TWI668526B - Cylindrical mask exposure device - Google Patents

Abstract

The substrate processing apparatus (1011) includes: a first support member (1021) to traverse a first surface curved into a cylindrical surface with a predetermined curvature in one of the illumination region (IR) and the projection region (PA) (p1001) to support one of the first object (M) and the second object (P); and the second support member (1022) to set a predetermined second surface in the other of the illumination area and the projection area ( p1002) to support the other of the first object and the second object. The projection optical system (PL) includes a deflecting member that directs the principal ray between the first surface of the imaging beam from the illumination area to the projection area and the principal ray between the projection optical system toward the first surface and the second surface The imaging beam propagates in a way that the plane is not perpendicular to the radial direction.

Description

Cylindrical mask exposure device

The present invention relates to a substrate processing apparatus, a device manufacturing system, and a device manufacturing method.

This application claims priority based on Japanese Patent Application No. 2011-278290 filed on December 20, 2011 and Japanese Patent Application No. 2012-024058 filed on February 7, 2012, and the contents are used here.

Substrate processing apparatuses such as exposure apparatuses, such as described in Patent Document 1 below, are used in the manufacture of various devices. The substrate processing apparatus can project the image of the pattern formed on the mask M arranged in the illumination area on the substrate arranged in the projection area. The mask M used for the substrate processing apparatus has a planar shape or a cylindrical shape.

In addition, as one of the methods of manufacturing the element, for example, a roll-to-roll method described in Patent Document 2 described below is known. The roll-to-roll method is a method in which various substrates are processed on the transport path while the substrate such as a film is transferred from the delivery roll to the recovery roll. The substrate may be processed in a substantially flat state, for example, between transfer rollers. In addition, the substrate may be processed in a curved state, for example, on the surface of the drum.

Advanced technical literature

[Patent Document 1] Japanese Unexamined Patent Publication No. 2007-299918

[Patent Document 2] International Publication No. 2008/129819

As in the substrate processing apparatus (exposure apparatus) described above, for example, in the case where one or both of the illumination area on the reticle and the projection area on the substrate are bent at a predetermined curvature, if the imaging performance of the projection optics used for exposure is considered, then In particular, there will be restrictions on the setting of the chief ray of the imaging beam. For example, suppose that a mask pattern formed on the outer peripheral cylindrical surface of a cylindrical rotating mask of radius R is imaged and projected onto the substrate (which is wound on a cylindrical rotating drum (drum) of radius R) through a projection optical system. Film, sheet, net, etc.) on the surface. In this case, in general, as long as the chief ray of the imaging beam from the reticle pattern (cylindrical surface) to the substrate surface (cylindrical surface) is formed, the rotation center axis and circle of the cylindrical rotating reticle will form The projection optical system of the optical path in which the central axis of rotation of the reel is directly connected with the reel.

However, when the size of the mask pattern is large in the direction of the rotation axis of the cylindrical rotating mask, it is sometimes necessary to multiply a plurality of such projection optics in the direction of the rotation axis. In such a majority situation, even if a plurality of projection optics are closely aligned in the direction of the rotation axis, the projection field of view (projection area) of each projection optics must be separated from the thickness of the metal object such as the lens barrel. The large mask pattern cannot be faithfully exposed.

In addition, if the above-described substrate processing apparatus has a complicated apparatus configuration, for example, the apparatus cost may increase and the apparatus size may become large. As a result, it is possible to increase the manufacturing cost of the device.

For example, when precise patterning is necessary, as a substrate processing device, a photomask that illuminates a pattern depicting electronic components or display elements is used, and the light from the pattern of the photomask is projected and exposed to the photosensitive layer (light Exposure, etc.) on the substrate. When the pattern of the photomask is repeatedly exposed to the continuously transported flexible long substrate (film, sheet, net, etc.) by roll-to-roll method, if the transport direction of the long substrate is also used as the scanning direction, use As a scanning exposure device for a reticle with a cylindrical rotating mask, productivity can be expected to improve leaps and bounds.

Such a rotating reticle has a transmission method in which the outer surface of a transparent cylindrical body such as glass is patterned with a light-shielding layer, and the outer peripheral surface of a metallic cylindrical body (which may also be a cylinder) is shaped as a reflection portion and an absorption portion Form a patterned reflection. For transmission type cylindrical masks, it is necessary to assemble an illumination optical system (optical members such as mirrors, lenses, etc.) for illuminating the pattern toward the outer peripheral surface inside the cylindrical mask. It is difficult to pass the rotation axis through the cylindrical light In the inner center of the cover, there are cases where the structure of the holding structure of the cylindrical mask or the rotation drive system becomes complicated.

On the other hand, in the case of a reflective cylindrical mask, a cylindrical body (or cylinder) made of metal can be used, so although the mask can be made inexpensively, it is necessary to provide irradiation in the outer peripheral space of the cylindrical mask The illumination optics of the illumination light for exposure and the projection optics that project the reflected light from the pattern formed on the outer peripheral surface onto the substrate, and there are changes in the configuration of the exposure device side in order to satisfy the required resolution, transfer fidelity, etc. Complicated situation.

An aspect of the present invention aims to provide a substrate processing apparatus equipped with a large light source capable of disposing even one or both of a photomask and a substrate (a flexible substrate such as a film, sheet, net, etc.) into a cylindrical surface The mask pattern faithfully exposes the projection optical system used. Another purpose is to provide a device manufacturing system and device manufacturing method that can faithfully expose a larger mask pattern.

In addition, another object is to provide a substrate processing apparatus that can simplify the structure of the apparatus. In addition, another object is to provide a device manufacturing system and a device manufacturing method that can reduce manufacturing costs.

According to one aspect of the present invention, there is provided a substrate processing apparatus comprising: a projection optical system that projects a light beam from an illumination area on a first object (mask) on a projection area on a second object (substrate); 1 a supporting member that supports one of the first object and the second object along a first surface that is curved into a cylindrical shape with a predetermined curvature in one of the illumination area and the projection area; and the second supporting member, The other of the first object and the second object is supported along the predetermined second surface in the other of the illumination area and the projection area; the projection optics is provided with a deflection member that extends from the illumination area to The chief ray between the first surface of the imaging beam of the projection area and the projection optical system causes the imaging beam to propagate in a direction in which the radial direction of the first surface is not perpendicular to the second surface.

According to another aspect of the present invention, there is provided a device manufacturing system including the substrate processing apparatus of the above aspect.

According to another aspect of the present invention, there is provided a device manufacturing method including: exposing a second object by the substrate processing apparatus of the above aspect; and forming a pattern of the first object by processing the exposed second object.

According to another aspect of the present invention, there is provided a substrate processing apparatus that projects and exposes an image of a reflective mask pattern onto a sensing substrate, and includes: a mask holding member to hold the mask pattern; a projection optics system will set from A reflected light beam generated in a part of the illumination area on the mask pattern is projected onto the sensing substrate, thereby imaging a part of the image of the mask pattern on the sensing substrate; optical components, including: arranged in the projection optics for oblique illumination of the illumination area In the optical path of the system, the part that passes one of the illumination light to the illumination area and the reflected light beam generated from the illumination area and the other part reflects; A part of the projection optical system has a part of the optical path and the optical member to direct the illumination light from the light source image to the illumination area, and a conjugate surface optically conjugated with the light source image is formed at or near the reflection part or the passing part of the optical member.

According to another aspect of the present invention, there is provided a substrate processing apparatus that projects and exposes an image of a reflective mask pattern onto a sensing substrate, and includes: a mask holding member to hold the mask pattern; A reflected light beam generated in a part of the illumination area on the mask pattern is projected onto the sensing substrate, thereby imaging a part of the image of the mask pattern on the sensing substrate; optical components, including: arranged in the projection optics for oblique illumination of the illumination area In the optical path of the system, the part that passes one of the illumination light to the illumination area and the reflected light beam generated from the illumination area and the other reflects; and the illumination optics, which will be a plurality of light source images as the source of the illumination light It is regularly or randomly formed at or near the reflection part or passing part of the optical member.

According to another aspect of the present invention, there is provided a device manufacturing system including the substrate processing apparatus of the above aspect.

According to another aspect of the present invention, a device manufacturing method is provided, which includes: exposing an object with the substrate processing apparatus of the above aspect; and developing the exposed object.

According to another aspect of the present invention, a device manufacturing method is provided in which a flexible sheet substrate is continuously transferred in a long-side direction while forming a pattern for an element on the sheet substrate, which includes: The center line is a cylindrical surface of a certain radius with a transmission or reflection type mask pattern corresponding to the pattern of the element. The cylindrical mask rotates around the first center line; The second center line is a cylindrical body with a cylindrical outer peripheral surface of a certain radius, which bends and supports a part of the sheet substrate while transferring the sheet substrate in the longitudinal direction; the mask pattern is set by a set of projection optics The projection image is exposed to the sheet substrate. The set of projection optics is configured to be approximately symmetrical with respect to the center plane including the first center line and the second center line, and the mask pattern with the cylindrical mask as the object plane , When the surface of the sheet substrate supported by the cylinder is used as the image plane, the extension line of the chief ray passing through the object plane from the chief ray of the imaging beam from the object plane to the image plane toward the first center line, passing through the main plane of the image plane The extension of the light is towards the 2nd Center line.

According to the aspect of the present invention, even if one or both of the mask and the substrate are cylindrical, it is possible to faithfully expose a larger mask pattern by a substrate processing device (exposure device) equipped with a small projection optical system . In addition, according to the aspect of the present invention, it is possible to provide a device manufacturing system and a device manufacturing method that can faithfully expose a large mask pattern.

Furthermore, according to the aspect of the present invention, it is possible to provide a substrate processing apparatus which can simplify the structure of the apparatus. Furthermore, according to the aspect of the present invention, it is possible to provide a device manufacturing system and a device manufacturing method that can reduce manufacturing costs.

1001‧‧‧Component manufacturing system

1009‧‧‧Conveying device

1011‧‧‧Substrate processing device

1021‧‧‧The first reel member

1022‧‧‧The second reel member

1050‧‧‧The first deflection member

1057‧‧‧The second deflection member

1078‧‧‧mask stage

1120‧‧‧The third deflection member

1121‧‧‧ 4th deflection member

1132‧‧‧The seventh deflection member

1133‧‧‧Eighth deflection member

1136‧‧‧The 9th deflection member

1137‧‧‧10th deflection member

1140‧‧‧Eleventh deflection member

1143‧‧‧12th deflection member

1151‧‧‧13th deflection member

1152‧‧‧The 14th deflection member

AX1001‧‧‧The first central axis

AX1002‧‧‧2nd central axis

D1001‧‧‧ First diameter direction

D1002‧‧‧The second diameter direction

D1003‧‧‧First normal direction

D1004‧‧‧ 2nd normal direction

DFx‧‧‧Distance

DMx‧‧‧Perimeter

IR‧‧‧Illuminated area

M‧‧‧mask

P‧‧‧Substrate

PA‧‧‧Projection area

PL‧‧‧Projection optics

PL1001 ~ PL1006‧‧‧Projection module

p1001‧‧‧The first side

p1002‧‧‧Second side

p1003‧‧‧Center plane

p1007‧‧‧Intermediate image plane

2001‧‧‧Component Manufacturing System

2005‧‧‧Higher control device

2013‧‧‧Control device

2014‧‧‧First Optical Department

2015‧‧‧ 2nd Department of Optics

2020‧‧‧Reel

2030‧‧‧Rotary reel

2040‧‧‧Concave mirror

2094‧‧‧stem lens

U3‧‧‧Processing device (substrate processing device, exposure device)

FIG. 1 is a diagram showing the structure of a component manufacturing system according to the first embodiment.

2 is a diagram showing the overall configuration of a substrate processing apparatus (exposure apparatus) according to the first embodiment.

FIG. 3 is a diagram showing the configuration of a mask holding device of the exposure device shown in FIG. 2.

4 is a diagram showing the configuration of the first reel member and the illumination optics of the exposure apparatus shown in FIG. 2.

FIG. 5 is a diagram showing the arrangement of the illumination area and the projection area of the exposure device shown in FIG. 2.

6 is a diagram showing a configuration of a projection optical system suitable for the exposure apparatus shown in FIG. 2.

7 is a diagram showing the overall configuration of an exposure apparatus according to a second embodiment.

8 is a diagram showing the overall configuration of an exposure apparatus according to a third embodiment.

9 is a diagram illustrating the positional relationship conditions of the projection area of the illumination area of the exposure apparatus shown in FIG. 8.

FIG. 10 is a graph showing the conditions illustrated in FIG. 9 as a function of the radius of the cylindrical mask.

Fig. 11 is a diagram showing the overall configuration of an exposure apparatus according to a fourth embodiment.

12 is a diagram showing the configuration of the oblique illumination method of the exposure apparatus of the fifth embodiment.

Fig. 13 is a diagram showing the configuration of a projection optical system according to a sixth embodiment.

FIG. 14 is a diagram showing a configuration in which the projection optical system shown in FIG. 13 is pluralized.

15 is a diagram showing the projection optical system shown in FIG. 14 after being pluralized from other directions.

Fig. 16 is a diagram showing the configuration of a projection optical system according to a seventh embodiment.

Fig. 17 is a diagram showing the configuration of a projection optical system according to an eighth embodiment.

Fig. 18 is a diagram showing the configuration of a projection optical system according to a ninth embodiment.

Fig. 19 is a diagram showing the structure of a projection optical system according to a tenth embodiment.

Fig. 20 is a diagram showing the configuration of the component manufacturing system of the eleventh embodiment.

21 is a diagram showing the structure of a substrate processing apparatus (exposure apparatus) according to an eleventh embodiment.

Fig. 22 is a diagram showing the configuration of an optical member in the eleventh embodiment.

23 is a schematic diagram showing the light path from the illuminated area to the projection area.

24 is a diagram showing a configuration example of a light source device according to an eleventh embodiment.

FIG. 25 is a diagram showing a configuration example of a fly-eye lens array of the eleventh embodiment.

Fig. 26 is a diagram showing a configuration example of a diaphragm in the illumination optical system of the eleventh embodiment.

Fig. 27 is a diagram showing a configuration example of an optical member according to an eleventh embodiment.

FIG. 28 is a diagram showing a configuration example of a fly-eye lens array of the twelfth embodiment.

FIG. 29 is a diagram showing a configuration example of a fly-eye lens array of the thirteenth embodiment.

Fig. 30 is a diagram showing a configuration example of a fly-eye lens array of the fourteenth embodiment.

Fig. 31 is a diagram showing a configuration example of a light source image forming unit in a fifteenth embodiment.

32A is a diagram showing a configuration example of an illumination optical system according to a sixteenth embodiment.

32B is a diagram showing a configuration example of an illumination optical system according to a sixteenth embodiment.

Fig. 33A is a diagram showing each part of the illumination optical system according to the sixteenth embodiment.

Fig. 33B is a diagram showing each part of the illumination optical system according to the sixteenth embodiment.

Fig. 33C is a diagram showing each part of the illumination optical system according to the sixteenth embodiment.

34 is a diagram showing the structure of a substrate processing apparatus (exposure apparatus) according to a seventeenth embodiment.

Fig. 35 is a diagram showing the arrangement of the illumination area and the projection area in the seventeenth embodiment.

Fig. 36 is a diagram showing a configuration example of an exposure apparatus according to a seventeenth embodiment.

Fig. 37 is a diagram showing a configuration example of a projection optical system according to an eighteenth embodiment.

Fig. 38 is a diagram showing a configuration example of a projection optical system according to a nineteenth embodiment.

FIG. 39 is a flowchart showing the device manufacturing method of this embodiment.

[First Embodiment]

FIG. 1 is a diagram showing the configuration of a component manufacturing system 1001 of this embodiment. The component manufacturing system 1001 shown in FIG. 1 includes a substrate supply device 1002 that supplies a substrate P, a processing device 1003 that performs predetermined processing on the substrate P supplied by the substrate supply device 1002, and recycling is processed by the processing device 1003 The substrate recovery device 1004 of the substrate P and the upper control device 1005 of each part of the control element manufacturing system 1001.

In the present embodiment, the substrate P has flexibility such as a so-called flexible substrate (Piece) substrate. In the device manufacturing system 1001 of this embodiment, a flexible device can be manufactured from the flexible substrate P. The substrate P is selected, for example, to have a degree of flexibility that does not break when the device manufacturing system 1001 is bent.

In addition, the flexibility of the substrate P during the manufacture of the device can be adjusted according to the material, size, thickness, etc. of the substrate P, and can be adjusted according to the environmental conditions such as humidity and temperature during the manufacture of the device. In addition, the substrate P may be a substrate having no flexibility such as a so-called hard substrate. In addition, the substrate P may also be a composite substrate formed by combining a flexible substrate and a rigid substrate.

For the flexible substrate P, a foil made of metal or alloy such as a resin film, stainless steel, or the like can be used. The material of the resin film includes, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin , Polystyrene resin, polyvinyl alcohol resin one or more than two.

The characteristics of the substrate P, such as the coefficient of thermal expansion, are set so as to substantially ignore the amount of deformation caused by the heat applied to the various processing steps applied to the substrate P. For the substrate P, for example, a non-significant thermal expansion coefficient can be selected. The thermal expansion coefficient can be set to be smaller than the threshold value corresponding to the process temperature and the like by, for example, mixing an inorganic filler into the resin film. Examples of inorganic fillers include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide. In addition, the substrate P may be a very thin glass monomer having a thickness of about 100 μm manufactured by a float method or the like, or a laminate in which the above-mentioned resin film and aluminum foil are bonded to the very thin glass.

In this embodiment, the substrate P is a so-called multi-faceted substrate. The device manufacturing system 1001 of this embodiment repeatedly executes various processes for manufacturing a device on the substrate P. The substrate P subjected to various processes is divided into elements, and becomes a plurality of elements. The size of the substrate P is, for example, approximately 1 m to 2 m in the width direction (short side direction), and 10 m or more in the longitudinal direction (long side direction).

In addition, the size of the substrate P can be appropriately set according to the size of the manufactured device or the like. For example, the P dimension of the substrate may be 1 m or less or 2 m or more in the width direction, and the dimension in the long side direction may also be It is less than 10m. In addition, when the substrate P is a substrate for so-called multi-sided extraction, it may be a strip-shaped substrate or a substrate formed by connecting a plurality of substrates. In addition, the component manufacturing system 1001 can also manufacture components by using a substrate independent of each component. In this case, the substrate P may also be a substrate equivalent to the size of one element.

The substrate supply device 1002 of this embodiment supplies the substrate P to the processing device 1003 by sending out the substrate P wound on the supply reel 1006. The substrate supply device 1002 includes, for example, a shaft portion that winds the substrate P, a rotation driving portion that rotates the shaft portion, and the like. In the present embodiment, the substrate P is transported in the longitudinal direction and sent to the processing apparatus 1003. That is, in this embodiment, the transport direction of the substrate P is substantially the same as the longitudinal direction of the substrate P.

In addition, the substrate supply device 1002 may also include a cover portion that covers the substrate P wound on the supply reel 1006 and the like. In addition, the substrate supply apparatus 1002 may also include a mechanism such as a clamping-type driving roller that sequentially sends out the substrate P in the longitudinal direction thereof.

The substrate recovery device 1004 of the present embodiment collects the substrate P by winding the substrate P passing through the processing device 1003 on the collection reel 1007. The substrate recovery device 1004 includes, for example, a shaft portion that winds the substrate P, a rotation drive portion that rotates the shaft portion, and a cover portion that covers the substrate P wound on the collection reel 1007, as in the substrate supply device 1002.

Furthermore, the processed substrate P is cut by the cutting device, and the substrate recovery device 1004 can also recover the cut substrate. In this case, the substrate recovery device 1004 may also be a device that recovers the stacked and cut substrates. The above-mentioned cutting device may be a part of the processing device 1003, or may be a device different from the processing device 1003, for example, may be a part of the substrate recovery device 1004.

The processing device 1003 transfers the substrate P supplied from the substrate supply device 1002 to the substrate recovery device 1004, and processes the processed surface of the substrate P during the transfer. The processing apparatus 1003 includes a processing apparatus 1010 that processes the surface to be processed of the substrate P, and a transport apparatus 1009 including a transfer drum 1008 that transfers the substrate P under conditions corresponding to the processing.

The processing device 1010 includes one or more devices for processing the substrate P The surface executes various processes for forming the requirements of the component. In the component manufacturing system 1001 of this embodiment, devices for performing various processes are appropriately provided along the transport path of the substrate P, and components such as flexible displays can be produced in a so-called roll-to-roll method. By roll-to-roll method, components can be produced with good efficiency.

In this embodiment, the various devices of the processing device 1010 include a film forming device, an exposure device, a coating and developing device, and an etching device. The film forming apparatus is, for example, a gold plating apparatus, a vapor deposition apparatus, a sputtering apparatus, and the like. In the film forming apparatus, a functional film such as a conductive film, a semiconductor film, and an insulating film is formed on the substrate P. The coating and developing device is formed by forming a photosensitive material such as a photoresist film on the substrate P on which the functional film is formed by the film forming device. The exposure device applies an exposure process to the substrate P by projecting the image of the pattern corresponding to the film pattern constituting the element on the substrate P on which the photosensitive material is formed. The coating and developing device develops the substrate P after exposure. The etching device uses the photosensitive material of the developed substrate P as a mask M to etch the functional film. In this way, the processing device 1010 forms the functional film of the desired pattern on the substrate P.

In addition, the processing apparatus 1010 may also include an apparatus such as a film forming apparatus of an imprint method, a droplet discharge apparatus, etc. that directly forms a film pattern without etching. At least one of various devices of the processing device 1010 may be omitted.

In this embodiment, the higher-level control device 1005 controls the substrate supply device 1002 so that the substrate supply device 1002 executes the process of supplying the substrate P to the processing device 1010. The higher-level control device 1005 controls the processing device 1010 to cause the processing device 1010 to perform various processes on the substrate P. The higher-level control device 1005 controls the substrate recovery device 1004 to cause the substrate recovery device 1004 to perform a process of recovering the substrate P to which the processing device 1010 has applied various processes.

Next, the structure of the substrate processing apparatus of this embodiment will be described with reference to FIGS. 2, 3 and 4. FIG. 2 is a diagram showing the overall configuration of the substrate processing apparatus 1011 of this embodiment. The substrate processing apparatus 1011 shown in FIG. 2 is at least a part of the processing apparatus 1010 as described above. In this embodiment, the substrate processing apparatus 1011 includes an exposure apparatus EX that performs exposure processing and a transport apparatus 1009 At least part of it.

The exposure apparatus EX of this embodiment is a so-called scanning exposure apparatus, which simultaneously drives the rotation of the cylindrical mask (cylindrical mask) M and the transfer of the flexible substrate P, and simultaneously images the pattern formed on the mask M The projection optical system PL (PL1001 to PL1006) with a projection magnification of equal magnification (× 1) is projected on the substrate P. In addition, in FIGS. 2 to 4, the Y axis of the orthogonal coordinate system XYZ is set to be parallel to the rotation center line (first center line) AX1001 of the cylindrical mask M, and the X axis is set to the direction of scanning exposure And the transport direction of the substrate P at the exposure position.

As shown in FIG. 2, the exposure device EX includes a mask holding device 1012, an illumination device 1013, a projection optical system PL, and a control device 1014. The substrate processing apparatus 1011 rotates and moves the mask M held in the mask holding apparatus 1012, and the substrate P is transferred by the transfer device 1009. The illuminating device 1013 illuminates a part (illumination area IR) of the reticle M held by the reticle holding device 1012 with uniform brightness by the illuminating light beam EL1. The projection optics PL projects the image of the pattern of the illumination area IR on the mask M onto a part of the substrate P (projection area PA) transported by the transport device 1009. As the mask M moves, the portion disposed on the mask M of the illumination area IR also changes, and as the substrate P moves, the portion disposed on the substrate P of the projection area PA also changes, thereby placing the mask M on The image of a predetermined pattern (mask pattern) is projected on the substrate P. The control device 1014 controls each part of the exposure device EX, and causes each part to execute processing. In this embodiment, the control device 1014 controls at least a part of the transport device 1009.

In addition, the control device 1014 may also be part or all of the upper control device 1005 of the component manufacturing system 1001. In addition, the control device 1014 may be controlled by the higher-level control device 1005 and may be a different device from the higher-level control device 1005. The control device 1014 includes, for example, a computer system. The computer system includes hardware such as a CPU and various memories or OS, peripheral devices, and the like. The operation process of each part of the substrate processing apparatus 1011 is stored in a computer-readable recording medium in the form of a program, and the program is read out by the computer system to be executed, thereby performing various processes. When the computer system can be connected to the Internet or Internet system, it also includes a webpage providing environment (or display surroundings). Furthermore, computer-readable recording media include portable media such as floppy disks, magneto-optical disks, ROM, CD-ROM, and memory devices such as hard disks embedded in computer systems. The computer can read the recording media, including those that keep the program dynamically for a short period of time when the program is sent through a communication line such as the Internet or a telephone line, or as a server client in this case The volatile memory inside the computer system is kept for a certain period of time. In addition, the program may be used to realize a part of the functions of the substrate processing apparatus 1011, or may be combined with a program already recorded in the computer system to realize the functions of the substrate processing apparatus 1011. The higher-level control device 1005 can be realized by a computer system in the same manner as the control device 1014.

