CN107247388B - Exposure device, device inspection apparatus and device making method - Google Patents

Exposure device, device inspection apparatus and device making method Download PDF

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Publication number
CN107247388B
CN107247388B CN201710421666.8A CN201710421666A CN107247388B CN 107247388 B CN107247388 B CN 107247388B CN 201710421666 A CN201710421666 A CN 201710421666A CN 107247388 B CN107247388 B CN 107247388B
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Prior art keywords
light
substrate
projected
optical system
projection
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CN107247388A (en
Inventor
加藤正纪
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lenses (AREA)
  • Microscoopes, Condenser (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

Have：Projection optical system (PL), make the imaging of the 1st projected light beam (EL2a) from light shield (M) and form intermediary image, make the 2nd projected light beam (EL2b) of the intermediate image plane (P7) for carrying out self-forming intermediary image on substrate (P) reimaging and form projection image；The light quantity in light quantity reduction portion, the leak light being projected on substrate (P) that will be generated from the 1st projected light (EL2a) is reduced, and projection optical system (PL) has：Partial optical system (61) makes the 1st projected light (EL2a) from light shield (M) be imaged and is projected to intermediate image plane (P7)；Reflective optics (62), the 1st projected light (EL2a) that will be projected from partial optical system (61) is guided to intermediate image plane (P7), and the 2nd projected light (EL2b) that will come from intermediate image plane (P7) is guided to partial optical system (61), partial optical system (61) makes the 2nd projected light (EL2b) reimaging from intermediate image plane (P2) and forms projection image on substrate (P).

Description

Exposure device, device inspection apparatus and device making method
The present patent application be international filing date be on November 29th, 2013, international application no PCT/JP2013/082185, National application number into National Phase in China is 201380066736.2, entitled " substrate board treatment, device manufacture The divisional application of the patent application of system and device making method ".
Technical field
The present invention relates to substrate board treatment, device inspection apparatus and device making methods.
Background technology
In the past, as substrate board treatment, it is known that configured with projection optical system between light shield and plate (substrate) Exposure device (for example, referring to patent document 1).The projection optical system includes lens group, plane mirror, two polarised lights point Beam device, two speculums, the wave plates of λ/4 and field stop and constitute.In the exposure device, projected light is exposed to via light shield The projected light of the S-polarization light of system is reflected by the polarising beam splitter of a side.The projected light of the S-polarization light reflected is from λ/4 Wave plate passes through to be converted to circularly polarized light.The projected light of circularly polarized light reflexes to plane mirror by lens group.It is anti- The projected light for the circularly polarized light penetrated passes through from the wave plates of λ/4 to be converted to P polarization light.The projected light of P polarization light is from another party's Polarising beam splitter penetrates, and is reflected by the speculum of a side.The projected light of the P polarization light reflected by the speculum of a side is in visual field Intermediary image is formed in diaphragm.From field stop by the projected light of P polarization light reflected by the speculum of another party, it is incident again To the polarising beam splitter of a side.The projected light of P polarization light is penetrated from the polarising beam splitter of a side.P polarization light through after Projected light pass through from the wave plates of λ/4 to be converted to circularly polarized light.The projected light of circularly polarized light passes through from lens group, and by plane Speculum reflects.The projected light of the circularly polarized light reflected passes through from the wave plates of λ/4 to be converted to S-polarization light.The throwing of S-polarization light Shadow light is reflected and reached on plate by the polarising beam splitter of another party.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 8-64501 bulletins
Invention content
Here, a part for the projected light for reflecting and penetrating in polarising beam splitter becomes leak light.That is, in polarised light point The part separation of the projected light reflected in beam device, the part of the projected light of separation is as leak light and from polarising beam splitter Through, or the projected light that is penetrated in polarising beam splitter part separation, a part for the projected light of separation becomes leakage Light is reflected by polarising beam splitter.In this case, it has leak light to be imaged on substrate, to be formed not on substrate The possibility of good picture.In this case, on substrate, projection image is formed by projected light, is formed not by leak light Good picture, so having the possibility as double exposure.
The scheme of the invention is completed in view of the above subject, it is intended that providing a kind of substrate board treatment, device Part manufacture system and device making method can reduce leak light to being formed in the influence of the projection image on substrate, and will project As being suitably projected on substrate.
1st mode according to the present invention, provides a kind of substrate board treatment, has：Projection optical system, by coming from 1st projected light of the pattern of light shield component and the intermediary image that the pattern is formed in defined intermediate image plane, so that from described The 2nd projected light that intermediate image plane is advanced to defined substrate is turned back from the projection optical system by way of again, to The projection image of the intermediary image reimaging is formed on the substrate；And light quantity reduction portion, by the one of the 1st projected light Part is projected to the light quantity on the substrate as leak light and reduces, and the projection optical system has：Incidence is from described The 1st projected light of pattern and the partial optical system for forming the intermediary image；And light guide optical system, it will be from described The 1st projected light that partial optical system projects is guided to the intermediate image plane, and will be from described in the intermediate image plane 2nd projected light is redirected to the partial optical system, and the partial optical system makes from described in the intermediate image plane 2nd projected light reimaging, and the projection image is formed on the substrate.
In the above method, can also be that the partial optical system includes：It is thrown for the 1st projected light and the described 2nd The lenticular unit of shadow light incidence, and the 1st projected light for having passed through the lenticular unit and the described 2nd are projected into light reflection Reflection optics, the 1st projected light from the pattern is incident to the lenticular unit, by the reflection optics After reflection, projected from the lenticular unit, and reach the intermediate image plane, the 2nd projected light from the intermediate image plane It is incident to the lenticular unit, after being reflected by the reflection optics, is projected from the lenticular unit, and reach the substrate On, light quantity reduction portion is the light guide optical system, and light quantity reduction portion includes：Make described from the pattern 1 projected light is incident to the 1st optical component of the lenticular unit；The 1st projected light projected from the lenticular unit is set to enter It is incident upon the 2nd optical component of the intermediate image plane；The 2nd projected light from the intermediate image plane is set to be incident to the lens 3rd optical component of component；The 2nd projected light projected from the lenticular unit is set to be incident to the 4th light on the substrate Department of the Chinese Academy of Sciences's part, light quantity reduction portion make the 1st incident visual field of the 1st projected light for being incident to the lenticular unit, from described 1st outgoing visual field of the 1st projected light that lenticular unit projects, the 2nd projected light for being incident to the lenticular unit 2nd incident visual field, the 2nd outgoing visual field of the 2nd projected light projected from the lenticular unit are separated from each other.
In the above method, can also be that light quantity reduction portion makes the throwing formed by the 2nd projected light The image space of image is different with the image space of the bad picture formed by a part of leak light of the 1st projected light.
In the above method, can also be that the partial optical system includes：It is thrown for the 1st projected light and the described 2nd The lenticular unit of shadow light incidence, and the 1st projected light for having passed through the lenticular unit and the described 2nd are projected into light reflection Reflection optics, the 1st projected light from the pattern is incident to the lenticular unit, by the reflection optics After reflection, projected from the lenticular unit, and reach the intermediate image plane, the 2nd projected light from the intermediate image plane It is incident to the lenticular unit, after being reflected by the reflection optics, is projected from the lenticular unit, and reach the substrate On, light quantity reduction portion is the light guide optical system, and light quantity reduction portion includes：1st polarising beam splitter, the 1st Polarising beam splitter makes the 1st projection light reflection from the pattern and is incident to the lenticular unit, and makes to come from institute The 2nd projected light for stating intermediate image plane penetrates and is incident to the lenticular unit；Wave plate, the wave plate make from the 1st polarization The 1st projected light and the 2nd projection light polarization that beam splitter projects；2nd polarising beam splitter, the 2nd polarised light point Beam device makes to project from the lenticular unit and is penetrated by the 1st projected light of the wave plate by be incident to the intermediary image Face, and make to project from the lenticular unit and by the 2nd projection light reflection of the wave plate towards on the substrate； 1st optical component, it is described that the 1st optical component makes the 1st projected light for having penetrated the 2nd polarising beam splitter be incident to Intermediate image plane；2nd optical component, it is described that the 2nd optical component makes the 2nd projected light from the intermediate image plane be incident to 1st polarising beam splitter；And the 1st barn door, the 1st barn door be set to the 2nd polarising beam splitter and the substrate it Between, light quantity reduction portion makes to be formed in the base by the 2nd projected light by being reflected by the 2nd polarising beam splitter The image space of the image space of the projection image on plate and the bad picture is on the scanning direction for making the substrate scanning Difference, it is described it is bad seem by not from the 2nd polarising beam splitter through by reflected by the 2nd polarising beam splitter A part of leak light of 1st projected light and form picture on the substrate, the 1st barn door is set to will be from described the The position that the leak light of 2 polarising beam splitters towards the substrate is blocked.
In the above method, can also be, light quantity reduction portion also include the 2nd barn door, the 2nd barn door block from The leak light of 1st polarising beam splitter towards the 2nd polarising beam splitter.
In the above method, can also be that the partial optical system includes：It is thrown for the 1st projected light and the described 2nd The lenticular unit of shadow light incidence, and the 1st projected light for having passed through the lenticular unit and the described 2nd are projected into light reflection Reflection optics, the 1st projected light from the pattern is incident to the lenticular unit, by the reflection optics After reflection, projected from the lenticular unit, and reach the intermediate image plane, the 2nd projected light from the intermediate image plane It is incident to the lenticular unit, after being reflected by the reflection optics, is projected from the lenticular unit, and reach the substrate On, light quantity reduction portion is the light guide optical system, and light quantity reduction portion includes：1st polarising beam splitter, the 1st Polarising beam splitter makes the 1st projection light reflection from the pattern and is incident to the lenticular unit, and makes to come from institute The 2nd projected light for stating intermediate image plane penetrates and is incident to the lenticular unit；Wave plate, the wave plate make from the 1st polarization The 1st projected light and the 2nd projection light polarization that beam splitter projects；2nd polarising beam splitter, the 2nd polarised light point Beam device makes to project from the lenticular unit and is penetrated by the 1st projected light of the wave plate by be incident to the intermediary image Face, and make to project from the lenticular unit and by the 2nd projection light reflection of the wave plate towards on the substrate； 1st optical component, it is described that the 1st optical component makes the 1st projected light for having penetrated the 2nd polarising beam splitter be incident to Intermediate image plane；And the 2nd optical component, the 2nd optical component make the 2nd projected light from the intermediate image plane be incident to 1st polarising beam splitter, light quantity reduction portion are projected by the reflected by the 2nd polarising beam splitter the described 2nd Light and form the image space of the projection image on the substrate and the image space of the bad picture in the depth of focus It is different on direction, it is described it is bad seem by from the 2nd polarising beam splitter through by by the 2nd polarising beam splitter A part of leak light of the 1st projected light of reflection is formed by picture.
In the above method, can also be, from the pattern to the 1st projected light of the 1st polarising beam splitter Light path than the 1st projected light from the 2nd polarising beam splitter to the intermediate image plane optical path length.
