇ m and an application time of 0.5 to 3 seconds. This is because excessive application of ultrasonic waves damages the entire bump.
  • the heating and application of ultrasonic waves in the joining process may be performed on at least the sintered body as the second bump layer for the purpose, but may be performed on the entire bump.
  • a heating method in addition to pressurizing in an atmospheric furnace at a predetermined temperature, a stage on which a substrate (or a counter substrate) is placed may be heated at the time of bonding, and heat transfer at that time may be used. Similarly, it is easy to apply ultrasonic waves from the stage.
  • the figure which illustrates roughly the bump formation process in this embodiment The SEM photograph which shows the external appearance of the bump manufactured by this embodiment.
  • the SEM photograph (enlargement) which shows the appearance of the bump manufactured by this embodiment.
  • the relationship between the particle size of the metal powder forming the second bump layer, the sintering conditions, and the strength of the bump layer after sintering was examined.
  • a plurality of metal pastes were produced from metal powders having different particle diameters of each metal (gold, silver), which is the second conductive metal, and sintered after application, and the strength was evaluated.
  • the metal paste is prepared by mixing a metal powder (purity 99.99% by weight) having a particle size of 0.005, 0.3, 1.0, and 2.0 ⁇ m manufactured by a wet reduction method with ester alcohol as an organic solvent. Was used.
  • the Young's modulus is relatively stable in the metal powder having a particle size of 0.005 to 1.0 ⁇ m, whereas 2.0 ⁇ m is remarkably low.
  • the bumps actually manufactured for 2.0 ⁇ m ones were easily disintegrated, although the shape was temporarily maintained as a three-dimensional state. This is considered to be due to insufficient sintering due to the sintering temperature being too low.
  • the metal powder having a particle size of 0.005 ⁇ m had no problem in terms of strength after sintering, but the agglomeration in the paste state was severe, and sufficient stirring until just before use was required. Therefore, in consideration of handleability, it can be said that a metal powder paste having a particle size smaller than this is not preferred.
  • the strength of the sintered body rapidly increases when it exceeds 300 ° C., but based on the strength (Young's modulus) of the first bump layer, an appropriate Young's modulus ratio is set to set the upper limit of the sintering temperature. It can be said that it is necessary to define.
  • FIG. 1 illustrates a bump manufacturing process in this embodiment.
  • a photoresist film (manufactured by Kayaku Microchem Co., Ltd .: AZP4903) is spun onto the surface of a semiconductor wafer (material: silicon) on which a Ti film (0.5 ⁇ m) and an Au film (1.0 ⁇ m) have been formed in advance.
  • After coating and pre-baking 100 ° C. ⁇ 120 seconds, patterning was performed. Patterning was performed under irradiation conditions of g-line (wavelength 436 nm) with an illuminance of 2100 mJ / cm 2 and an exposure time of 150 seconds.
  • the resist film thickness of this substrate was 20 ⁇ m as measured by a stylus type film thickness meter, and the in-plane variation was ⁇ 1 ⁇ m.
  • the diameter of the opening was 20 ⁇ m.
  • a gold plating layer (first bump layer) was formed in the opening.
  • an electrolytic gold plating solution (manufactured by Nippon Electroplating Engineers Co., Ltd .: Tempex 209A) was used. Then, a gold plating layer was formed to a height of 10 ⁇ m.
  • a gold paste as a metal paste was dropped on the surface of the photoresist layer, and the gold paste was filled into the openings by a spin coating method.
  • the gold paste used was gold powder (average particle size: 0.3 ⁇ m) having a purity of 99.99% by weight and ester alcohol (2,2,4-trimethyl-3-hydroxypentaisobutyrate (organic solvent) as an organic solvent). C 12 H 24 O 3 )) is mixed and adjusted. After applying the paste, this was vacuum dried at + 5 ° C. in a dryer.
  • the bump formed in this example has a form in which a powdered sintered body (second bump layer) is crowned on a gold plating layer (first bump layer), and bridge formation between the bumps is also possible. The shape was neatly arranged.
  • the Young's modulus was measured for each of the first bump layer and the second bump layer of the manufactured bump.
  • the Young's modulus was measured by conducting a shear test as shown in FIG. 4, creating a stress-strain curve, and determining the slope of the straight line portion.
  • a bonding test was performed using the bump pattern-formed silicon wafer produced as described above.
  • a glass substrate on which a Ti film (0.5 ⁇ m) and an Au film (1.0 ⁇ m) are formed by sputtering is used as a counter substrate, and a bump forming surface of a silicon wafer is opposed to the Au film surface of the counter substrate.