Next, each part of the exposure apparatus EX of FIG. 2 will be described in detail with reference to FIGS. 3 and 4. FIG. 3 is a diagram showing the configuration of the reticle holding device 1012, and FIG. 4 is a diagram showing the configuration of the first reel member 1021 and the illumination optical system IL.

As shown in FIG. 3 (FIG. 2), the mask holding device 1012 includes a first member (hereinafter referred to as a first roll member 1021) that holds the mask M, a guide roller 1023 that supports the first roll member 1021, and a drive The driving roller 1024 of the first spool member 1021, the first detector 1025 that detects the position of the first spool member 1021, and the first driving unit 1026.

As shown in FIG. 4 (FIG. 2 or FIG. 3), the first reel member 1021 forms the first surface p1001 where the illumination area IR is arranged on the light distribution mask M. In this embodiment, the first surface p1001 includes a surface (hereinafter referred to as a cylindrical surface) that rotates a line segment (generator line) about an axis parallel to the line segment (first center axis AX1001). The cylindrical surface is, for example, a cylindrical outer peripheral surface, a cylindrical outer peripheral surface, or the like. The first reel member 1021 is made of, for example, glass, quartz, or the like, has a cylindrical shape with a certain thickness, and its outer peripheral surface (cylindrical surface) forms the first surface p1001. That is, in this embodiment, the illumination region IR on the mask M is curved from the rotation center line AX1001 into a cylindrical surface shape having a certain radius r1001 (see FIG. 1). The portion of the first reel member 1021 that overlaps with the pattern of the reticle M when viewed from the radial direction of the first reel member 1021, for example, the center except for both end sides in the Y-axis direction of the first reel member 1021 shown in FIG. 3 Part of the light beam EL1001 has translucency.

The photomask M is made as a transmissive flat sheet photomask with a pattern of a light-shielding layer of chromium or the like formed on one surface of a short strip-shaped thin glass plate (for example, thickness 100-500 μm) with good flatness, along the first The outer circumferential surface of the cylindrical member 1021 is bent, and is used in a state of being wound (attached) to this outer circumferential surface. The mask M has a pattern non-formed area where no pattern is formed, and is attached to the first reel member 1021 in the pattern non-formed area. The mask M can attach and detach (release) the first reel member 1021.

In addition, it is also possible to replace the method of forming the photomask M with an extremely thin glass plate and winding the photomask M around the first reel member 1021 of the transparent cylindrical base material. The outer peripheral surface of the member 1021 is directly drawn and formed into a photomask pattern formed by a light-shielding layer such as chromium and integrated. In this case, the first reel member 1021 also functions as a support member of the reticle (first object).

In addition, the first reel member 1021 may have a structure in which the thin-plate-shaped photomask M is bent and attached to the inner peripheral surface thereof. In addition, the mask M may be formed with the whole or part of the pattern for the panel corresponding to one display element, or may be formed with the pattern for the panel corresponding to a plurality of display elements. Furthermore, in the mask M, a plurality of patterns for panels may be repeatedly arranged in the circumferential direction around the first central axis AX1001, or a plurality of patterns for small panels may be repeatedly arranged in a direction parallel to the first central axis AX1001. In addition, the mask M may include a pattern for the panel of the first display element, a size and the like, and a pattern for the panel of the second display element that are different from the first display element. In addition, the outer peripheral surface (or inner peripheral surface) of the first reel member 1021 may be provided with a structure in which a plurality of separate thin-plate-shaped photomasks M are individually mounted in a direction parallel to the first central axis AX1001 or in the peripheral direction.

The guide roller 1023 and the driving roller 1024 shown in FIG. 3 extend in the Y-axis direction parallel to the first central axis AX1001 of the first reel member 1021. The guide roller 1023 and the driving roller 1024 are provided to be rotatable about an axis parallel to the first central axis AX1001. The outer diameter of the end portion of the guide roller 1023 and the drive roller 1024 in the axial direction is larger than the other portions, and this end portion is externally connected to the first reel member 1021. As described above, the guide roller 1023 and the driving roller 1024 are provided so as not to contact the mask M held by the first reel member 1021. The driving roller 1024 transmits the torque supplied from the first driving unit 1026 to the first spool member 1021, so that the first spool member 1021 is wound around the first central axis AX1001 rotates.

In addition, although the mask holding device 1012 includes one guide roller 1023 and one drive roller 1024, the number of guide rollers 1023 may be two or more, and the number of drive rollers 1024 may be two or more. At least one of the guide roller 1023 and the driving roller 1024 may be disposed inside the first spool member 1021 and inscribed with the first spool member 1021. In addition, the portion of the first reel member 1021 that does not overlap the pattern of the reticle M as viewed from the radial direction of the first reel member 1021 (both ends in the Y-axis direction) can transmit light to the illumination beam EL1001, and May not have light transmission. In addition, one or both of the guide roller 1023 and the drive roller 1024 may be, for example, truncated cone-shaped, and the center axis (rotation axis) is non-parallel to the first center axis AX1001.

The first detector 1025 optically detects the rotational position of the first reel member 1021. The first detector 1025 includes, for example, a rotary encoder. The first detector 1025 supplies information indicating the detected rotational position of the first reel member 1021 to the control device 1014. The first driving part 1026 including an actuator such as an electric motor adjusts the torque for rotating the driving drum 1024 according to the control signal supplied from the control device 1014. The control device 1014 controls the rotation position of the first reel member 1021 by controlling the first drive unit 1026 based on the detection result of the first detector 1025. In other words, the control device 1014 controls one or both of the rotation position and the rotation speed of the mask M held in the mask holding device 1012.

In addition, a sensor that optically measures the position of the first reel member 1021 in the Y-axis direction in FIG. 3 (hereinafter referred to as a Y-direction position measurement sensor) can also be added to the first detector 1025. Although the Y-direction position of the first reel member 1021 shown in FIGS. 2 and 3 is basically limited to be unchanged, in order to perform the relative position of the exposed area or alignment mark on the substrate P and the pattern of the mask M For alignment, a mechanism (actuator) that causes the first reel member 1021 (mask M) to jog in the Y direction may also be considered. In this case, the measurement information from the Y-direction position measurement sensor can also be used to control the Y-direction micro-motion mechanism of the first reel member 1021.

As shown in FIG. 2, the transport device 1009 includes a first transport roller 1030, a first guide member 1031, The second support member (hereinafter referred to as the second reel member 1022) forming the second surface p1002 of the projection area PA on the arrangement substrate P, the second guide member 1033, the second transport roller 1034, and the second detector 1035, And the second driving unit 1036. In addition, the transfer roller 1008 shown in FIG. 1 includes a first transfer roller 1030 and a second transfer roller 1034.

In this embodiment, the substrate P transferred from the upstream of the transfer path to the first transfer roller 1030 is transferred to the first guide member 1031 via the first transfer roller 1030. The substrate P via the first guide member 1031 is supported by the surface of a cylindrical or cylindrical second reel member (cylindrical body) 1022 supported by a radius r1002, and is transported to the second guide member 1033. The substrate P via the second guide member 1033 is transported downstream of the transport path via the second transport roller 1034. In addition, the rotation center lines (second center lines) AX1002 of the second spool member 1022, and the rotation center lines of the first transfer roller 1030 and the second transfer roller 1034 are all set parallel to the Y axis.

The first guide member 1031 and the second guide member 1033 are moved in a direction crossing the width direction of the substrate P (moving in the XZ plane in FIG. 2), for example, and the adjustment of the transport path acts on the substrate P Tension etc. In addition, the first guide member 1031 (and the first transfer roller 1030) and the second guide member 1033 (and the second transfer roller 1034) can be configured to be movable in the width direction (Y direction) of the substrate P, for example, The position of the substrate P wound around the outer periphery of the second reel member 1022 in the Y direction is adjusted. In addition, as long as the transport device 1009 can transport the substrate P along the projection area PA of the projection optical system PL, its configuration can be appropriately changed.

The second reel member 1022 forms a second surface p1002 that supports a portion of the projection area PA on the substrate P on which the imaging beam from the projection optical system PL is projected into an arc shape. In the present embodiment, the second reel member 1022 is part of the conveying device 1009 and also serves as a support member (substrate stage) that supports the substrate P to be exposed. That is, the second reel member 1022 may be a part of the exposure apparatus EX.

The second spool member 1022 can rotate about its central axis (hereinafter referred to as the second central axis AX1002), and the substrate P is curved into a cylindrical surface along the outer peripheral surface (cylindrical surface) on the second transfer roller 1034, and is bent Part of the song configures the projection area PA.

In this embodiment, the radius r1001 of the portion of the outer surface of the first reel member 1021 where the mask M is wound and the radius r1002 of the portion of the outer surface of the second reel member 1022 where the substrate P is wound are set to be substantially the same . This is because it is assumed that the thickness of the thin-plate-shaped photomask M is substantially equal to the thickness of the substrate P.

On the other hand, for example, when a pattern is formed directly on the outer peripheral surface of the first reel member 1021 (transmission cylindrical base material) by a chromium layer, the thickness of the chromium layer can be ignored, so compared to the pattern surface of a photomask The radius remains r1001. If the thickness of the substrate P is about 200 μm, the radius of the surface of the substrate P in the projection area PA is r1002 + 200 μm. In this case, the radius r1002 of the portion of the outer peripheral surface of the second reel member 1022 where the substrate P is wound may be reduced by the thickness of the substrate P.

As can be seen from the above, in order to strictly set the conditions, the radii of the first reel member 1021 and the second reel member 1022 may also be determined as the pattern surface of the photomask supported by the outer peripheral surface of the first reel member 1021 ( The radius of the cylindrical surface is equal to the radius of the surface of the substrate P supported by the outer peripheral surface of the second reel member 1022.

In the present embodiment, the second spool member 1022 rotates by the torque supplied from the second driving unit 1036 including an actuator such as an electric motor. The second detector 1035 includes, for example, a rotary encoder, and the second detector 1035 optically detects the rotational position of the second reel member 1022. The second detector 1035 supplies information indicating the detected rotational position of the second reel member 1022 to the control device 1014. The second driving unit 1026 adjusts the torque for rotating the second reel member 1022 according to the control signal supplied from the control device 1014. The control device 1014 controls the rotation position of the second reel member 1022 by controlling the second drive unit 1036 based on the detection result of the second detector 1035, so that the first reel member 1021 and the second reel member 1022 move synchronously ( Synchronous rotation).

In addition, when the substrate P is a thin flexible film, wrinkling or twisting may occur when it is wound around the second reel member 1022. Therefore, the substrate P is brought into contact with the outer peripheral surface of the second reel member 1022 as straight as possible, and the conveyance direction (X direction) given to the substrate P is stretched. As much as possible, strength is important. From such a viewpoint, the control device 1014 controls the second driving unit 1036 so that the rotational speed unevenness of the second spool member 1022 is extremely small.

In this embodiment, if the plane including the first central axis AX1001 of the first spool member 1021 and the second central axis AX1002 of the second spool member 1022 is the central plane p1003 (parallel to the YZ plane), Then, in the vicinity of the position where the central plane p1003 intersects the cylindrical first surface p1001, the central plane p1003 and the first surface p1001 will have an approximately orthogonal relationship. Similarly, the central plane p1003 and the cylindrical second Near the position where the plane p1002 intersects, the center plane p1003 and the second plane p1002 are approximately orthogonal.

The exposure apparatus EX of this embodiment is assumed to be an exposure apparatus equipped with a projection optical system of a so-called multi-lens system. The projection optical system PL includes a plurality of projection modules that project a part of the image in the pattern of the mask M. For example, in FIG. 2, there are three projection modules (projection optics) PL1001, PL1003, PL1005 on the left side of the center plane p1003 at a certain interval in the Y direction, and three projection modules (projection optics) on the right side of the center plane p1003 PL1002, PL1004, PL1006 are arranged at a fixed interval in the Y direction.

In this multi-lens exposure apparatus EX, the Y-direction end portions of the areas (projection areas PA1001 to PA1006) exposed by the plurality of projection modules PL1001 to PL1006 are overlapped with each other by scanning, thereby projecting the desired pattern The overall image. In such an exposure device EX, even when the necessity of processing the pattern P on the reticle M in the Y direction becomes larger and the substrate P with a larger width in the Y direction inevitably arises, it is only necessary to add a projection module in the Y direction The module on the side of the lighting device 1013 may be sufficient, so it has an advantage that it can be easily applied to the enlargement of the panel size (the width of the substrate P).

In addition, the exposure device EX may not be a multi-lens system. For example, when the width direction dimension of the substrate P is small to a certain extent, the exposure device EX may also project an image with a full width of the pattern on the substrate P by a projection module. Moreover, the plurality of projection modules PL1001 ~ PL1006 can also project the pattern corresponding to one element respectively. That is, the exposure device EX can also project the patterns for the plural elements in parallel by the plural projection modules.

The lighting device 1013 of this embodiment includes a light source device (not shown) and an illumination optical system IL. As shown in FIG. 4, the illumination optical system IL includes a plurality of (for example, six) illumination modules IL1001 to IL1006 arranged in the Y-axis direction corresponding to each of the plurality of projection modules PL1001 to PL1006. The light source device includes a lamp light source such as a mercury lamp, or a solid-state light source such as a laser diode and a light emitting diode (LED). The illumination light emitted by the light source device is, for example, far-ultraviolet light (DUV light) such as glow line (g line, h line, i line), KrF excimer laser light (wavelength 248nm), and ArF excimer laser light (wavelength) 193nm) etc. The illumination light emitted from the light source device has a uniform illuminance distribution, and is distributed to a plurality of illumination modules IL1001 to IL1006 through light guide members such as optical fibers.

In addition, the light source device may be disposed inside the first reel member 1021 or may be disposed outside the first reel member 1021. Moreover, the light source device may be a device (external device) different from the exposure device EX.

The plurality of illumination modules IL1001 to IL1006 respectively include a plurality of optical components such as lenses. In this embodiment, the light emitted from the light source device and passing through any one of the plurality of illumination modules IL1001 to IL1006 is referred to as an illumination light beam EL1. Each of the plurality of illumination modules IL1001 ~ IL1006 includes, for example, an integrator optical system, a rod lens, a compound eye lens, etc., and illuminates the illumination area IR with an illumination beam EL1 of uniform illumination distribution. In this embodiment, a plurality of lighting modules IL1001 to IL1006 are arranged inside the first reel member 1021. Each of the plurality of illumination modules IL1001 to IL1006 illuminates the illumination regions IR (IR1001 ~ IR1006).

In this embodiment, each lighting module is referred to as the first lighting module IL1001 and the second lighting module IL1002 in the order of -Y side (the front side of the paper surface in FIG. 2) to + Y side (the deep side of the paper surface in FIG. 2). , The third lighting module IL1003, the fourth lighting module IL1004, the fifth lighting module IL1005, the sixth lighting module IL1006. That is, among the plurality of lighting modules IL1001 to IL1006, the first lighting module IL1001 is disposed on the most-Y side, and the sixth lighting module IL1006 is disposed on the most-Y side. In addition, the number of projection modules included in the projection optical system PL may be more than one, less than five, or seven. More than.

The plurality of lighting modules IL1001 to IL1006 are arranged in a direction (for example, X-axis direction) crossing the first central axis AX1001 so as not to interfere with each other. The first lighting module IL1001, the third lighting module IL1003, and the fifth lighting module IL1005 are arranged at positions that overlap each other when viewed from the Y-axis direction. The first lighting module IL1001, the third lighting module IL1003, and the fifth lighting module IL1005 are separated from each other in the Y-axis direction.

In the present embodiment, the second lighting module IL1002 is arranged to be symmetrical to the first lighting module IL1001 with respect to the center plane p1003 when viewed from the Y-axis direction. The fourth lighting module IL1004 and the sixth lighting module IL1006 are arranged at positions that overlap with the second lighting module IL1002 when viewed from the Y-axis direction. The second lighting module IL1002, the fourth lighting module IL1004, and the sixth lighting module IL1006 are arranged apart from each other in the Y-axis direction.

The plurality of illumination modules IL1001 to IL1006 are directed to the first radial direction D1001 or the second radial direction D1002 that intersects the central plane p1003 in the radial direction (radial direction) of the first central axis AX1001 relative to the first reel member 1021. Irradiate the illumination beam EL1. The irradiation direction of the illumination beam EL1 of each lighting module alternately changes according to the order in which the bright modules are arranged in the Y-axis direction. For example, the irradiation direction of the illumination beam from the first illumination module IL1001 (the first diameter direction D1001) is inclined to the -X side from the Z axis direction, and the irradiation direction of the illumination beam from the second illumination module IL1002 (the second diameter direction D1002 ) Incline to + X side from -Z axis direction. Similarly, the illumination directions of the illumination beams from each of the third illumination module IL1003 and the fifth illumination module IL1005 are substantially parallel to the illumination directions of the first illumination module IL1001, and from the fourth illumination module IL1004 and the first 6 The illumination direction of each illumination beam of the illumination module IL1006 is substantially parallel to the illumination direction of the second illumination module IL1002.

FIG. 5 is a diagram showing the arrangement of the illumination area IR and the projection area PA in this embodiment. In addition, FIG. 5 illustrates a plan view (left image in FIG. 5) of the illumination region IR disposed on the reticle M of the first reel member 1021 viewed from the -Z side and a configuration disposed in the second volume from the + Z side The base of the cylinder member 1022 A top view of the projection area PA on the board P (right image in FIG. 5). Symbol Xs in FIG. 5 shows the moving direction (rotation direction) of the first reel member 1021 or the second reel member 1022.

The first to sixth lighting modules IL1001 to IL1006 respectively illuminate the first to sixth lighting regions IR1001 to IR1006 on the reticle M. For example, the first lighting module IL1001 illuminates the first lighting area IR1001, and the second lighting module IL1002 illuminates the second lighting area IR1002.

Although the first illumination region IR1001 of this embodiment is described as a trapezoidal region elongated in the Y direction, it may also be a rectangular region including the trapezoidal region depending on the configuration of the projection optical system (projection module) PL described later. . The third illumination region IR1003 and the fifth illumination region IR1005 are both regions of the same shape as the first illumination region IR1001, and are arranged at a constant interval in the Y-axis direction. In addition, the second illumination region IR1002 is a trapezoidal (or rectangular) region symmetrical to the first illumination region IR1001 with respect to the center plane p1003. The fourth illumination region IR1004 and the sixth illumination region IR1006 are both regions of the same shape as the second illumination region IR1002, and are arranged at regular intervals in the Y-axis direction.

As shown in FIG. 5, each of the first to sixth illumination regions IR1001 to IR1006 is arranged such that the triangular portion of the oblique side portion of the adjacent trapezoidal illumination region overlaps when viewed in the circumferential direction of the first surface p1001. Therefore, for example, the first area A1001 on the reticle M passing through the first illumination area IR1001 by the rotation of the first reel member 1021 and the second illumination area IR1002 passing through the rotation of the first reel member 1021 The second area A1002 on the mask M partially overlaps.

In this embodiment, the mask M has a pattern-formed area A1003 in which a pattern is formed, and a pattern non-formation area A1004 in which no pattern is formed. The pattern non-formation area A1004 is arranged to surround the pattern formation area A1003 in a frame shape, and has a characteristic of blocking the illumination light beam EL1. The pattern forming area A1003 of the reticle M moves in the direction Xs with the rotation of the first reel member 1021, and each partial area in the Y axis direction in the pattern forming area A1003 passes through any one of the first to sixth illumination areas IR1001 to IR1006 . In other words, the first to sixth illumination regions IR1001 to IR1006 are arranged so as to cover the entire width in the Y-axis direction of the pattern formation region A1003.

As shown in FIG. 2, the projection optical system PL includes a plurality of projection modules PL1001 to PL1006 arranged in the Y-axis direction. Each of the plurality of projection modules PL1001 ~ PL1006 corresponds one-to-one with each of the first to sixth illumination regions IR1001 ~ IR1006, and the photomask M appearing in the illumination region IR illuminated by the corresponding illumination module The image of the partial pattern is projected on each projection area PA on the substrate P.

For example, the first projection module PL1001 corresponds to the first illumination module IL1001, and the pattern image of the mask M in the first illumination region IR1001 (see FIG. 5) illuminated by the first illumination module IL1001 is projected on the substrate P The first projection area PA1001. The third projection module PL1003 and the fifth projection module PL1005 correspond to the third illumination module IL1003 and the fifth illumination module IL1005, respectively. The third projection module PL1003 and the fifth projection module PL1005 are arranged at positions that do not overlap with the first projection module PL1001 when viewed from the Y-axis direction.

Moreover, the second projection module PL1002 corresponds to the second illumination module IL1002, and projects the pattern image of the mask M in the second illumination region IR1002 (see FIG. 5) illuminated by the second illumination module IL1002 on the substrate P The second projection area PA1002. The second projection module PL1002 is arranged at a position symmetrical with respect to the first projection module PL1001 against the center plane p1003 when viewed from the Y-axis direction.

The fourth projection module PL1004 and the sixth projection module PL1006 are respectively arranged corresponding to the fourth illumination module IL1004 and the sixth illumination module IL1006, and the fourth projection module PL1004 and the sixth projection module PL1006 are arranged from the Y axis direction The position that does not overlap with the second projection module PL1002 when viewing.

In addition, in this embodiment, the light that reaches the illumination regions IR1001 to IR1006 from the illumination modules IL1001 to IL1006 of the illumination device 1013 to the reticle M is referred to as the illumination beam EL1, and is received by the illumination regions IR1001 to IR1006. The intensity distribution corresponding to the partial pattern of the reticle M that appears and enters each projection module PL1001 ~ PL1006 and reaches each projection area PA1001 ~ PA1006 is called imaging beam EL2.

As shown in the right figure in FIG. 5, the pattern image in the first illumination area IR1001 is projected on the first In the projection area PA1001, the pattern image in the third illumination area IR1003 is projected on the third projection area PA1003, and the pattern image in the fifth illumination area IR1005 is projected on the fifth projection area PA1005. In the present embodiment, the first projection area PA1001, the third projection area PA1003, and the fifth projection area PA1005 are arranged in a line in the Y-axis direction.

In addition, the pattern image in the second illumination area IR1002 is projected on the second projection area PA1002. In the present embodiment, the second projection area PA1002 is arranged to be symmetrical with the first projection area PA1001 with respect to the center plane p1003 when viewed from the Y-axis direction. In addition, the pattern image in the fourth illumination area IR1004 is projected on the fourth projection area PA1004, and the pattern image in the sixth illumination area IR1006 is projected on the sixth projection area PA1006. In this embodiment, the second projection area PA1002, the fourth projection area PA1004, and the sixth projection area PA1006 are arranged in a line in the Y-axis direction.

Each of the first to sixth projection areas PA1001 to PA1006 is arranged such that the projection area adjacent to the direction parallel to the second central axis AX1002 overlaps the end portion (trapezoidal triangle portion) when viewed along the circumferential direction of the second surface p1002 . Therefore, for example, the third area A1005 on the substrate P passing through the first projection area PA1001 by the rotation of the second reel member 1022, and the substrate passing the second projection area PA1002 by the rotation of the second reel member 1022 Part of the fourth area A1006 on P repeats.

The shapes of the first projection area PA1001 and the second projection area PA1002 are set so that the exposure amount in the area where the third area A1005 and the fourth area A1006 overlap and the exposure amount in the non-overlap area are substantially the same.

In the present embodiment, as shown in the right diagram of FIG. 5, the area of the substrate P that is to be exposed (hereinafter referred to as exposure area A1007) moves in the direction Xs with the rotation of the second reel member 1022, and Y in the exposure area A1007 Each partial area in the axial direction passes through any one of the first to sixth projection areas PA1001 to PA1006. In other words, the first to sixth projection areas PA1001 to PA1006 are arranged to cover the entire width of the exposure area A1007 in the Y-axis direction.

In addition, relative to the irradiation direction of the illumination light beam EL1 of the first projection module PL1001, for example, It may be the traveling direction of the chief ray passing through any position in the first illumination area IR1001, or may be the traveling direction of the chief ray passing through the center of the first illumination area IR1001. The illumination directions of the illumination beam EL1 relative to the second to sixth projection modules PL1002 to PL1006 are also the same.

In addition, the first to sixth projection areas PA1001 to PA1006 may be arranged so that the areas on the substrate P passing through any one of them do not overlap with each other at the ends. For example, the third area A1005 passing through the first projection area PA1001 may not partially overlap with the fourth area A1006 passing through the second projection area PA1002. That is, even if it is a multi-lens method, it is not possible to perform continuous exposure of each projection module. In this case, the third area A1005 may also be an area where the pattern corresponding to the first element is projected, and the fourth area A1006 may also be an area where the pattern corresponding to the second element is projected. The above-mentioned second element may be the same kind of element as the first element, and the same pattern as the third area A1005 is projected on the fourth area A1006. The above-mentioned second element may also be an element of a different type from the first element, and a pattern different from the third area A1005 is projected on the fourth area A1006.

