WO2016114160A1 - 異方性導電フィルム、その製造方法及び接続構造体 - Google Patents

異方性導電フィルム、その製造方法及び接続構造体 Download PDF

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Publication number
WO2016114160A1
WO2016114160A1 PCT/JP2016/050065 JP2016050065W WO2016114160A1 WO 2016114160 A1 WO2016114160 A1 WO 2016114160A1 JP 2016050065 W JP2016050065 W JP 2016050065W WO 2016114160 A1 WO2016114160 A1 WO 2016114160A1
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Prior art keywords
anisotropic conductive
conductive film
metal particles
flux
insulating film
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Ceased
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PCT/JP2016/050065
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English (en)
French (fr)
Japanese (ja)
Inventor
芳賀　賢一
朋之 石松
恭志 阿久津
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Dexerials Corp
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Dexerials Corp
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Priority to CN201680004593.6A priority Critical patent/CN107112657B/zh
Priority to US15/541,621 priority patent/US10575410B2/en
Priority to KR1020177010334A priority patent/KR102028900B1/ko
Publication of WO2016114160A1 publication Critical patent/WO2016114160A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
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    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
    • H—ELECTRICITY
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    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
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    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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Definitions

  • the present invention relates to an anisotropic conductive film in which metal particles and a flux are present in contact with or close to each other in the film.
  • Patent Document 1 It has been proposed to use an anisotropic conductive film in which conductive particles having a nickel / gold plating layer formed on the surface of a resin core are dispersed in an insulating adhesive composition when an IC chip is mounted on a substrate.
  • Patent Document 1 the conductive particles are crushed between the terminals of the IC chip and the terminals of the substrate, or the conductive particles bite into the respective terminals to ensure conduction, and the insulating adhesive composition is used for the IC chip, the substrate, and the conductive particles. And are fixed.
  • connection structure obtained by connecting the IC chip to the substrate using an anisotropic conductive film is high temperature and high pressure. Or, when stored in a high-temperature and high-humidity environment, there is a problem that conduction reliability is lowered.
  • the conductive particles of the anisotropic conductive film it is possible to employ solder particles that form a metal bond with copper or the like at a relatively low temperature as compared with metals such as copper and aluminum that are widely used as terminal materials for IC chips. It is considered.
  • An object of the present invention is to solve the above-described problems of the prior art, and an anisotropic conductive film having metal particles such as solder particles having an oxide film on the surface as conductive particles for anisotropic conductive connection. In this case, it is possible to suppress occurrence of a short circuit and to realize high conduction reliability.
  • the present inventors have used metal particles in order to suppress the occurrence of short circuit. Rather than randomly dispersing in the insulating adhesive composition, the anisotropic conductive film should be regularly arranged when viewed in plan, and in order to achieve high conduction reliability, the flux in the film Has been found to be present in contact with or close to the metal particles, and the present invention has been completed.
  • the present invention is an anisotropic conductive film having metal particles in an insulating film, wherein the metal particles are regularly arranged in a plan view, and the anisotropic conductive film surface side end of the metal particles or a different surface.
  • an anisotropic conductive film in which a flux is disposed so as to be in contact with or close to at least one of the end portions on the back side of the isotropic conductive film.
  • the present invention also relates to a method for producing the above anisotropic conductive film, which comprises the following steps (A) to (C): (A) a step of disposing a flux on at least the bottom of the concave portion of the transfer mold having the concave portions arranged regularly; (B) a step of placing metal particles in the recesses in which the flux is disposed; and (C) the insulating film is brought into contact with the insulating film from the recess side of the transfer mold in which the metal particles are disposed, and the metal particles are applied to the insulating film by heating and pressing.
  • a production method is provided. This production method preferably further comprises step (D) (D) There is a step of thermocompression bonding another insulating film to the metal particle transfer surface of the insulating film to which the metal particles have been transferred.