  • a glass substrate was placed on a heat stage heated to 230 ° C., and pressure and pressure were applied for 10 minutes so that a pressure of 0.015 N per bump was applied.
  • the first bump layer is gold (plating) and the second bump layer is gold (sintered).
  • the metal of the first and second bump layers is changed, and the bump formation and bonding tests are performed while adjusting the sintering temperature of the second bump layer.
  • the relationship between Young's modulus ratio and bondability was investigated. Tables 3 to 7 show the results.
  • the ratio of the strength (Young's modulus) of the first and second bump layers is important in order to improve the bondability. It can be seen that the ratio needs to be in the range of 0.1 to 0.4.
  • the sintering temperature range of the sintered body that becomes the second bump layer is appropriately adjusted. It can be said that it is preferable.
  • the entire bump was formed by gold plating, and the same evaluation was performed.
  • the bumps were formed by using the same electrolytic gold plating solution as in this embodiment and adjusting the plating time to form a plating layer over the entire resist opening. Then, the resist was removed in the same manner as in the present embodiment to form bumps, but the bump height was 20 ⁇ m ⁇ 2 ⁇ m.
  • the same bonding test as in this embodiment was performed on the silicon wafer having the plated bump. After bonding, the continuity between adjacent bump joints was measured at room temperature, but it was not possible to take continuity of all terminals. And also about the location which can take conduction, the electrical resistance was 2.1 ⁇ 0.6 ⁇ .
  • the comparative example is clearly inferior in conduction stability. That is, in this embodiment, all terminals are electrically connected, the resistance value is low, and the variation is small. Such a difference is considered to be due to the non-uniform bonding state of the bumps due to variations in bump height in the substrate having bumps formed by plating in the comparative example.