Next, the detailed configuration of the projection optical system PL of this embodiment will be described with reference to FIG. 6. In addition, in the present embodiment, each of the second to sixth projection modules PL1002 to PL1006 has the same configuration as the first projection module PL1001. Therefore, the configuration of the first projection module PL1001 will be described to represent the projection optical system PL.

The first projection module PL1001 shown in FIG. 6 includes a first optical system 1041 that forms a pattern image of the mask M disposed in the first illumination area IR1001 on the intermediate image plane p1007, and an intermediate image formed by the first optical system 1041 At least a part of it is re-imaged on the second optical system 1042 of the first projection area PA1001 of the substrate P, and the first field stop 1043 disposed on the intermediate image plane p1007 forming the intermediate image.

In addition, the first projection module PL1001 includes a focus correction optical member 1044 for finely adjusting the focus state of the pattern image (hereinafter referred to as a projected image) of the photomask formed on the substrate P, and used for minimizing the projected image in the image plane The traverse image shift correction optical member 1045, the magnification correction optical member 1047 for finely correcting the magnification of the projected image, and the rotation correction mechanism 1046 for slightly rotating the projected image in the image plane.

The focus correction optical member 1044 is arranged at a position where the imaging beam EL2 emitted from the first illumination region IR1001 enters, and the image movement correction optical member 1045 is arranged at a position where the imaging beam EL2 emitted from the focus correction optical member 1044 enters. The magnification correction optical member 1047 is arranged at a position where the imaging light beam EL2 emitted from the second optical system 1042 enters.

The imaging light beam EL2 of the pattern from the mask M is emitted from the first illumination region IR1001 in the normal direction, and enters the image movement correction optical member 1045 through the focus correction optical member 1044. The imaging light beam EL2 transmitted through the image shift correction optical member 1045 is reflected on the first reflection surface (plane mirror) p1004 of the first deflection member 1050, which is a requirement of the first optical system 1041, and is reflected on the first concave mirror 1052 through the first lens group 1051 Then, it is reflected by the first lens group 1051 again on the second reflection surface (planar mirror) p1005 of the first deflection member 1050, and enters the first field stop 1043.

The imaging light beam EL2 passing through the first field stop 1043 is reflected on the third reflection surface (plane mirror) p1008 of the second deflection member 1057, which is a requirement of the second optical system 1042, and is reflected on the second concave mirror 1059 through the second lens group 1058. After passing through the second lens group 1058 again, it is reflected on the fourth reflection surface (planar mirror) p1009 of the second deflection member 1057 and enters the optical member 1047 for magnification correction.

The imaging light beam EL2 emitted from the magnification correction optical member 1047 enters the first projection area PA1001 on the substrate P, and the pattern image appearing in the first illumination area IR1001 is projected on the first projection area PA1001 at an equal magnification (× 1) .

The first optical system 1041 and the second optical system 1042 are, for example, telecentric refraction optical systems in which the Dyson system is deformed. In this embodiment, the optical axis of the first optical system 1041 (hereinafter referred to as the first optical axis AX1003) is substantially orthogonal to the central plane p1003. The first optical system 1041 includes a first deflection member 1050, a first lens group 1051, and a first concave mirror 1052. The imaging light beam EL2 emitted from the image-shift correction optical member 1045 is reflected on the first reflection surface p1004 of the first deflection member 1050 and travels toward one side (-X side) of the first optical axis AX1003, and enters through the first lens group 1051 The first concave mirror 1052 disposed on the pupil plane. The imaging light beam EL2 reflected by the first concave mirror 1052 travels to the other side (+ X side) of the first optical axis AX1003, and then passes through the first lens group 1051, at the first deflection member The second reflecting surface p1005 of 1050 is reflected and enters the first field stop 1043.

The first deflection member 1050 is a triangular prism that extends in the Y-axis direction. In the present embodiment, each of the first reflective surface p1004 and the second reflective surface p1005 includes a mirror surface (surface of the reflective film) formed on the surface of the triangular prism. The chief ray EL3 of the imaging light beam EL2 passing through the center of the first illumination region IR1001 travels along the first radial direction D1001 inclined in the XZ plane with respect to the center plane p1003 and then enters the first projection module PL1001.

The first deflection member 1050 deflects the imaging light beam EL2 into the principal ray EL3 reaching the first reflection surface p1004 from the first illumination region IR1001 and the principal ray EL3 reaching the intermediate image plane p1007 from the second reflection surface p1005 (and the central plane p1003 (Parallel) becomes non-parallel in the XY plane.

In order to form the optical path as described above, in this embodiment, the ridge line where the first reflecting surface p1004 and the second reflecting surface p1005 of the first deflecting member 1050 intersect and the first optical axis AX1003 is defined as the plane parallel to the XY plane In p1006, the first reflecting surface p1004 and the second reflecting surface p1005 are arranged at an asymmetric angle with respect to this surface p1006.

When the angle of the first reflecting surface p1004 with respect to the surface p1006 is set to θ 1001 and the angle of the second reflecting surface p1005 with respect to the surface p1006 is set to θ 1002, in this embodiment, the angle (θ 1001 + θ 1002) is set It is less than 90 °, the angle θ 1001 is set to 45 °, and the angle θ 1002 is set to substantially 45 °.

The principal ray EL3 incident on the first lens group 1051 by being reflected on the first reflecting surface p1004 is set to be parallel to the optical axis AX1003, and the principal ray EL3 can pass through the center of the first concave mirror 1052, that is, the pupil plane and the light The intersection of the axis AX1003 can ensure the telecentric imaging state. Therefore, in FIG. 6, when the inclination angle of the chief ray EL3 (first radial direction D1001) reaching the first reflection surface p1004 from the first illumination region IR1001 with respect to the center plane p1003 is set to θd, the first reflection surface p1004 The angle θ 1001 may be set so as to satisfy the following formula (1).

θ 1001 = 45 °-(θ d / 2) ... (1)

In this embodiment, each of the plurality of lenses belonging to the first lens group 1051 surrounds the first light The axis AX1003 is an axisymmetric shape. The imaging light beam EL2 reflected on the first reflecting surface p1004 enters the first lens group 1051 from one side (+ Z side) of the opposing surface p1006. The first concave mirror 1052 is disposed at or near the pupil plane of the first optical system 1041.

The chief ray EL3 of the imaging light beam EL2 passing through the first lens group 1051 enters the intersection of the first optical axis AX1003 and the first concave mirror 1052. The imaging light beam EL2 reflected by the first concave mirror 1052 is compared with before entering the first concave mirror 1052, and travels in the first lens group 1051 along the symmetrical optical path of the opposing surface p1006. The imaging light beam EL2 reflected by the first concave mirror 1052 is emitted from the other side (-Z side) of the first lens group 1051, is reflected on the second reflection surface p1005 of the first deflection member 1050, and extends along the main surface parallel to the central surface p1003 Light EL3 travels.

The first field stop 1043 has an opening that defines the shape of the first projection area PA1001. That is, the opening shape of the first field stop 1043 defines the shape of the first projection area PA1001. Therefore, as shown in FIG. 6, when the first field of view diaphragm 1043 can be arranged on the intermediate image plane p1007, the opening shape of the first field of view diaphragm 1043 can be trapezoidal as shown in the right diagram of FIG. In this case, the respective shapes of the first to sixth illumination regions IR1006 may not be similar to the respective shapes (trapezoidal) of the first to sixth projection regions PA1001 to PA1006, and may include the openings of the respective projection regions (the first field stop 1043 ) Of the trapezoid shape is rectangular.

The second optical system 1042 has the same configuration as the first optical system 1041, and is provided symmetrically with the first optical system 1041 with respect to the intermediate image plane p1007 including the first field stop 1043. The optical axis of the second optical system 1042 (hereinafter referred to as the second optical axis AX1004) is substantially orthogonal to the central plane p1003. The second optical system 1042 includes a second deflection member 1057, a second lens group 1058, and a second concave mirror 1059. The imaging light beam EL2 emitted from the first optical system 1041 and passing through the first field stop 1043 is reflected on the third reflection surface p1008 of the second deflection member 1057, and enters the second concave mirror 1059 through the second lens group 1058. The imaging light beam EL2 reflected by the second concave mirror 1059 passes through the second lens group 1058 again, is reflected on the fourth reflection surface p1009 of the second deflection member 1057, and enters the magnification correction optical member 1047.

The second deflection member 1057, the second lens group 1058, and the second concave mirror 1059 of the second optical system 1042 are the same as the first deflection member 1050, the first lens group 1051, and the first concave mirror 1052 of the first optical system 1041, respectively. The angle θ 1003 formed by the third reflection surface p1008 of the second deflection member 1057 and the second optical axis AX1004 and the angle θ 1002 formed by the second reflection surface p1005 of the first deflection member 1050 and the first optical axis AX1003 are substantially the same. The angle θ 1004 formed by the fourth reflection surface p1009 of the second deflection member 1057 and the second optical axis AX1004 and the angle θ 1001 formed by the first reflection surface p1004 of the first deflection member 1050 and the first optical axis AX1003 Essentially the same. Each of the plurality of lenses belonging to the second lens group 1058 has an axis-symmetric shape around the second optical axis AX1004.

The second concave mirror 1059 is disposed at or near the pupil plane of the second optical system 1042.

The imaging light beam EL2 passing through the first field stop 1043 travels in the direction of the chief ray parallel to the center plane p1003 and then enters the third reflection surface (plane) p1008. The inclination angle θ 1003 of the third reflection surface p1008 with respect to the second optical axis AX1004 (or plane p1006 or intermediate image plane p1007) of the second optical system 1042 is 45 ° in the XZ plane, and the imaging beam EL2 reflected here It enters the field of view of the upper half of the second lens group 1058. The chief ray EL3 of the imaging beam EL2 incident on the second lens group 1058 becomes parallel to the second optical axis AX1004, and enters the intersection of the second optical axis AX1004 and the second concave mirror 1059.

The imaging light beam EL2 reflected by the second concave mirror 1059 travels symmetrically with respect to the second optical axis AX1004 as compared with before entering the second concave mirror 1059. The imaging light beam EL2 reflected by the second concave mirror 1059 again passes through the field of view of the lower half of the second lens group 1058, is reflected by the fourth reflection surface p1009 of the second deflection member 1057, and travels in a direction crossing the center plane p1003.

The traveling direction of the chief ray EL3 of the imaging beam EL2 emitted from the second optical system 1042 and directed to the first projection area PA1001 is set relative to the intermediate image plane p1007 including the first field stop 1043 and incident from the first illumination area IR1001 The traveling direction of the chief ray EL3 of the imaging light beam EL2 of the first optical system 1041 is symmetrical. That is, when viewed in the XZ plane, the second deflection member 1057 The angle θ 1004 of the fourth reflective surface p1009 with respect to the second optical axis AX1004 is set to satisfy the following formula (2) in the same manner as the previous formula (1).

θ 1004 = 45 °-(θ d / 2) ... (2)

By this, the chief ray EL3 of the imaging beam EL2 emitted from the second optical system 1042 is directed to the normal direction of the first projection area PA1001 (cylindrical surface) on the substrate P (toward the rotation center line AX1002 in FIG. 2) Direction).

In this embodiment, the focus correction optical member 1044, the image movement correction optical member 1045, the rotation correction mechanism 1046, and the magnification correction optical member 1047 constitute an imaging characteristic adjustment mechanism that adjusts the imaging characteristic of the first projection module PL1001. By controlling the imaging characteristic adjustment mechanism, the projection conditions of the projected image on the substrate P can be adjusted for each projection module. The projection conditions referred to herein include at least one of the parallel position or rotation position, magnification, and focus of the projection area on the substrate P. The projection conditions can be determined for each position of the projection area relative to the substrate P during synchronous scanning. By adjusting the projection conditions of the projected image, the skew of the projected image when compared with the pattern of the mask M can be corrected. In addition, the configuration of the imaging characteristic adjustment mechanism can be appropriately changed, and at least a part of it can be omitted.

The focus correction optical member 1044 is, for example, a stack of two wedge-shaped prisms in the reverse direction (the reverse direction in the X direction in FIG. 6) to form a transparent parallel flat plate as a whole. The thickness of the parallel flat plate can be changed by sliding the pair of prisms in the direction of the inclined plane without changing the interval between the surfaces facing each other. Thereby, the effective optical path length of the first optical system 1041 is finely adjusted, and the focus state of the pattern image formed on the intermediate image plane p1007 and the projection area PA1001 is finely adjusted.

The image-shift correction optical member 1045 is composed of a transparent parallel flat glass that can be tilted in the XZ plane in FIG. 6 and a transparent parallel flat glass that can be tilted in a direction orthogonal thereto. By adjusting the inclination of the two parallel flat glasses, the pattern image formed on the intermediate image plane p1007 and the projection area PA1001 can be slightly displaced in the X direction or the Y direction.

The optical member 1047 for magnification correction is constituted by, for example, a concave lens, a convex lens, a concave lens The three pieces are arranged coaxially at a predetermined interval, and the front and rear concave lenses are fixed, so that the convex lens between them moves in the direction of the optical axis (principal light). As a result, the pattern image formed in the projection area PA1001 can be enlarged or reduced by a minute amount while maintaining the telecentric imaging state. In addition, the optical axes of the three lens groups constituting the magnification correction optical member 1047 are inclined in the XZ plane so as to be parallel to the principal ray EL3 passing therethrough.

The rotation correction mechanism 1046 is, for example, an actuator (not shown) that slightly rotates the first deflection member 1050 about an axis parallel to the first optical axis AX1003. By rotating the correction mechanism 1046, the image formed on the intermediate image plane p1007 can be slightly rotated in the intermediate image plane p1007.

As described above, the imaging light beam EL2 emitted from the first projection module PL1001 forms an image of a pattern appearing in the first illumination area IR1001 in the first projection area PA1001 of the substrate P disposed on the outer peripheral surface of the second reel member 1022. In this embodiment, the chief ray EL3 passing through the imaging beam EL2 at the center of the first illumination area IR1001 is emitted from the first illumination area IR1001 in the normal direction, and enters the first projection area PA1001 from the normal direction. In this way, the image of the pattern of the mask M appearing in the cylindrical first illumination region IR1001 is projected on the first projection region PA1001 on the cylindrical substrate P. In addition, the images of the patterns appearing in the second to sixth illumination regions IR1002 to IR1006 are similarly projected on each of the second to sixth projection regions PA1002 to PA1006 on the cylindrical substrate P.

In this embodiment, as shown in FIGS. 2 and 5, the odd-numbered illumination areas IR1001, IR1003, IR1005 and the even-numbered illumination areas IR1002, IR1004, IR1006 are arranged at a symmetrical distance from the central plane p1003 and an odd-numbered projection area PA1001, PA1003, PA1005 and even-numbered projection areas PA1002, PA1004, PA1006 are also arranged at a symmetrical distance from the central plane p1003. Therefore, all of the six projection modules can be made to have the same structure, the parts of the projection optical system can be shared, the assembly steps and inspection steps can be simplified, and the imaging characteristics (aberrations, etc.) of the projection modules can be aggregated into the same . This point, especially in the case of continuous exposure between the projection areas of each projection module by the multi-lens method, the quality of the panel pattern formed on the substrate P (transfer faithfulness) It is advantageous to keep it constant regardless of the position or area within the panel.

In addition, in a general exposure device, if the projection area is curved into a cylindrical surface, for example, when an imaging light beam enters the projection area from a non-perpendicular direction, the defocus may increase depending on the position of the projection area. As a result, poor exposure may occur and defective elements may occur.

In this embodiment, the first deflecting member 1050 (first reflecting surface p1004) and the second deflecting member 1057 (fourth reflecting surface p1009) of the projection optical system PL (for example, the first projection module PL1001) connect the principal ray EL3 The deflection is such that the principal ray EL3 emitted from the first illumination area IR1001 in the normal direction is projected on the first projection area PA1001 from the normal direction. Therefore, the substrate processing apparatus 1011 can reduce the focus error of the projected image in the projection area PA1001, especially the optimal focus plane of the projected image in each of the projection areas PA1001 to PA1006 shown in FIG. 5 from each projection module The width of the depth of focus of PL1001 ~ PL1006 is greatly shifted to prevent the occurrence of poor exposure. As a result, the occurrence of defective components in the component manufacturing system 1001 can be suppressed.

In the present embodiment, since the projection optical system PL includes the first field stop 1043 disposed at the position where the intermediate image is formed, the shape and the like of the projected image can be managed with high accuracy. Therefore, the substrate processing apparatus 1011 can reduce the overlapping error of the first to sixth projection areas PA1001 to PA1006, for example, and suppress the occurrence of poor exposure. In addition, the second reflecting surface p1005 of the first deflection member 1050 deflects the chief ray EL3 from the first illumination region IR1001 to be orthogonal to the field stop 1043. Therefore, the substrate processing apparatus 1011 can manage the shape and the like of the projected image with higher accuracy.

Furthermore, in the present embodiment, each of the first to sixth projection modules PL1001 to PL1006 projects the image of the pattern of the photomask M as an upright image. Therefore, when the substrate processing apparatus 1011 divides the pattern of the photomask M into the first to sixth projection modules PL1001 to PL1006 for projection, the area where the image is projected can be performed (for example, the third area A1005 and the fourth area A1006 ) Partially overlapped continuous exposure, so the design of the mask M becomes easy.

In the present embodiment, the substrate processing apparatus 1011 uses the exposure apparatus EX to expose the substrate P while the substrate P is continuously conveyed at a constant speed along the second surface p1002 by the conveying apparatus 1009. Therefore, the productivity of the exposure process can be improved. As a result, the component manufacturing system 1001 can manufacture components with good efficiency.

In the present embodiment, although the first reflective surface p1004 and the second reflective surface p1005 are arranged on the surface of the same deflection member (first deflection member 1050), they may be arranged on the surface of different members. In addition, one or both of the first reflection surface p1004 and the second reflection surface p1005 may be disposed on the inner surface of the first deflection member 1050, and have the characteristic of reflecting light by total reflection conditions, for example.

Furthermore, as described above, the deformations related to the first reflecting surface p1004 and the second reflecting surface p1005 can also be applied to one or both of the third reflecting surface p1008 and the fourth reflecting surface p1009. For example, when the radius r1002 of the second surface p1002 is changed, the fourth reflection surface p1009 of the second deflection member 1057 sets the angle θ 1004 so that the imaging light beam EL2 enters the first projection area PA1001 from the normal direction, And set the configuration so that the arc-shaped perimeter between the center points of the first projection area PA1001 and the second projection area PA1002, and the corresponding center point and illumination area of the illumination area IR1001 on the reticle M (radius r1001) The arc-shaped circumferences between the center points of IR1002 are consistent.

[Second Embodiment]

Next, the second embodiment will be described. In this embodiment, the same constituent elements as those in the above-mentioned embodiment may be given the same symbols as in the above-mentioned embodiment, and the description thereof may be simplified or omitted.

FIG. 7 is a diagram showing the configuration of the substrate processing apparatus 1011 of this embodiment. The transport device 1009 of the present embodiment includes a first transport roller 1030, a first guide member (air rotating rod, etc.) 1031, a fourth transport roller 1071, a fifth transport roller 1072, a sixth transport roller 1073, and a second guide A member (air rotating rod, etc.) 1033 and a second conveying roller 1034.

The substrate P transferred from the upstream of the transfer path to the first transfer roller 1030 is transferred to the first guide member 1031 via the first transfer roller 1030. The substrate P via the first guide member 1031 is transported to the fifth transport roller 1072 via the fourth transport roller 1071. The center axis of the fifth transport roller 1072 is arranged on the center plane p1003. The substrate P passing through the fifth transfer roller 1072 is transferred to the second guide member 1033 via the sixth transfer roller 1073.

The sixth transport roller 1073 is arranged symmetrically to the fourth transport roller 1071 with respect to the center plane p1003. The substrate P passing through the second guide member 1033 is conveyed downstream of the conveying path via the second conveying roller 1034. The first guide member 1033 and the second guide member 1033 are similar to the first guide member 1031 and the second guide member 1033 shown in FIG. 2, and adjust the tension acting on the substrate P in the conveyance path.

The first projection area PA1001 in FIG. 7 is set on the substrate P that is linearly transported between the fourth transport roller 1071 and the fifth transport roller 1072. Between the fourth transfer roller 1071 and the fifth transfer roller 1072, the substrate P is supported so as to be given a predetermined tension in the transfer direction, and the substrate P is transferred along the planar second surface p1002.

The first projection area PA1001 (second surface p1002) is inclined so as not to be perpendicular to the center plane p1003. The normal direction of the first projection area PA1001 (hereinafter referred to as the first normal direction D1003) is arranged relative to the plane orthogonal to the central plane p1003, for example, the intermediate image plane p1007 shown in FIG. 6 and the first radial direction D1001 is symmetrical. The chief ray EL3 of the imaging beam EL2 emitted from the first projection module PL1001 enters the first projection area PA1001 from the first normal direction D1003. In other words, the fourth transport roller 1071 and the fifth transport roller 1072 are arranged so as to be laid across the first normal direction D1003 of the substrate P of the fourth transport roller 1071 and the fifth transport roller 1072, relative to the middle orthogonal to the center plane p1003 The image plane p1007 is symmetrical with the first radial direction D1001.

The second projection area PA1002 is set on the substrate P that is linearly transported between the fifth transport roller 1072 and the sixth transport roller 1073. The substrate P is supported between the fifth transfer roller 1072 and the sixth transfer roller 1073 to be given a certain tension, and the substrate P is transferred along the planar second surface p1002.

The second projection area PA1002 is inclined so as not to be perpendicular to the center plane p1003. The normal direction of the second projection area PA1002 (hereinafter referred to as the second normal direction D1004) is arranged symmetrically with the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the center plane p1003. The chief ray EL3 of the imaging beam EL2 emitted from the second projection module PL1002 enters the second projection area PA1002 from the second normal direction D1004. In other words, the fifth transport roller 1072 and the sixth transport roller 1073 is arranged so that the second normal direction D1004 of the substrate P erected on the fifth transfer roller 1072 and the sixth transfer roller 1073 is symmetrical with the second radial direction D1002 with respect to the intermediate image plane p1007 orthogonal to the center plane p1003. .

The substrate processing apparatus 1011 of this embodiment makes the second cylindrical surface p1002 shown in FIG. 2 close to an approximate plane by the fourth conveying roller 1071, the fifth conveying roller 1072, and the sixth conveying roller 1073. The transfer faithfulness of the pattern image projected on the substrate P in each of the projection areas PA1001 to PA1006 is further improved from the viewpoint of depth of focus (DOF). Moreover, as shown in FIG. 2 above, compared with the case where the second reel member 1022 of radius r1002 is used for supporting and transporting the substrate P, the Z-direction height of the entire transport device 1009 can be suppressed lower, enabling the device Overall small.

In the device configuration of FIG. 7, the fourth transfer roller 1071, the fifth transfer roller 1072, and the sixth transfer roller 1073 are part of the transfer device 1009, and also serve as a support member (exposure device EX) that supports the substrate P to be exposed Side substrate stage). In addition, between the fourth transfer roller 1071 and the fifth transfer roller 1072, and between the fifth transfer roller 1072 and the sixth transfer roller 1073, a back surface side of the non-contact flat support substrate P by a fluid bearing may be provided The pad of the Benui method improves the flatness of the local area of the substrate P where each projection area PA1001 ~ PA1006 is located.

Furthermore, at least one of the conveying rollers of the conveying device 1009 shown in FIG. 7 may be fixed to the projection optical system PL or may be movable. For example, the fifth transport roller 1072 may include three parallel directions including a parallel direction parallel to the X-axis direction, a parallel direction parallel to the Y-axis direction, and a parallel direction parallel to the Z-axis direction. The rotation direction of the axis, the rotation direction about the axis parallel to the Y axis direction, and the rotation direction about the axis parallel to the Z axis direction are at least one of the six rotation directions (six degrees of freedom) (one DOF) Move slightly. Alternatively, the first normal direction D1003 of the first projection area PA1001 can be finely adjusted by adjusting the relative position of one or both of the fourth transport roller 1071 and the sixth transport roller 1073 in the Z axis direction relative to the fifth transport roller 1072. Or the second normal direction D1004 of the second projection area PA1002 and the The angle formed by the surface of the substrate P supported by the planarization. In this way, by slightly moving the selected roller, the posture of the surface of the substrate P with respect to the pattern projection surface of the pattern in each projection area PA1001 to PA1006 can be accurately aligned.

[Third Embodiment]

Next, the third embodiment will be described. In this embodiment, the same constituent elements as those in the above-mentioned embodiments may be given the same symbols as in the above-mentioned embodiments, and the description thereof may be simplified or omitted.

FIG. 8 shows the configuration of the exposure apparatus EX as the substrate processing apparatus 1011 of this embodiment, and the basic configuration is the same as that of FIG. 7 previously. However, the difference from the structure of FIG. 7 is that the angle θ 1004 of the fourth reflective surface p1009 of the second deflection member 1057 provided in each projection module PL1001 to PL1006 of the projection optical system PL with respect to the optical axis AX1004 is set to At 45 °, the substrate P transferred by the transfer device 1009 is supported on a plane orthogonal to the center plane p1003 (parallel to the XY plane in FIG. 8) at the position of each projection area PA1001 to PA1006.