  • the present invention is another method for producing the above-mentioned anisotropic conductive film, which comprises the following steps (a) to (d): (A) a step of disposing metal particles in the recesses of the transfer mold having regularly arranged recesses; (B) a step of disposing a flux on a recess forming surface on which transfer-type metal particles are disposed; (C) a step of bringing the insulating film into contact with the transfer-type flux arrangement surface side and applying heat and pressure to transfer the metal particles to the insulating film; , Thermocompression bonding another insulating film; Have
  • the present invention provides the first electronic component by disposing the aforementioned anisotropic conductive film disposed between the terminal of the first electronic component and the terminal of the second electronic component, and heating and pressing the first electronic component.
  • a connection structure in which the second electronic component and the second electronic component are anisotropically conductively connected.
  • the metal particles are regularly arranged in a plan view, so that the occurrence of short-circuits can be suppressed when applied to anisotropic conductive connection. it can. Also, since the flux is arranged so that the flux contacts or is close to at least one of the anisotropic conductive film surface side end portion or the anisotropic conductive film back surface side end portion of the metal particles, The oxide film on the surface of the metal particles can be removed at the time of conductive connection, and high conduction reliability can be realized.
  • FIG. 1A is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 1B is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 1C is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 2A is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 2B is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 2C is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 3 is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 4 is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 5 is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 6 is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 7A is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 7B is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 7C is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 7A is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 7B is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 7C is a process explanatory diagram of
  • FIG. 8A is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 8B is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 8C is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 8D is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 9A is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 9B is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 9C is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 9D is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 10A is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 10B is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 10C is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 10D is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 11A is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 11B is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 11C is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 11D is a cross-sectional view of the anisotropic conductive film of the present invention.
  • FIG. 12A is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 12B is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 12C is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • FIG. 12D is a process explanatory diagram of the method for producing an anisotropic conductive film of the present invention.
  • the insulating film 1 can be used by appropriately selecting from the insulating films employed in conventionally known anisotropic conductive films.
  • a thermoplastic acrylic or epoxy resin film, a thermosetting or photocuring acrylic or epoxy resin film, and the like can be given.
  • the thickness of such an insulating film is usually 10 to 40 ⁇ m.
  • the insulating film 1 should just be a film in the state of an anisotropic conductive film at least, and may be a highly viscous liquid at the time of the manufacture.
  • the metal particles 2 are used as anisotropic conductive film metal particles in an anisotropic conductive film and can be used by appropriately selecting from those having an oxide film formed on the surface. it can. Among these, solder particles having an average particle diameter of 10 to 40 ⁇ m when measured with an image type particle size distribution meter are preferred.
  • the flux 3 is in contact with or close to at least one end of the anisotropic conductive film surface side end or the anisotropic conductive film back side end of the metal particles. Is arranged.
  • the flux 3 is arranged so as to contact the anisotropic conductive film surface side end 2 a of the metal particles 2.
  • the flux 3 is disposed so as to contact the anisotropic conductive film back surface side end 2 b of the metal particles 2.
  • FIG. 1A the flux 3 is disposed so as to contact the anisotropic conductive film back surface side end 2 b of the metal particles 2.
  • the flux 3 is arranged so as to contact the anisotropic conductive film surface side end 2 a and the anisotropic conductive film back side end 2 b of the metal particles 2. As described above, when the metal particles 2 and the flux 3 are in contact with each other, the oxide film on the surface of the metal particles 2 is removed by the flux 3 by the heat in the anisotropic conductive connection, and the metal particles 2 are connected. A metal bond is formed with the terminal to be.
  • the quantitative relationship between the metal particles 2 and the flux 3 in contact with or close to the metal particles 2 is such that the thickness of the flux 3 is 0.001 to 0.4 times the average particle diameter of the metal particles 2. If it is this range, the surface of the metal particle 2 can be cleaned and an anisotropic conductive connection thing will not be corroded.
  • the flux 3 When the flux 3 is placed in contact with or close to the metal particles 2, the flux diluted in a solvent (preferred dilution ratio: 0.1 to 40 wt% with respect to the solvent) What is necessary is just to apply
  • the flux 3 removes the oxide film on the surface of the metal particles 2 under the heating condition in the anisotropic conductive connection.
  • a known flux according to the material of the metal particles 2 can be applied.