  • the double-structured bump according to the present invention can solve the problem caused by the variation in bump height at the time of bonding by the flip chip method.
  • the substrate mounting method using the present invention is suitable for manufacturing various semiconductor circuits for which high integration is desired.

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Abstract

　本発明に係るバンプは、基板上に形成され、金、銅、ニッケルのいずれかである第１の導電性金属のバルク体からなる第１バンプ層と、第１バンプ層上に形成され、金、銀のいずれかである第２の導電性金属の粉末の焼結体からなる第２バンプ層とからなる２層構造を有する。第１バンプ層を構成するバルク体は、メッキ法、スパッタリング法、ＣＶＤ法のいずれかにより形成されるものである。ここで、第２バンプ層を構成する焼結体は、純度が９９．９重量％以上であり、平均粒径が０．００５μｍ～１．０μｍである第２の導電性金属からなる金属粉末を焼結して形成されたものである。そして、第２バンプ層のヤング率は、第１バンプ層のヤング率の０．１～０．４倍とする。

Description

バンプ及び該バンプの形成方法並びに該バンプが形成された基板の実装方法
　本発明は、半導体チップ等に形成されるバンプ及びその形成方法に関する。詳しくは、金属ペーストを用いて製造されるバンプであって、その平坦度を補償することができ、実装時において過度の加圧を要することのないものに関する。
　近年の半導体回路の高集積化より、その構造としてチップオンボード（ＣＯＢ）やチップオンチップ（ＣＯＣ）等が採用される傾向にあり、その実装方法としてフリップチップ法の適用が多くなっている。フリップチップ法による実装方法では、基板に形成された電極（バンプ）を直接、回路基板へ接合するものであるが、そのバンプの形成方法としては、メッキ法によるものが主流となっている。
　メッキ法は、緻密な電極を安定的に製造することができ、また、適切な条件設定により膜厚（バンプ高さ）の制御や微細なパターン形成も可能である。但し、如何に条件設定を調整しても、完全に均一な膜厚を形成することは困難であり、バンプの高さに多少のバラつきが生じることまで回避できるわけではない。そして、バンプの高さにバラつきがある場合、実装の際に接触不良となるバンプが生じる。
　バンプ高さのバラつきに対する対策としては、実装時に全てのバンプが密着するように加圧を行うことが挙げられるが、過度の加圧はバンプ内部に歪を残すこととなり、これが半導体回路の使用による熱サイクルによる伸縮と相俟って破損が生じるおそれがある。また、そもそも、過度の加圧による基板の損傷のおそれもある。
　そこで、メッキ後のバンプを研削・研磨してバラつきを解消することが提案されている。例えば、特許文献１では、バンプ形成後の基板表面に樹脂を被覆して、これをバンプが表出するまで研削して、バンプの平坦化をはかる方法が開示されている。これにより、導通安定性を確保すると共に、低圧で実装が可能となるためバンプ内の歪残留のおそれもなくなる。
　また、本願出願人は、上記とは別の視点からメッキバンプの問題点を解消する手法を提案している（特許文献２）。この手法は、バンプの構成を変更し、所定粒径・純度の金属粉を焼結してバンプを形成するものである。この焼結体からなるバンプは、メッキ等で形成される緻密なバルク状金属よりも多孔質で比較的柔らかく弾力性を有するものとなる。そして、バンプに弾力性を具備させることで、バンプ高さにバラつきがあっても、その高低差に追従して収縮し一定の高さでの接合が可能となる。また、内部に歪を残すこともなく、膨張・収縮しても破損のおそれが低い。
特開２００４－３１１７７号公報 特開２００５－２１６５０８号公報
　しかし、研削・研磨によるバンプの平坦化では、研削された微細な粉末が隣接するバンプに付着し、バンプ間をショートさせるおそれがある。また、ＣＭＰ研磨機等は、装置コストの問題がある。
　他方、焼結体からなるバンプを適用する場合には、上記のような問題はないが、バンプに弾性を持たせたために、実装の際の横方向の変形のおそれがあり、バンプ間隔（ピッチ）を損ねることがある。
　本発明は、以上のような背景のもとになされたものであり、フリップチップ法に用いられる基板上のバンプであって、バンプ高さのバラつきによる問題を解消し得るもの、及び、これを用いた基板の実装方法を提供することを課題とする。