In the above method, can also be that the substrate is scanned relative to the projection image, and the projection image is limited In length and the width direction for being orthogonal to the scanning direction of the scanning direction for making substrate scanning length ratio, sweep The length for retouching the length/width direction in direction is 1/4 or less such elongated region.
In the above method, can also be that also there is the lamp optical system for guiding illumination light to the light shield component, The illumination light is laser.
In the above method, it can also be, also there is the light shield holding member for keeping the light shield component and pass through bearing The substrate supporting component of substrate described in surface bearing, the pattern plane of the light shield component is with bent as the 1st centered on the 1st axis 1st periphery of rate radius, the bearing surface of the substrate supporting component have and become the 2nd curvature centered on the 2nd axis 2nd periphery of radius, the 1st axis is parallel with the 2nd axis, the projection optical system and is configured at the pattern plane Multiple illumination regions are correspondingly provided with multiple, and multiple projection optical systems are by multiple photographs from the pattern plane Multiple 1st projected lights in area pellucida domain are guided to multiple intermediate image planes, will be from the multiple of multiple intermediate image planes Multiple view fields guiding of 2nd projected light to configuration on the substrate, in multiple projection optical systems along institute The circumferential direction for stating light shield component is configured to view field's phase of substrate described in 2 row and each projection optical system side by side For the pattern plane the illumination region in the case of circumferential offset, the light shield holding member and the substrate supporting In component, the 2nd axis becomes with the view field relative to the illumination region relative to the position of the 1st axis in week Upward offset correspondingly different position, will be in the illumination region corresponding with the 1st row projection optical system The center of the heart and the illumination region corresponding with the 2nd row projection optical system links along the circumferential direction of the light shield component The perimeter come, with arranging the projection by the center of the view field corresponding with the 1st row projection optical system and with the 2nd The identical length of Zhou Changwei that the center of the corresponding view field of optical system is linked up along the circumferential direction of the substrate.
2nd mode according to the present invention, provides a kind of device inspection apparatus, has：At the substrate of the 1st mode of the present invention Manage device；The substrate feeding device of aforesaid substrate is supplied to aforesaid substrate processing unit.
3rd mode according to the present invention, provides a kind of device making method, including：Use the base of the 1st mode of the present invention Plate processing unit carries out projection exposure to aforesaid substrate；Above-mentioned light shield portion is formed through the aforesaid substrate of projection exposure by processing The pattern of part.
4th mode according to the present invention, provides a kind of substrate board treatment, by the visual field area of the slit-shaped on object plane The light beam projecting of pattern in domain, which is exposed to, to be exposed on body, and the substrate board treatment has：Projection optical system, it includes Make the imaging lens group of the light beam incidence of the pattern in the field of view and is configured at the light of the imaging lens group The speculum of pupil face or pupil plane neighbouring position, by the speculum make the light beam from the field of view towards it is described at As being reflected with lens group, the image planes with field of view conjugation are formed in the object plane side；And folding mirrors, by institute Field of view configuration is stated along comprising the object plane or the image planes and the benchmark that intersects with the optical axis of the projection optical system 1st position in face, make the intermediary image of the slit-shaped for the field of view being initially imaged by the projection optical system about It is configured the different with the 1st position the 2nd from width direction that the long side direction of the slit intersects along the reference plane Position makes the light beam of the generation intermediary image with from the width direction and the described 1st about the slit along the reference plane The 3rd all different position of either one or two of position and the 2nd position is and towards by way of the projection optical system is turned back Reflection forms the projection image being optically conjugated with the intermediary image by the projection optical system.
In the above method, can also be that the projection optical system includes：1st reflection component, the 1st reflection component The 1st light beam of the pattern in the field of view of the slit-shaped on the object plane is set to reflect and be incident to the imaging and use Lens group；2nd reflection component, the 2nd reflection component make to project from the projection optical system to generate the projection image The 2nd light beam be exposed on body and reflect described in, the reflective portion of the 1st light beam of the 1st reflection component and described The reflective portion of the 2nd light beam of 2nd reflection component in the width direction along the slit of the reference plane discretely Configuration.
In the above method, can also be that the folding mirrors have：3rd reflecting part, the 3rd reflecting part is for life The light beam projected from the projection optical system is set to be reflected along the direction of the reference plane at the intermediary image；4th is anti- Portion is penetrated, the 4th reflecting part makes the light beam reflected by the 3rd reflecting part be reflected towards the projection optical system, and the described 3rd Either one of reflecting part and the 4th reflecting part are configured at the 1st reflection component about the direction along the reference plane Between reflective portion and the reflective portion of the 2nd reflection component.
In the above method, can also be each reflective portion for making the 1st reflection component and the 2nd reflection component Position and the 3rd reflecting part of the folding mirrors and each position of the 4th reflecting part about the projection optics The direction of the optical axis of system is different.
In the above method, can also be the reflection of the reflective portion, the 2nd reflection component of the 1st reflection component Partly and the 3rd reflecting part of the folding mirrors and the 4th reflecting part be all formed as with described in the slit-shaped Field of view corresponds to such rectangle, and the width direction about the slit along the reference plane is matched separated from each other It sets.
In the above method, can also be that the 1st reflection component and the 2nd reflection component are by polarising beam splitter It constitutes.
Invention effect
Mode according to the present invention provides substrate board treatment, device inspection apparatus and device making method, can reduce It is projected to the light quantity of the leak light on substrate, projection image is made suitably to project on substrate.
Description of the drawings
Fig. 1 is the figure of the composition for the device inspection apparatus for indicating the 1st embodiment.
Fig. 2 is the figure of the overall structure for the exposure device (substrate board treatment) for indicating the 1st embodiment.
Fig. 3 is the figure of the illumination region for indicating exposure device shown in Fig. 2 and the configuration of view field.
Fig. 4 is the figure of the composition of the lamp optical system and projection optical system that indicate exposure device shown in Fig. 2.
Fig. 5 is the figure that the circular full imaging viewing field based on Projection optics is unfolded on the faces YZ.
Fig. 6 is the flow chart for the device making method for indicating the 1st embodiment.
Fig. 7 is the figure of the lamp optical system for the exposure device for indicating the 2nd embodiment and the composition of projection optical system.
Fig. 8 is the figure of the composition of the projection optical system for the exposure device for indicating the 3rd embodiment.
Fig. 9 is the figure of the overall structure for the exposure device (substrate board treatment) for indicating the 4th embodiment.
Specific implementation mode
Mode for carrying out the present invention (embodiment) is described in detail with reference to attached drawing.The present invention is not by following Embodiment recorded in content limit.It can be easy in addition, the inscape recorded below includes those skilled in the art The element and substantially the same element expected.Moreover, following recorded inscape can be appropriately combined.In addition, not Various inscapes can be omitted, replace or change in the range of disengaging present inventive concept.
[the 1st embodiment]
The substrate board treatment of 1st embodiment is the exposure device for implementing exposure-processed to substrate, and exposure device is by group It manufactures in the device inspection apparatus of device mounted in implementing various processing to the substrate after exposure.First, to device inspection apparatus It illustrates.
＜ device inspection apparatus ＞
Fig. 1 is the figure of the composition for the device inspection apparatus for indicating the 1st embodiment.Device inspection apparatus 1 shown in FIG. 1 is Manufacture the production line (flexible display production line) of the flexible display as device.As flexible display, for example, it is organic EL display etc..The device inspection apparatus 1 is to send out the substrate with roller FR1 from the supply that flexible substrate P is wound into roll P, and after continuously implementing various processing to the substrate P of submitting, will treated that substrate P is wound in as flexible device Roller FR2, so-called roll-to-roll (the Roll to Roll) mode of recycling.In the device inspection apparatus 1 of the 1st embodiment, show Go out the substrate P of the sheet material as film-form to be sent out from supply roller FR1, and the substrate P sent out with roller FR1 from supply is successively By n platform processing units U1, U2, U3, U4, U5 ... examples of the Un until being wound in recycling roller FR2.First, to making Substrate P for the process object of device inspection apparatus 1 illustrates.
Substrate P is such as the foil (foil) etc. formed using resin film, the metal or alloy by stainless steel.It is thin as resin The material of film, such as include polyvinyl resin, acrylic resin, polyester resin, ethylene-vinyl alcohol copolymer resin, polyvinyl chloride Resin, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate One or more of resin.
Preferably, the less significantly big material of for example selected coefficient of thermal expansion of substrate P, so that can actually neglect The deflection for being heated and generating in the various processing that apparent implements substrate P.Coefficient of thermal expansion for example can be by filling out by inorganic Material is mixed in resin film and is set as smaller than threshold value corresponding with technological temperature etc..Inorganic filler for example can be oxidation Titanium, zinc oxide, aluminium oxide, silica etc..In addition, it is 100 μm or so that substrate P, which can be by the thickness of the manufactures such as float method, The individual layers of very thin glass can also be to paste laminated body made of above-mentioned resin film, foil etc. on the very thin glass.
The substrate P constituted in this way is wound into roll into roller FR1, the supply are installed in device with roller FR1 for the supply Part manufacture system 1.The device inspection apparatus 1 of supply roller FR1 is installed, the substrate P sent out from supply roller FR1 is repeated to hold Various processing of the row for manufacturing device.Therefore, substrate P that treated becomes the state that multiple devices are connected.That is, from Supply becomes the substrate of more than one piece processing simultaneously with the substrate P that roller FR1 is sent out.In addition, substrate P can be as defined in pre- first pass through Pre-treatment is modified its surface and makes the component of its activation, alternatively, can also be to be formed on the surface for precision The component of patterned fine next door construction (sag and swell).
Treated, and substrate P is wound into roll, to be recovered as recycling roller FR2.Recycling roller FR2 installations In cutter device (not shown).Be equipped with recycling roller FR2 cutter device will treated substrate P by each Device singulation (cutting) is to become multiple devices.The size of substrate P is, for example, that the size of width direction (direction for becoming short side) is 10cm The size of~2m or so, length direction (direction for becoming long side) are 10m or more.In addition, the size of substrate P be not limited to it is above-mentioned Size.
Next, referring to Fig.1, being illustrated to device inspection apparatus.In Fig. 1, X-direction, Y-direction and Z-direction are just The rectangular coordinate system of friendship.X-direction is in the horizontal plane by supply roller FR1 and the direction of recycling roller FR2 connections.Y-direction is The direction orthogonal with X-direction in the horizontal plane.Y-direction is supplied with the axis direction with roller FR1 and recycling roller FR2.Z-direction be with X-direction and the orthogonal direction (vertical direction) of Y-direction.
Device inspection apparatus 1 have supplying substrate P substrate feeding device 2, to by substrate feeding device 2 supply Lai base Plate P implements processing unit U1~Un of various processing, is recycled to the substrate P for implementing processing by processing unit U1~Un Substrate retracting device 4 and the host control device 5 that each device of device inspection apparatus 1 is controlled.