  • the insulating film 1 is a single layer. However, as shown in FIG. 3, the insulating film 1 has a two-layer structure (1a and 1b), and a metal is interposed between these layers. Particles 2 may be arranged. With such a two-layer structure, the manufacturing flexibility can be expanded.
  • the anisotropic conductive film 10 of the present invention includes an embodiment in which a part of the surface of the metal particle 2 is not in contact with the flux 3.
  • the surface portion of the metal particle 2 that is not in contact with the flux 3 faces the side surface direction of the film, but may face the front surface side of the film or may face the back surface side.
  • the surface portion of the metal particles 2 that is not in contact with the flux 3 is preferably disposed on the opposite side of the surface portion of the metal particles that are in contact with the flux.
  • the flux 3 may be arrange
  • the flux 3 disposed between the adjacent metal particles 2 is attracted to the metal particles 2 at the time of anisotropic conductive connection.
  • the surface of the particles can be cleaned and delamination of the insulating film having a two-layer structure does not occur.
  • the amount of flux per unit area arranged at least one of the anisotropic conductive film surface side end 2a or the anisotropic conductive film back side end 2b of the metal particles 2 is adjacent.
  • the amount of flux per unit area disposed between the metal particles 2 is preferably larger.
  • the flux 3 is disposed on at least the bottom of the recess 50 of the transfer mold 100 having the recesses 50 arranged regularly. Specifically, as shown in FIG. 7A, the flux 3 may be disposed only at the bottom of the recess 50, or as shown in FIG. 7B, the flux 3 may be disposed on the entire inner wall surface including the bottom of the recess 50. Good. Further, as shown in FIG. 7C, the flux 3 may be disposed on the bottom of the recess 50 and the surface between the adjacent recesses 50 of the transfer body 100. In the case of FIG. 7C, the amount of flux per unit area at the bottom of the recess 50 is preferably larger than the amount of flux per unit area of the surface between adjacent recesses 50.
  • the flux 3 is applied to the entire surface of the transfer mold by a screen printing method, and the flux on the outermost surface is applied if necessary. Scraping with a blade.
  • the metal particles 2 are arranged in the recesses 50 in which the flux 3 is arranged.
  • a known method can be employed.
  • metal particles may be dispersed on the surface of the transfer mold, and the metal particles present on the transfer mold surface other than the recesses may be removed by air blow or a blade.
  • you may supply a metal particle to a recessed part one by one with a micro dispenser.
  • the flux 3 may be arranged on the surface of the metal particles 2 by using a process technique as shown in FIG. 8D.
  • FIGS. 9A to 9D the insulating film 1 is brought into contact with the transfer mold 100 (FIGS. 8A to 8D) of FIGS.
  • the metal particles 2 are transferred to the insulating film 1 by applying pressure. If the insulating film 1 is wound around the roll in this state, the anisotropic conductive film 10 of FIG. 10A is obtained from the embodiment of FIG. 9A, and the anisotropic conductive film 10 of FIG. 10B is obtained from the embodiment of FIG. 9C is obtained, and the anisotropic conductive film 10 of FIG. 10C is obtained from the embodiment of FIG. 9C, and the anisotropic conductive film 10 of FIG. 10D is obtained from the embodiment of FIG. 9D.
  • step (D) in order to make the insulating film have a two-layer structure.
  • the anisotropic conductive film of the present invention can also be produced by another production method having the following steps (a) to (c).
  • the metal particles 2 are arranged in the recesses 50 of the transfer mold 200 having the recesses 50 arranged in a regular arrangement.
  • the anisotropic conductive film of the present invention is disposed between a terminal of a first electronic component such as an IC chip or a semiconductor wafer and a terminal of a second electronic component such as a wiring board or a halfway wafer, and is heated. It is useful for manufacturing a connection structure in which the first electronic component and the second electronic component are anisotropically conductively connected by applying pressure. Such a connection structure is also one embodiment of the present invention.