　本発明者等は、上記課題を解決すべく鋭意検討を行い、新たなバンプの構造として、バンプの剛性を確保するためのバルク状金属からなる層と、バンプ高さのバラつきを吸収するための焼結体からなる層とからなる２層構造とすることを見出した。即ち、本発明は、基板上に所定パターンで形成され、導電性金属からなるバンプであって、基板上に形成され、金、銅、ニッケルのいずれかである第１の導電性金属のバルク体からなる第１バンプ層と、前記第１バンプ層上に形成され、金、銀のいずれかである第２の導電性金属の粉末の焼結体からなる第２バンプ層と、からなる２層構造を有し、前記第１バンプ層を構成するバルク体は、メッキ法、スパッタリング法、ＣＶＤ法のいずれかにより形成されるものであり、
　前記第２バンプ層を構成する焼結体は、純度が９９．９重量％以上であり、平均粒径が０．００５μｍ～１．０μｍである第２の導電性金属からなる金属粉末を焼結して形成されたものであり、前記第２バンプ層のヤング率が、前記第１バンプ層のヤング率の０．１～０．４倍である、バンプである。
　本発明は、バルク状金属をバンプの主要部としつつ、上記した本出願人による焼結体からなるバンプの弾力性に着目し、これをバンプ先端部に配するものである。本発明に係るバンプは、その剛性は第１バンプ層により担保されており、フリップチップ接合時のバンプの横方向の変形を抑制しピッチを維持することができる。また、上部の第２バンプ層は弾力性を有することから、バンプ高さのバラつきに追従して変形し得ることから、低圧で平坦度の良好な接合を可能とする。
　ここで、第１バンプ層は、剛性を有する緻密なバルク状金属であり、メッキ法、スパッタリング法、ＣＶＤ法のいずれかにより形成されるものである。
　一方、上記第１バンプ層上に形成される、焼結体からなる第２バンプ層としては、純度が９９．９重量％以上であり、平均粒径が０．００５μｍ～１．０μｍである第２の導電性金属からなる金属粉を焼結したものである。金属粉の純度を９９．９重量％以上の高純度とするのは、純度が低いと粉末の硬度が上昇し、塑性変形し難くなり弾力性が低下するからである。また、金属粉の平均粒径については、１．０μｍを超える粒径の金属粉では、焼結が困難となるからであり、０．００５μｍを下限とするのは、その取扱性を考慮するものである。
　そして、この第２バンプ層は、そのヤング率が、第１バンプ層のヤング率より低いことを要する。第１バンプ層より軟らかい第２バンプ層を上部に設けることで、バンプ高さのバラつきに追従しつつ安定的な接合が可能となる。具体的には、第２バンプ層のヤング率が第１バンプ層のヤング率の０．１～０．４倍とする。０．１倍未満の場合、第２バンプ層が軟らかすぎて接合時の変形が著しくバンプとしての形状に問題が生じ得るからであり、０．４倍を超えると第１バンプ層の方に変形が生じるおそれがあるからである。
　そして、第１、第２バンプ層を構成する第１、第２の導電性金属は、いずれも電極として導電性を有することが必要であり、更に、それぞれのバルク体と焼結体が上記したヤング率比を具備し得る金属の組合せが必要となる。これらの観点から、第１の導電性金属は、金、銅、ニッケルのいずれかが選択される。また、第２の導電性金属は、金、銀のいずれかが選択される。
　上記の通り、第１の導電性金属と第２の導電性金属とは同じ金属（金）を選択しても良く、金メッキ層を第１バンプ層として、その上に金粉末を焼結したものを第２バンプ層として形成しても良い。また、第１の導電性金属と第２の導電性金属とが異なる種類の金属であっても良い。例えば、ニッケルや銅のメッキ層を第１バンプ層として、その上に金粉末を焼結したものを第２バンプ層として形成しても良い。異種金属を選択することで、金等の高価な金属の使用量を低減し、基板のコスト低減を図ることができる。
　また、第１バンプ層のバンプ全体に対する高さ比は、０．１～０．９とするのが好ましい。バンプの剛性を確保すると共に第２バンプ層の作用を発揮させるためである。この第１バンプ層の全体に対する高さ比は、０．５～０．９とするのがより好ましい。
　そして、各バンプ層を異種金属とする場合においては、第１バンプ層と第２バンプ層との間に、両層の密着性を向上させるバルク状の中間層を少なくとも１層備えたものが好ましい。これにより異種金属接合の際に懸念される密着性の低下（両バンプ層の剥離）を抑制することができる。例えば、銅メッキ層を第１バンプ層として、その上に金をメッキして中間層を形成し、その後、金粉末を焼結したものを第２バンプ層として形成する。これらバルク状の中間層は、メッキ（電解メッキ、無電解メッキ）、スパッタリング、ＣＶＤ法等により形成されたものが好ましい。中間層を構成する金属としては導電性金属であることが必要であるが、好ましくは、金、銀、白金、パラジウム、チタン、クロム、銅、ニッケルである。
　尚、密着性を更に向上させるため、中間層は多層設けても良く、複数種の金属からなる複数層の中間層が形成されても良い。そして、中間層は少なくとも第２バンプ層に接触する面が第２の導電性金属と同じ導電性金属であることが好ましい。よって、単層の中間層の場合は全体が第２の導電性金属からなり、多層の中間層については最上層が第２の導電性金属からなるものが好ましい。また、中間層の厚さは、全体で５～１０００ｎｍとするのが好ましい。中間層は密着性確保を目的とするものであり、さほどの厚さは必要ない。