Supply roller FR1 can be revolvably installed in substrate feeding device 2.Substrate feeding device 2 has from installation The marginal position of the driven roller R1 of substrate P and the position in the width direction (Y-direction) of adjustment substrate P are sent out in supply with roller FR1 Controller EPC1.Driven roller R1 rotates while the front and back sides of substrate P are clamped, and substrate P is returned from supply roller FR1 directions It receives and is sent out with the conveyance direction of roller FR2, thus supply substrate P to processing unit U1~Un.At this moment, marginal position controller EPC1, so that substrate P is located at ± more than ten μm~tens μ in the position of the end (edge) of width direction relative to target location Mode in the range of m or so makes substrate P move in the direction of the width, the position in width direction to correct substrate P.
Recycling roller FR2 can be revolvably installed on substrate retracting device 4.Substrate retracting device 4 has and will handle Substrate P afterwards pulls to the side of the driven roller R2 of the sides recycling roller FR2 and the position in the width direction (Y-direction) of adjustment substrate P Edge positioner EPC2.Substrate retracting device 4 is rotated by driven roller R2 while the front and back sides of substrate P are clamped, will Substrate P pulls to conveyance direction and recycling roller FR2 is made to rotate, and thus winds substrate P.At this moment, marginal position controller EPC2 It is constituted in the same manner as marginal position controller EPC1, corrects the position in the width direction of substrate P, in order to avoid the width side of substrate P To end (edge) generate unevenness in the direction of the width.
Processing unit U1 is the surface that photonasty functional liquid is coated on to the substrate P come from the supply of substrate feeding device 2 Applying device.As photonasty functional liquid, resist, photonasty silane coupling agent material, UV solidified resin liquid can be used for example, The solution etc. of other photonasty plating catalysis.Processing unit U1 is equipped with successively since the upstream side of the conveyance direction of substrate P Applying mechanism Gp1 and drier Gp2.Applying mechanism Gp1 have make substrate P wind roller platen DR1 and with roller platen DR1 Opposite application roll DR2.Applying mechanism Gp1 passes through roller platen in the state that the substrate P being supplied to is wound in roller platen DR1 Substrate P is clamped in DR1 and application roll DR2.Moreover, applying mechanism Gp1 is made on one side by making roller platen DR1 and application roll DR2 rotate Substrate P is moved along conveyance direction, applies photonasty functional liquid by application roll DR2 on one side.Drier Gp2 blowout hot winds are dry The drying air such as dry air removes solute (solvent or water) contained in photonasty functional liquid, and makes to be coated with photonasty work( The substrate P drying of energy liquid, thus forms photonasty functional layer in substrate P.
Processing unit U2 is heating device, will be from order to make the photonasty functional layer on the surface for being formed in substrate P stablize The substrate P that reason device U1 is moved is heated to set point of temperature (for example, tens DEG C~120 DEG C degree).Processing unit U2 is from substrate P Conveyance direction upstream side start successively be equipped with heating chamber HA1 and cooling chamber HA2.Heating chamber HA1 is set inside it There are multiple rollers and multiple air turning-bars (air turn bar), multiple rollers and multiple air turning-bars to constitute the conveyance of substrate P Path.Multiple rollers are arranged in a manner of the back side of rotating contact substrate P, and multiple air turning-bars are set to base with not contact condition The surface side of plate P.Multiple rollers and multiple air turning-bars are and to form removing for snake shape to lengthen the transport path of substrate P Send the configuration in path.Out of heating chamber HA1 by one edge of substrate P crawl shape transport path by conveyance on one side heated To set point of temperature.Cooling chamber HA2 makes substrate P be cooled to environment temperature, so that the substrate P after heating chamber HA1 heating Temperature is consistent with the environment temperature of process (processing unit U3) later.Cooling chamber HA2 is equipped with multiple rollers inside it, with heating Similarly, multiple rollers are and to form the configuration of the transport path of snake shape to lengthen the transport path of substrate P to chamber HA1.From In cooling chamber HA2 by substrate P, the transport path of edge snake shape is transported to be cooled on one side.In cooling chamber HA2 Conveyance direction on downstream side, be equipped with driven roller R3, driven roller R3 be clamped on one side from cooling chamber HA2 pass through after substrate P It rotates, thus supplies substrate P towards processing unit U3 on one side.
Processing unit (substrate board treatment) U3 is exposure device, to forming thoughts from the surface that processing unit U2 supplies come The pattern of the circuit of display or wiring etc. is carried out projection exposure by substrate (sensitive substrate) P of photosensitiveness functional layer.In in detail Appearance is reserved for later described, and processing unit U3 irradiates illuminating bundle to the light shield M of reflection-type, and illuminating bundle is obtained by light shield M reflection Projected light beam projection exposure in substrate P.Processing unit U3, which has, send the substrate P come from processing unit U2 supplies to conveyance side To downstream side driven roller R4 and adjust substrate P width direction (Y-direction) on position marginal position controller EPC3.Driven roller R4 rotates while the front and back sides of substrate P are clamped, and substrate P is sent to the downstream side of conveyance direction, by This supplies substrate P towards exposure position.It constitutes, repaiies in the same manner as marginal position controller EPC3 and marginal position controller EPC1 Position in the width direction of positive substrate P, so that the width direction of the substrate P on exposure position becomes target location.In addition, place Managing device U3 has in the state of assigning slackness to the substrate P after exposure, and substrate P is sent to the downstream side of conveyance direction Two groups of driven rollers R5, R6.Two groups of driven rollers R5, R6 are spaced and configure as defined in being separated by the conveyance direction of substrate P.Driven roller R5 is clamped the upstream side of the substrate P of conveyance and rotates, and driven roller R6 is clamped the downstream side of the substrate P of conveyance and rotates, and thus will Substrate P is supplied towards processing unit U4.At this moment, since substrate P is endowed slackness, it can absorb and be leaned on than driven roller R6 The variation of conveyance speed caused by the downstream side of conveyance direction, to substrate caused by the variation so as to block conveyance speed The influence of the exposure-processed of P.In addition, in processing unit U3, in order to by the picture and substrate of a part for the mask pattern of light shield M The aligming microscope AM1 of alignment mark that P progress relatively aligns (alignment), and is previously formed in equipped with detection in substrate P etc., AM2。
Processing unit U4 is wet type processing device, to from the substrate P after the exposure that processing unit U3 is moved, carrying out wet Development treatment, electroless plating processing of formula etc..Processing unit U4 has inside it：3 be layered along vertical direction (Z-direction) A treatment trough BT1, BT2, BT3 and the multiple rollers for transporting substrate P.Multiple rollers with become substrate P successively from 3 treatment trough BT1, The inside of BT2, BT3 transport path by way of configure.Downstream side in the conveyance direction for the treatment of trough BT3 is equipped with and drives Dynamic roller R7, driven roller R7 on one side be clamped from treatment trough BT3 pass through after substrate P while rotate, thus substrate P is filled towards processing Set U5 supplies.
Though illustration omitted, processing unit U5 is drying device, is done to the substrate P moved from processing unit U4 It is dry.Moisture accompanying by the substrate P through wet processed in processing unit U4 is adjusted to defined water by processing unit U5 Divide content.Pass through several processing units by the substrate P that processing unit U5 is dried, is transported to processing unit Un.Moreover, After processing unit Un processing, substrate P is rolled by the recycling of substrate retracting device 4 with roller FR2.
Host control device 5 unites to substrate feeding device 2, substrate retracting device 4 and multiple processing unit U1~Un Include control.5 control base board feedway 2 of host control device and substrate retracting device 4, and make substrate P from substrate feeding device 2 It is transported towards substrate retracting device 4.In addition, host control device 5 on one side synchronizes the conveyance of substrate P, multiple places are controlled on one side Device U1~Un is managed, to execute the various processing to substrate P.
＜ exposure devices (substrate board treatment) ＞
Next, referring to Figure 2 to Figure 4, to the exposure device (processing substrate as processing unit U3 of the 1st embodiment Device) composition illustrate.Fig. 2 is the overall structure for the exposure device (substrate board treatment) for indicating the 1st embodiment Figure.Fig. 3 is the figure of the illumination region for indicating exposure device shown in Fig. 2 and the configuration of view field.Fig. 4 is indicated shown in Fig. 2 Exposure device lamp optical system and projection optical system composition figure.
Exposure device U3 as shown in Figure 2 is so-called scanning-exposure apparatus, on one side by substrate P along conveyance direction (scanning Direction) conveyance, will be formed on one side the mask pattern of the peripheral surface of cylindric light shield M as projection exposure to substrate P table Face.In addition, in Fig. 2 and Fig. 3, it is X-direction, Y-direction and the orthogonal rectangular coordinate system of Z-direction, becomes right angle identical with Fig. 1 Coordinate system.
First, it is illustrated about light shield used in exposure device U3 (light shield component) M.Light shield M is for example to use The light shield of the reflection-type of metal cylinder.Light shield M, which is formed in have, to be become the 1st axis AX1 extended along Y-direction as in The radius of curvature of the heart is the cylinder of the peripheral surface (periphery) of Rm, radially with certain wall thickness.The periphery of light shield M at To be formed with light shield face (pattern plane) P1 of defined mask pattern (pattern).Light shield face P1 includes with high efficiency to prescribed direction The high reflection portion of the reflected beams and not to prescribed direction the reflected beams or with the reflection suppression portion of poor efficiency reflection, mask pattern is logical Excessively high reflecting part and reflection suppression portion are formed.Since such light shield M is metal cylinder, so can be to make at a low price At, by using high-precision laser beam drawing apparatus, and can make mask pattern (other than the various patterns of panel, Also reference mark, the measuring scale of encoder etc. that can include contraposition) it is deliberately formed on cylindric peripheral surface.
In addition, light shield M both could be formed with the whole or part of panel pattern corresponding with a display device, It could be formed with panel pattern corresponding with multiple display devices.In addition, on light shield M, it both can be along around the 1st axis AX1's Multiple panel patterns circumferentially have been concatenated to form, can also be concatenated to form along the direction parallel with the 1st axis AX1 multiple small-sized Panel pattern.Moreover, light shield M can also be formed with panel pattern and size of the 1st display device etc. and the 1st display device The panel pattern of the 2nd different display devices.In addition, as long as light shield M has the radius of curvature centered on the 1st axis AX1 For the periphery of Rm, it is not limited to the shape of cylinder.For example, light shield M can also be the arc-shaped with periphery Plank.In addition, light shield M both can be lamellar, or laminal light shield M is made to be bent and there is periphery.
Next, being illustrated about exposure device U3 shown in Fig. 2.Exposure device U3 in addition to above-mentioned driven roller R4~ Other than R6, marginal position controller EPC3 and aligming microscope AM1, AM2, also there is light shield holding mechanism 11, substrate supporting machine Structure 12, lamp optical system IL, projection optical system PL, slave control device 16.Exposure device U3 passes through lamp optical system IL and projection optical system PL guide the illuminating bundle EL1 projected from light supply apparatus 13, to pass through light shield holding mechanism 11 The picture of the mask pattern of the light shield M of holding is projected to the substrate P supported by base supporting mechanism 12.