In the configuration of FIG. 8, the substrate P is transferred from the upstream of the transfer path to the eighth transfer roller 1076 via the first transfer roller 1030, the first guide member 1031 (air rotating rod, etc.), and the fourth transfer roller 1071. The substrate P passing through the eighth conveying roller 1076 is conveyed downstream of the conveying path via the second guide member 1033 (air rotating rod, etc.) and the second conveying roller 1034.

As shown in FIG. 8, between the fourth transport roller 1071 and the eighth transport roller 1076, the substrate P is supported and transported parallel to the XY plane with a predetermined tension. In this case, the second surface p1002 of the support substrate P is a flat surface, and each projection area PA1001 to PA1006 is arranged in the second surface p1002.

Moreover, in the second optical system 1042 constituting each projection module PL1001 to PL1006, the third reflection surface p1008 and the fourth reflection surface p1009 of the second deflection member 1057 are arranged to be emitted from the second optical system 1042 to the imaging of the substrate P The chief ray EL3 of the light beam EL2 is substantially parallel to the central plane p1003. That is, the first deflection member 1050 and the second deflection member 1057 of the projection optical system PL (projection modules PL1001 to PL1006) deflect the imaging optical path from the cylindrical surface-shaped illumination regions IR1001 to IR1006 in the normal direction Each principal ray EL3 is incident from the normal direction and is set to be common Each projection area PA1001 ~ PA1006 on the plane.

In this embodiment, in the XZ plane viewed from the direction parallel to the first central axis AX1001 of the mask M, the center point of the projection area PA1001 (and PA1003, PA1005) to the center of the projection area PA1002 (and PA1004, PA1006) The distance DFx of the point along the second surface p1002 (the surface of the substrate P) is set from the center point of the illumination area IR1001 (and IR1003, IR1005) to the center point of the illumination area IR1002 (and IR1004, IR1006) along the first surface The distance (chord length or perimeter) DMx of p1001 (the cylindrical surface of radius r1001) is substantially equal.

Here, the positional relationship between the illumination areas IR and the projection area PA will be described with reference to FIG. 9 schematically shown. In addition, in FIG. 9, the symbol α indicates the angle (aperture angle) [°] formed by the first radial direction D1001 and the second radial direction D1002, and the symbol r indicates the radius [mm] of the first surface p1001.

In FIG. 9, the perimeter DMx [mm] from the center point of the illumination area IR1001 to the center point of the illumination area IR1002 in the XZ plane is expressed by the following formula (3) using the angle α and the radius r.

DMx = π‧α‧r / 180 ... (3)

The linear distance Ds between the center point of the illumination area IR1001 and the center point of the illumination area IR1002 is expressed by the following formula (4).

Ds = 2‧r‧sin (π‧α / 360) ... (4)

For example, when the angle α is 30 ° and the radius r is 180 mm, the perimeter DMx is about 94.248 mm, and the distance Ds is about 93.175 mm. That is, if it is assumed that the X coordinate of the center point of the illumination area IR1001 coincides with the X coordinate of the center point of the projection area PA1001, and the X coordinate of the center point of the illumination area IR1002 coincides with the X coordinate of the center point of the projection area PA1002, then In the pattern of the reticle M, two points separated in the circumferential direction by the perimeter DMx are projected on the substrate P through the projection areas PA1001 and PA1002, and the two points will be separated by a distance Ds (Ds <DMx) in the X direction on the substrate P exposure. That is, according to the previous numerical example, it means that the pattern exposed on the substrate P through the odd-numbered projection areas PA1001, PA1003, PA1005 and the even-numbered projection areas PA1002, PA1004, The pattern of PA1006 exposed on the substrate P will deviate by a maximum of 1.073mm in the X direction.

Therefore, in this embodiment, the configuration conditions of the specific optical members in the projection optical system PL are changed from the conditions shown in FIG. 6 previously, so that the center point of the projection area PA1001 and the projection area PA1002 on the planarized substrate P The linear distance DFx between the center points and the perimeter DMx are substantially equal.

Specifically, the fourth reflecting surface p1009 of the second deflection member 1057 is slightly shifted from the position shown in FIG. 6 to the direction parallel to the optical axis AX1004 (X axis), and the result is set to a linear distance DFx and perimeter DMx is consistent. According to the numerical example given previously, the difference between the perimeter DMx and the distance Ds is 1.073 mm, and the fourth reflecting surface p1009 of the second deflection member 1057 included in each of the odd-numbered projection modules PL1001, PL1003, and PL1005 can be easily The position is arranged to move parallel to the second concave mirror 1059 side along the optical axis AX1004 by about 1 mm.

However, in such a configuration, the configuration of the second deflection member 1057 (arrangement of the fourth reflective surface p1009) may sometimes have parts different from the even-numbered projection modules PL1002, PL1004, and PL1006.

Therefore, as long as the position of the fourth reflecting surface p1009 of the second deflection member 1057 mounted on all the projection modules PL1001 to PL1006 is moved in parallel along the optical axis AX1004 toward the second concave mirror 1059 side by 0.5 mm, it is enough Seeking commonality of parts.

10 is a graph showing the correlation between the difference between the linear distance Ds between the circumference DMx of the pattern surface (first surface p1001) of the reticle M (the first surface p1001) and the odd-numbered and even-numbered illumination areas and the angle α illustrated in FIG. Represents the difference, and the horizontal axis represents the aperture angle α. Moreover, the complex curve in the graph of FIG. 10 shows the case where the radius r of the pattern surface (the first surface p1001 of the cylindrical surface) of the mask M is changed to 180 mm, 210 mm, 240 mm, and 300 mm. As explained in the previous numerical examples, when the angle α is 30 ° and the radius r is 180 mm, the perimeter DMx is about 94.248 mm, and the distance Ds is about 93.175 mm, so the difference shown on the vertical axis of the graph of FIG. 10 It is about 1.073mm.

As shown in FIG. 10, the difference between the linear distance Ds between the perimeter DMx on the pattern surface (first surface p1001) of the mask M and the center point of the illumination area IR1001 to the center point of the illumination area IR1002, Since it changes according to the radius r and angle α of the first surface p1001, it is sufficient to set the position of the fourth reflection surface p1009 of the second deflection member 1057 according to the relationship of the graph in FIG. 10.

In addition, in order to make the linear distance DMx on the substrate P substantially equal to the circumference DMx on the mask M, even if the X-direction position of the fourth reflecting surface p1009 of the second deflection member 1057 is optimally arranged, it is still difficult It is consistent at the ultra-micron level, so the residual difference of several μm to tens of μm or less can be used to slightly shift the projected image in the X direction by using the image shift correction optical member 1045 shown in FIG. 6 previously. Sufficient precision makes the straight-line distance DMx and perimeter DMx consistent.

As described above, the image shift correction optical member 1045 is used to slightly shift the projected image in the X direction, and each projection area PA1001 to PA1006 is adjusted to the distance (periphery) between the two object points in the scanning exposure direction within the mask pattern surface ) The method of equalizing the distance (perimeter) of the scanning exposure direction of each image point when the two object points are projected on the substrate P at the ultra-micron level can also be used in the previous devices of FIGS. 2 to 6 The configuration is applicable to the device configuration of FIG. 7.

[Fourth Embodiment]

Next, the fourth embodiment will be described. In FIG. 11, the same constituent elements as those in the above-mentioned embodiments may be given the same symbols as in the above-mentioned embodiments, and the description thereof may be simplified or omitted.

FIG. 11 is a diagram showing the configuration of the exposure apparatus EX as the substrate processing apparatus 1011 of this embodiment. In this embodiment, the configuration of the transport device 1009 of the substrate P is the same as the configuration of the transport device 1009 shown in FIG. 2 previously. The configuration of the substrate processing apparatus 1011 shown in FIG. 11 differs from the previous configurations of the apparatuses of FIGS. 2, 7, and 8 in that the mask M is not a rotating cylindrical mask, but a normal transmissive flat mask, The angle θ 1001 of the first reflective surface p1004 of the first deflection member 1050 provided in each projection module PL1001 to PL1006 of the projection optical system PL with respect to the optical axis AX1003 (plane p1006) is set to 45 ° or the like.

In FIG. 11, the mask holding device 1012 includes a mask stage 1078 that holds a planar mask M, and the mask stage 1078 is scanned and moved in the X direction in a plane orthogonal to the center plane p1003 Mobile device (not shown).

Since the pattern surface of the mask M in FIG. 11 is a plane substantially parallel to the XY plane, each principal ray EL3 on the mask M side of the projection modules PL1001 to PL1006 is perpendicular to the XY plane, illuminating each on the mask M The optical axes (primary rays) of the illumination modules IL1001 ~ IL1006 of the illumination areas IR1001 ~ IR1006 are also perpendicular to the XY plane.

In this embodiment, the first reflection surface p1004 and the second reflection surface p1005 of the first deflection member 1050 included in the first optical system 1041 of the projection modules PL1001 to PL1006 are arranged as the imaging light beam EL2 emitted from the first optical system 1041 The chief ray EL3 is substantially parallel to the central plane p1003. That is, the first deflection member 1050 and the second deflection member 1057 included in each of the projection modules PL1001 to PL1006 deflect the imaging light beam EL2 to travel from the illumination regions IR1001 to IR1006 on the reticle M to the normal direction The chief ray EL3 enters the projection areas PA1001 to PA1006 formed on the substrate P along the cylindrical surface from the normal direction.

For this reason, the first reflection surface p1004 and the second reflection surface p1005 of the first deflection member 1050 are arranged orthogonally, and both the first reflection surface p1004 and the second reflection surface p1005 are set substantially with respect to the first optical axis AX1003 (XY surface) Up to 45 °.

In addition, the third reflective surface p1008 of the second deflection member 1057 is arranged to be non-plane symmetric with respect to the fourth reflective surface p1009 with respect to the surface (parallel to the XY plane) that includes the second optical axis AX1004 and is orthogonal to the center plane p1003. Further, the angle θ 1003 formed by the third reflection surface p1008 and the second optical axis AX1004 is substantially 45 °, and the angle θ 1004 formed by the fourth reflection surface p1009 and the second optical axis AX1004 is substantially less than 45 °, The setting of the angle θ 1004 is as described above in FIG. 6.

Furthermore, in this embodiment, similar to the previous FIG. 9, when viewed in the XZ plane, the center point of the illumination area IR1001 (and IR1003, IR1005) on the mask M (first surface p1001) to the illumination area IR1002 (and IR1004, IR1006) The distance between the center point of the projection area PA1001 (and PA1003, PA1005) on the cylindrical substrate P to the center point of the second projection area PA1002 (and PA1004, PA1006) The second surface p1002 along the cylindrical surface along the second surface p1002 The length (perimeter) is substantially equal.

Similarly to the substrate processing apparatus 1011 shown in FIG. 11, the control device 1014 shown in FIG. 2 previously controls the moving device of the mask holding device 1012 (a linear motor for scanning exposure or an actuator for fine movement, etc.), and The rotation of the second reel member 1022 drives the mask stage 1078 in synchronization. The substrate processing apparatus 1011 shown in FIG. 11 must perform an operation (rewind) to return the mask M to the initial position in the -X direction after performing scanning exposure with the synchronous movement of the mask M in the + X direction. Therefore, when the second reel member 1022 is continuously rotated at a constant speed to continuously transfer the substrate P at a constant speed, during the rewinding operation of the mask M, the substrate P is not subjected to pattern exposure, but the substrate P The pattern for the panel is dispersed (separated) in the conveying direction. However, in practice, since the speed of the substrate P during scanning exposure (here, the peripheral speed) and the speed of the reticle M are assumed to be 50 to 100 mm / s, the reticle M only needs to be The stage 1078 is driven at a maximum speed of, for example, 500 mm / s, so that the gap in the substrate transport direction between the panel patterns formed on the substrate P can be reduced.

[Fifth Embodiment]

Next, the fifth embodiment will be described. In FIG. 12, the same constituent elements as those in the above-mentioned embodiments may be given the same symbols as in the above-mentioned embodiments, and the description thereof may be simplified or omitted.

Although the mask M in FIG. 12 uses the same cylindrical mask M as in the previous FIGS. 2, 7 and 8, it is constructed so as to have a high reflection portion and a low reflection (light absorption) portion for illumination light Reflective mask with pattern. Therefore, it is not possible to use the transmissive illumination device 1013 (illumination optics IL) as in the previous embodiments, and it is necessary to have the oblique illumination system that projects the illumination light from the projection modules PL1001 ~ PL1006 side to the reflective mask M Pose.

In FIG. 12, between the first reflection surface p1004 of the first deflection member 1050 constituting the first optical system 1041 and the reflective mask M, a polarizing beam splitter PBS and a quarter-wave plate PK are provided. In the configuration of each projection module shown in FIG. 6 above, although the focus correction optical member 1044 and the image movement correction optical member 1045 are provided at this position, in this embodiment, the focus correction optical member 1044 and the image movement correction The optical member 1045 is moved to the front of the intermediate image plane p1007 (field diaphragm 1043) or Space behind.

The wave surface dividing surface of the polarizing beam splitter PBS is arranged at an angle of inclination α / 1001 (<45 °) relative to the central surface p1003 according to the angle θ 1001 (<45 °) of the first reflecting surface p1004 of the first deflection member 1050 with respect to the optical axis AX1003 (surface p6) 2 (θ d) is about 45 ° relative to the principal ray EL3 traveling in the radial direction (normal direction) from the illumination area IR1001 on the reflective mask M.

The illumination light beam EL1 is emitted from, for example, a laser light source with excellent polarization characteristics, and is transmitted into a polarized beam splitter PBS as linearly polarized light (S-polarized light) through a beam shaping optical system or an illumination uniformity optical system (a compound eye lens or a rod-shaped element, etc.). Most of the illuminating light beam EL1 is reflected on the wavefront dividing surface of the polarizing beam splitter PBS, and the illuminating light beam EL1 is converted into circularly polarized light by the 1/4 wavelength plate PK, illuminating the illumination area IR1001 on the reflective mask M into a trapezoid or rectangle .

The light (imaging beam) reflected on the pattern surface (first surface p1001) of the reticle M is converted into linearly polarized light (P-polarized light) again through the 1/4 wavelength plate PK, and most of it is transmitted through the wave surface of the polarizing beam splitter PBS The dividing surface is directed toward the first reflecting surface p1004 of the first deflection member 1050. The optical path of the constituent or imaging beam (primary ray EL3) after the first reflecting surface p1004 is the same as that described above with reference to FIG. 6, and the pattern formed by the reflection portion appearing in the illumination area IR1001 on the reflective mask M The image is projected in the projection area PA1001.

As described above, in this embodiment, only the first optical system 1041 of the projection module PL1001 (and PL1002 ~ PL1006) is added with the polarization beam splitter PBS and the 1/4 wavelength plate PK, even if it is a reflective cylinder The shape of the light mask can also easily realize the oblique lighting system. In addition, the illumination light beam EL1 is configured to enter the polarizing beam splitter PBS from the direction crossing the principal light beam EL3 direction of the imaging light beam reflected on the reflective mask M and to the reflective mask M. Therefore, even if there is a small extinction ratio (separation characteristic) of P-polarized light and S-polarized light of the polarizing beam splitter PBS, it is possible to prevent stray light from causing a part of the illumination beam EL1 from the wavefront of the polarizing beam splitter PBS The dividing surface is directed at the first reflecting surface p1004 of the first deflection member 1050 and the projection area PA1001 of the substrate P, which can maintain the quality (contrast, etc.) of the image projected on the substrate P and project the mask pattern faithfully. Printed.

[Sixth Embodiment]

13 is a diagram showing the configuration of a projection optical system PL (first projection module PL1001) of the sixth embodiment. The first projection module PL1001 includes a third deflection member (plane mirror) 1120, a first lens group (equal-magnification projection) 1051, a first concave mirror 1052 disposed on the pupil plane, a fourth deflection member (plane mirror) 1121, and a fifth optical Department (enlarged projection system) 1122. The first surface p1001 where the illumination area IR (the first illumination area IR1001) is arranged is a cylindrical surface that is held by the pattern surface of the reticle M (transmission type or reflection type) of the cylindrical first roll member 1021 . In addition, the second surface p1002 on the substrate P where the projection area PA (first projection area PA1001) is arranged is a plane here.

In addition, the photomask M held by the first reel member 1021 (mask support member), as in the case of the reflective type shown in FIG. 12 previously, is provided with a polarizing component between the photomask M and the third deflection member 1120 Beamer and 1/4 wavelength plate.

In FIG. 13, the imaging light beam EL2 emitted from the first illumination region IR1001 is reflected on the fifth reflection surface p1017 of the third deflection member 1120, and enters the first lens group 1051. The imaging light beam EL2 incident on the first lens group 1051 is reflected by the first concave mirror 1052 and returned to be emitted from the first lens group 1051, and enters the sixth reflection surface p1018 of the fourth deflection member 1121. The first lens group 1051 and the first concave mirror 1052 form an intermediate image of the pattern of the mask M appearing in the first illumination region IR1001 at the same magnification as in the above-described embodiment.

The imaging light beam EL2 reflected on the sixth reflection surface p1018 enters the fifth optical system 1122 through the formation position of the intermediate image, and reaches the first projection area PA1001 through the fifth optical system 1122. The fifth optical system 1122 re-images the intermediate image formed by the first lens group 1051 and the first concave mirror 1052 in the first projection area PA1001 at a predetermined magnification (for example, 2 times or more).

In FIG. 13, the fifth reflecting surface p1017 of the third deflecting member 1120 corresponds to the first reflecting surface p1004 of the first deflecting member 1050 described in FIG. 6, and the sixth reflecting surface p1018 of the fourth deflecting member 1121 corresponds to 6 illustrates the second reflection surface p1005 of the first deflection member 1050.

In the projection optical system shown in FIG. 13, the third deflection member 1120 and the mask M (cylindrical surface The extension line of the principal ray EL3 between the first surface p1001) is set to pass through the rotation center line AX1001 of the reticle M, and has the fifth optical axis AX1008 perpendicular to the surface (second surface p1002) of the substrate P supported by the plane The chief ray EL3 of the imaging beam EL2 between the optical system 1122 and the projection area PA1001 on the substrate P is set to be perpendicular to the second surface p1002, that is, to satisfy telecentric imaging conditions. In order to maintain such a condition, the projection optical system of FIG. 13 includes an adjustment mechanism for slightly rotating the third deflection member 1120 or the fourth deflection member 1121 in the XZ plane in FIG. 13.

In addition, the third deflection member 1120 or the fourth deflection member 1121 can be configured to be slightly movable in the X-axis direction or the Z-axis direction and to be parallel to the Z-axis in addition to being slightly rotated in the YZ plane in FIG. 13. The axis rotates slightly. In this case, the image projected into the projection area PA1001 can be slightly displaced in the X direction or rotated slightly in the XY plane.

In addition, although the entire projection module PL1001 is an enlarged projection optical system, it may be an equal-magnification projection optical system as a whole, or a reduced projection optical system. In this case, since the first optical system composed of the first lens group 1051 and the first concave mirror 1052 is an equal-magnification system, it is only necessary to change the projection magnification of the fifth optical system 1122 in the subsequent stage to equal-magnification or reduction.

[Modification of Sixth Embodiment]

14 is a diagram showing a configuration of a modification of the projection optical system according to the sixth embodiment viewed from the Y-axis direction, and FIG. 15 is a diagram showing the configuration of FIG. 14 viewed from the X-axis direction. The projection optics shown in FIGS. 14 and 15 show that the enlarged projection optics of FIG. 13 are arranged in the Y-axis direction, that is, in the axial direction of the rotation center line AX1001 of the cylindrical mask M to form a plural number Variation of the situation.

As shown in FIG. 15, the projection optical system PL of this modification includes a first projection module PL1001 and a second projection module PL1002. The second projection module PL1002 has the same structure as the first projection module PL1001. As shown in FIG. 14, although it is arranged symmetrically with respect to the central plane p1003 and the first projection module PL1001, in the Y-axis direction in FIG. 14, As shown in Fig. 15, the systems are separated from each other.

The first projection module PL1001, as shown in FIG. 14, is equipped to receive illumination from the mask M The third deflection member 1120A, the first lens group 1051A, the first concave mirror 1052A, the fourth deflection member 1121A, and the fifth optical system (magnification imaging system) 1122A of the imaging beam of the region IR1001.

The projection module PL1001 shown in FIGS. 14 and 15 changes the tilt direction of the chief ray between the reticle M and the third deflection member 1120A compared with the previous projection optical systems (FIG. 6 or FIG. 13). That is, the reflection surface p1004 of the first deflection member 1050 of FIG. 6 or the reflection surface of the third deflection member 1120 of FIG. 13 deflects the chief ray EL3 of the illumination region IR1001 from the mask M at an obtuse angle (90 ° or more) The optical axis AX1003 of the first optical system composed of the first lens group 1051 (1051A) and the first concave mirror 1052 (1052A) is parallel. Compared to this, in the configuration of FIG. 14, the angle is obtuse (90 ° Full) is deflected so that the chief ray EL3 from the illumination area IR1001 is parallel to the optical axis of the first optical system.

As shown in FIG. 14, the second projection module PL1002 includes a third deflection member 1120B that receives the imaging beam from the illumination area IR1002 on the mask M, a first lens group 1051B, a first concave mirror 1052B, and a fourth deflection The member 1121B and the fifth optical system (magnification imaging system) 1122B.

The projection modules PL1001 and PL1002 shown in FIGS. 14 and 15 are enlarged projection optical systems as a whole. As shown in FIG. 15, the first mask region M1 (first reel member 1021) on the first illumination region IR1001 is arranged. The area A1001 and the second area A1002 on the mask M (first reel member 1021) on which the second illumination area IR1002 is arranged are separated from each other in the Y direction. However, by appropriately determining the magnification of the projection modules PL1001 and PL1002, the third area A1005 (image area) of the first area A1001 of the projection area PA1001 projected on the substrate P and the projection area of the substrate P The fourth area A1006 (image area) of the second area A1002 of the projection area PA1002 is set so as to partially overlap in the Y direction when viewed in the YZ plane. As a result, the first area A1001 and the second area A1002 on the reticle M (first reel member 1021) are formed by being connected to the Y direction on the substrate P, and the pattern for large exposure panels can be projected.

As described above, the substrate processing apparatus provided with the projection optical system PL shown in FIGS. 14 and 15 is arranged symmetrically with respect to the central plane p1003 with the projection optical system shown in FIG. 13 as opposed to Y Compared with the case where a plurality of axes are arranged in the axis direction, the overall width of the projection optical system in the X direction can be made smaller, and as a processing device, the size in the X direction can also be made smaller.

In addition, as previously described in FIG. 9, in FIG. 14 viewed in the XZ plane, the circumference between the center points of the illumination area IR1001 and the illumination area IR1002 defined on the reticle M (first reel member 1021) is defined. The distance DFx between the long DMx and the center points of the corresponding projection areas PA1001 and PA1002 on the substrate P is set to a relationship of DFx = Mp‧DMx when the magnification of the projection optical system is set to Mp.

[Seventh Embodiment]

16 is a diagram showing the configuration of a projection optical system according to a seventh embodiment. The imaging light beam EL2 from the first illumination region IR1001 formed on the cylindrical first surface p1001 (mask pattern surface) enters the sixth optical system 1131, and passes through the sixth optical system 1131 to the seventh deflection member (plane mirror) ) The imaging light beam EL2 reflected by the ninth reflection surface p1022 of 1132 reaches the intermediate image plane p1007 where the first field stop 1043 is arranged, and the pattern image of the mask M is formed on the intermediate image plane p1007.

The imaging light beam EL2 passing through the intermediate image plane p1007 is reflected on the tenth reflection surface p1023 of the eighth deflection member (planar mirror) 1133, passes through the seventh optical system 1134, and reaches the third substrate P supported on the cylindrical second surface p1002. 1 Projection area PA1001. The first projection module PL1001 in FIG. 16 projects the image of the pattern of the mask M in the first illumination area IR1001 as a standing image on the first projection area PA1001.

In FIG. 16, the sixth optical system 1131 is an equal-magnification imaging optical system, and its optical axis AX1010 is substantially coaxial with the chief ray of the imaging light beam EL2 passing through the center of the first illumination region IR1001. In other words, the optical axis AX1010 is substantially parallel to the first diameter direction D1001 shown in FIG. 4 or FIGS. 7-9.

The seventh optical system 1134 is an equal-magnification imaging optical system, and the intermediate image formed by the sixth optical system 1131 is re-imaged in the first projection area PA1001. The optical axis AX1011 of the seventh optical system 1134 is substantially parallel to the first normal direction (radial direction) D1003 of the cylindrical second surface p1002 passing through the center of the first projection area PA1001.