  • Example 1 A nickel plate having a thickness of 2 mm was prepared, and cylindrical convex portions (outer diameter 25 ⁇ m, height 20 ⁇ m) were formed in a tetragonal lattice pattern to obtain a transfer material master. The distance between the centers of adjacent convex portions was 40 ⁇ m. Therefore, the density of the convex portions was 625 pieces / mm 2 .
  • a flux (ESR-250T4, Senju Metal Industry Co., Ltd.) diluted with toluene using a squeegee is applied to the transfer mold peeled off from the transfer mold master, and the flux thickness in the recess becomes 1 ⁇ m after drying. The flux on the surface of the transfer mold was scraped off.
  • solder particles fine solder powder, Mitsui Mining & Smelting Co., Ltd.
  • the recesses were filled with solder particles by air blowing.
  • insulating film 60 ⁇ m of insulating film (phenoxy resin (YP-50, Nippon Steel & Sumikin Chemical Co., Ltd.) with a thickness of 20 ⁇ m, epoxy resin (jER828, Mitsubishi Chemical Co., Ltd.) on the transfer type solder particle adhesion surface to which conductive particles have adhered. ) 40 parts by weight, and a cationic curing agent (SI-60L, Sanshin Chemical Industry Co., Ltd.) 2 parts by weight), and press at a temperature of 50 ° C. and a pressure of 0.5 MPa to form an insulating film. Solder particles were transferred.
  • Example 2 A transfer mold similar to that of Example 1 was prepared. Solder particles (fine solder powder, Mitsui Mining & Smelting Co., Ltd.) having an average particle diameter of 20 ⁇ m were sprayed on the transfer mold, and then air blowed to form solder particles in the recesses. Filled.
  • Solder particles fine solder powder, Mitsui Mining & Smelting Co., Ltd.
  • a flux diluted to 20 wt% with toluene using a squeegee was applied to the surface of the transfer mold filled with solder particles so that the flux thickness after drying was 1 ⁇ m. .
  • An insulating film (phenoxy resin (YP-50, Nippon Steel & Sumikin Chemical Co., Ltd.) 60 parts by mass, epoxy resin (jER828, Mitsubishi Chemical Co., Ltd.) 40 parts by mass, and cationic curing with respect to the flux surface
  • An agent (SI-60L, a film consisting of 2 parts by mass of Sanshin Chemical Industry Co., Ltd.) was placed and pressed at a temperature of 50 ° C. and a pressure of 0.5 MPa to transfer the solder particles to the insulating film.
  • Comparative Example 1 An anisotropic conductive film was obtained by repeating Example 1 except that no flux was used.
  • Example 3 A transfer mold similar to that in Example 1 was prepared, and a flux was disposed on the bottom of the recess of the transfer mold in the same manner as in Example 1. Then, the recess was filled with solder particles. On the surface of the transfer mold, a flux (ESR-250T4, Senju Metal Industry Co., Ltd.) diluted to 5 wt% with toluene was applied again using a squeegee. Then, the anisotropic conductive film was obtained by repeating the same operation as Example 1. The coating thickness after drying of the flux was 1 ⁇ m at the end of the solder particles on the film interface side, and less than 1 ⁇ m between the solder particles.
  • ESR-250T4 Senju Metal Industry Co., Ltd.
  • Example 4 Example 1 is repeated except that the dilution of the flux (ESR-250T4, Senju Metal Industry Co., Ltd.) with toluene is changed from 5 wt% to 10 wt% in Example 1 and the coating thickness after drying is changed to 2 ⁇ m. Thus, an anisotropic conductive film was obtained.
  • ESR-250T4, Senju Metal Industry Co., Ltd. Senju Metal Industry Co., Ltd.
  • the initial conduction resistance value needs to be less than 1 ⁇
  • the conduction resistance value after PCT and after the high temperature and high humidity bias test needs to be less than 15 ⁇ .

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CN110767348A (zh) * 2019-11-12 2020-02-07 业成科技（成都）有限公司 异方性导电膜及其制作方法
WO2022102672A1 (ja) * 2020-11-12 2022-05-19 昭和電工マテリアルズ株式会社 回路接続用接着剤フィルム及びその製造方法、並びに、接続構造体及びその製造方法
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