Slave control device 16 controls each section of exposure device U3, and each section is made to execute processing.Slave control device 16 Can be part or all of the host control device 5 of device inspection apparatus 1.In addition, slave control device 16 can also be It is generalized the control of control device 5, the device different from host control device 5.Slave control device 16 is for example comprising computer.
Light shield holding mechanism 11 has the light shield holding cylinder (light shield holding member) 21 for keeping light shield M and makes light shield holding cylinder 1st driving portion 22 of 21 rotations.Light shield holding cylinder 21 keeps light shield in such a way that the 1st axis AX1 of light shield M is as rotation center M.1st driving portion 22 is connect with slave control device 16, as rotation center rotates light shield holding cylinder 21 the 1st axis AX1.
In addition, light shield holding mechanism 11 keeps the light shield M of cylinder by light shield holding cylinder 21, but it is not limited to the structure At.Light shield holding mechanism 11 can also along the peripheral surface rolled sheet shape of light shield holding cylinder 21 light shield M and keep.In addition, Light shield holding mechanism 11 can also make the light shield M for forming pattern on the surface for the plank for being bent into arc-shaped be maintained at light shield holding The peripheral surface of cylinder 21.
The 2nd driving that base supporting mechanism 12 has the substrate supporting cylinder 25 of supporting substrates P, substrate supporting cylinder 25 is made to rotate Portion 26, a pair of air turning-bar ATB1, ATB2 and a pair of of guide reel 27,28.Substrate supporting cylinder 25 is formed to have will be along the side Y The cylindrical shape for the peripheral surface (periphery) that radius of curvature centered on to the 2nd axis AX2 of extension is Rfa.Here, the 1st axis AX1 is mutually parallel with the 2nd axis AX2, and by from the 1st axis AX1 and the 2nd axis AX2 by face centered on face CL.Substrate supporting cylinder A part for 25 periphery becomes the bearing surface P2 of supporting substrates P.That is, substrate supporting cylinder 25 makes substrate P wound on its bearing On the P2 of face, to supporting substrates P.2nd driving portion 26 is connect with slave control device 16, makes substrate supporting cylinder 25 with the 2nd axis AX2 It is rotated for rotation center.A pair of of air turning-bar ATB1, ATB2 clip substrate supporting cylinder 25, are respectively arranged on the conveyance of substrate P The upstream side and downstream side in direction.A pair of of air turning-bar ATB1, ATB2 are set to the surface side of substrate P, in the vertical direction (side Z To) on compared with the bearing surface P2 of substrate supporting cylinder 25 on the lower side configure.A pair of of guide reel 27,28 clips a pair of of air and turns to Bar ATB1, ATB2 are respectively arranged on the upstream side and downstream side of the conveyance direction of substrate P.A pair of of guide reel 27, one of 28 Guide reel 27 guides the substrate P moved from driven roller R4 to air turning-bar ATB1, another guide reel 28 will be from air The substrate P that turning-bar ATB2 is moved is guided to driven roller R5.
Therefore, the substrate P moved from driven roller R4 is guided to air by guide reel 27 and is turned by base supporting mechanism 12 To bar ATB1, the substrate P after passing through from air turning-bar ATB1 is directed into substrate supporting cylinder 25.Base supporting mechanism 12 passes through 2nd driving portion 26 and so that substrate supporting cylinder 25 is rotated, to which one side is directed by the bearing surface P2 bearing of substrate supporting cylinder 25 The substrate P of substrate supporting cylinder 25 is transported to air turning-bar ATB2 on one side.Base supporting mechanism 12 passes through air turning-bar ATB2 And conveyance to the substrate P of air turning-bar ATB2 is guided to guide reel 28, by the substrate P after passing through from guide reel 28 guide to Driven roller R5.
At this moment, the slave control device 16 being connect with the 1st driving portion 22 and the 2nd driving portion 26 makes light shield holding cylinder 21 and base Plate supports cylinder 25 with defined rotary speed than synchronous rotary, to be formed in light shield M light shield face P1 mask pattern picture Continuously projection exposure is (curved along periphery in the surface of the substrate P for the bearing surface P2 for being wound in substrate supporting cylinder 25 repeatedly Bent face).
Light supply apparatus 13 projects the illuminating bundle EL1 to light shield M illuminations.Light supply apparatus 13 has light source portion 31 and light guide section Part 32.Light source portion 31 is the light for the defined wavelength region that the exposure with the photonasty functional layer in substrate P matches, and is to project Photolytic activity acts on the light source of the light of strong ultraviolet region.As light source portion 31, such as open-wire line with ultraviolet region can be used The lamp sources such as the mercury vapor lamp of (g lines, h lines, i lines etc.), the laser two in wavelength 450nm ultraviolet regions below with oscillation peak The solid light sources such as pole pipe, light emitting diode (LED), or vibrate the KrF excimer laser (wavelength of extreme ultraviolet light (DUV light) 248nm), the gas laser sources such as ArF excimer laser (wavelength 193nm), XeCl excimer laser (wavelength 308nm).
Here, the illuminating bundle EL1 projected from light supply apparatus 13 is incident to aftermentioned polarising beam splitter PBS.In order to press down Make caused by polarising beam splitter PBS the separation of illuminating bundle EL1 due to the energy loss that generates, preferably illuminating bundle EL1 is Make the light beam of the incident substantially the entirety of reflections of illuminating bundle EL1 in polarising beam splitter PBS.Polarising beam splitter PBS makes into Light beam for the rectilinearly polarized light of S-polarization light reflects, and the light beam for becoming the rectilinearly polarized light of P polarization light penetrates.Therefore, light Preferably project following laser in the light source portion 31 of source device 13：The illuminating bundle EL1 for being incident to polarising beam splitter PBS is set to become straight The laser of the light beam of linearly polarized light (S-polarization light).In addition, due to laser energy density height, so can suitably ensure to project The illumination of light beam on to substrate P.
Light guide member 32 guides the illuminating bundle EL1 projected from light source portion 31 to lamp optical system IL.Light guide member 32 are made of optical fiber or the relay component (relay module) etc. for having used reflective mirror (mirror).In addition, equipped with multiple In the case of lamp optical system IL, light guide member 32 the illuminating bundle EL1 from light source portion 31 is separated into it is multiple, will be multiple Illuminating bundle EL1 is guided to multiple lamp optical system IL.In addition, in the feelings that the light beam for example projected from light source portion 31 is laser Under condition, light guide member 32 can also keep polarized wave optical fiber (polarization corrugated preserves optical fiber) to be used as optical fiber, be protected by polarized wave Holding optical fiber maintains the polarization state of laser constant and guide-lighting.
Here, as shown in Figure 3, the exposure device U3 of the 1st embodiment assumes that as the exposure of so-called poly-lens mode Electro-optical device.In addition, showing the illumination region IR on the light shield M that the light shield holding cylinder 21 from the sides-Z is kept in figure 3 Obtained from vertical view (left figure of Fig. 3) and the view field PA that is supported on from the sides+Z in the substrate P of substrate supporting cylinder 25 Obtained from vertical view (right figure of Fig. 3).The reference numeral Xs of Fig. 3 indicates the movement of light shield holding cylinder 21 and substrate supporting cylinder 25 Direction (direction of rotation).The exposure device U3 of poly-lens mode is to multiple (for example, 6 in the 1st embodiment on light shield M It is a) illumination region IR1~IR6 irradiates illuminating bundle EL1, each illuminating bundle EL1 quilt in each illumination region IR1~IR6 respectively Multiple (being, for example, 6 in the 1st embodiment) on multiple projected light beam EL2 projection exposures to substrate P obtained from reflection View field PA1~PA6.
First, it is illustrated about the multiple illumination region IR1~IR6 illuminated by lamp optical system IL.Such as Fig. 3 Shown in left figure, multiple illumination region IR1~IR6 clip median plane CL and are configured to 2 row along direction of rotation, the upstream in direction of rotation It is configured with the 1st illumination region IR1, the 3rd illumination region IR3 and the 5th illumination region IR5 of odd number on the light shield M of side, is revolving Turn the 2nd illumination region IR2, the 4th illumination region IR4 on the light shield M in the downstream side in direction configured with even number and the 6th illumination Region IR6.
Each illumination region IR1~IR6 is the parallel short side and long side extended with the axial direction (Y-direction) along light shield M The region of elongated trapezoidal (rectangle).At this moment, trapezoidal each illumination region IR1~IR6 is that its short side is located at the sides median plane CL, Long side is located at the region in outside.The 1st illumination region IR1, the 3rd illumination region IR3 and the 5th edges illumination region IR5 of odd number Interval configuration as defined in axially-spaced.In addition, the 2nd illumination region IR2, the 4th illumination region IR4 of even number and the 6th illumination Interval configuration as defined in region IR6 is axially spaced.At this moment, the 2nd illumination region IR2 in the axial direction, is configured at the 1st illumination region Between IR1 and the 3rd illumination region IR3.Similarly, the 3rd illumination region IR3 in the axial direction, be configured at the 2nd illumination region IR2 with Between 4th illumination region IR4.4th illumination region IR4 in the axial direction, is configured at the 3rd illumination region IR3 and the 5th illumination region Between IR5.5th illumination region IR5 in the axial direction, is configured between the 4th illumination region IR4 and the 6th illumination region IR6.It is each to shine The side that the triangular part in the bevel edge portion of the illumination region of adjacent trapezoidal overlaps when area pellucida domain IR1~IR6 is with from the circumferential direction of light shield M Formula (mode of overlapping (overlap)) configuration.In addition, in the 1st embodiment, each illumination region IR1~IR6 is set as step sector Domain can also be set as rectangular region.
It is formed with the pattern forming region A3 of mask pattern in addition, light shield M has and does not form the pattern of mask pattern Non-forming region domain A4.Pattern non-forming region domain A4 is the region for being difficult to reflect for absorbing illuminating bundle EL1, is configured to pattern shape It is surrounded at region A3 frame-shaped.1st~the 6th illumination region IR1~IR6 is with the entire of the Y-direction of overlay pattern forming region A3 The mode of width configures.