In this embodiment, the two deflection members 1132 and 1133 are arranged symmetrically on the XZ plane in FIG. 16 with the intermediate image plane p1007 in between. For the sake of simplicity, the intermediate image plane is formed at the position where the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 intersect. A plane mirror that bends the light path. However, when it can be processed by a plane mirror, in the XZ plane of FIG. 16, the angle formed by the optical axis AX1010 of the sixth optical system 1131 and the optical axis AX1011 of the seventh optical system 1134 is greater than 90 °. The angle formed by a plane mirror and each optical axis AX1010 and AX1011 becomes an acute angle of less than 45 °, and the imaging characteristics are not very good. For example, if the angle formed by the optical axes AX1010 and AX1011 becomes about 140 °, the angle formed by the reflection surface of a plane mirror and each optical axis AX1010 and AX1011 becomes 20 °. Therefore, if two deflection members (planar mirrors) 1132 and 1133 are used to bend the optical path as shown in FIG. 16, such a problem can be alleviated.

In addition, in the configuration of FIG. 16, the sixth optical system 1131 may be used as an imaging lens of magnification Mf, and the seventh optical system 1134 may be used as an imaging lens of reduction magnification 1 / Mf, and the whole is a projection system of equal magnification. Conversely, the sixth optical system 1131 may be used as an imaging lens with a reduction magnification of 1 / Mf, and the seventh optical system 1134 may be used as an imaging lens with a magnification Mf, and the whole is a projection system of equal magnification.

[Eighth Embodiment]

FIG. 17 is a diagram showing the configuration of the projection optical system PL (first projection module PL1001) of the eighth embodiment. Although the structure of the basic optical system is the same as that shown in FIG. 16, the difference is that two deflection members (planar mirrors) 1140 and 1143 are further added.

In FIG. 17, the eighth optical system 1135 corresponding to the imaging optical system 1131 in FIG. 16 is composed of the third lens 1139 and the fourth lens 1141, and its optical axis is set to be different from the first surface along the cylindrical surface. The chief ray of the imaging light beam EL2 emitted toward the normal direction from the center of the first illumination region IR1001 on the reticle M supported by p1001 is substantially parallel. The pupil plane of the eighth optical system 1135 is formed between the third lens 1139 and the fourth lens 1141, and an eleventh deflection member (planar mirror) 1140 is provided at this position.

The imaging light beam EL2 emitted from the first illumination area IR1001 and passing through the third lens 1139 is bent at an angle of 90 ° or closer to the 13th reflection surface p1026 of the 11th deflection member 1140, and enters the 4th lens 1141, at The eleventh reflection surface p1024 corresponding to the ninth deflection member (planar mirror) 1136 of the deflection member 1132 in FIG. 16 reflects and reaches the field diaphragm 1043 disposed on the intermediate image plane p1007. With this, the eighth optical system 1135 forms the image of the pattern of the mask M appearing in the first illumination region IR1001 at the position of the intermediate image plane p1007.

In addition, in the eighth optical system 1135-type imaging optical system of equal magnification, the intermediate image plane p1007 is configured to be orthogonal to the central plane p1003. In addition, the optical axis of the third lens 1139 is substantially coaxial or parallel to the principal ray of the imaging light beam EL2 emitted from the center of the first illumination region IR1001 in the normal direction (radial direction of the cylindrical first surface p1001).

The ninth optical system 1138 and the eighth optical system 1135 of FIG. 17 have the same structure, and are arranged so as to be symmetrical with the eighth optical system 1135 with respect to the intermediate image plane p1007 that includes the first field stop 1043 and is substantially orthogonal to the center plane p1003. . The optical axis of the eighth optical system 1135 (hereinafter referred to as the second optical axis AX1004) is substantially orthogonal to the central plane p1003. The imaging light beam EL2 passing through the field stop 1043 via the eighth optical system 1135 and the ninth deflection member 1136 is reflected on the twelfth reflection surface p1025 of the tenth deflection member (planar mirror) 1137, and passes through the The 5th lens 1142, the 12th deflection member 1143 disposed at the pupil position, and the 6th lens 1144 reach the first projection area PA1001 on the substrate P supported along the cylindrical second surface p1002. In the configuration of FIG. 17, the optical axis of the sixth lens 1144 is set to be substantially coaxial with the principal ray of the imaging light beam EL2 traveling in the normal direction (radial direction of the cylindrical second surface p1002) relative to the first projection area PA1001. Or parallel.

[Ninth Embodiment]

FIG. 18 is a diagram showing the configuration of the projection optical system PL (first projection module PL1001) of the ninth embodiment. The first projection module PL1001 in FIG. 18 is a so-called on-line type refraction type projection optical system. The first projection module PL1001 includes a tenth optical system 1145 of equal magnification composed of two pieces of a fourth concave mirror 1146 and a fifth concave mirror 1147, a first field stop 1043 (intermediate image plane p1007), and And the fifth optical system 1122 shown in FIGS. 13 and 14.

The tenth optical system 1145 forms an intermediate image of the pattern appearing in the first illumination region IR1001 on the mask M supported along the cylindrical first surface p1001 at the position of the field stop 1043. In the present embodiment, the tenth optical system is the 1145-series optical system of equal magnification. Each of the fourth concave mirror 1146 and the fifth concave mirror 1147 is configured as a part of a rotational ellipse, for example. This rotating ellipse surface is a surface formed by rotating the ellipse around the long axis (X-axis direction) or the short axis (Z-axis direction) of the ellipse.

In the configuration of FIG. 18, the chief ray of the imaging light beam EL2 emitted from the center of the first illumination region IR1001 toward the normal direction (radial direction) of the cylindrical first surface p1001 is set to be directed when viewed in the XZ plane The rotation center axis AX1001 of the first surface p1001 (first reel member 1021). That is, the chief ray of the imaging light beam EL2 incident on the fourth concave mirror 1146 of the projection module PL1001 from the reticle M (first surface p1001) is inclined in the XZ plane relative to the central plane p1003.

The fifth optical system 1122 is, for example, the refractive-magnification projection optical system described in FIG. 13, and the intermediate image formed at the position of the field stop 1043 by the tenth optical system 1145 is projected on the second surface along the plane p1002 The first projection area PA1001 on the substrate P supported.

The fourth concave mirror 1146 and the fifth concave mirror 1147 of the tenth optical system 1145 deflect the imaging light beam EL2 into the normal direction from the first illumination region IR1001 and enter the normal direction through the fifth optical system 1122 The first projection area PA1001. A substrate processing apparatus equipped with such a projection optical system PL can, like the substrate processing apparatus 1011 described in the above embodiment, suppress the occurrence of poor exposure and perform faithful projection exposure. In addition, the fifth optical system 1122 may be a projection optical system of equal magnification, or an optical system of a reduction system.

[Tenth Embodiment]

FIG. 19 is a diagram showing the configuration of the projection optical system PL (first projection module PL1001) of the tenth embodiment. The first projection module PL1001 of FIG. 19 is a refractive optical system that does not include a reflective member with power. The first projection module PL1001 includes an eleventh optical system 1150, a thirteenth deflection member 1151, a first field stop 1043, a fourteenth deflection member 1152, and a twelfth optical system 1153.

In the present embodiment, the imaging light beam EL2 emitted from the first illumination region IR1001 on the mask M held along the cylindrical first surface p1001 is formed by the wedge-shaped prism through the eleventh optical system 1150. The deflection member 1151 deflects in the XZ plane and reaches the first field stop 1043 disposed on the intermediate image plane p1007, where the intermediate image of the mask pattern is formed. Furthermore, the imaging light beam EL2 passing through the first field stop 1043 is deflected in the XZ plane by the 14th deflection member 1152 composed of wedge-shaped prisms, and enters the 12th optical system 1153, passes through the 12th optical system 1153, and reaches the circle The first projection area PA1001 on the substrate P on which the cylindrical second surface p1002 is supported.

The optical axis of the eleventh optical system 1150 is, for example, substantially coaxial or parallel to the chief ray of the imaging light beam EL2 emitted from the center of the first illumination region IR1001 in the normal direction (radial direction of the cylindrical first surface p1001). The twelfth optical system 1153 and the eleventh optical system 1150 have the same structure, and are arranged so as to be symmetrical to the eleventh optical system 1150 with respect to the intermediate image plane p1007 (orthogonal to the central plane p1003) where the first field stop 1043 is arranged. The optical axis of the 12th optical system 1153 is set to be substantially parallel to the chief ray of the imaging beam EL2 incident on the first projection area PA1001 along the normal line of the planar second surface p1002.

The thirteenth deflection member 1151 has a ninth surface p1028 that enters the imaging light beam EL2 of the eleventh optical system 1150 and a tenth surface p1029 that emits the imaging light beam that enters from the ninth surface p1028, and is disposed on the first field stop 1043 (Middle image plane p1007) in front of or immediately before. In the present embodiment, each of the ninth surface p1028 and the tenth surface p1029 constituting a predetermined vertex angle is configured by a plane inclined relative to the surface (XY plane) orthogonal to the center plane p1003 and extending in the Y-axis direction.

The 14th deflection member 1152 is the same as the 13th deflection member 1151, and is symmetrically arranged with the 13th deflection member 1151 with respect to the intermediate image plane p1007 where the first field stop 1043 is located. The 14th deflecting member 1152 has an eleventh surface p1030 that enters the imaging light beam EL2 through the first field stop 1043 and a twelfth surface p1031 that emits the imaging light beam EL2 that enters from the eleventh plane p1030, and is disposed on the first field of view light The stop 1043 (intermediate image plane p1007) is behind or immediately behind.

In this embodiment, the 13th deflection member 1151 and the 14th deflection member 1152 1 The imaging beam EL2 emitted from the illumination area IR1001 in the normal direction is deflected to enter the first projection area PA1001 from the normal direction. A substrate processing apparatus equipped with such a projection optical system PL can, like the substrate processing apparatus 1011 described in the above embodiment, suppress the occurrence of poor exposure and perform faithful projection exposure.

In addition, although the eleventh optical system 1150 or the twelfth optical system 1153 may also be a projection optical system of equal magnification, or may be an optical system of a reduction system, when either one of the mask M or the substrate P is along the cylindrical surface ( Or circular arc surface) when projecting exposure with support, between the two projection modules separated in the circumferential direction of the cylindrical surface, the field of view distance (peripheral distance) on the object side and the final image plane side The ratio of the projection field of view (peripheral distance) can also be set to coincide with the projection magnification.

[Eleventh Embodiment]

FIG. 20 is a diagram showing a part of the configuration of the component manufacturing system (flexible display manufacturing line) of the eleventh embodiment. Here, it is shown that the flexible substrate P (sheet, film, etc.) pulled out from the supply roller FR1 passes through n processing devices U1, U2, U3, U4, U5, ... Un in sequence, and is wound up for recycling Example of roller FR2. The higher-level control device 2005 controls the processing devices U1 ~ Un that make up the manufacturing line as a whole.

In FIG. 20, the orthogonal coordinate system is XYZ, and the surface (or back surface) of the substrate P is set perpendicular to the XZ plane, and the width direction orthogonal to the transport direction (length direction) of the substrate P is set as the Y direction. In addition, the substrate P may be modified and activated by a predetermined pre-treatment in advance, or a fine partition wall structure (concavo-convex structure) for precise patterning may be formed on the surface.

The substrate P wound on the supply roller FR1 is pulled out by the driven driving roller DR1 and transferred to the processing device U1, and the center of the substrate P in the Y direction (width direction) is controlled by the edge position controller EPC1 servo The relative target position is in the range of ± tens of μm to tens of μm.

The processing device U1 is a printing method in which the photosensitive functional liquid (photoresist, photosensitive silane coupling material, UV curing resin liquid, etc.) is continuously or selectively applied to the surface of the substrate P in the transport direction (longitudinal direction) of the substrate P Of the coating device. In the processing device U1, a pressurized drum DR2 wound with a substrate P is provided, and the photosensitive functional liquid is uniformly applied to the substrate P on the pressurized drum DR2 A coating mechanism Gp1 such as a coating roller on the surface, a drying mechanism Gp2 for rapidly removing the solvent or moisture contained in the photosensitive functional liquid applied to the substrate P, etc.

The processing device U2 is a heating device for heating the substrate P transferred from the processing device U1 to a predetermined temperature (for example, about 10 to 120 ° C.) to stabilize the photosensitive functional layer coated on the surface. In the processing device U2, a plurality of rollers and air rotating rods for folding and transporting the substrate P, a heating chamber portion HA1 for heating the transferred substrate P, and a temperature for reducing the temperature of the heated substrate P to and after The cooling chamber part HA2 with the same ambient temperature in the step (processing device U3), the driven roller DR3 being held, etc.

The processing device U3 as a substrate processing device is an exposure device that irradiates ultraviolet light patterned light corresponding to a circuit pattern or a wiring pattern for a display on the photosensitive functional layer of the substrate P transferred from the processing device U2. In the processing device U3, there is an edge position controller EPC that controls the center of the substrate P in the Y direction (width direction) to a certain position, the driven roller DR4 is held, the substrate P is partially wound with a predetermined tension and the substrate The pattern exposure portion on P supports a rotating drum DR5 having a uniform cylindrical surface, and two sets of drive rollers DR6, DR7, etc. for imparting a predetermined slack (gap) DL to the substrate P.

Furthermore, a cylindrical mask M is provided in the processing device U3, and a portion of the mask pattern of the cylindrical mask M is projected on a portion of the substrate P supported by the rotating drum DR5 in a cylindrical shape. The image projection optical system PL, the alignment microscopes AM1 and AM2 that detect alignment marks and the like formed on the substrate P in advance to align (align) a part of the projected mask pattern with the substrate P (alignment).

In this embodiment, since the cylindrical mask M is of a reflective type (the pattern on the outer peripheral surface is composed of a highly reflective portion and a non-reflective portion), a part of the optical element that transmits the projection optical system PL is also provided The oblique illumination optical system of the cylindrical mask M is irradiated with illumination light for exposure. The structure of this oblique illumination optical system will be described in detail later.

The processing device U4 performs the photosensitive functional layer of the substrate P transferred from the processing device U3 Dry processing equipment such as wet development processing, electroless plating processing, etc. The processing apparatus U4 is provided with three processing tanks BT1, BT2, BT3 hierarchized in the Z direction, a plurality of rollers for bending and conveying the substrate P, and a driving roller DR8 sandwiched therebetween.

Although the processing device U5 is a heating and drying device that warms the substrate P transferred from the processing device U3 and adjusts the moisture content of the substrate P wetted in the wet process to a predetermined value, its detailed structure is omitted. Thereafter, after passing through several processing devices, the substrate P after passing through the last processing device Un in a series of processes is wound up to the recovery roller FR2 through the clamped driving roller DR1. During this winding, the relative position in the Y direction of the driving roller DR1 and the recovery roller FR2 is also corrected by the edge position controller EPC2 to make the center of the substrate P in the Y direction (width direction) or the substrate end in the Y direction in the Y direction. Not uneven.

The substrate P used in this embodiment can be the same as the one exemplified in the first embodiment, and the description is omitted here.

The component manufacturing system 2001 of this embodiment repeatedly executes various processes for manufacturing a component on the substrate P. The substrate P subjected to various processes is divided (cut) according to each element, and becomes a plurality of elements. The size of the substrate P, for example, the width direction (the Y direction of the short side) is about 10 cm to 2 m, and the length direction (the X direction of the long side) is 10 m or more.

Next, although the configuration of the processing device U3 (exposure device) of this embodiment will be described, before that, the basic configuration of the exposure device of this embodiment will be described with reference to FIGS. 21 to 23.

The exposure apparatus U3 shown in FIG. 21 is a so-called scanning exposure apparatus, and includes a reflective cylindrical mask M having a circumferential surface with a radius r2001 from the rotation center axis AX2001 and a circumferential surface with a radius r2002 from the rotation center axis AX2002 The rotating reel 2030 (DR5 in Figure 1). Then, by rotating the cylindrical mask M and the rotating reel 2030 at a predetermined rotation speed ratio, the image of the pattern formed on the outer periphery of the cylindrical mask M is continuously exposed to the roll by repeated projection exposure The surface of the substrate P (a surface curved along the cylindrical surface) around a part of the outer peripheral surface of the rotating reel 2030.

The exposure device U3 is provided with a transport mechanism 2009, a mask holding device 2012, and illumination optics The system IL, the projection optics PL, and the control device 2013, the control device 2013 controls the rotation drive of the cylindrical mask M held in the mask holding device 2012 or the micro movement in the direction of the rotation center axis AX2001, or constitutes the substrate P is conveyed in the longitudinal direction of a part of the conveying mechanism 2009, the rotation of the rotating drum 2030, or the rotation of the central axis of rotation AX2002 direction.

The reticle holding device 2012 includes driving transmission mechanisms 2021, 2022 such as rollers, gears, belts, etc., and imparts rotation about the rotation center axis AX2001 to the rotating reel 2020 having a reflective reticle M (reticle pattern) formed on the outer peripheral surface The driving force may cause the rotating reel 2020 to jog in the direction of the rotation center axis AX2001 parallel to the Y axis; Used linear motors or piezoelectric elements. In addition, the rotation angle position of the rotating reel 2020 (mask M) or the position of the rotation center axis AX2001 direction is measured by the first detector 2023 including a rotary encoder, a laser interferometer, a gap sensor, etc. The measurement information is sent to the control device 2013 in real time for use in the control of the first drive unit 2024.

Similarly, the rotating reel 2030 is given a rotation driving force or rotation about a rotation central axis AX2002 parallel to the Y axis by the second driving unit 2032 including a rotation motor, a linear motor for inching, a piezoelectric element, etc. Micro power in the direction of the central axis AX2002. The rotation angle position of the rotating drum 2030 or the position of the rotation center axis AX2002 direction is measured by the second detector 2031 including a rotary encoder, a laser interferometer, a gap sensor, etc., and the measurement information is sent in real time The control device 2013 is used for the control of the second driving unit 2032.

Here, in this embodiment, the central axis of rotation AX2001 of the cylindrical mask M and the central axis of rotation AX2002 of the rotating reel 2030 are parallel to each other, and are located in the central plane pc parallel to the YZ plane.

Next, on the cylindrical pattern surface p2001 on which the cylindrical mask M is formed, the illumination area IR of the exposure illumination light is set on the portion that intersects the central plane pc, and is rolled around the outer peripheral surface p2002 along the rotating reel 2030 The portion of the substrate P wound into a cylindrical shape that intersects the central plane pc is set to A projection area PA which projects an image of a part of the mask pattern appearing in the illumination area IR.

In this embodiment, the projection optics PL emits the illumination beam EL1 to the illumination area IR on the cylindrical mask M, and the diffracted beam (imaging beam) is reflected by the mask pattern entering the illumination area IR EL2. In the projection area PA on the substrate P, a pattern image is formed, and the illumination optical system IL is formed by a slanting method of sharing a part of the optical path of the projection optical system PL.

As shown in FIG. 21, the projection optical system PL includes: a prism reflector 2041 inclined at 45 ° in the XZ plane with respect to the center plane pc and having reflection planes 2041a and 2041b orthogonal to each other, and having a plane orthogonal to the center plane pc The optical axis 2015a is a second optical system 2015 composed of a concave mirror 2040 and a plurality of lenses arranged on the pupil plane pd.

Here, if the plane including the optical axis 2015a and parallel to the XY plane is set to p2005, the angle θ 2001 of the reflection plane 2041a based on the plane p2005 is + 45 °, and the reflection plane 2041b based on the plane p2005 The angle θ 2002 is -45 °.

The projection optical system PL is, for example, a semi-image field of view type refraction type projection optical system (a deformation type of Dyson optical system) which is a half-image field divided by a circular image field divided by reflection planes 2041a, 2041b above and below the prism mirror 2041 Telecentric. Therefore, the imaging beam EL2 reflected and refracted by the pattern in the illumination area IR is reflected by the reflection plane 2041a on the upper side of the prism mirror 2041, and reaches the concave mirror 2040 disposed on the pupil plane pd through a plurality of lenses (it can also be a plane mirror) . Next, the imaging light beam EL2 reflected by the concave mirror 2040 reaches the reflection plane 2041b of the prism mirror 2041 through the optical path symmetrical with respect to the plane p2005, where it is reflected and reaches the projection area PA on the substrate P, the image of the mask pattern It is imaged on the substrate P at an equal magnification (× 1).

In order to apply the oblique illumination method to this projection optical system PL, in this embodiment, a part of the reflection surface p2004 of the concave mirror 2040 disposed on the pupil plane pd is formed with a passing portion (window), and the passing portion is transmitted from the surface p2003 (Glass surface) The illumination light beam EL1 enters.

In FIG. 21, only a part of the first optical system 2014 disposed behind the concave mirror 2040 in the illumination optical system IL of this embodiment is shown, and only the light source, the fly-eye lens, and the illumination from the after-mentioned are shown. The illumination light beam EL1 of one of the plurality of point light source images generated on the pupil plane pd among the illumination lights such as the field diaphragm and the like is generated.

The point light source image Sf is, for example, set to be optically conjugate to the point light source image (the light emitting point of the light source) formed on each exit side of the plurality of lens elements constituting the fly-eye lens, so the cylindrical mask M The illumination area IR is illuminated with a uniform illuminance distribution by the illumination beam EL1 passing through the second optical system 2015 of the projection optical system PL and the reflection plane 2041a on the upper side of the prism reflector 2041 using the Keira illumination method.

In addition, in FIG. 21, the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is arranged coaxially with the optical axis 2015a of the projection optical system PL, and the illumination area IR on the cylindrical mask M is set to a circle The cylindrical pattern surface p2001 has a narrow width in the circumferential direction and a long slit shape in the direction of the rotation center axis AX2001.

For example, when the radius r2001 of the pattern surface p2001 of the cylindrical mask M is set to 200 mm, and the thickness tf of the substrate P is set to 0.2 mm, the conditions for projection exposure can be set to the outer peripheral surface of the rotating reel 2030 The radius r2002 is r2002 = r2001-tf (199.8mm).

In addition, although the narrower the width of the illumination area IR (or the projection area PA) in the circumferential direction (the width of the scanning exposure direction), the more accurately a fine pattern can be projected and exposed, but it is inversely proportional to the need to increase the illumination area IR Illumination per unit area. To set the width of the illumination area IR (or projection area PA), the radius r2001, r2002 of the cylindrical mask M or the rotating reel 2030, the fineness of the pattern to be transferred (line width) can be considered Etc.), the depth of focus of the projection optics PL, etc., is determined.

Next, in FIG. 21, when the position on the reflective surface p2004 of the concave mirror 2040 through which the optical axis 2015a passes is taken as the center point 2044, the point light source image Sf is formed from the center point 2044 in the paper surface (XZ plane) toward- The position shifted in the Z direction, so the normal reflected light (0th-order diffracted light) in the imaging beam EL2 (including diffracted light) reflected by the illumination area IR on the cylindrical mask M is converged on the relative reflection surface The center point 2044 on p2004 is a point symmetrical position to form a point light source image Sf ’. Therefore, as long as the area including the portion where the point light source image Sf 'on the reflection surface p2004 is located and the portion where the ± 1st-order diffracted light is distributed is set as the reflection portion, the imaging beam EL2 from the illumination area IR is roughly It passes through the plurality of lenses of the second optical system 2015 and the reflection plane 2041b of the prism mirror 2041 without loss and reaches the projection area PA.

The concave mirror 2040 is formed on a concave surface of a concave lens made of a transmissive optical glass material (such as quartz) by vapor-depositing a metal reflective film such as aluminum to form a reflective surface p2004. Generally, the light transmittance of the reflective film is extremely small. Therefore, in this embodiment, in order to enter the illumination light beam EL1 from the surface p2003 on the back side of the reflection surface p2004, a part of the reflection film constituting the reflection surface p2004 is removed by etching or the like to form the converged illumination light beam EL1 to pass (transmit Through) the window.

FIG. 22 is a view of the reflection surface p2004 of such a concave mirror 2040 viewed from the X direction. In FIG. 22, in order to simplify the explanation, the reflection surface p2004 is offset from the plane p2005 (parallel to the XY plane) containing the optical axis 2015a by a certain amount in the -Z direction, and three window portions 2042a are provided separately in the Y direction , 2042b, 2042c. The windows 2042a, 2042b, and 2042c are created by selective etching to remove the reflective film that constitutes the reflective surface p2004. Here, although the point light sources such as Sfa, Sfb, and Sfc (illumination beams EL1a, EL1b are not blocked) , EL1c) a small rectangular shape, but can also be other shapes (circle, ellipse, polygon, etc.). The three point light sources like Sfa, Sfb, and Sfc are created by, for example, three lens elements arranged in the Y direction among the plural lens elements of the compound eye lens provided in the illumination optical system IL.

When viewed in the reflective surface p2004, the positional relationship between the windows 2042a, 2042b, and 2042c is set to be not point-symmetrical, that is, not point-symmetrical, with respect to the central point 2044 (optical axis 2015a). Although only three window parts are shown here, in the case of making more window parts, the window parts are also set in a non-point symmetrical positional relationship with respect to the central point 2044.

Furthermore, after the illumination light beam EL1a generated from the point light source image Sfa generated in the window portion 2042a becomes a substantially parallel light beam and is irradiated to the illumination area IR of the cylindrical mask M, the imaging light beam EL2a which reflects the diffracted light is reflected in the concave mirror 2040 The reflection surface p2004 on the relative center point 2044 and the window 2042a is a point-symmetrical position converging into a point light source image Sfa '.