　本発明に係るバンプの製造方法は、基板上に、メッキ法、スパッタリング法、ＣＶＤ法のいずれかにより第１バンプ層を形成する工程、前記第１バンプ層上に、純度が９９．９重量％以上であり、平均粒径が０．００５μｍ～１．０μｍである第２の導電性金属からなる粉末を含む金属ペーストを塗布し、前記金属ペーストを乾燥させた後、７０～３２０℃の温度で加熱焼結させて第２バンプ層を形成する工程、を含むものである。
　第１バンプ層の形成のためのメッキ法、スパッタリング法、ＣＶＤ法の条件については、特に限定されることはなく、これらの方法について一般的に適用されるバンプ形成のための条件、方法が適用できる。
　一方、第２バンプ層形成のために適用される金属ペーストは、上記特性の金属粉末を適宜の分散媒に分散させたスラリーである。金属ペーストを適用するのは、金属粉末の取り扱い性確保のためである。金属ペースト中の金属粉（第２の導電性金属）について、純度が９９．９重量％以上であり、平均粒径が０．００５μｍ～１．０μｍとしたのは上記で説明したとおりである。
　金属粉末を分散する分散媒としては、通常、有機溶剤が用いられ、例えば、エステルアルコール、ターピネオール、パインオイル、ブチルカルビトールアセテート、ブチルカルビトール、カルビトール等が挙げられる。例えば、好ましいエステルアルコール系の有機溶剤として、２，２，４－トリメチル－３－ヒドロキシペンタイソブチレート（Ｃ１２Ｈ２４Ｏ３）、を挙げることができる。これらの溶剤は、比較的低温で乾燥させることができるからである。
　尚、この金属ペーストは、添加剤として、アクリル系樹脂、セルロース系樹脂、アルキッド樹脂から選択される一種以上を含有していても良い。これらの樹脂等を更に加えると金属ペースト中の金属粉の凝集が防止されてより均質となる。尚、アクリル系樹脂としては、メタクリル酸メチル重合体を、セルロース系樹脂としては、エチルセルロースを、アルキッド樹脂としては、無水フタル酸樹脂を、それぞれ挙げることができる。そして、これらの中でも特にエチルセルロースが好ましい。
　金属ペーストを基板に塗布する方法としては、スピンコート法、スクリーン印刷法、インクジェット法、ペーストを滴下後にヘラ等で広げる方法等、目的とするバンプのサイズやパターンに対応させて種々の方法を用いることができる。
　塗布した金属ペーストを乾燥させるのは、ペースト中の有機溶剤を除去するためである。この乾燥は、－２０℃以上５℃以下で行なうのが好ましい。乾燥工程における雰囲気を減圧雰囲気としても良い。これにより乾燥過程において大気中の水分が金属粉末表面に結露するのを防止することができる。減圧雰囲気とする場合、好ましくは１００Ｐａ以下、より好ましくは１０Ｐａ以下とするが、この雰囲気の真空度は、金属ペースト中の有機溶剤の揮発性に応じて設定する。
　金属ペーストを乾燥した後、焼結することでペースト中の金属粒子同士、及び、第１バンプ層の表面と金属粒子との間に、互いに点接触した近接状態が形成された焼結体となる。焼結温度は、第１バンプ層を構成する金属（第１の導電性金属）の種類によるが、７０～３２０℃の範囲内とする。７０℃未満では焼結が不完全であり、バンプとしての使用に耐えない。また、本発明に係るバンプは、第１バンプ層と第２バンプ層と間で所定のヤング率比が具備される必要があるが、下限未満の温度では第２バンプ層が軟らかすぎてヤング比率を適切なものにすることができず、接合時に第２バンプ層の変形が著しくなりバンプとしての形状に問題が生じ得るからである。また、上限値を超える温度では、第２バンプ層が固くなりすぎヤング比率を適切に保てず、接合時に第１バンプ層の方が変形するおそれがあるからである。そして、第１バンプ層の構成金属に対応した焼結温度の具体的な範囲としては、第１バンプ層が金の場合は７０～３００℃とし、銅の場合は８０～３００℃とし、ニッケルの場合は９０～３２０℃とする。このように第１バンプ層の構成金属により焼結温度を調整するのは、バルク体の各金属のヤング率の相違を考慮するものである。尚、焼結の際の加熱時間は、１０～６０分とするのが好ましい。短時間では焼結炉の温度が安定せず十分な焼結ができず、また、あまりに長時間とすると生産性が損なわれるからである。この焼結は無加圧で行なうのが好ましい。
　尚、以上の第１及び第２バンプ層形成の前に、フォトレジストによるパターン形成を行っても良い。フォトレジストの適用は、微細なパターン形成のために通常用いられるものである。また、このようなレジストを適用したバンプパターンを形成する場合、焼結工程を複数としても良い。例えば、露光により形成された孔（パターン）に金属ペーストを充填し、まず、比較的低温（８０～１００℃）で焼結させた後、レジストを剥離し比較的高温（２００～３００℃）で再度焼結してもよい。この２段階の焼結は、レジストを保護するため低温で仮焼結し、レジスト除去後に仕上げ的に焼結させるものであり、強固なバンプ形成に有効である。