Lamp optical system IL and multiple illumination region IR1~IR6 are correspondingly provided with multiple (in the 1st embodiment For example, 6).Illuminating bundle EL1 from light supply apparatus 13 is incident to respectively in multiple lamp optical system IL1~IL6.Respectively Lamp optical system IL1~IL6 will be separately directed to each illumination region IR1 from the incident each illuminating bundle EL1 of light supply apparatus 13 ~IR6.That is, the 1st lamp optical system IL1 guides illuminating bundle EL1 to the 1st illumination region IR1, similarly, the 2nd~the 6th Lamp optical system IL2~IL6 guides illuminating bundle EL to the 2nd~the 6th illumination region IR2~IR6.Multiple illumination optical systems It is 2 row that system IL1~IL6, which clips median plane CL along the arranged circumferentially of light shield M,.Multiple lamp optical system IL1~IL6 clip center Face CL is being configured with the 1st lamp optical system configured with the 1st, the 3rd, the 5th sides illumination region IR1, IR3, IR5 (left side of Fig. 2) IL1, the 3rd lamp optical system IL3 and the 5th lamp optical system IL5.1st lamp optical system IL1, the 3rd lamp optical system IL3 and the 5th lamp optical system IL5 separates defined interval configuration along Y-direction.In addition, multiple lamp optical system IL1~ IL6 clips median plane CL, and the 2nd is being configured with configured with the 2nd, the 4th, the 6th sides illumination region IR2, IR4, IR6 (right side of Fig. 2) Lamp optical system IL2, the 4th lamp optical system IL4 and the 6th lamp optical system IL6.2nd lamp optical system IL2, the 4th Lamp optical system IL4 and the 6th lamp optical system IL6 separates defined interval configuration along Y-direction.At this moment, the 2nd light optics System IL2 in the axial direction, is configured between the 1st lamp optical system IL1 and the 3rd lamp optical system IL3.Similarly, the 3rd shines Bright optical system IL3 in the axial direction, is configured between the 2nd lamp optical system IL2 and the 4th lamp optical system IL4.4th shines Bright optical system IL4 in the axial direction, is configured between the 3rd lamp optical system IL3 and the 5th lamp optical system IL5.5th shines Bright optical system IL5 in the axial direction, is configured between the 4th lamp optical system IL4 and the 6th lamp optical system IL6.In addition, 1st lamp optical system IL1, the 3rd lamp optical system IL3 and the 5th lamp optical system IL5 and the 2nd lamp optical system IL2, the 4th lamp optical system IL4 and the 6th lamp optical system IL6 are symmetrically matched from the point of view of Y-direction centered on median plane CL It sets.
Next, with reference to Fig. 4, each lamp optical system IL1~IL6 is illustrated.In addition, due to each illumination optical system System IL1~IL6 is identical composition, so the 1st lamp optical system IL1 (hereinafter simply referred to as lamp optical system IL) is made It is illustrated for example.
Lamp optical system IL in order to uniform illumination illumination illumination region IR (the 1st illumination region IR1), use by The pupil location that the light source picture (real image or the virtual image) generated by light supply apparatus 13 is formed in lamp optical system IL (becomes with Fourier It is suitable to change face) Kohler illumination (Kohler illumination).In addition, lamp optical system IL is to have used polarised light Lighting system is penetrated in falling for beam splitter PBS.Lamp optical system IL from the light incident side of the illuminating bundle EL1 from light supply apparatus 13 according to It is secondary that there is illumination optics ILM, polarising beam splitter PBS, quarter wave plate 41.
As shown in figure 4, illumination optics ILM includes collimation lens 51, compound eye successively from the light incident side of illuminating bundle EL1 Lens 52, multiple collector lenses 53, cylindrical lens 54, illuminated field diaphragm 55, multiple relay lens 56, and it is set to the 1st optical axis On BX1.Collimation lens 51 is set to the exiting side of the light guide member 32 of light supply apparatus 13.The optical axis of collimation lens 51 is configured the 1st On optical axis BX.The face that collimation lens 51 irradiates the light incident side of fly's-eye lens 52 is whole.Fly's-eye lens 52 is set to collimation lens 51 Exiting side.The center configuration in the face of the exiting side of fly's-eye lens 52 is on the 1st optical axis BX1.It is made of multiple rod-shaped lens etc. The illuminating bundle EL1 of fly's-eye lens self-focus lens in 52 future 51 presses each rod-shaped lens sectionalization, keeps multiple point light source pictures (poly- Luminous point) be created on fly's-eye lens 52 exiting side face, and as being entered by the illuminating bundle EL1 after rod-shaped lens sectionalization It is incident upon collector lens 53.At this moment, the face for generating the exiting side of the fly's-eye lens 52 of point light source picture is configured to：By from fly's-eye lens 52 reach the various lens of the 1st concave mirror 72 of aftermentioned projection optical system PL via illuminated field diaphragm 55, and with it is the 1st recessed The pupil plane optical conjugate for the projection optical system PL (PLM) that the reflecting surface of face mirror 72 is located at.Collector lens 53 is set to compound eye The exiting side of lens 52.The optical axis of collector lens 53 configures on the 1st optical axis BX1.Collector lens 53 makes to come from fly's-eye lens 52 Illuminating bundle EL1 be gathered on cylindrical lens 54.Cylindrical lens 54 be light incident side be plane, exiting side is convex piano convex cylindrical Lens.Cylindrical lens 54 is set to the exiting side of collector lens 53.The optical axis of cylindrical lens 54 configures on the 1st optical axis BX1.Cylinder Lens 54 make illuminating bundle EL1 in the faces XZ along the directional divergence orthogonal with the 1st optical axis BX1.Illuminated field diaphragm 55 and cylinder The exiting side of lens 54 is disposed adjacent.The opening portion of illuminated field diaphragm 55 is formed as the ladder of shape identical with illumination region IR Shape or rectangle, the center configuration of the opening portion of illuminated field diaphragm 55 is on the 1st optical axis BX1.At this moment, illuminated field diaphragm 55 By configured from illuminated field diaphragm 55 to the various lens of light shield M with the illumination region IR optical conjugates on light shield M Face.Relay lens 56 is set to the exiting side of illuminated field diaphragm 55.The optical axis of relay lens 56 configures on the 1st optical axis BX1.In The illuminating bundle EL1 from illuminated field diaphragm 55 is set to be incident in polarising beam splitter PBS after lens 56.
After illuminating bundle EL1 is incident to illumination optics ILM, illuminating bundle EL1 becomes by collimation lens 51 Irradiate the light beam of the face entirety of the light incident side of fly's-eye lens 52.The illuminating bundle EL1 after fly's-eye lens 52 is incident to as coming from The illuminating bundle EL1 of each of multiple point light source pictures, and it is incident to cylindrical lens 54 via collector lens 53.It is incident to cylinder The illuminating bundle EL1 of lens 54 is in the faces XZ along the directional divergence orthogonal with the 1st optical axis BX1.It is dissipated by cylindrical lens 54 Illuminating bundle EL1 be incident to illuminated field diaphragm 55.The illuminating bundle EL1 after illuminated field diaphragm 55 is incident to regard from illumination The opening portion of field diaphragm 55 passes through, to the light beam as the intensity distribution with shape identical with illumination region IR.From photograph Illuminating bundle EL1 after photopic vision field diaphragm 55 passes through is incident to polarising beam splitter PBS via relay lens 56.
Polarising beam splitter PBS is configured at about X-direction between illumination optics ILM and median plane CL.Polarised light Beam splitter PBS is matched with quarter wave plate 41, on the other hand the illuminating bundle EL1 reflections from illumination optics ILM are made It is penetrated by the projected light beam EL2 after light shield M reflection.In other words, the illuminating bundle EL1 from illumination optics ILM is as anti- Irradiating light beam is incident to polarising beam splitter PBS, and projected light beam (reflected light) EL2 from light shield M is used as and is incident to through light beam Polarising beam splitter PBS.That is, the illuminating bundle EL1 for being incident to polarising beam splitter PBS is the linear polarization as S-polarization light The reflected beams of light, the projected light beam EL2 for being incident to polarising beam splitter PBS are the saturating of the rectilinearly polarized light as P polarization light Cross light beam.
As shown in figure 4, polarising beam splitter PBS has the 1st prism 91, the 2nd prism 92, is set to the 1st prism 91 and the 2nd rib Polarised light parting surface 93 between mirror 92.1st prism 91 and the 2nd prism 92 are made of quartz glass, become triangle in the faces XZ The triangular prism of shape.Then, polarising beam splitter PBS clips polarization by the 1st prism 91 of triangle and the 2nd prism 92 Light parting surface 93 engages, and becomes quadrilateral shape in the faces XZ.
1st prism 91 is the prism of illuminating bundle EL1 and projected light beam EL2 institutes light incident side.2nd prism 92 is from polarised light The prism for the side emitted by projected light beam EL2 that parting surface 93 penetrates.It is incident to polarised light parting surface 93 from 91 court of the 1st prism To the illuminating bundle EL1 and projected light beam EL2 of the 2nd prism 92.Polarised light parting surface 93 reflects S-polarization light (rectilinearly polarized light) Illuminating bundle EL1, and the projected light beam EL2 of P polarization light (rectilinearly polarized light) is made to penetrate.
Quarter wave plate 41 is configured between polarising beam splitter PBS and light shield M.Quarter wave plate 41 makes by polarising beam splitter The illuminating bundle EL1 of PBS reflection is converted to circularly polarized light from rectilinearly polarized light (S-polarization light).Be converted to the illumination of circularly polarized light Light beam EL1 exposes to light shield M.It is inclined that quarter wave plate 41 makes the projected light beam EL2 by the circularly polarized light of light shield M reflection be converted to straight line Shake light (P polarization light).
Next, being illustrated about the multiple view field PA1~PA6 for being projected optical system PL projection exposures.Such as Shown in the right figure of Fig. 3, multiple view field PA1~PA6 in substrate P and multiple illumination region IR1~IR6 phases on light shield M Corresponding configuration.That is, multiple view field PA1~PA6 in substrate P clip median plane CL and are configured to 2 row along conveyance direction, removing Send the 1st view field PA1, the 3rd view field PA3 in the substrate P of the upstream side in direction configured with odd number and the 5th projection Region PA5, the 2nd view field PA2, the 4th view field in the substrate P in the downstream side of conveyance direction configured with even number PA4 and the 6th view field PA6.
Each view field PA1~PA6 be with along substrate P width direction (Y-direction) extend short side and long side it is thin Long trapezoidal region.At this moment, trapezoidal each view field PA1~PA6 is that its short side is located at the sides median plane CL, and long side is located at The region in outside.The 1st view field PA1, the 3rd view field PA3 and the 5th view field PA5 of odd number are in the width direction Separate specified interval configuration.In addition, the 2nd view field PA2, the 4th view field PA4 and the 6th view field PA6 of even number Specified interval configuration is separated in the width direction.At this moment, the 2nd view field PA2 in the axial direction, be configured at the 1st view field PA1 with Between 3rd view field PA3.Similarly, the 3rd view field PA3 in the axial direction, is configured at the 2nd view field PA2 and the 4th and throws Between the PA4 of shadow zone domain.4th view field PA4 is configured between the 3rd view field PA3 and the 5th view field PA5.5th projection Region PA5 is configured between the 4th view field PA4 and the 6th view field PA6.Each view field PA1~PA6 and each lighting area Domain IR1~IR6 similarly, the bevel edge portion of adjacent trapezoidal view field PA when with from the conveyance direction from substrate P Mode (mode of the overlapping) configuration that triangular part overlaps.At this moment, view field PA is the area that adjacent view field PA is repeated Light exposure in domain becomes substantially the same shape with the light exposure in unduplicated region.Also, the 1st~the 6th projected area It is configured in a manner of the entire width of Y-directions of the domain PA1~PA6 to cover the exposure area A7 being exposed in substrate P.