Similarly, although the illumination beams EL1b and EL1c from the point light source images Sfb and Sfc generated in the windows 2042b and 2042c also become substantially parallel beams and illuminate the illumination area IR of the cylindrical mask M, their reflection The imaging beams of light EL2b, EL2c converge into point light source images Sfb ', Sfc' on the reflection surface p2004 of the concave mirror 2040 at point-symmetrical positions with respect to the center point 2044 and each of the windows 2042b, 2042c.

Also, as shown in FIG. 22, the imaging light beams EL2a, EL2b, and EL2c as point light source images Sfa ', Sfb', and Sfc 'include 0th order diffracted light (normally reflected light) and ± 1st order diffracted light, but each ± 1st-order diffracted light DLa, DLb, DLc is spread and distributed in the Z-axis direction and X-axis direction through 0th-order diffracted light.

Furthermore, the point light sources formed on the reflective surface p2004 are like Sfa ', Sfb', and Sfc '(especially 0-order diffracted light). Since the illumination area IR of the cylindrical mask M is a cylindrical surface, it is shown in Fig. 22 In the paper surface (YZ surface), the shape of the point light source images Sfa, Sfb, Sfc is distributed to be stretched in the Z direction (the circumferential direction of the cylindrical mask).

As shown in FIG. 22, when each point light source image Sfa, Sfb, Sfc is located on the lower side (-Z direction) than the plane p2005 including the center point 2044 (optical axis 2015a), it is within the paper surface shown in FIG. 21 (XZ In-plane), the illumination light beam EL1 (EL1a, EL1b, EL1c) passes through the second optical system 2015 and the reflection plane 2041a on the upper side of the prism mirror 2041 and reaches the cylindrical mask M. The illumination beams EL1 (EL1a, EL1b, EL1c) are parallel beams in front of the cylindrical mask M, but are slightly inclined relative to the central plane pc. The amount of tilt corresponds to the amount of Z-direction displacement of the point light source image Sf (Sfa, Sfb, Sfc) in the reflection surface p2004 (pupil plane pd) from the center point 2044 (optical axis 2015a).

The imaging beam EL2 (EL2a, EL2b, EL2c) reflected and refracted in the illumination area IR reaches the upper side of the mirror 2041 in the XZ plane with respect to the central plane pc at an angle symmetric to the illumination beam EL1 (EL1a, EL1b, EL1c) The reflection plane 2041a is reflected here and enters the second optical system 2015, and reaches a portion of the reflection surface p2004 of the concave mirror 2040 above the plane p2005 (center point 2044).

In the example shown in FIGS. 21 and 22 above, although it is on the reflecting surface p2004 of the concave mirror 2040 Inside, the point light source image (collecting point) Sf of the illumination light beam EL1 is distributed on the lower side of the plane p2005 (-Z direction) parallel to the XY plane of the optical axis 2015a containing the projection optical system PL, as long as it is set as described previously The condition, that is, the positional relationship of the windows 2042 in the reflection surface p2004 of the point light source image passing through the illumination beam is not a point-symmetric relationship (non-point-symmetric relationship) relative to the center point 2044, then the point on the reflection surface p2004 The position of the light source image Sf (window portion 2042) can be freely set.

If at least under such conditions, the window portion 2042 through which the plurality of point light source images Sf as the source of the illumination light beam EL1 pass is formed on the reflection surface p2004 of the concave mirror 2040, then the reflection surface p2004 (pupil surface pd) can be made The illumination beam and the imaging beam are efficiently separated in space.

In order to uniformly distribute a large number of windows 2042 (point light sources of the illumination beam like Sfa, Sfb, Sfc ...) in the reflective surface p2004, while maintaining a good spatial separation of the illumination beam and the imaging beam, the The size of each point light source image Sfa ', Sfb', Sfc '... formed by the convergence of the imaging beam EL2 on the reflective surface p2004 (also including the size of ± 1 order diffracted light DLa, DLb, DLc) is set to The distance between the Y direction and the Z direction of the adjacent window portion 2042 may be smaller. In other words, the size of each point light source image Sfa, Sfb, Sfc ... of the illumination beam EL1 in the pupil plane pd (reflection plane p2004) is reduced as much as possible to reduce the window portions 2042a, 2042b, 2042c ... For each size, this method is effective.

In this embodiment, as a light source, a mercury discharge lamp, a halogen lamp, an ultraviolet LED, etc. can be used, but in order to reduce the point light sources of the illumination beam EL1 like Sfa, Sfb, Sfc ..., high brightness and radiation shock can be used Laser light source with narrow band of light.

Here, an example of the configuration of the illumination optical system IL (first optical system 2014) shown in FIGS. 21 and 22 will be described with reference to FIG. 23. In addition, in FIG. 23, the same members as those described in FIGS. 21 and 22 are given the same symbols, and the description is omitted. In addition, in FIG. 23, the prism reflector 2041 in FIG. 21 is omitted, and the optical path between the illumination area IR on the cylindrical mask M and the cylindrical pattern surface p2001 and the second optical system 2015, and the rotation The optical path between the projection area PA on the outer peripheral surface (or the surface of the substrate P) p2002 of the reel 2030 and the second optical system 2015 is unfolded and displayed.

As described previously, the illumination optical system IL is provided with a compound eye lens 2062 that emits a light beam EL0 (illumination beam EL0) from a light source to generate a plurality of point light source images, so that each light beam from the plurality of point light source images is in the illumination field of view A condenser lens 2065 superimposed on a blind 2064, and a lens system 2066 that guides the illumination light passing through the opening of the illumination field diaphragm 2064 to the concave mirror 2040 of the projection optical system PL (second optical system 2015). Since the Keira illumination method is applied, the surface Ep that generates a point light source image on the exit side of the compound eye lens 2062 is set to the concave mirror 2040 by the glass material (concave lens shape) constituting the condenser lens 2065, lens system 2066, and concave mirror 2040 The pupil plane pd where the reflecting surface is located is conjugated.

In the YZ plane, the center of the output end of the fly-eye lens 2062 is disposed on the optical axis 2065a of the condenser lens 2065, and the center of the illumination field diaphragm 2064 (opening) is disposed on the optical axis 2065a. Furthermore, the illumination field diaphragm 2064 is arranged in the illumination area IR on the cylindrical mask M by a plurality of lenses constituting the lens system 2066, the glass material of the concave mirror 2040 (concave lens shape), and the second optical system 2015 (Pattern surface p2001) Optically conjugate surface 2014b.

Furthermore, although the optical axis 2014a of the first optical system 2014 of the illumination optical system IL is arranged coaxially with the optical axis 2015a of the projection optical system PL (second optical system 2015), the optical axis 2065a of the condenser lens 2065 is arranged opposite The optical axis 2014a of the first optical system 2014 is decentered in the -Z direction within the paper surface (XZ surface) of FIG. 23.

Here, taking the two point light source images SPa and SPd located at the position asymmetric in the Z direction across the optical axis 2065a among the plurality of point light source images generated on the surface Ep of the fly-eye lens 2062 as an example, the illumination beam will be described Phenomenon.

The light beam from the point light source image SPa is irradiated by the condenser lens 2065 into a substantially parallel light beam and illuminates the illumination field diaphragm 2064. The illumination beam EL1a of the opening of the transmitted illumination field diaphragm 2064 (slender slit shape in the Y direction) converges into a point light source in the window of the reflective surface of the concave mirror 2040 formed in the projection optical system PL by the lens system 2066 Like Sfa.

The illumination beam EL1a from the point light source like Sfa, as explained in FIG. 21, passes through the projection optics The second optical system of PL 2015 illuminates the illumination area IR on the cylindrical pattern surface p2001 of the cylindrical mask M. The imaging light beam EL2a generated on the pattern surface p2001 by the irradiation of the illumination light beam EL1a from the point light source image Sfa is reversed in the second optical system 2015 and the point light source image Sfa 'is again imaged on the concave mirror 2040. The point light source image Sfa created by the light beam from the illumination optical system IL and the point light source image Sfa 'created by the imaging light beam EL2a are located in the position of point symmetry in the pupil plane pd.

Similarly, the light beam from the point light source image SPd is irradiated to the illumination field diaphragm 2064 as a substantially parallel light beam by the condenser lens 2065. The illumination light beam EL1d of the opening of the transmission illumination field diaphragm 2064 is converged into a point light source image Sfd by the lens system 2066 in the window formed on the reflective surface of the concave mirror 2040. The illumination light beam EL1d from the point light source image Sfd passes through the second optical system 2015 to illuminate the illumination area IR on the cylindrical pattern surface p2001. The imaging light beam EL2a generated on the pattern surface p2001 by the irradiation of the illumination light beam from the point light source image Sfd is reversed in the second optical system 2015 and the point light source image Sfd 'is again imaged on the concave mirror 2040. The point light source image Sfd created by the light beam from the illumination optical system IL and the point light source image Sfd 'created by the imaging light beam EL2d are located in a point-symmetric relationship in the pupil plane pd.

On the reflective surface of the concave mirror 2040, imaging light beams EL2a, EL2d with a point light source like Sfa ', Sfd' are formed, projected on the cylindrical projection area PA on the substrate P, and the image of the mask pattern in the illumination area IR is image-projected on Within the projection area PA of the substrate P.

FIG. 24 shows the structure of the light source device 2055 that enters the illuminating light beam EL0 of the compound eye lens 2062 of the illumination optical system IL shown in FIG. 23. The light source device 2055 includes a solid-state light source 2057, an expansion lens (concave lens) 2058, a condenser lens 2059, and a light guide member 2060. The solid-state light source 2057 includes, for example, a laser diode (LD), a light-emitting diode (LED), and the like. The illumination light beam LB emitted from the solid-state light source 2057 is converted into a divergent light beam by the expansion lens 2058, and condensed on the incident end surface 2060a of the light guide member 2060 by a condenser lens 2059 at a predetermined convergence ratio (NA).

The light guide member 2060 is, for example, an optical fiber, etc., and the illumination light beam IB incident on the end surface 2060a is The NA (Numerical Aperture) is stored and emitted from the output end face 2060b, and converted into a substantially parallel illumination beam EL0 by the lens system 2061 (collimator). The lens system 2061 adjusts the beam diameter of the illumination beam EL0 to illuminate the entire surface of the fly-eye lens 2062 on the incident side. In addition, although the diameter of a single optical fiber is, for example, 300 μm, when the light intensity of the illumination light beam LB from the solid-state light source 2057 is large, a plurality of optical fibers can be tightly bundled.

FIG. 25 shows the arrangement state of the plurality of point light source images SP formed by the surface Ep (parallel to the YZ plane) on the exit side of the fly-eye lens 2062 in FIG. 23 viewed from the condenser lens 2065 side. When the center point of the surface Ep of the fly-eye lens 2062 on the YZ plane is set to 2062a, the center point 2062a is located on the optical axis 2065a of the condenser lens 2065.

As shown in FIG. 25, the fly-eye lens 2062 of this embodiment includes a plurality of lens elements 2062E arranged on a plane orthogonal to the optical axis 2065a of the condenser lens 2065. Each of the plurality of lens elements 2062E has a rectangular cross section elongated in the Y direction, and is tightly bound in the Y direction and the Z direction. Although the point light source image (point) SP is formed at the center of the emitting end of each lens element 2062E, this is the conjugate image of the emitting end surface 2060b of the light guide member 2060 (optical fiber) in FIG. In addition, when viewed in the YZ plane, a plurality of lens elements 2062E are bundled so that each point light source image SP is not point-symmetrical with respect to the center point 2062a (optical axis 2065a).

In the example shown in FIG. 25, when the plane including the optical axis 2065a of the condensing lens 2065 and the plane parallel to the XY plane is set to p2006, if the lens element 2062E on the + Z side more than this plane p2006 is the upper lens The element group 2062U and the lens element 2062E on the -Z side more than this side p2006 are the lower lens element group 2062D, and the position of the lens element 2062E is shifted between the upper lens element group 2062U and the lower lens element group 2062D 1/2 of the dimension in the Y direction. As a result, the plurality of point light source images SP dispersed in the upper lens element group 2062U and the plurality of point light source images SP dispersed in the lower lens element group 2062D are also relative to the line parallel to the Y axis passing through the center point 2062a as Asymmetrical configuration.

The reason for the cross-sectional shape of each lens element 2062E of the compound eye lens 2062 in the YZ plane The rectangular shape extending in the Y direction is to match the slit-shaped opening shape of the illumination field diaphragm 2064 in FIG. 23. The appearance will also be described with reference to FIG. 26.

FIG. 26 is a view of the illumination field diaphragm 2064 in FIG. 23 viewed in the YZ plane. The illumination field diaphragm 2064 is formed with an elongated rectangular (or trapezoidal) opening 2064A in the Y direction. The light beams of each point light source image SP from the compound eye lens 2062 are passed through the condenser lens 2065 to the illumination field diaphragm At 2064, the rectangular illumination light beam EL1 including the opening 2064A is overlapped. When the opening center of the opening 2064A has been arranged on the optical axis 2065a of the condenser lens 2065, the optical axis 2014a of the first optical system 2014 of the illumination optics IL passes through the opening center of the opening 2064A and decenters in the + Z direction The location.

FIG. 27 is a view of the reflection surface p2004 (disposed on the pupil surface pd) of the concave mirror 2040 that can be used for the point light source image SP distribution generated by the compound eye lens 2062 of FIG. 25 viewed from the second optical system 2015 side of the projection optical system PL . Since the reflective surface p2004 of the concave mirror 2040 is conjugated with the surface Ep on the exit side of the compound eye lens 2062, the distribution of the plurality of point light source images SP (lens element 2062E) shown in FIG. 25 is as shown in FIG. 27 on the reflective surface p2004 ( The distribution of the point light source image Sf (black circle) in the left and right, upside down in the pupil plane pd).

As previously described with reference to FIG. 22, the reflecting portion p2004 of the concave mirror 2040 is used to make the window portion 2042 for transmitting a plurality of point light source images Sf to be non-point symmetric with respect to the center point 2044 (optical axis 2015a). In the example of FIG. 27, the window portion 2042 is formed in a slit shape elongated in the Z direction so that the illumination beams from the plural point light source images Sf arranged in a row in the Z direction are collectively transmitted. In addition, the slit-shaped window portion 2042 in the reflection surface p2004 is a highly reflective portion that efficiently reflects the imaging beam from the pattern in the illumination area IR of the cylindrical mask M.

A plurality of point light source images Sf are arranged non-plane symmetrically with respect to a plane p2005 including the optical axis 2015a of the second optical system 2015 and orthogonal to the central plane pc (FIG. 21), and the Y-direction dimensions of the slit-shaped windows 2042 , Set narrowly to the extent that the point light source image Sf is not blocked. As explained with reference to FIG. 23, the light beams (illumination light beams EL1) from each of the plurality of point light source images Sf passing through the windows 2042 pass through the 2 The optical system 2015 overlaps the illumination area IR on the pattern surface p2001 of the cylindrical mask M. With this, the illumination area IR is illuminated with a uniform illuminance distribution.

Although the reflected light (imaging beam EL2) from the mask pattern appearing in the illumination area IR of the pattern surface p2001 returns to the reflecting surface p2004 of the concave mirror 2040, the imaging beam EL2 becomes a point light source image again on the reflecting surface p2004 Sf 'becomes the distribution of separation. As illustrated in FIG. 22, the distribution of the plurality of point light source images Sf ′ (especially 0th-order diffracted light) generated on the reflection surface p2004 by the imaging beam EL2 is relative to the central point 2044 and is the illumination beam EL1 The distribution of most point light sources like Sf is point-symmetric.

As shown in FIG. 27, a plurality of window portions 2042 distributed with a plurality of point light source images Sf as sources of the illumination light beam EL1 are point-symmetrical on the reflection surface p2004 because they are all high-reflection portions, so they are imaged again The point light source image Sf 'on the reflective surface p2004 (including the primary diffracted light) is reflected almost without loss and reaches the substrate P.

[Modification 1 of the eleventh embodiment]

In addition, in FIG. 27, even the portion on the line crossing the plane p2005 (parallel to the XY plane) including the optical axis 2015a of the projection optical system PL (second optical system 2015) in the reflective surface p2004 of the concave mirror 2040 has an illumination beam In the case of the point light source image Sf of the source, as long as the previous configuration condition is the position where the point light source image Sf is located is set as the window portion 2042, and the area where the center point 2044 and the window portion 2042 are point symmetrical is set as the reflection Part (light shield).

However, when the point light source image Sf (window portion 2042) is located at the central point 2044, if the illumination light beam using the point light source image Sf as the source irradiates the illumination area IR on the cylindrical mask M, then the The reflected imaging light beam converges to form a point light source image Sf 'at the central point 2044 (window portion 2042) of the reflecting surface p2004, so there is a case where it does not become an imaging light beam toward the substrate P. Therefore, the arrangement of the plurality of lens elements 2062E constituting the fly-eye lens 2062 can be changed in the manner of the pointless light source image Sf near the center point 2044 of the reflection surface p2004, or a light-shielding film can be applied to the lens element 2062E corresponding to the position of the center point 2044 ( Inked).

In addition, in this embodiment, as shown in FIGS. 25 and 27, the arrangement of the point light source image SP (the arrangement of lens elements 2062E) formed on the surface Ep of the fly-eye lens 2062 and the concave mirror are formed. The configuration of the window portion 2042 of the reflecting surface p2004 of 2040 fits one-to-one, but it is not necessarily necessary. That is, of the plurality of point light source images SP formed on the emission side surface Ep of the fly eye lens 2062, a part of the point light source image Sf that can reach a part of the reflection surface p2004 (pupil surface pd) from the surface p2003 on the back side of the concave mirror 2040 is incident Alternatively, the window portion 2042 may not be provided, and the state of the reflective surface may be maintained to shield the light. This light shielding can also be achieved by forming a light shielding film or a light absorption layer in the area p2003 on the back side of the concave mirror 2040 where the point light source image Sf to be shielded is located.

[Modification 2 of the eleventh embodiment]

The imaging light beam EL2 (many point light source images Sf ') incident on the concave mirror 2040 from the second optical system 2015 constituting the projection optical system PL may not necessarily be completely reflected by the concave mirror 2040. For example, in the reflection surface p2004 of the concave mirror 2040, in addition to the transmissive window portion 2042 and the reflection portion, a plurality of point light source images Sf as a source of the illumination light beam EL1 and a complex number formed by the convergence of the imaging light beam EL2 may be provided A light-shielding portion of the point light source image of one or both of the point light source images Sf ′.

The eleventh embodiment has been described above. In this embodiment, as shown in FIG. 21 or FIG. 22, the illumination light from the illumination optical system IL enters from the back side of the concave mirror 2040 disposed on the pupil plane pd of the projection optical system PL , Through the second optical system 2015 constituting the projection optical system PL and the reflecting plane 2041a on the upper side of the prism mirror 2041, the illumination light beam EL1 reaches the illumination area IR on the cylindrical mask M.

If the imaging optical path of the projection optical system PL in this embodiment is divided into the first optical path from the illumination area IR (object plane) to the concave mirror 2040 (pupil plane pd) and the concave mirror 2040 (pupil plane pd) to the projection area PA ( In the second optical path of the image plane, the first optical path also serves as an optical path for oblique illumination for guiding the illumination light beam from the illumination optical system IL to the illumination area IR.

As described above, the processing device U3 (exposure device) of this embodiment is arranged in the projection The pupil plane of the optical system PL or the mirror near it efficiently separates the illumination beam and the imaging beam in the oblique illumination mode, so the device configuration can be simplified. In addition, compared with the method of separating the illumination beam and the imaging beam by the difference in polarization state, there is no need to use a larger polarization beam splitter or wavelength plate, etc., which can simplify the device configuration.

Furthermore, in the method of separating the illumination beam from the imaging beam by polarization, although it is necessary to respond to the wave surface disturbance caused by the wavelength plate, or due to the problem of the extinction ratio of the polarizing beam splitter, the projected image characteristics (contrast, aberration Etc.) Deterioration, but in this embodiment, there is almost no degradation of the characteristics of the projected image due to these reasons, which can suppress the occurrence of poor exposure. In addition, since the processing device U3 of the present embodiment is equipped with the oblique illumination method that irradiates illumination light to the reflective mask M through a part of the projection optical system, it is compared with the case where the illumination optical system is assembled inside the transmissive mask , Especially in the design of lighting optics, the degree of freedom is improved.

In this embodiment, since the light source device 2055 shown in FIG. 24 can reduce the size of the point light source image, it is assumed that a laser light source with strong directivity of emitted light (for example, excimer laser light such as KrF, ArF, XeF, etc.) is used. , But not limited to this. For example, a lamp light source that emits glow rays such as g-rays, h-rays, and i-rays, or a laser diode or a light-emitting diode (LED) that emits light with low directivity can also be used.

The component manufacturing system 2001 (FIG. 20) of the present embodiment can simplify the configuration of the processing device U3 (exposure device), so that the manufacturing cost of the component can be reduced. In addition, since the processing device U3 is a method of scanning exposure while conveying the substrate P along the outer peripheral surface p2002 of the rotating reel 2030, it is possible to efficiently perform exposure processing. As a result, the component manufacturing system 2001 can manufacture components with good efficiency.

[Twelfth Embodiment]

Next, the twelfth embodiment will be described with reference to FIG. 28. In this embodiment, the configuration of the fly-eye lens 2062 described previously in FIGS. 25 and 27 and the arrangement of the point light source image Sf formed in the reflection surface p2004 of the concave mirror 2040 are changed, and the same configuration requirements as those in the above embodiment are given The same symbols as in the above embodiments are simplified or omitted.

FIG. 28 is a view of how the lens elements 2062E of the fly-eye lens 2062 are arranged equivalently in the YZ plane orthogonal to the optical axis 2015a of the projection optical system PL, in the reflection surface p2004 of the concave mirror 2040. In such a manner that the center point 2044 (optical axis 2015a) of the plurality of lens elements 2062E (point light source image Sf) and the reflective surface p2004 of the concave mirror 2040 becomes non-point symmetrical to each other, the center of the lens element 2062E closest to the center point 2044 is from The center point 2044 is displaced in the Y direction and the Z direction.

In this embodiment, the cross-sectional shape (shape in the YZ plane) of each lens element 2062E of the fly-eye lens 2062 is set to be equal to the rectangular opening 2064A including the illumination field diaphragm 2064 as described in FIG. 26 above. The rectangle has a similar shape, but here, the ratio Py / Pz of the Y-direction cross-sectional dimension Py to the Z-direction cross-sectional dimension Pz is set to approximately 4. Therefore, a plurality of point light source images Sf distributed in the reflection surface p2004 (pupil surface pd) are also arranged at a pitch of the cross-sectional size Py in the Y direction and at a pitch of the cross-sectional size Pz in the Z direction.

As long as it is a common compound eye lens, although the center of each lens element 2062E will be arranged straight in both directions of the Y direction and the Z direction, in this embodiment, the lens elements 2062E adjacent in the Z direction are in the Y direction Each displacement is △ Y to configure. If this displacement amount ΔY is set to about 1/4 of the cross-sectional dimension of the lens element 2062E in the Y direction (arrangement pitch) Py, the point light source images Sf will be located within ± 45 degrees and ± 135 from each other in the YZ plane The position separated in either direction of the degree.

In FIG. 28, when the four point light source images Sf located very close to the center point 2044 of the reflecting surface p2004 and surrounding the center point 2044 are specified, the area surrounded by the four point light source images Sf (here is inclined) The position of the center of gravity of the rectangle) is displaced from the central point 2044. In other words, the center of gravity of the area surrounded by the four point light source images Sf is located at a position different from the center point 2044. By setting the positional relationship of the concave mirror 2040 and the fly's eye lens 2062 in the YZ plane to cause such displacement, each point light source image Sf can be arranged in a non-point-symmetric relationship with respect to the center point 2044. This means that the area on the reflecting surface p2004 that has a point-symmetric relationship with respect to the central point 2044 and each point light source image Sf can be a reflecting portion at any time.

Although the window portion 2042 that transmits each point light source image Sf is formed in the reflection surface p2004 of the concave mirror 2040 corresponding to the distribution of the point light source image Sf as configured above, several shapes, sizes, and arrangements of the window portion can be considered form. Simply speaking, as shown in FIG. 28, the circular window portion 2042H that transmits only one point light source image Sf is distributed over the entire reflection surface p2004 in accordance with the arrangement of the point light source image Sf.

As another form, all the point light source images Sf arranged in a row on the reflective surface p2004 inclined 45 degrees with respect to the Y direction may converge and transmit the groove-shaped window portion 2042K. When a series of point light source images Sf located in this window portion 2042K are used as the source to illuminate the illumination area IR of the cylindrical mask M, the reflected beam (imaging beam) becomes the reflection surface p2004 of the concave mirror 2040 The point light source image Sf '(including the primary diffraction image) converges on the reflection area 2042K' that is displaced from the window portion that transmits the point light source image Sf. In addition, two point light source images Sf arranged in a direction inclined by 45 degrees with respect to the Y direction may be a set of window portions 2042L that converge and transmit the elliptical shape (or gourd shape). Regardless of the type of window portion 2042H, 2042K, 2042L, it is formed by reducing the illumination light from each point light source image Sf within a range where it is not partially blocked.