　また、上記の中間層を備えるバンプを形成する場合、メッキ等により第１バンプ層を形成した後、中間層を形成する工程を含む。この中間層の形成方法は、メッキ、スパッタリング、ＣＶＤ等が適用できるが、メッキ、特に、無電解メッキが好ましい。安価に薄い薄膜の製造が可能だからである。
　本発明に係るバンプが形成された基板を用いて、フリップチップ法により前記基板を対向基板に実装する方法としては、少なくとも第２バンプ層を加熱しながら前記基板の一方向又は双方向から加圧しバンプを接合する。本発明に係るバンプの第２バンプ層である焼結体は、加圧されることで接触部に塑性変形が生じると共に、その変形界面で金属原子間の結合が生じ、緻密な接合部となる。この加圧は、一方向で行っても良いし双方向から行っても良い。また、加圧する際の圧力は、接合部の緻密化のため、焼結体の降伏強度より大きくするのが好ましい。
　そして、この接合工程の際には、少なくとも焼結体を加熱しながら加圧することが必要である。加熱しない場合、接合部の緻密化が不十分となり、接合強度が不足するからである。このときの加熱温度は、７０～３００℃とするのが好ましい。７０℃未満では接合ができないからであり、３００℃を超えると冷却時の熱歪の影響が大きくなるからである。
　また、この接合工程においては、加熱に加えて超音波を印加しても良い。加熱又は加熱と超音波との組合わせにより、金属粉末の塑性変形及び結合を促進することができ、加熱温度を低くすることができる。但し、バンプのサイズが極微小の場合、振動によりバンプ全体が変形するおそれもあることから、ピッチ幅の狭いパターンで形成された微小なバンプについては超音波印加することなく加熱のみで接合することが好ましい。超音波を印加する場合、その条件は、振幅０．５～５μｍとし、印加時間を０．５～３秒とするのが好ましい。過大な超音波印加はバンプ全体を損傷させるからである。
　接合工程における上記加熱及び超音波印加は、その目的から少なくとも第２バンプ層である焼結体に対して行なえばよいが、バンプ全体に行っても良い。加熱の方法としては、所定温度の雰囲気炉中で加圧する他、接合時に基板（又は対向基板）を載せるステージを加熱し、その際の伝熱を利用しても良い。同様に、超音波の印加は、ステージから超音波発振させるのが簡易である。
　以上説明したように、本発明に係るバンプを適用することで、バンプ高さのバラつきを考慮することなく、フリップチップ法による回路実装をすることができる。このときのバンプ接合は、低圧ですることができる。
本実施形態におけるバンプ形成工程を概略説明する図。 本実施形態で製造したバンプの外観を示すＳＥＭ写真。 本実施形態で製造したバンプの外観を示すＳＥＭ写真（拡大）。 第１及び第２バンプ層のヤング率測定方法を説明する図。
　以下、本発明に係るバンプ形成の好適な実施形態を説明する。本実施形態では、まず、第２バンプ層を形成する金属粉末の粒径、焼結条件と焼結後のバンプ層の強度との関係について検討した。この検討は、第２の導電性金属である各金属（金、銀）の粒径の相違する金属粉末から金属ペーストを複数製造し、これを塗布後に焼結してその強度を評価した。金属ペーストは、湿式還元法により製造された粒径０．００５、０．３、１．０、２．０μｍの金属粉末（純度９９．９９重量％）を、有機溶剤であるエステルアルコールに混合して調整したものを用いた。そして、この金属ペーストを、レジストによる孔を形成した基板（Ｓｉ／Ａｕメッキ）に塗布し、真空乾燥し（５℃）。焼結温度を２３０℃として焼結させ、その後レジストを除去した後に、ヤング率を測定した。ヤング率の測定は、形成したバンプについてせん断試験を行い、応力－ひずみ曲線を作成してその直線部の傾きを求めることにより行った。各種金属ペーストにより製造されるバンプのヤング率を表１に示す。
Figure JPOXMLDOC01-appb-T000001
　表１から、金属粉末の粒径が０．００５～１．０μｍまでの金属粉末においては、ヤング率が比較的安定しているのに対し、２．０μｍは著しく低くなっている。２．０μｍのものについて実際に製造されたバンプは、形状として一応は立体的な状態を保っているものの、容易に崩壊し易いものであった。これは、焼結温度が低すぎることにより、焼結が不十分であることによると考えられる。また、粒径０．００５μmの金属粉末については、焼結後の強度面では問題がなかったが、ペースト状態の凝集が酷く、使用直前までの十分な攪拌を要した。よって、取扱い性を考慮すると、これより小さい粒径の金属粉末のペーストはあまり好まれないといえる。
　次に、焼結の際の焼結温度の適正範囲について検討した。各金属の粒径０．３μｍの金属ペーストを用いて、焼結温度を６０～３４０℃としてバンプを形成し、そのヤング率を測定した。バンプの形成工程、ヤング率測定方法は、上記と同じくした。その結果を表２に示す。