Here, in fig. 2, when being observed in the faces XZ, the central point of the slave illumination region IR1 (and IR3, IR5) on light shield M To illumination region IR2 (and IR4, IR6) central point perimeter in the substrate P of bearing surface P2 from view field PA1 The perimeter of the central point of (and PA3, PA5) to the central point of the 2nd view field PA2 (and PA4, PA6) is set as being substantially equal.
Projection optical system PL and 6 view field PA1~PA6 in the 1st above embodiment are correspondingly set as 6 It is a.To projection optical system PL1~PL6 incident mask patterns by being located at corresponding illumination region IR1~IR6 respectively Multiple projected light beam EL2 of reflection.Each projection optical system PL1~PL6 will be distinguished by each projected light beam EL2 of light shield M reflection It guides to each view field PA1~PA6.That is, the 1st projection optical system PL1 is by the projected light beam from the 1st illumination region IR1 EL2 is guided to the 1st view field PA1, and similarly, the 2nd~the 6th projection optical system PL2~PL6 will come from the 2nd~the 6th illumination Each projected light beam EL2 of region IR2~IR6 is guided to the 2nd~the 6th view field PA2~PA6.
It is 2 row that multiple projection optical system PL1~PL6, which clip median plane CL along the arranged circumferentially of light shield M,.Multiple projected lights System PL1~PL6 clips median plane CL, on the side (left side of Fig. 2 configured with the 1st, the 3rd, the 5th view field PA1, PA3, PA5 Side) it is configured with the 1st projection optical system PL1, the 3rd projection optical system PL3 and the 5th projection optical system PL5.1st projected light System PL1, the 3rd projection optical system PL3 and the 5th projection optical system PL5 separate defined interval configuration along Y-direction.Separately Outside, multiple lamp optical system IL1~IL6 clip median plane CL, configured with the 2nd, the 4th, the 6th view field PA2, PA4, The side (right side of Fig. 2) of PA6 is configured with the 2nd projection optical system PL2, the 4th projection optical system PL4 and the 6th projection optics system Unite PL6.2nd projection optical system PL2, the 4th projection optical system PL4 and the 6th projection optical system PL6 separate rule along Y-direction Fixed interval configuration.At this moment, the 2nd projection optical system PL2 in the axial direction, is configured at the 1st projection optical system PL1 and the 3rd and throws Between shadow optical system PL3.Similarly, the 3rd projection optical system PL3 in the axial direction, is configured at the 2nd projection optical system PL2 Between the 4th projection optical system PL4.4th projection optical system PL4 is configured at the projections of the 3rd projection optical system PL3 and the 5th Between optical system PL5.5th projection optical system PL5 is configured at the 4th projection optical system PL4 and the 6th projection optical system Between PL6.In addition, the 1st projection optical system PL1, the 3rd projection optical system PL3 and the 5th projection optical system PL5 and the 2nd are thrown Shadow optical system PL2, the 4th projection optical system PL4 and the 6th projection optical system PL6 from being with median plane CL from the point of view of Y-direction The heart symmetrically configures.
With further reference to Fig. 4, illustrated about each projection optical system PL1~PL6.Further, since each projection optics System PL1~PL6 is identical composition, so by the 1st projection optical system PL1 (hreinafter referred to as projection optical system PL) It illustrates as an example.
Projection optical system PL makes the throwing reflected from the illumination region IR (the 1st illumination region IR1) of the light shield face P1 of light shield M Shadow light beam EL2 is incident, and the intermediary image for the pattern for being revealed in light shield face P1 is formed in intermediate image plane P7.In addition, will be from light shield face P1 The projected light beam EL2 for reaching intermediate image plane P7 is set as the 1st projected light beam EL2a.Being formed in the intermediary image of intermediate image plane P7 becomes phase It is the inverted image of 180 ° of point symmetries for the picture of the mask pattern of illumination region IR.
In addition, projection optical system PL makes the projected light beam EL2 projected from intermediate image plane P7 in the projection image planes of substrate P View field's PA reimagings and form projection image.In addition, by the projected light beam for the projection image planes for reaching substrate P from intermediate image plane P7 EL2 is set as the 2nd projected light beam EL2b.Projection image is the handstand for becoming 180 ° of point symmetries relative to the intermediary image of intermediate image plane P7 In other words picture is the erect image for becoming identical picture relative to the picture of the mask pattern of illumination region IR.The projection optical system PL in order, has above-mentioned quarter wave plate 41, above-mentioned polarising beam splitter from the light incident side of the projected light beam EL2 from light shield M PBS, Projection optics PLM.
Quarter wave plate 41 and polarising beam splitter PBS dual-purpose lamp optical systems IL.In other words, lamp optical system IL and Projection optical system PL shares quarter wave plate 41 and polarising beam splitter PBS.
The 1st projected light beam EL2a reflected in illumination region IR is directed towards the radial direction of the 1st axis AX1 of light shield holding cylinder 21 The light beam of the telecentricity in outside is incident to projection optical system PL.When the 1st projection of the circularly polarized light reflected in illumination region IR When light beam EL2a is incident to projection optical system PL, rectilinearly polarized light (P polarization is converted to from circularly polarized light by quarter wave plate 41 Light) after, it is incident to polarising beam splitter PBS.The 1st projected light beam EL2a for being incident to polarising beam splitter PBS divides from polarised light After beam device PBS is penetrated, it is incident to Projection optics PLM.
As shown in figure 4, Projection optics PLM has：Be imaged intermediary image in intermediate image plane P7, and in substrate P at Partial optical system 61 as being projection image；The 1st projected light beam EL2a and the 2nd projected light beam EL2b is set to be incident to partial optical system The reflective optics (guide-lighting optical system) 62 of system 61；It is configured at the perspective view diaphragm for the intermediate image plane P7 for being formed with intermediary image 63.In addition, Projection optics PLM has：Focus corrects optical component 64, as offset optical component 65, multiplying power amendment are used Optical component 66, rotation correction mechanism 67, polarised light adjustment mechanism 68.
Partial optical system 61 and reflective optics 62 are that will for example wear obtained from gloomy (Dyson) system deformed The reflection and refraction optical system of telecentricity.The optical axis (hereinafter referred to as the 2nd optical axis BX2) of partial optical system 61 is relative to median plane CL is substantially orthogonal.Partial optical system 61 has the 1st lens group 71 and the 1st concave mirror (reflection optics) 72.1st lens Group 71 has the multiple lenticular units for including refractor (lenticular unit) 71a set on the sides median plane CL, multiple lenticular units Optical axis configure on the 2nd optical axis BX2.1st concave mirror 72 be configured at multiple point light sources by being generated by fly's-eye lens 52 from Fly's-eye lens 52 is reached via illuminated field diaphragm 55 on the pupil plane of the various lens imagings of the 1st concave mirror 72.
Reflective optics 62 has the 1st deflection component (the 1st optical component and the 1st reflection component) the 76, the 2nd deflection component (the 2nd optical component and the 3rd reflecting part) the 77, the 3rd deflection component (the 3rd optical component and the 4th reflecting part) the 78, the 4th deflection component (the 4th optical component and the 2nd reflection component) 79.1st deflection component 76 is the speculum with the 1st reflecting surface P3.1st reflecting surface P3 makes the 1st projected light beam EL2a reflections from polarising beam splitter PBS, and the 1st projected light beam EL2a reflected is made to be incident to The refractor 71a of 1st lens group 71.2nd deflection component 77 is the speculum with the 2nd reflecting surface P4.2nd reflecting surface P4 makes The 1st projected light beam EL2a reflections projected from refractor 71a, in making the 1st projected light beam EL2a reflected be incident to and be set to Between image planes P7 perspective view diaphragm 63.3rd deflection component 78 is the speculum with the 3rd reflecting surface P5.3rd reflecting surface P5 makes The 2nd projected light beam EL2b reflections from perspective view diaphragm 63, make the 2nd projected light beam EL2b reflected be incident to the 1st thoroughly The refractor 71a of microscope group 71.4th deflection component 79 is the speculum with the 4th reflecting surface P6.4th reflecting surface P6 makes from folding The 2nd projected light beam EL2b reflections that lens 71a is projected are penetrated, the 2nd projected light beam EL2b reflected is made to be incident in substrate P.Picture In this way, the 2nd deflection component 77 and the 3rd deflection component 78 as make the 1st projected light beam EL2a from partial optical system 61 with The folding mirrors reflected again towards the mode that partial optical system 61 is turned back play a role.1st~the 4th deflection component 76, 77,78,79 each reflecting surface P3~P6 is the plane parallel with the Y-axis in Fig. 4, is matched with predetermined angular inclination in the faces XZ It sets.
Perspective view diaphragm 63 has the opening of the shape of regulation view field PA.That is, the opening of perspective view diaphragm 63 Shape provide the shape of view field PA.
The 1st projected light beam EL2a from polarising beam splitter PBS passes through from as offset optical component 65, partially by the 1st 1st reflecting surface P3 reflections of rotation member 76.1st lens group is incident to by the 1st projected light beam EL2a after the 1st reflecting surface P3 reflections 71, after multiple lenticular units comprising refractor 71a pass through, it is incident to the 1st concave mirror 72.At this moment, the 1st projected light beam EL2a is in the 1st lens group 71, from the visual field area of the upper side for being located at +Z direction relative to the 2nd optical axis BX2 of refractor 71a Domain passes through.The 1st projected light beam EL2a for being incident to the 1st concave mirror 72 is reflected by the 1st concave mirror 72.It is reflected by the 1st concave mirror 72 The 1st projected light beam EL2a afterwards is incident to the 1st lens group 71, after multiple lenticular units comprising refractor 71a pass through, from 1st lens group 71 projects.At this moment, the 1st projected light beam EL2a is in the 1st lens group 71, from refractor 71a relative to the 2nd The field of view that optical axis BX2 is located at the lower side of -Z direction passes through.From the 1st lens group 71 project the 1st projected light beam EL2a by 2nd reflecting surface P4 reflections of the 2nd deflection component 77.Projection is incident to by the 1st projected light beam EL2a after the 2nd reflecting surface P4 reflections Field stop 63.The 1st projected light beam EL2a for being incident to perspective view diaphragm 63 is formed into light shield figure in illumination region IR The intermediary image of the inverted image of case.