In the above twelfth embodiment, the Y-direction displacement amount ΔY of the lens element 2062E of the fly-eye lens 2062 can be arbitrarily set, and the ratio of the cross-sectional dimensions of the lens element 2062E, Py / Pz, does not necessarily have to be an integer multiple.

[Thirteenth Embodiment]

Next, a thirteenth embodiment will be described with reference to FIG. 29. This embodiment also relates to the configuration of the fly-eye lens 2062 and the deformation of the point light source image Sf formed in the reflection surface p2004 of the concave mirror 2040 in the same manner as FIG. 28. In the configuration of FIG. 29, the centers of the plural lens elements 2062E of the fly-eye lens 2062 are linearly arranged in the Y direction and the Z direction in the YZ plane.

In the case of this fly-eye lens 2062, the point light source images Sf formed on the exit side of each lens element 2062E are arranged at a pitch of the cross-sectional dimension Py in the Y direction and at a pitch of the cross-sectional dimension Pz in the Z direction. This situation is also as explained in the twelfth embodiment of FIG. 28. When the four point light source images Sfv1, Sfv2, Sfv3, and Sfv4 that are near the center point 2044 (optical axis 2015a) of the reflective surface p2004 of the concave mirror 2040 and surround the center point 2044 are surrounded by the four point light source images Sfv1 to Sfv4 The center of gravity Gc of the region (rectangle) is displaced from the center point 2044. In other words, the center of gravity position Gc is located at a position different from the center point 2044.

By setting the positional relationship of the concave mirror 2040 and the fly's eye lens 2062 in the YZ plane to cause such displacement, each point light source image Sf can be arranged in a non-point-symmetric relationship with respect to the center point 2044. Therefore, the area on the reflection surface p2004 in which the relative center point 2044 and the point light source images Sf are point-symmetrical can be used as the reflection portion at any time.

In addition, the reflecting surface p2004 of the concave mirror 2040 of the present embodiment is formed in accordance with the arrangement pitch of the lens element 2062E (point light source image Sf) to form a circular window portion 2042H useful for individually transmitting the point light source image Sf.

[14th embodiment]

Next, a fourteenth embodiment will be described with reference to FIG. 30. This embodiment is similar to FIGS. 28 and 29 in terms of the configuration of the fly-eye lens 2062 and the deformation of the point light source image Sf formed in the reflection surface p2004 of the concave mirror 2040. In the configuration of FIG. 30, although a plurality of lens elements 2062E of the compound eye lens 2062 (the cross-sectional shape is an elongated rectangle in the Y direction) are arranged at a pitch of the cross-sectional dimension Py in the Y direction, and the pitch of the cross-sectional size Pz is close The lens elements 2062E group arranged in one row in the Y direction are arranged alternately in the Y direction with each row changing (staggered) in the Y direction.

In the case of the compound-eye lens 2062, the point light source image Sf is generated on the output end side of all lens elements 2062E that receive the illumination light from the light source (for example, EL0 in FIG. 24), but in order to cover the point light source image Sf The center point 2044 of the reflective surface p2004 of the concave mirror 2040 is one of the two point light source images Sf in a point-symmetrical arrangement relationship with each other, and a light-shielding body 2062s is formed on the corresponding lens element 2062E.

In the configuration of FIG. 30, the light-shielding body 2062s (metal Film, etc.) The point light source images Sf selected in the reflection surface p2004 of the concave mirror 2040 are randomly and uniformly distributed. When such a fly-eye lens 2062 is used, a circular window portion 2042H for transmitting the point light source image Sf is also formed on the reflection surface p2004 of the concave mirror 2040 as shown in FIG. 30.

[Fifteenth Embodiment]

Next, the fifteenth embodiment will be described with reference to FIG. 31. In the present embodiment, instead of using the compound eye lens 2062 described so far, a plurality of point light source images Sf are formed in the reflection surface p2004 of the concave mirror 2040 by the light source image forming section. FIG. 31 shows a cross section including a concave mirror 2040 on a plane parallel to the XZ plane and including the optical axis 2015a (center point 2044), and each window portion 2042H is formed on the reflection surface p2004 where the point light source image Sf (Sfa) is located.

The concave mirror 2040 is formed, for example, on a concave surface side of a base material made of precision ceramic or glass ceramic with a low thermal expansion coefficient. A plurality of window portions 2042H are formed on the reflective film under the same conditions as in the previous embodiments. In this embodiment, the base material behind the window portions 2042H is formed to pass through a part of the illumination optical system IL, that is, the optical fiber Fbs Hole (diameter about 1mm).

The output end of each optical fiber Fbs functions as a point light source image, and is provided on a surface substantially the same as the reflection surface p2004. The illumination light irradiated to the entrance end of each optical fiber Fbs is set so that the illumination light beam (for example, EL1a) projected from the exit end of the optical fiber Fbs has a predetermined numerical aperture (divergence angle characteristic). In addition, the direction of the illumination beam from the exit end of each optical fiber Fbs is set to coincide with the direction of the chief ray passing through the exit end (point light source image).

In the configuration shown in FIG. 31, since a plurality of point light source images Sf are generated at the exit end of the optical fiber Fbs without using the fly eye lens 2062, although the number of optical fibers corresponding to the window portion 2042H is required, the light source can reach the concave mirror 2040 The system, that is, the illumination optical system IL is miniaturized as a whole.

In addition, although the concave mirror 2040 is provided with a small hole through which the output end of the optical fiber Fbs passes, a thin light tube (cylindrical rod) made of quartz or the like may be embedded in each small hole An ultraviolet light emitting diode (LED) having a condenser lens is provided on the side so that the exit end side of each light pipe coincides with the reflective surface p2004 of the concave mirror 2040.

[16th embodiment]

Next, the sixteenth embodiment will be described with reference to FIGS. 32A, 32B, 33A, 33B, and 33C. In this embodiment, instead of the compound eye lens 2062 in the illumination optical system IL, a rod lens (corner-shaped glass or quartz) is used to uniformly illuminate the illumination area IR on the cylindrical mask M.

32A is a plan view of the optical path from the Y-axis direction of the light guide member 2060 (fiber) guiding the light of the light source to the projection optical system PL (second optical system 2015), and FIG. 32B is the optical path of FIG. 32A viewed from the Z-axis direction Top view. In FIGS. 32A and 32B, the configuration of the optical path from the illumination field diaphragm 2064 to the projection optical system PL is the same as the configuration of FIG. 23 previously, and therefore the description of this part is omitted.

The illumination optical system IL shown in FIGS. 32A and 32B includes the light guide member 2060, the condenser lens 2093, the rod lens 2094, the illumination field diaphragm 2064, the lens system 2066, and the like described with reference to FIG. The configuration of the projection optical system PL (second optical system 2015) after the concave mirror 2040 is the same as the previous FIGS. 21 and 23.

The illumination light beam EL0 emitted from the light guide member (optical fiber) 2060 is converged by the condenser lens 2093 to the incident end surface 2094a of the rod lens 2094 or its vicinity. The rod lens 2094 has a cross-sectional shape along the YZ plane (incident end surface 2094a, exit end surface 2094b), and is formed into a rectangular shape including a trapezoidal or rectangular opening 2064A (FIG. 26) of the illumination field diaphragm 2064. The cross-sectional shape is substantially similar to the cross-sectional shape of the lens element 2062E of the compound eye lens 2062 shown in FIGS. 25 and 28 to 30 previously.

When the rod lens 2094 is used, the illumination beam EL0 converging on the incident end face 2094a is inside the rod lens 2094, and moves many times between the side face 2094c parallel to the XZ plane and the side face 2094d parallel to the XY plane to repeat the inside After reflection, it enters the exit end face 2094b. In the case of a rod lens, although the most uniform illuminance distribution of the illuminating light is the exit end face 2094b, its uniformity will be better as the number of internal reflections is repeated. Therefore, the emission end surface 2094b and the surface 2014b conjugate to the illumination region IR on the cylindrical mask M are arranged in unison.

Since the rod lens 2094 of this embodiment has a rectangular cross section, the number of reflections of the illumination light between the opposing side surfaces 2094c is less than the number of reflections of the illumination light between the opposing side surfaces 2094d. The number of times the illumination light beam EL0 is reflected on the inner surface of the rod lens 2094 is to set the length of the rod lens 2094, etc. from the viewpoint of improving the uniformity of illuminance at least twice. In addition, since the shape of the exit end surface 2094b of the rod lens 2094 defines the outer edge of the illumination region IR, the illumination field stop 2064 can also be omitted.

Next, if the line connecting the center point of the incident end surface 2094a of the rod lens 2094 in the YZ plane and the center point of the incident end surface 2094b in the YZ plane is set to the central axis AX2003, the central axis AX2003 is not related to the projection optical system. The optical axis 2015a of the PL (the optical axis 2014a of the lens system 2066) is parallel, but decentered in the Z direction. Furthermore, although the output end of the light guide member 2060 is disposed on the optical axis 2093a of the condenser lens 2093, the optical axis 2093a is disposed to be displaced in the -Y direction with respect to the central axis AX2003 of the rod lens 2094.

By the displacement in the -Y direction, a plurality of point light source images Sf generated in the reflective surface p2004 of the concave mirror 2040 can be arranged to be non-point symmetrical with respect to the center point 2044 (optical axis 2015a) of the reflective surface p2004. This matter will be described in detail based on Figures 33A ~ 33C. 33A is a view of the condenser lens 2093 viewed from the exit end surface 2094b side of the rod lens 2094 toward the X axis direction, FIG. 33B is a view of the rod lens 2094 viewed from the lens system 2066 side toward the X axis direction, and FIG. 33C is viewed from the X axis direction See the picture of the reflection surface p2004 of the concave mirror 2040.

As shown in FIG. 33A, the cross-section of the rod lens 2094 is a rectangle defined by the side surface 2094d parallel to the XY plane and the side surface 2094c parallel to the XZ plane. The central axis AX2003 of the rod lens 2094 is opposed to the optical axis 2093a of the condenser lens 2093. The ground is eccentric in the Y direction. As shown in FIG. 33B, the central axis AX2003 of the rod lens 2094 is decentered in the Z direction with respect to the optical axis 2014a (2015a) of the lens system 2066.

In this configuration, the concave lens and the lens system 2066, which are the base materials of the concave mirror 2040, are the Fourier conversion surface (pupil surface pd) of the surface 2014b on which the emission end surface 2094b of the rod lens 2094 is located It is formed on the reflective surface p2004 of the concave mirror 2040. Therefore, as shown in FIG. 33C, a plurality of point light source images Sf on the reflection surface p2004 of the concave mirror 2040 are formed with a pitch DSy in the Y direction and a pitch DSz in the Z direction. The point light source image Sf appears as a virtual image of the point image of the illumination light beam EL0 converging on the incident end surface 2094a of the rod lens 2094.

A plurality of point light source images Sf have a rectangular cross section, so the arrangement pitch Dsy of the point light source images Sf parallel to the long side of the cross section (Y direction) is more parallel to the short side (Z direction) The arrangement pitch of the point light source like Sf is long. As shown in FIGS. 32A and 32B, since the number of internal reflections of the illumination light in the rod lens 2094 is larger in the Z direction than in the Y direction, the number of point light source images Sf generated on the reflection surface p2004 of the concave mirror 2040 is also The Z direction is more than the Y direction. In the example of FIG. 33C, five point light source images Sf are arranged in the Z direction, and three point light source images Sf are arranged in the Y direction.

Furthermore, by decentering the central axis AX2003 of the rod lens 2094 and the optical axis 2093a of the condenser lens 2093 with respect to the Y direction, the distribution of the point light source image Sf generated on the reflection surface p2004 of the concave mirror 2040 relative to the central point 2044 (optical axis 2015a) is decentered in the Y direction as a whole, and each point light source image Sf can be arranged in a non-point-symmetric relationship with respect to the center point 2044.

As in the previous embodiment shown in FIG. 27, the reflection surface p2004 of the concave mirror 2040 is formed by arranging a plurality of point light source images Sf arranged in a row in the Z direction and transmitting the groove-shaped window portion 2042 in the Y direction at a pitch DSy has three columns. The width of each window portion 2042 in the Y direction is set to be as small as possible in a range that does not block the illumination light beam with the point light source image Sf as the source. These groove-shaped window portions 2042 are also formed to be non-point-symmetrical with respect to the center point 2044.

In the configuration of FIG. 33C, the eccentric amount in the Y direction of the central axis AX2003 of the rod lens 2094 and the optical axis 2093a of the condenser lens 2093 is set to be closest to the central point 2044 on the reflection surface p2004 (pupil surface pd) of the concave mirror 2040 The distance from the point light source image Sf of the (optical axis 2015a) to the center point 2044 in the Y direction (set to Yk) is set such that half of the interval between the window portions 2042 arranged in the Y direction (set to Yw) is not full, that is, Yk <( Yw / 2).

As described above, if the point light source image Sf which is the source of the illumination light beam EL1 illuminating the illumination region IR of the cylindrical mask M is arranged on the reflection surface p2004 (pupil plane pd) of the concave mirror 2040, the As shown in FIG. 33C, the imaging beam EL2 generated by the illumination region IR on the mask M becomes a diffraction image Sf 'of the point light source image Sf on the reflection surface p2004 (including 0-order light and ± 1-order diffraction light, etc.) And distribution. On the reflecting surface p2004, the diffracted image Sf 'and the point light source image Sf, which is the source of the illumination light beam EL1, are located in a point-symmetrical position with respect to the center point 2044.

In this embodiment, since the relationship between the distance Yk and the interval Yw is set to Yk <(Yw / 2), a plurality of diffraction images Sf ′ generated on the concave mirror 2040 (pupil plane pd) by the imaging light beam EL2 , Are formed on the reflecting portion offset from the window portion 2042. In this way, the imaging light beam EL2 is reflected by the reflecting portion of the concave mirror 2040 with almost no loss, and as shown in the previous FIG. 21, is projected on the projection area PA on the substrate P held along the outer peripheral surface p2002.

As described above, even in the case where the rod lens 2094 is used, it is possible to shift a plurality of point light sources like Sf by shifting the convergence position of the illumination beam EL0 on the incident end surface 2094a of the rod lens 2094 from the central axis AX2003 Each is set to have a non-point-symmetric relationship with respect to the center point 2044 of the reflective surface p2004 of the concave mirror 2040.

[17th embodiment]

Next, the configuration of the processing device (exposure device) U3 of the seventeenth embodiment will be described with reference to FIGS. 34 and 35. The exposure apparatus of the present embodiment is designed to correspond to the size of the Y-direction of the pattern exposure area on the substrate P that is larger than the Y-direction size of the illumination area IR or the projection area PA of the projection optical system PL shown in FIG. The projection optics are arranged in the Y direction to expand the possible exposure range in the Y direction.

Therefore, the pattern of the cylindrical mask M must be projected on the substrate P as an upright image. In the projection optical system PL shown in FIG. 21 previously, although the X direction of the mask pattern image projected on the substrate P is upright, it is reversed in the Y direction. Therefore, by arranging the projection optics of the same configuration in tandem (in tandem), the projected image with the Y direction reversed can be inverted again in the Y direction. If the projection area PA on the substrate P is in the X direction and the Z direction, it will be an upright image.

FIG. 34 shows the overall schematic configuration of the exposure apparatus of this embodiment. FIG. 35 shows the arrangement relationship between the illumination area IR and the projection area PA formed by each of a plurality of projection optical systems. The orthogonal coordinates of each figure are XYZ, and the previous The coordinate system set in the embodiment of FIG. 21 is the same. In addition, the same symbols as those of the components or requirements of the exposure apparatus shown in FIGS. 21 and 23 are given.

The substrate P transported upstream from the transport path is wound around a part of the outer peripheral surface of the rotating drum 2030 through a transport roller or guide member (not shown), and then transported downstream through a guide member or transport roller (not shown). The second driving unit 2032 drives the rotating reel 2030 to rotate clockwise around the rotation center axis AX2002, and the substrate P is transferred at a constant speed. The projection areas PA2001-PA2006 of the six projection optical systems PL2001-PL2006 are located in the portion of the cylindrical outer peripheral surface of the rotating reel 2030 where the substrate P is wound. Corresponding to each of the six projection areas PA2001 to PA2006, six illumination areas IR 2001 to PA2006 are set on the outer peripheral surface of the cylindrical mask M (cylindrical mask pattern surface).

The six projection optics PL2001 ~ PL2006 all have the same optical structure, and are divided into the central plane pc (with the YZ plane) relative to the central axis of rotation AX2001 of the cylindrical mask M and the central axis of rotation AX2002 of the rotating reel 2030 (Parallel) projection optics PL2001, PL2003, PL2005 (also collectively called odd projection optics PLo) on the left (-X direction), and projection optics PL2002, PL2004, PL2006 (on the right) (+ X direction) It is also collectively referred to as even-numbered projection optics (PLe).

The projection optics PL2001-PL2006 of this embodiment include the projection optics PL shown in FIG. 21 and the illumination optics IL2001-IL2006 for oblique illumination. Since its configuration is the same as FIG. 21, the projection optical system PL2001 and the illumination optical system IL2001 will be representatively briefly described. Illumination optics IL2001, which enters the illuminating light beam EL0 from the light source device 2055, from the back side of the concave mirror 2040 arranged on the pupil surface of the upper unit of the projection optics PL2001 (the same projection optics PL as in FIG. 21) on the reflection surface p2004 Generate multiple point light sources like Sf. Take the point light source image Sf as the source The illumination light beam EL1 is reflected by the reflection plane 2041a on the upper side of the prism mirror 2041, and illuminates the illumination area IR2001 on the outer peripheral surface of the cylindrical mask M.

The imaging beam EL2 reflected from the mask pattern in the illumination area IR2001 is reflected on the reflection plane 2041a, then reflected on the concave mirror 2040, and reflected on the reflection surface (2041b) on the lower side of the prism mirror 2041, on the surface p2007 (middle image Surface p2007) forms a spatial image (middle image) of the mask pattern.

The projection unit of the second stage of the projection optics PL2001 is also a half-field equal-magnification refraction projection system with a prism mirror, a plurality of lens elements, a concave mirror 2078 arranged on the pupil plane, etc., and forms an intermediate image on the intermediate image plane p2007 After the light beam EL2 is reflected by the concave mirror 2078, it is reflected by the reflection plane 2076b on the lower side of the prism mirror (2076), reaches the projection area PA2001 on the substrate P, and generates an upright image of the mask pattern in the projection area PA2001. In addition, the projection optics is the projection unit of the back stage of PL2001 (intermediate image plane to projection area), as long as the intermediate image formed on the intermediate image plane p2007 is re-imaged on the projection area PA2001 on the substrate P, it is reflected by the concave mirror 2078 The surface is not provided with the window portion 2042 formed on the reflection surface p2004 of the concave mirror 2040.

As the projection optical system PL2001 (the same as the other projection optical systems PL2002 ~ PL2006) constructed above, because it is a projection system of the so-called multi-lens system, there may be times when the projection optical system PL of FIG. 21 cannot pass through the illumination area. The situation where the chief ray of the center point in IR and the chief ray passing through the center point in the projection area PA2001 are arranged in the center plane pc.

Therefore, as shown in FIG. 34, the angle θ 2001 (refer to FIG. 21) of the reflection plane 2041a of the projection mirror 2041 of the projection unit on the upper side of the projection optical system PL2001 (the same is true for PL2003 and PL2005) is set to a value other than 45 °. The extension line D2001 of the chief ray passing through the center point in the illumination area IR2001 is directed toward the rotation central axis AX2001 of the cylindrical mask M. Similarly, the angle of the reflection plane 2076b of the prism mirror 2076 of the projection unit on the lower side of the projection optics PL2001 is set to a value other than 45 ° relative to the XY plane, so that the chief ray passing through the center point in the projection area PA2001 Extend the line D2001 to the central axis of rotation AX2002 of the cylindrical mask M.

A projection optical system symmetrically arranged with the projection optical system PL2001 relative to the center plane pc In PL2002 (the same for PL2004 and PL2006), the angle θ 2001 of the reflection plane 2041a of the prism mirror 2041 of the upper projection unit is set to a value other than 45 ° to pass the main point of the center point in the illumination area IR2002 The angle of the extension line D2002 of the light toward the central axis of rotation AX2001 of the cylindrical mask M is set to a value other than 45 ° relative to the XY plane at the angle of the reflection plane 2076b of the prism mirror 2076 of the rear projection unit. The extension line D2002 of the chief ray passing through the center point in the projection area PA2002 is directed to the central axis of rotation AX2002 of the cylindrical mask M.

As described above, the odd-numbered projection optical system PLo and the even-numbered projection optical system PLe of the extension lines D2001 and D2002 of the chief ray symmetrically inclined with respect to the central plane pc are arranged symmetrically with respect to the central plane pc when viewed in the XZ plane. However, when viewed on the XY plane, it is offset in the Y direction. Specifically, each projection optical system PL2001 ~ PL2006 is set such that the illumination areas IR2001 ~ IR2006 formed on the pattern surface of the cylindrical mask M and the projection areas PA2001 ~ PA2006 formed on the substrate P become Configuration relationship.

Fig. 35 is a view of the arrangement of the illumination areas IR2001 ~ IR2006 and the projection areas PA2001 ~ PA2006 in the XY plane. The figure on the left shows the illumination on the cylindrical mask M from the side of the intermediate image plane p2007 forming the intermediate image For the regions IR2001 ~ IR2006, the right picture shows the projection areas PA2001 ~ PA2006 supported on the substrate P of the rotating reel 2030 from the middle image plane p2007 side. In addition, the symbol Xs in FIG. 35 shows the moving direction (rotating direction) of the cylindrical mask M (rotating reel 2020) and the rotating reel 2030.

In FIG. 35, each illumination area IR2001 ~ IR2006 has an elongated trapezoid shape with an upper base and a lower base parallel to the center plane pc (parallel to the Y axis). This means that each of the illumination optical systems IL2001 to IL2006 shown in FIG. 34 has an illumination field diaphragm 2064 as shown in FIG. 26 previously. In addition, since the projection optical systems PL2001-PL2006 of FIG. 34 are formed on the intermediate image plane p2007 to form an intermediate image, when the field diaphragm with a trapezoidal opening is arranged there, the shapes of the illumination regions IR2001-IR2006 can also be formed It is simply rectangular (including the size of the trapezoidal opening).

On the outer peripheral surface of the cylindrical mask M, a photo formed by an odd number of projection optics Plo The central points of the bright regions IR2001, IR2003, IR2005 are located on the plane Lo (perpendicular to the XY plane) parallel to the central plane pc, and the central points of the illumination regions IR2002, IR2004, IR2006 formed by the even-numbered projection optics PLe are located On the plane Le (perpendicular to the XY plane) parallel to the central plane pc.

If each illumination area IR2001 ~ IR2006 is trapezoidal, the dimension of the lower base in the Y direction is A2002a, and the dimension of the upper base in the Y direction is A2002b, then the center points of the odd numbered illumination areas IR2001, IR2003, IR2005 are at The Y direction is arranged at intervals (A2002a + A2002b), and the center points of the even-numbered illumination regions IR2002, IR2004, and IR2006 are also arranged at intervals (A2002a + A2002b) in the Y direction. However, relative to odd-numbered illumination areas IR2001, IR2003, and IR2005, even-numbered illumination areas IR2002, IR20 () 4, and IR2006 are relatively offset in size in the Y direction (A2002a + A2002b) / 2. In addition, the distances in the X direction from the center plane pc of the plane Lo and the plane Le are set to be equal to each other.

In the present embodiment, each of the illumination regions IR2001 to IR2006 is configured such that the ends of the illumination region adjacent to the Y direction when viewed along the circumferential direction (Xs direction) of the outer peripheral surface of the cylindrical mask M (the trapezoidal oblique side) Department) overlap each other (overlap). With this, even when the dimension of the pattern area A2003 of the cylindrical mask M in the Y direction is large, it can ensure that the effective exposure area of the pattern area A2003 is covered. In addition, although the pattern area A2003 is surrounded by the frame-shaped pattern non-formation area A2004, the pattern non-formation area A2004 is made of a material having extremely low reflectance (or high light absorption rate) for illumination light.

On the other hand, as shown on the right side of FIG. 35, when the projection areas PA2001 to PA2006 on the substrate P are provided with the illumination field diaphragm 2064 as shown in FIG. 26 in each illumination optical system IL2001 to IL2006, it will become a reflection formed in the cylinder The configuration and shape of the illumination regions IR2001 ~ IR2006 on the outer surface of the mask M (similar relationship). Therefore, the center points of the odd projection areas PA2001, PA2003, and PA2005 are located on the surface Lo, and the center points of the even projection areas PA2002, PA2004, and PA2006 are located on the surface Le.

In addition, in the diagram on the right side of FIG. 35, although the substrate P is along the outer circumferential surface of the rotating drum 2030, It is transported in the (Xs direction) at a certain speed, but the area A2007 shown by the diagonal line in the figure is the part that is exposed at 100% relative to the target exposure amount (dose) by the six projection areas PA2001 to PA2006.