Figure JPOXMLDOC01-appb-T000002
　表２から、焼結温度としては７０℃以上とすることで実用的な強度を有する焼結体を得ることができると考えられる。これは７０℃以上の焼結温度で焼結が進行しネッキングの促進等により緻密化が図られたためと考えられる。そして、６０℃未満の温度では焼結が生じることなく、焼結工程後のバンプはボロボロで形状を留めないものであった。従って、ある程度の強度を有するバンプを形成するためには、少なくとも７０℃以上での焼結が必要である。また、焼結体の強度は、３００℃を超えたときに急激に上昇するが、第１バンプ層の強度（ヤング率）に基づき、適切なヤング率比を設定して焼結温度の上限を定めることが必要であるといえる。
　以上の予備試験を経て、本発明における２層構造のバンプの製造、評価を行った。図１は、本実施形態におけるバンプの製造工程を説明するものである。予め、Ｔｉ膜（０．５μｍ）及びＡｕ膜（１．０μｍ）をスパッタ法により形成した半導体ウェハー（材質：シリコン）の表面に、フォトレジスト膜（化薬マイクロケム株式会社製：ＡＺＰ４９０３)をスピンコートし、プリベーク（１００℃×１２０秒）後、パターニングした。パターニングは、ｇ線（波長４３６ｎｍ）を照度２１００ｍＪ/ｃｍ２、露光時間１５０秒の照射条件で行った。この基板のレジスト膜厚さは、触針式膜厚計による測定で２０μｍであり、面内バラつきは±１μｍであった。そして、開孔の径は２０μｍであった。
　この基板について、開孔部内に金メッキ層（第１バンプ層）を形成した。金メッキは、電解金めっき液（日本エレクトロプレイティングエンジニヤーズ株式会社製：テンペレックス２０９Ａ）を用いた。そして、金メッキ層を１０μｍ高さまで形成した。
　次に、金属ペーストとして金ペーストをフォトレジスト層の表面に滴下し、スピンコート法によって開孔内に金ペーストを充填した。ここで、使用した金ペーストは、純度９９．９９重量％の金粉（平均粒径：０．３μｍ）と、有機溶剤としてエステルアルコール（２，２，４－トリメチル－３－ヒドロキシペンタイソブチレート（Ｃ１２Ｈ２４Ｏ３））を混合して調整されたものである。ペースト塗布後、これを乾燥器にて＋５℃で真空乾燥した。
　そして、余剰な金属ペーストをブレードで除去し、半導体ウェハーを電気炉に入れて金粉を焼結させた（焼結温度は８０℃で３０分間とした。）。その後、半導体ウェハーをアセトンに浸漬させてレジストを剥離し、２３０℃で３０分間、再度焼結させた。
　図２、３は、本実施形態で製造したバンプの外観を示すＳＥＭ写真である。この写真からわかるように、本実施例で形成されたバンプは、金メッキ層（第１バンプ層）に粉末焼結体（第２バンプ層）を冠した形態を有し、バンプ間のブリッジ形成もなく、綺麗に揃った形状であった。
　また、製造したバンプの第１バンプ層、第２バンプ層それぞれについて、ヤング率を測定した。ヤング率の測定は、図４で示すようなせん断試験を行い、応力－ひずみ曲線を作成してその直線部の傾きを求めることにより行った。
　以上のようにして製造したバンプパターン形成シリコンウェハーを用いて接合試験を行った。この検討は、Ｔｉ膜（０．５μｍ）及びＡｕ膜（１．０μｍ）をスパッタ法により形成したガラス基板を対向基板とし、この対向基板のＡｕ膜面に、シリコンウェハーのバンプ形成面を対向させて接合するものである。接合の際には、２３０℃に加熱したヒートステージ上にガラス基板を載置し、１バンプ辺り０．０１５Ｎの圧力となるように１０分間加圧して熱と圧力を負荷した。
　以上のバンプ形成・接合試験は、第１バンプ層を金（めっき）とし、第２バンプ層を金（焼結）とするものである。本実施形態では、上記と同様の工程により、第１、第２バンプ層の金属を変更し、また第２バンプ層の焼結温度を調整しつつバンプ形成、接合試験を行い、両バンプ層のヤング率比と接合性との関係を検討した。表３～表７は、その結果を示す。
Figure JPOXMLDOC01-appb-T000003
Figure JPOXMLDOC01-appb-T000004
Figure JPOXMLDOC01-appb-T000005
Figure JPOXMLDOC01-appb-T000006
Figure JPOXMLDOC01-appb-T000007
Figure JPOXMLDOC01-appb-T000008
　以上の各種金属の組み合わせにおいて、接合性を良好なものとするためには、第１、第２バンプ層の強度（ヤング率）の比が重要であり、いずれの金属を適用するにもヤング率比を０．１～０．４の範囲内とすることが必要であることがわかる。また、金、銅、ニッケルのバルク体は、強度が相違することから、第１バンプ層をこれらの金属で構成するときには、第２バンプ層となる焼結体の焼結温度範囲を適宜調整することが好ましいといえる。