The 2nd projected light beam EL2b from perspective view diaphragm 63 is reflected by the 3rd reflecting surface P5 of the 3rd deflection component 78. 1st lens group 71 is again incident on by the 2nd projected light beam EL2b after the 3rd reflecting surface P5 reflection, from including refractor 71a's After multiple lenticular units pass through, it is incident to the 1st concave mirror 72.At this moment, the 2nd projected light beam EL2b is in the 1st lens group 71, from folding Penetrate light incident side and the outgoing of the upper side and the 1st projected light beam EL2a for being located at +Z direction relative to the 2nd optical axis BX2 of lens 71a Field of view between side passes through.The 2nd projected light beam EL2b for being incident to the 1st concave mirror 72 is reflected by the 1st concave mirror 72.By The 2nd projected light beam EL2b after the reflection of 1 concave mirror 72 is incident to the 1st lens group 71, from multiple lens comprising refractor 71a After component passes through, projected from the 1st lens group 71.At this moment, the 2nd projected light beam EL2b is in the 1st lens group 71, from refractor The lower side for being located at -Z direction relative to the 2nd optical axis BX2 of 71a and between the light incident side and exiting side of the 1st projected light beam EL2a Field of view pass through.From the 1st lens group 71 project the 2nd projected light beam EL2b by the 4th deflection component 79 the 4th reflecting surface P6 Reflection.By the 2nd projected light beam EL2b after the 4th reflecting surface P6 reflections optical component 64 and multiplying power amendment optics are corrected from focus Component 66 passes through, the view field PA being projected in substrate P.Be projected to view field PA the 2nd projected light beam EL2b formed at For the projection image of the erect image of the mask pattern in illumination region IR.At this moment, the picture of the mask pattern in illumination region IR with etc. (× 1) is projected to view field PA again.
Here, being simplyd illustrate with reference to Fig. 5 by being constituted comprising the 1st lens group 71 of refractor 71a and the 1st concave mirror 72 Projection optics PLM field of view.Fig. 5 is indicated the circular full imaging viewing field (benchmark of Projection optics PLM Face) YZ face expansion of the CIF in Fig. 5 state, rectangular-shaped illumination region IR on light shield M, image in intermediate image plane P7's Intermediary image Img1 on perspective view diaphragm 63, trapezoidal intermediary image is adjusted to by the perspective view diaphragm 63 of intermediate image plane P7 Trapezoidal view field PA in Img2 and substrate P is slenderly set along Y direction respectively, is discretely arranged along Z-direction.
First, the center of the rectangular-shaped illumination region IR on light shield M is set as the central point from full imaging viewing field CIF (optical axis BX2 is passed through) deviates the position (the 1st position) of image height value k1 to +Z direction.Therefore, by out of Projection optics PLM By initial imaging optical path (the 1st projected light beam EL2a) by be formed on perspective view diaphragm 63 (intermediate image plane P7) Between as Img1, when being observed in the faces YZ, so that the state that illumination region IR or more (Z-direction) and left and right (Y-direction) invert, is imaged In the central point from full imaging viewing field CIF to the position (the 2nd position) of the image height value k1 of -Z direction bias.
Intermediary image Img2 is by intermediary image Img1 with the picture of the trapezoidal opening limitation of perspective view diaphragm 63.Then, in Between as light path due to being bent by Img2 by being configured at front and back two deflection components 77,78 of perspective view diaphragm 63, institute When being observed in the faces YZ, it is imaged on the position of the image height value k2 (k2 ＜ k1) from from the central point of full imaging viewing field CIF to +Z direction It sets (the 3rd position).Moreover, the intermediary image Img2 limited by perspective view diaphragm 63 out of Projection optics PLM by passing through The 2nd imaging optical path (the 2nd projected light beam EL2b), and reimaging is in the view field PA on being formed in substrate P.
When the central point of picture of the reimaging in view field PA is observed in the faces YZ, it is located at from full imaging viewing field CIF's Image height value k2 (k2 ＜ k1) of the central point to -Z direction.And reimaging is in the picture in view field PA relative to illumination region IR Interior mask pattern, left and right directions (Y-direction) is nonreversible, is formed with equimultiple (× 1).
Like this, in the present embodiment, by so that the imaging beam from mask pattern is easy in circular imaging The mode that is spatially detached in visual field CIF and illumination region IR is limited to elongated rectangular-shaped or trapezoidal region, and base In four deflection components 76,77,78,79 formed by common total reflection mirror, and make the imaging of round trip (double pass) Road is formed in Projection optics PLM.Therefore, it is possible to make the pattern on light shield M in substrate P at least with Y direction (base In the connection direction of each projection image of Projection optics PL1~PL6) it is projected as the erect image of equimultiple.
Like this, the 1st deflection component 76, the 2nd deflection component 77, the 3rd deflection component 78 and the 4th deflection component 79 make the 1st Visual field (the 1st outgoing of visual field (the 1st incident visual field), the exiting side of the 1st projected light beam EL2a of the light incident side of projected light beam EL2a Visual field), the visual field (the 2nd incident visual field) of the light incident side of the 2nd projected light beam EL2b, the exiting side of the 2nd projected light beam EL2b regard Field (the 2nd outgoing visual field) detaches in reflective optics 62.Therefore, reflective optics 62 becomes in the 1st projected light beam It is difficult to generate the composition of leak light when EL2a leaded lights, to which reflective optics 62 is as making the leak light being projected in substrate P Light quantity reduction light quantity reduction portion and play a role.In addition, leak light is for example to be generated due to the 1st projected light beam EL2a is scattered Scattering light, because of separation light that the 1st projected light beam EL2a separation due to generates, due to a part of the 1st projected light beam EL2a reflects The reflected light of generation.
Here, reflective optics 62 is in z-direction, it is equipped with the 1st deflection component the 76, the 3rd in order from upper side and deflects Component 78, the 4th deflection component 79, the 2nd deflection component 77.Therefore, it throws be incident to the refractor 71a of the 1st lens group 71 the 1st Shadow light beam EL2a is incident to close to the sides illumination region IR (upper side of refractor 71a).In addition, from the folding of the 1st lens group 71 The 2nd projected light beam EL2b that lens 71a is projected is penetrated to project from close to the sides view field PA (lower side of refractor 71a).Cause This, can shorten the distance between illumination region IR and the 1st deflection component 76, in addition, it is inclined to shorten view field PA and the 4th The distance between rotation member 79, so the miniaturization of projection optical system PL can be realized.In addition, as shown in figure 4, the 3rd deflection Component 78 is configured at about the direction (Z-direction) along full imaging viewing field CIF between the 1st deflection component 76 and the 4th deflection component 79. In addition, the position and the position of the 2nd deflection component 77 and the 3rd deflection component 78 of the 1st deflection component 76 and the 4th deflection component 79 are closed Become different positions in the direction of the 2nd optical axis BX2.
In addition, since there is reflective optics 62 the 1st incident visual field, the 1st outgoing visual field, the 2nd incident visual field, the 2nd to go out Visual field this 4 visual fields (suitable with IR, Img1, Img2, PA shown in Fig. 5) are penetrated, so in order not to make projected light beam EL2 4 It is repeated in a visual field, view field PA is preferably sized to defined size.That is, the sweeping along substrate P of view field PA It retouches the length on direction and the length in the width direction of the substrate P orthogonal with scanning direction is：The length of scanning direction/wide Spend length≤1/4 in direction.Therefore, reflective optics 62 can not make projected light beam EL2 repeatedly will in 4 visual fields Projected light beam EL2 is detached and is guided to partial optical system 61.
Moreover, the 1st deflection component 76, the 2nd deflection component 77, the 3rd deflection component 78 and the 4th deflection component 79 are formed as (it is equivalent to figure with the 1st of slit-shaped incident visual field, the 1st outgoing visual field, the 2nd incident visual field and the 2nd outgoing visual field this 4 visual fields IR, Img1, Img2, PA shown in 5) either one or two of corresponding rectangle, and in the slit along full imaging viewing field CIF Width direction (Z-direction) configures separated from each other.
Focus is corrected optical component 64 and is configured between the 4th deflection component 79 and substrate P.Focus is corrected optical component 64 and is adjusted The focus condition of the whole picture for projecting to the mask pattern in substrate P.Focus, which corrects optical component 64, for example makes 2 wedge-shaped prisms Reversed opposite (reversely opposite about X-direction in Fig. 4), overlaps in a manner of as transparent parallel flat as a whole.Make 1 pair of prism is slided in a manner of the interval between not changing mutually opposite face along bevel direction, and is changed as parallel flat The thickness of plate.Therefore, it is possible to finely tune the effective optical path length of partial optical system 61, to being formed in intermediate image plane P7 and projection The focus condition of the picture of the mask pattern of region PA is finely adjusted.
As offset optical component 65 is configured between polarising beam splitter PBS and the 1st deflection component 76.As offset is used up The picture that department of the Chinese Academy of Sciences's part 65 makes to project to the mask pattern in substrate P can be adjusted movably in image planes.As offset optical component 65 by being capable of inclined transparent parallel plate glass and can be inclined transparent in the faces YZ of Fig. 4 in the faces XZ of Fig. 4 Parallel plate glass is constituted.By adjusting each tilt quantity of 2 parallel plate glass, can make to be formed in intermediate image plane P7 and The picture of the mask pattern of view field PA is slightly offset in X-direction or Y-direction.
Multiplying power amendment optical component 66 is configured between the 4th deflection component 79 and substrate P.Multiplying power amendment optical component 66 are configured to for example to make concavees lens, convex lens, concavees lens this 3 that arranged coaxial, front and back concavees lens are fixed, are allowed at predetermined intervals Between convex lens along optical axis (chief ray) direction move.Therefore, the picture for being formed in the mask pattern of view field PA maintains telecentricity Image formation state, and isotropically only zoomed in or out with micro.In addition, constituting multiplying power amendment with the 3 of optical component 66 The optical axis of piece lens group is tilted in the faces XZ in a manner of parallel with the chief ray of projected light beam EL2 (the 2nd projected light beam EL2b).
Correction mechanism 67 is rotated for example by actuator (diagram is omited), makes the 2nd deflection component 77 around flat with the 2nd optical axis BX2 The axis of row (or vertical) slightly rotates.The rotation correction mechanism 67 makes the 2nd deflection component 77 rotate, in making to be formed in Between the picture of mask pattern of image planes P7 slightly rotated in the P7 of its face.
Polarised light adjustment mechanism 68 for example by actuator (diagram is omited), makes quarter wave plate 41 be revolved around the axis orthogonal with plate face Turn to adjust direction of polarized light.Polarised light adjustment mechanism 68 can adjust by making quarter wave plate 41 rotate and be projected to projected area The illumination of the projected light beam EL2 (the 2nd projected light beam EL2b) of domain PA.