Moreover, the partial area A2005a exposed at the end (triangle portion) in the + Y direction of the area A2005 exposed by the projection area PA2001 corresponding to the illumination area IR2001, for example, does not reach the target exposure amount. However, when the substrate P is transferred in the Xs direction (circumferential direction) and the area A006 is exposed by the projection area PA2002 corresponding to the illumination area IR2002, the insufficient exposure amount is added, and as a result, the partial area A2005a is also relative to the target exposure amount (Dose) was exposed at 100%.

In this way, the projected image of the entire pattern area A2003 formed on the outer peripheral surface of the cylindrical mask M is transferred to the long side of the substrate P repeatedly at an equal magnification every time the cylindrical mask M rotates direction.

In addition, although the principal rays of the imaging beams EL2 from the illumination regions IR2001 to IR2006 on the cylindrical mask M are projected toward the projection optics PL2001 to PL2006, the main points passing through the center points in the illumination regions IR2001 to IR2006 The extension lines D2001 and D2002 of the rays are set to cross the central axis of rotation AX2001 of the cylindrical mask M, but they are not necessarily necessary, as long as they pass through the principal ray and the central axis of rotation at any point within each illumination area IR2001 ~ IR2006 AX2001 can be crossed. Similarly, the imaging beam EL2 emitted from each projection optical system PL2001 ~ PL2006 to each projection area PA2001 ~ PA2006 on the substrate P is the same, as long as any of the chief rays is consistent with the rotating reel 2030 The extension lines D2001 and D2002 crossing the central axis of rotation AX2002 are sufficient.

Next, the specific configurations of the projection optical systems PL2001 to PL2006 and the illumination optical systems IL2001 to IL2006 shown in FIG. 34 will be described using FIG. 36. 36, although the detailed configurations of the projection optical system PL2001 and the illumination optical system IL2001 are representatively shown, the configurations of the other projection optical systems PL2002-PL2006 and the illumination optical systems IL2002-IL2006 are also the same.

As shown in FIG. 36, the illumination light beam EL0 from the light source device 2055 (refer to FIG. 24) including the light guide member 2060 and the lens system 2061 enters the compound eye lens 2062 of the illumination optical system IL2001 (refer to FIG. 25, Figure 28 ~ 30). A plurality of point light source images generated on the surface Ep of the fly-eye lens 2062 as the source of the illuminating light beam are uniformly illuminated by the condenser lens 2065 on the surface conjugated to the mask 2014b equipped with the illumination field diaphragm 2064 distributed. The illumination beam passing through the opening of the illumination field diaphragm 2064, the base material (quartz, etc.) of the concave mirror 2040 of the second optical system 2015 on the upper side of the transmission optics PL2001 and the projection optics PL2001 (paragraph 1), formed on the concave mirror 2040 The window portion (2042) of the reflecting surface p2004, the second optical system 2015, and the reflection plane 2041a on the upper side of the prism reflector 2041 is reflected toward the direction along the extension line D2001 to reach the illumination area on the cylindrical mask M IR.

As in the previous configuration of FIG. 23, since the reflective surface p2004 of the concave mirror 2040 is disposed on the pupil plane pd in the imaging beam of the projection optical system PL2001, the reflective surface p2004 is configured to be substantially the same as the surface Ep on the exit side of the compound eye lens 2062 The yoke, therefore, generates a plurality of point light source image relays generated on the surface Ep of the fly-eye lens 2062 on the exit side, and is generated in the window portion 2042 formed on the reflective surface p2004.

Furthermore, in the specific configuration of FIG. 36, a focus correction optical member 2080 and an image are provided along the inclined extension line D2001 between the reflection plane 2041a on the upper side of the prism mirror 2041 and the pattern surface p2001 of the cylindrical mask M.移 光学 机构 2081. The focus correction optical member 2080 is, for example, a stack of two wedge-shaped prisms in the reverse direction (reverse direction in the X direction in FIG. 36) into a transparent parallel flat plate as a whole. By sliding the pair of prisms, the thickness of the parallel flat plate can be changed, the effective optical path length of the imaging beam can be adjusted, and the focus state of the pattern image formed on the intermediate image plane p2007 and the projection area PA2001 can be fine-tuned.

The image-shift correction optical member 2081 is composed of a transparent parallel flat glass that can be tilted in the XZ plane in FIG. 36 and a transparent parallel flat glass that can be tilted in a direction orthogonal to it. By adjusting the inclination of the two parallel flat glasses, the pattern image formed on the intermediate image plane p2007 and the projection area PA2001 can be slightly displaced in the X direction or the Y direction.

Next, the image of the reticle pattern that appears in the illumination area IR2001, through focus correction optics Component 2080, image-shift correction optical component 2081, reflection plane 2041a of the prism mirror 2041, second optical system 2015 on the upper side (first stage) of the projection optics PL2001, reflection plane 2041b of the prism mirror 2041, imaged in the middle On the image plane p2007, the intermediate image plane p2007 can be arranged so that the projection area PA201 has a trapezoidal field stop 2075 as shown in FIG. 35. In this case, the opening of the illumination field stop 2064 provided in the illumination optics IL2001 may also be a rectangle (rectangle) including the trapezoidal opening of the field stop 2075.

The imaging beam that becomes an intermediate image at the opening of the field diaphragm 2075 passes through the reflection plane 2076a constituting the lower (second stage) 稜 珡 mirror 2076 of the projection optical system PL2001, the second optical system 2077, 稜鏡 reflector 2076 The reflective plane 2076b is projected on the projection area PA2001 of the substrate P wound on the outer peripheral surface p2002 of the rotating reel 2030. The reflecting surface of the concave mirror 2078 included in the second optical system 2077 is arranged on the pupil plane pd, and the reflecting plane 2076b on the lower side of the prism mirror 2076 is set at an angle of 45 ° relative to the XY plane to make the chief ray of the imaging beam Travel along the extension line D2001 inclined with respect to the center plane pc.

Next, in the specific configuration of FIG. 36, a magnification correction optical member 2083 is provided between the reflection plane 2076b on the lower side of the prism mirror 2076 and the projection area PA2001 wound on the substrate P of the rotating reel 2030, which converts the concave lens , The convex lens and the concave lens are coaxially arranged at a predetermined interval, and the front and rear concave lenses are fixed, so that the convex lens between them moves in the direction of the optical axis (principal light). With this, the pattern image formed in the projection area PA2001 can be enlarged or reduced by a minute amount while maintaining the telecentric imaging state.

In addition, although not shown in FIG. 36, there is also provided a rotation correction mechanism capable of slightly rotating either the prism mirror 2041 or the prism mirror 2076 around an axis parallel to the Z axis. This rotation correction mechanism, for example, slightly rotates each of the plurality of projection areas PA2001 to PA2006 (and the projected mask pattern image) shown in FIG. 35 in the XY plane.

As described above, in the seventeenth embodiment, as shown in FIGS. 34 and 36, each of the six sets of projection optical systems PL2001 to PL2006 can have a rotation central axis AX2001 with the cylindrical mask M The illumination light of the intersecting principal rays illuminates each illumination area IR2001 ~ IR2006 on the outer peripheral surface (pattern surface) of the cylindrical mask M.

Furthermore, the imaging beam is deflected so that the principal rays traveling from each illumination area IR2001 to IR2006 to the normal direction of the pattern surface p2001 of the cylindrical mask M also enter the substrate P along the outer peripheral surface p2002 from the normal direction The above projection area PA2001 ~ PA2006. Therefore, it is possible to reduce the defocus of the projected image and suppress the occurrence of processing defects such as poor exposure, and as a result, the generation of defective elements can be suppressed.

In addition, each of the projection optics PL2001-PL2006 is formed between the outer peripheral surface of the cylindrical mask M and the prism reflector 2041 (reflection plane 2041a) so that the chief ray of the imaging beam is inclined with respect to the central plane pc. Therefore, the spatial arrangement of each projection optics PL2001 ~ PL2006, the conditions of interference (collision) with each other are alleviated.

In addition, the reflection plane 2076b on the lower side of the prism mirror 2041 and the reflection plane 2076a on the upper side of the prism mirror 2076 are set at an angle of 45 ° relative to the XY plane to be imaged by the intermediate image plane p2007 of each of the projection optics PL2001 ~ PL2006 The chief ray of the light beam is parallel to the central plane pc.

[Modification of the 17th embodiment]

In the exposure apparatus with a multi-lens projection optical system shown in FIGS. 34 to 36, although the image of the cylindrical mask pattern is projected and exposed to the surface of the substrate P supported by the cylindrical surface, However, the photomask M or the substrate P may be configured to support either plane, or may support both planes. For example, the substrate P may be wound on a rotating reel 2030 as shown in FIG. 34 to be supported in a cylindrical surface shape, and the mask M may be formed on parallel flat glass (quartz) as is conventionally known and linearly moved in the X direction for scanning. Exposure method, or conversely, the reticle M can be supported on the rotating reel 2020 as shown in FIG. 34, and the substrate P can be supported by a flat plane stage or air cushion-type holder and linearly transferred in the X-direction scanning exposure method. Either of the above two methods.

Moreover, the projection optical system and the illumination optical system of the previous embodiments can be applied regardless of whether the supporting form of the reticle M or the substrate P is a cylindrical plane or a plane, but as long as it is supported on a plane parallel to the XY plane The side of the shape, reflecting the reflection plane 2041a or 珜 鏡 on the upper side of the prism mirror 2041 The inclination angle of the reflecting plane 2076b on the lower side of the mirror 2076 with respect to the XY plane may be 45 °. In other words, as long as the normal line passing through the center of the illumination area IR (object plane) on the reticle M or the normal line passing through the center of the projection area PA (image plane) on the substrate P, the chief ray of the projection optics on the object plane Or, the chief ray on the image plane side may be inclined in the XZ plane.

[18th embodiment]

FIG. 37 is a diagram showing the configuration of the projection optical system PL (PL2001 in the case of the multi-lens system) of the eighteenth embodiment. The projection optics PL (PL2001) of this embodiment reflects the imaging beam EL2 (with the principal ray set to EL6) from the mask pattern in the illumination area IR (IR2001) on the outer peripheral surface of the cylindrical mask M on the plane The reflection surface 2100a of the mirror 2100 reflects through the second optical system 2015 (a semi-field-type refraction imaging system) having a concave mirror 2040 having a reflection surface p2004 on the pupil plane, and reflects it on the reflection surface 2101a of the flat mirror 2101. An equal-magnification intermediate image of the mask pattern appearing in the illumination area IR (IR2001) is formed on the intermediate image plane Im.

Furthermore, the intermediate image formed on the intermediate image plane Im is projected on the outer circumferential surface p2002 parallel to the XY plane by an enlarged imaging system 2102 (having an optical axis 2102a parallel to the Z axis) having a magnification of more than twice, for example. The projection area PA (PA2001) on the substrate P. The substrate P is supported by a plane holder HH having a fluid bearing pad having a flat surface through a fluid bearing layer. In this embodiment, too, the reflection surface p2004 of the concave mirror 2040 constituting the projection optical system PL (PL2001) is formed with a plurality of point light source images generated by the illumination light from the illumination optical system IL (IL2001) behind Sftransmitted window part 2042.

The enlarged projection optical system as shown in FIG. 37 is multi-lensed, and when a mask pattern with a large dimension in the Y direction is exposed, the projection optical system PL (PL1) including the illumination optical system IL (IL2001) and the plane mirrors 2100 and 2101 will be included. As shown in the previous FIGS. 34 and 35, the group is arranged symmetrically with respect to the central plane pc in the XZ plane and separated in the Y direction to be projected at the end (triangle part) of the Y direction of the projection area PA (PA2001) Like a part of overlap.

In this embodiment, when the central plane pc is the central axis of rotation including the cylindrical mask M When the surface of AX2001 is perpendicular to the XY surface (peripheral surface p2002), the central points of the illumination area IR2001, IR2003 ... of the odd-numbered projection optics PL2001, PL2003 ... (for example, the point where the principal ray EL6 passes), because The chief ray EL6 on the mask side is inclined with respect to the central plane pc, so the separation distance DMx is the circumference from the intersection of the outer peripheral surface of the cylindrical mask M and the central plane pc. Therefore, the center points of the illumination areas IR2002, IR2004 ... of the even-numbered projection optics PL2002, PL2004 ... are also separated at the circumference from the intersection of the outer peripheral surface of the cylindrical mask M and the central surface pc Distance DMx. Therefore, the odd-numbered illumination area IR2001 ... and the even-numbered illumination area IR2002 ... are separated by a distance (2DMx) in the circumferential direction on the cylindrical mask M.

On the other hand, due to the odd projection optics PL2001, PL2003 ..., the center points of the projection areas PA2001, PA2003 ... (for example, the point where the chief ray EL6 passes) are separated from the center plane pc in the X direction on the substrate P Since the distance DFx, the odd projection area PA2001 ... and the even projection area PA2002 ... are separated on the substrate P by a distance (2DFx) in the X direction. Therefore, when each of the illumination regions IR2001, IR2002 ... formed on the cylindrical mask M is uniformly formed in the circumferential direction, if the projection optics PL2001, PL2002 ... are enlarged If the magnification is set to Mp, it needs to be set to satisfy the relationship of MP‧ (2DMx) = 2DFx. If the above conditions cannot be constituted due to problems in the organization, as long as the odd-numbered illumination areas IR2001, IR2003 ... formed on the cylindrical mask M, the mask pattern and the even-numbered illumination area IR2002, IR2004 ... The mask pattern used should be relatively staggered in the circumferential direction.

[19th embodiment]

FIG. 38 is a diagram showing the configuration of the projection optical system PL of the nineteenth embodiment. The projection optical system PL of this embodiment is composed of a lens system 2103, a lens system 2104, a concave mirror (reflective optical member) 2040 disposed on the pupil plane, deflection mirrors 2106, 2107, and a lens system 2108.

In this embodiment, the imaging light beam EL2 from the illumination area IR on the outer peripheral surface of the cylindrical mask M is attached to the optical axis 2103a of the lens system 2103, and enters the lens system 2103 through a half of the field of view on the -X side, and The incident lens system 2104 (the optical axis 2104a is coaxial with the optical axis 2103a). Through the lens system The imaging beam EL2 of 2103 is reflected on the reflecting surface p2004 of the concave mirror 2040 (the optical axis of which is 2104a), and is reflected toward the -X direction on the reflecting surface p2106a of the deflector mirror 2106, and is guided to the lens system 2103, 2104 and the concave mirror 2040. After being out of the optical path, the reflection surface 2107a of the deflector mirror 2107 reflects toward the -Z direction.

The imaging light beam EL2 reflected by the deflector 2107 is irradiated to the projection area PA through the lens system 2108. With the above optical path, the projection optics PL, the image of the mask pattern appearing in the illumination area IR on the mask M is imaged on the projection area on the substrate P supported by the plane by the same structure as in FIG. 37 Within PA. The projection optical system of the present embodiment is designed so as not to form an intermediate image plane in order to realize enlarged projection with a small system. In addition, the extension line D2001 of the principal ray EL6 of the cylindrical mask M side of the projection optics PL is set to intersect the central axis of rotation AX2001 of the cylindrical mask M, and the principal ray EL6 of the substrate P side is set It is perpendicular to the surface of the substrate P supported by the plane.

In FIG. 38, the imaging light beam EL2 from the illumination area IR can be designed to pass through the -X side of the optical axis 2108a (parallel to the Z axis and perpendicular to the substrate P) of the lens system 2108 given the main magnification. Therefore, the portion on the + X side from the optical axis 2108a of the lens system 2108 is cut off, and the portion that does not contribute to the projection of the reticle pattern. With this, the size of the projection optical system PL in the X direction (scanning direction of the substrate P) can be reduced.

In this embodiment, as in the previous FIGS. 21, 23, 31, 32A, 32B, and 37, the illumination optical system IL and the light source device 2055 are arranged on the back side of the concave mirror 2040, and a plurality of point light source images Sf are generated in It is formed in the window portion (2042) of the reflection surface p2004 (disposed on the pupil surface) of the concave mirror 2040. The distribution on the reflection surface p2004 of the point light source image and the shape or arrangement of the window portion in the reflection surface p2004 are set as shown in FIGS. 27-30 or 33A-33C according to the conditions described in FIG. 22 previously.

As in the above-described embodiments or modifications (FIGS. 12, 21, and 34 to 38), the cylindrical mask M assumes that the pattern formed by the reflecting portion and the non-reflecting portion is directly formed on metal, ceramic, The surface of the cylindrical base material such as glass, but it can also be made into a sheet-shaped reflective mask with a pattern formed by a reflective film on one surface of a short strip-shaped extremely thin glass plate with a good flatness (for example, a thickness of 100-500 μm). It is bent and wound along the outer peripheral surface of the metallic rotating reel 2020.

The above-mentioned sheet-shaped reflective photomask may be permanently attached to the outer peripheral surface of the rotating reel 2020, or may be fixed so as to be releasable (can be exchanged). Such a sheet-shaped reflective mask includes, for example, a film such as aluminum having a high reflectivity to the illumination light beam EL1 or a dielectric multilayer film. In this case, the rotating reel 2020 may also be provided with a light-shielding layer (film) that absorbs the illuminating light beam EL1 passing through the transparent portion of the sheet-shaped reflective mask, and the light-shielding layer also suppresses the generation of stray light.

In addition, the cylindrical mask M may cover a pattern in which only one element (one display element) is formed over the entire circumference, or a plurality of patterns in which one element (one display element) is formed. Furthermore, the element patterns on the cylindrical mask M may be repeatedly arranged in the circumferential direction of the outer peripheral surface, or a plurality of element patterns may be arranged in a direction parallel to the rotation center axis AX2001. In addition, a pattern for manufacturing a first element and a pattern for manufacturing a second element different from the first element may be provided on the cylindrical mask M.

[Component manufacturing method]

Next, the element manufacturing method will be described. FIG. 39 is a flowchart showing the device manufacturing method of this embodiment.

In the device manufacturing method shown in FIG. 39, first, for example, device function and performance design of a display panel such as a self-luminous device such as organic EL is performed, and necessary circuit patterns or wiring patterns are designed with CAD or the like (step 201). Next, according to the design of the pattern and other components of each layer designed by CAD or the like, the necessary mask M (cylindrical or planar) of each layer part is manufactured (step 202). In addition, by purchasing or manufacturing, etc., a substrate such as a transparent film or sheet that is an element substrate, or a very thin metal foil, or a flexible substrate (resin film, metal foil film, plastic Etc.) (step 203).

In addition, the reel-shaped substrate prepared in step 203 can also be modified on its surface as needed In addition, a base layer (for example, micro unevenness formed by imprinting method) is formed in advance, and a functional film or a transparent film (insulating material) having a photosensitivity is previously deposited.

Next, the prepared substrate is put into a reel-type or batch-type manufacturing line, and electrodes, wires, insulating films, semiconductor films (thin-film semiconductors), and other TFTs that constitute elements such as display panel elements are formed on the substrate. The base layer forms a light emitting layer of a self-luminous element such as an organic EL as a display pixel portion so as to be laminated on the base layer (step 204). Step 204 typically includes a step of forming a resist pattern on a film on the substrate, and a step of etching the film using the resist pattern as a photomask. The formation of the resist pattern is to perform the step of uniformly forming the resist film on the surface of the substrate, and to expose the resist film of the substrate with the exposure light patterned through the mask M according to the above embodiments Step: a step of forming a latent image with a mask pattern by this exposure.

In the case of manufacturing a flexible element using printing technology, etc., it is a step of forming a functional photosensitive layer (photosensitive silane coupling material) by coating on the surface of the substrate. According to the above embodiments, the photomask M will be used. The patterned exposure light is irradiated to the functional photosensitive layer, and the functional photosensitive layer is formed with a hydrophilic part and a water-repellent part to form a pattern according to the shape of the pattern. The exposure step of the functional sexy layer is highly hydrophilic. The step of partially coating the plating base liquid and the like and forming a metallic pattern by electroless plating.

In addition, in this step 204, although it also includes a conventional lithography step for exposing the photoresist layer using the exposure device described in the previous embodiments, it also includes pattern exposure of the photo-sensitive catalyst layer. Processes such as the wet step of forming a pattern (wiring, electrode, etc.) of a metal film by electrolytic plating method, or the printing step of drawing a pattern with conductive ink containing silver nanoparticles.

Secondly, according to the manufactured elements, each of the display elements continuously manufactured on the long substrate by, for example, a reel method, implements cutting or cutting of the substrate, or other substrates to be manufactured in other steps, such as a protective film (for Environmental shielding layer), a sheet-shaped color filter with a sealing function, or a thin glass substrate, etc., are attached to the surface of each display panel element to assemble the element (step 205). Secondly, whether the display panel components function normally or whether they satisfy the desired performance Or post-processing (steps) for component inspection such as characteristics or characteristics (step 206). In the above manner, components such as display panels (flexible displays) can be manufactured.

In addition, the technical scope of the present invention is not limited to those in the above-described embodiments or modifications. For example, one or more of the constituent elements described in the above embodiment or modification may be omitted. In addition, the constituent elements described in the above embodiment or modification may be combined as appropriate.

Claims (6)

A cylindrical reticle exposure device by rotating a long cylindrical substrate along the first center line while rotating a cylindrical reticle having a cylindrical pattern surface with a predetermined radius from the first center line Moving in the longitudinal direction, projecting and exposing the mask pattern formed on the pattern surface of the cylindrical mask on the sheet substrate, comprising: a rotating reel, having a second center parallel to the first center line The line is formed into a cylindrical outer peripheral surface with a predetermined radius, while supporting a part of the longitudinal direction of the sheet substrate on the outer peripheral surface into a cylindrical shape, while rotating around the second center line to rotate the sheet shape The substrate is transferred in the aforementioned long direction; and a projection optical system, which is composed of a first optical system and a second optical system, the first optical system is incident on the pattern surface that illuminates the illumination light on the cylindrical mask When a part of the illumination area is set, the imaging beam generated from the illumination area forms an intermediate image of the mask pattern, and the second optical system directs the imaging beam that becomes the intermediate image before being supported by the rotating reel A projection area set on a part of the surface of the sheet substrate is projected, and the intermediate image is re-imaged on the sheet substrate; the projection optics includes: a first deflecting member, which includes the first center line and the first 2 When the plane of the center line is used as the center plane, the first chief ray that travels in the normal direction of the illumination area through the center of the illumination area among the chief rays of the imaging beam is relative to the center plane at the cylindrical mask The imaging beam with a predetermined tilt angle in the circumferential direction is deflected toward the first optical system; and the second deflection member uses the imaging when the plane including the first centerline and the second centerline is used as the center plane Among the chief rays of the light beam, passing through the center of the projection area, the second chief ray traveling in the normal direction of the projection area becomes a predetermined inclination angle with respect to the center plane in the circumferential direction of the rotating reel, so that The aforementioned imaging beam projected by the optical system is deflected. A cylindrical reticle exposure device as claimed in item 1 of the patent application, wherein the first optical system of the projection optical system is configured to have a first optical axis perpendicular to the central plane and enter the first deflecting member The deflected imaging light beam forms the intermediate image; the second optical system of the projection optical system is configured to have a second optical axis perpendicular to the central plane, and by entering the imaging light beam that becomes the intermediate image Projecting onto the second deflection member, thereby re-imaging the intermediate image in the projection area; in a plane perpendicular to the first centerline and the second centerline, the first optical axis and the first principal ray The angle formed is set to an obtuse angle of 90 ° or more, and the angle formed by the second optical axis and the second chief ray is set to an obtuse angle of 90 ° or more. According to the cylindrical mask exposure device of claim 2 of the patent scope, the projection optical system projects the image of the pattern appearing in the illumination area in the projection area at an equal magnification, and the first light The obtuse angle between the axis and the first principal ray 90 ° or more and the obtuse angle between the second optical axis and the second principal ray 90 ° or more are set equal. A cylindrical mask exposure device as claimed in item 3 of the patent scope, wherein the projection optics includes a first projection module disposed on one side of the center plane and on the other side of the center plane The second projection module of the first projection module is arranged symmetrically; the first projection module and the second projection module are separately arranged in the direction of the first center line or the second center line, and the cylinder Each pattern formed in different areas in the direction of the first center line in the pattern surface of the photomask is simultaneously projected onto the sheet substrate. The cylindrical reticle exposure device according to any one of claims 1 to 4, wherein the cylindrical reticle is a reflective reticle; and is provided with: a polarizing beam splitter disposed in the aforementioned projection optical system The optical path of the imaging beam between the first deflection member and the illumination area on the pattern surface of the cylindrical reticle enters the linearly polarized illumination light and reflects toward the illumination area, and causes the imaging reflected in the illumination area Beam transmission. The cylindrical mask exposure apparatus according to any one of the items 1 to 4 of the patent application scope, wherein the radius of the outer peripheral surface of the rotating reel and the pattern surface radius of the cylindrical mask are set to the first state And either of the second states in which the surface radius of the sheet substrate supported by the outer peripheral surface of the rotating reel in a cylindrical shape and the pattern surface radius of the cylindrical mask are the same.