　尚、上記フリップチップ法によるウェハー接合後、各バンプの接合状態（安定性）を確認するために、隣接するバンプ接合部間の導通を室温下で測定したところ、電気抵抗は１．５±０．１Ωであった。これに対する比較として、従来例として、バンプ全体を金メッキにより形成し、同様の評価を行った。バンプの形成は、本実施形態と同様の電解金メッキ液を用い、メッキ時間を調整してレジストの開孔全体にメッキ層を形成した。そして、本実施形態と同様にレジスト除去してバンプを形成したが、バンプ高さは２０μｍ±２μｍであった。
　また、このメッキバンプを有するシリコンウェハーについて、本実施形態と同様の接合試験を行った。接合後、隣接するバンプ接合部間の導通を室温下で測定したが、全ての端子の導通を採ることができなかった。そして、導通が取れる箇所についても、電気抵抗は２．１±０．６Ωであった。本実施形態と比較例とを対比すると、比較例は明らかに導通安定性に劣ることがわかる。即ち、本実施形態では全ての端子で導通がとれた上に、抵抗値も低く、また、そのバラつきも小さい。このような相違は、比較例のメッキによるバンプを備える基板では、バンプ高さのバラつきにより各バンプの接合状態が不均一であることによるものと考えられる。そして、これを解消するためには、接合時の圧力を高くすることも考えられるが、それでは基板に対する影響が懸念される。よって、この対比から、本発明は、従来技術にとっては不十分である低圧での接合が可能であることがわかった。
　本発明に係る二重構造のバンプは、フリップチップ法による接合の際、バンプ高さのバラつきによる問題を解消し得るものである。本発明を用いた基板の実装方法は、高集積化が望まれる各種の半導体回路の製造に好適である。

Claims (9)

  1. 基板上に所定パターンで形成され、導電性金属からなるバンプであって、
    　基板上に形成され、金、銅、ニッケルのいずれかである第１の導電性金属のバルク体からなる第１バンプ層と、前記第１バンプ層上に形成され、金、銀のいずれかである第２の導電性金属の粉末の焼結体からなる第２バンプ層と、からなる２層構造を有し、
    　前記第１バンプ層を構成するバルク体は、メッキ法、スパッタリング法、ＣＶＤ法のいずれかにより形成されるものであり、
    　前記第２バンプ層を構成する焼結体は、純度が９９．９重量％以上であり、平均粒径が０．００５μｍ～１．０μｍである第２の導電性金属からなる金属粉末を焼結して形成されたものであり、
    　前記第２バンプ層のヤング率が、前記第１バンプ層のヤング率の０．１～０．４倍である、バンプ。
  2. 第１バンプ層のバンプ全体に対する高さ比は、０．１～０．９である請求項１記載のバンプ。
  3. 第１の導電性金属と第２の導電性金属とが異なる種類の金属であり、第１バンプ層と第２バンプ層との間に、密着性向上のためのバルク状の中間層を少なくとも１層備える請求項１または請求項２記載のバンプ。
  4. 中間層は、少なくとも第２バンプ層との接触面が第２の導電性金属と同じ導電性金属からなる請求項３記載のバンプ。
  5. 請求項１～請求項４のいずれかに記載のバンプの製造方法であって、
    　基板上に、メッキ法、スパッタリング法、ＣＶＤ法のいずれかにより第１バンプ層を形成する工程、
    　前記第１バンプ層上に、純度が９９．９重量％以上であり、平均粒径が０．００５μｍ～１．０μｍである第２の導電性金属の粉末を含む金属ペーストを塗布し、前記金属ペーストを乾燥させた後、焼結温度を７０～３２０℃として加熱焼結して第２バンプ層を形成する工程、
    　を含む方法。
  6. 第１バンプ層の形成後、中間層を形成する工程を少なくとも１回含む請求項５記載のバンプの製造方法。
  7. 請求項１～請求項４のいずれかに記載のバンプが形成された基板を用いて、フリップチップ法により前記基板を対向基板に実装する方法であって、少なくとも第２バンプ層を加熱しながら前記基板の一方向又は双方向から加圧しバンプを接合する方法。
  8. 接合時の加熱温度を７０～３００℃とする請求項７記載の方法。
  9. 更に、少なくとも第２バンプ層に超音波を印加して加圧する請求項７又は請求項８記載の方法。
PCT/JP2010/053615 2008-05-12 2010-03-05 バンプ及び該バンプの形成方法並びに該バンプが形成された基板の実装方法 WO2010101236A1 (ja)

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EP10748829.8A EP2405474A4 (en) 2009-03-06 2010-03-05 BOSS, METHOD FOR FORMING BOSS AND METHOD FOR MOUNTING SUBSTRATE COMPRISING BOSS FORMED ON IT
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