In the projection optical system PL constituted like this, the 1st projected light beam EL2a from light shield M is from illumination region IR Normal direction (by the radial direction centered on the 1st axis AX1) along light shield face P1 projects, from quarter wave plate 41, polarising beam splitter PBS and as offset optical component 65 by by be incident to reflective optics 62.It throws be incident to reflective optics 62 the 1st Shadow light beam EL2a is reflected by the 1st reflecting surface P3 of the 1st deflection component 76 of reflective optics 62, is incident to partial optical system 61.The 1st projected light beam EL2a for being incident to partial optical system 61 passes through from the 1st lens group 71 of partial optical system 61, by 1st concave mirror 72 reflects.The 1st projected light beam EL2a after being reflected by the 1st concave mirror 72 is again by the 1st lens group 71 and from portion Spectroscopy system 61 projects.From partial optical system 61 project the 1st projected light beam EL2a by reflective optics 62 the 2nd partially 2nd reflecting surface P4 reflections of rotation member 77, are incident to perspective view diaphragm 63.From perspective view diaphragm 63 by the 2nd projection Light beam EL2b is reflected by the 3rd reflecting surface P5 of the 3rd deflection component 78 of reflective optics 62, is again incident on partial optical system System 61.Be incident to the 2nd projected light beam EL2b of partial optical system 61 from the 1st lens group 71 of partial optical system 61 by by It is reflected by the 1st concave mirror 72.The 2nd projected light beam EL2b reflected by the 1st concave mirror 72 again from the 1st lens group 71 by by from Partial optical system 61 projects.The 2nd projected light beam EL2b projected from partial optical system 61 is by the 4th of reflective optics 62 4th reflecting surface P6 reflections of deflection component 79, are incident to focus and correct optical component 64 and multiplying power amendment optical component 66.From Multiplying power amendment is incident to the view field PA in substrate P, illumination region IR with the 2nd projected light beam EL2b that optical component 66 projects The picture of interior shown mask pattern is projected with equimultiple (× 1) to view field PA.
＜ device making methods ＞
Next, with reference to Fig. 6, device making method is illustrated.Fig. 6 is the device system for indicating the 1st embodiment Make the flow chart of method.
In device making method shown in Fig. 6, first, the display formed such as the self-emission device by organic EL is carried out The function and performance design of panel pass through the circuit pattern and/or wiring pattern (step S201) of the designs such as CAD.Then, Based on each layer of pattern in the various layers designed by CAD etc. bys, to make the light shield M (steps of required layer amount S202).In addition, preparing the flexible substrate P (resin film, metal foil film, the modeling that are wound with the base material as display panel Material etc.) supply roller FR1 (step S203).In addition, the substrate P of the roll prepared in step S203 as needed can be with It is the substrate being modified to its surface, is previously formed the base of basal layer (such as minute asperities based on coining mode) Plate is laminated with the functional membrane of photoinduction and/or the substrate of hyaline membrane (insulating materials) in advance.
Then, the electrode of composition display panel device is formed in substrate P and (film is partly led by wiring, insulating film, TFT Body) etc. compositions baseplane layer, and the hair based on self-emission devices such as organic EL is formed in a manner of being laminated in the baseplane Photosphere (display pixel portion) (step S204).In step S204, illustrate in each embodiment before also including use The previous photo-mask process that exposure device U3 is exposed photoresist layer, but also include the place based on following process etc. Reason：To replacing photoresist coated with the substrate P of photonasty silane coupling agent material progress pattern exposure and in surface shape At the exposure process of hydrophilic pattern；Pattern exposure is carried out to the catalyst layer of photoinduction and passes through non-electrolytic plating method shape At the wet type operation of the pattern (wiring, electrode etc.) of metal film；Or utilize the descriptions such as the conductive ink containing Nano silver grain The printing process etc. of pattern.
Then, base is cut by each display panel device being continuously manufactured by the substrate P of strip by roller mode Plate P pastes protective film (resistance to environmental barrier layer) and colorized optical filtering sheet etc. on the surface of each display panel device, from And assembly device (step S205).Then, inspection operation is carried out, checks whether display panel device normally functions, is It is no to meet desired performance and characteristic (step S206).By the above, display panel (flexible display) can be manufactured.
More than, in the 1st embodiment, due to can be by matching with projection optical system PL (Projection optics PLM) The reflective optics 62 of conjunction and the 1st incident visual field, the 1st outgoing visual field, the 2nd incident visual field and the 2nd outgoing visual field are divided each other From so the generation of the leak light from the 1st projected light beam EL2a can be inhibited.Therefore, reflective optics 62 is formed as letting out Exposure is difficult to project the composition in substrate P, so the deterioration of the picture on projection exposure to substrate P can be prevented.
In addition, in the 1st embodiment, since view field PA can be made to be set as the length/width direction of scanning direction Length≤1/4, so regarding for the 1st projected light beam EL2a and the 2nd projected light beam EL2b in reflective optics 62 can be made , that is, the 1st incident visual field, the 1st outgoing visual field, the 2nd incident visual field and the 2nd outgoing visual field not repeatedly detach.
In addition, in the 1st embodiment, since illuminating bundle EL1 can be made to be laser, so can suitably ensure to throw It is incident upon the illumination of the 2nd projected light beam EL2b of view field PA.
In addition, in the 1st embodiment, make the 1st projected light beam EL2a for being incident to refractor 71a and the 2nd projected light Beam EL2b is located at the upper side of refractor 71a, makes the 1st projected light beam EL2a projected from refractor 71a and the 2nd projected light Beam EL2b is located at the lower side of refractor 71a.However, as long as the 1st incident visual field, the 1st outgoing visual field, the 2nd incidence can be made Visual field and the 2nd outgoing visual field are separated from each other, and just do not have to be particularly limited to the 1st projected light beam EL2a and the 2nd projected light beam EL2b is opposite In the incoming position and Exit positions of refractor 71a.
[the 2nd embodiment]
Next, with reference to Fig. 7, the exposure device U3 of the 2nd embodiment is illustrated.In addition, in the 2nd embodiment In, in order to avoid the record repeated with the 1st embodiment, only the part different from the 1st embodiment is illustrated, for Inscape identical with the 1st embodiment marks reference numeral identical with the 1st embodiment and illustrates.Fig. 7 is to indicate The figure of the lamp optical system of the exposure device of 2nd embodiment and the composition of projection optical system.The exposure of 1st embodiment Device U3 carries out visual field separation in the reflective optics 62 of projection optical system PL, to be difficult to generate leak light.2nd is real The exposure device U3 for applying mode makes in the reflective optics 100 of projection optical system PL, is formed by projected light beam EL2 The image space of the image space of projection image and the bad picture formed by leak light is different on the scanning direction of substrate P.
In the exposure device U3 of the 2nd embodiment, projection optical system PL is from the projected light beam EL2's from light shield M Light incident side has quarter wave plate 41, polarising beam splitter PBS, Projection optics PLM in order, and Projection optics PLM includes Partial optical system 61, reflective optics (light guide optical system) 100, perspective view diaphragm 63.In addition, Projection optics PLM includes that focus corrects optical component 64, as offset optical component 65, multiplying power amendment are used up in a same manner as in the first embodiment Department of the Chinese Academy of Sciences's part 66, rotation correction mechanism 67 and polarised light adjustment mechanism 68.In addition, due to quarter wave plate 41, polarising beam splitter PBS, Partial optical system 61, perspective view diaphragm 63, focus correct optical component 64, as offset optical component 65, multiplying power amendment It is identical composition with optical component 66, rotation correction mechanism 67 and polarised light adjustment mechanism 68, so omitting the description.
Reflective optics 100 has the 1st polarising beam splitter (the 1st reflection component) PBS1, the 2nd polarising beam splitter (the 2nd reflection component) PBS2,1/2 wave plate 104, the 1st deflection component (the 1st optical component and the 3rd reflecting part) the 105, the 2nd deflector Part (the 2nd optical component and the 4th reflecting part) the 106, the 1st barn door 111, the 2nd barn door 112.1st polarising beam splitter PBS1 tools There is the 1st polarised light parting surface P10.1st polarised light parting surface P10 makes the 1st projected light beam from polarising beam splitter PBS1 EL2a reflects, and the 1st projected light beam EL2a reflected is made to be incident to the refractor 71a of the 1st lens group 71.In addition, the 1st polarization Light parting surface P10 makes the 2nd projected light beam EL2b from intermediate image plane P7 penetrate, and keeps the 2nd projected light beam EL2b of transmission incident To the refractor 71a of the 1st lens group 71.2nd polarising beam splitter PBS2 has the 2nd polarised light parting surface P11.2nd polarization Light parting surface P11 makes the 1st projected light beam EL2a of the refractor 71a from the 1st lens group 71 penetrate, and makes the 1st after penetrating Projected light beam EL2a is incident to the 1st deflection component 105.In addition, the 2nd polarised light parting surface P11 makes the folding from the 1st lens group 71 The 2nd projected light beam EL2b reflections for penetrating lens 71a, make the 2nd projected light beam EL2b reflected be incident in substrate P.1/2 wave plate 104 will be converted to the 1st of P polarization light by the 1st projected light beam EL2a of the S-polarization light of the 1st polarising beam splitter PBS1 reflections throws Shadow light beam EL2a.In addition, 1/2 wave plate 104 is by the 2nd projected light beam of the P polarization light penetrated from the 1st polarising beam splitter PBS1 EL2b is converted to the 2nd projected light beam EL2b of S-polarization light.1st deflection component 105 is the speculum with the 1st reflecting surface P12. 1st reflecting surface P12 makes the 1st projected light beam EL2a reflections penetrated from the 2nd polarising beam splitter PBS2, makes the reflected the 1st throwing Shadow light beam EL2a is incident to the perspective view diaphragm 63 set on intermediate image plane P7.2nd deflection component 106 is that have the 2nd reflecting surface The speculum of P13.2nd reflecting surface P13 makes the 2nd projected light beam EL2b reflections from perspective view diaphragm 63, after making reflection 2nd projected light beam EL2b is incident to the 1st polarising beam splitter PBS1.Like this, the 1st deflection component 105 and the 2nd deflection component 106 as making sides of the 1st projected light beam EL2a from partial optical system 61 to turn back again towards partial optical system 61 The folding mirrors of formula reflection play a role.
In addition, due to being provided with the 1st polarising beam splitter PBS1 in reflective optics 100, so in order to make from inclined The projected light beam of P polarization light after beam splitter PBS transmissions of shaking is by the 1st polarising beam splitter PBS1 reflections, in polarized light beam splitting 1/2 wave plate 107 is equipped between device PBS and the 1st polarising beam splitter PBS1.
1st barn door 111 is set between the 2nd polarising beam splitter PBS2 and substrate P.1st barn door 111 is set to and can hide Gear is incident to a part of the 1st projected light beam EL2a of the 2nd polarising beam splitter PBS2 not from the 2nd polarising beam splitter PBS2's Positions of the 2nd polarised light parting surface P11 through the reflected light (leak light) of ground reflection.
2nd barn door 112 is set between the 1st polarising beam splitter PBS1 and the 2nd polarising beam splitter PBS2.2nd shading Plate 112 blocks the leak light that the 2nd polarising beam splitter PBS2 is leaked to from the 1st polarising beam splitter PBS1.
1st projected light beam EL2a of the P polarization light from polarising beam splitter PBS leads to from as offset optical component 65 It crosses, and is penetrated from 1/2 wave plate 107.After the 1st projected light beam EL2a penetrated from 1/2 wave plate 107 is converted to S-polarization light, it is incident to 1st polarising beam splitter PBS1.The 1st projected light beam EL2a of the S-polarization light of the 1st polarising beam splitter PBS1 is incident to by the 1st The 1st polarised light parting surface P10 reflections of polarising beam splitter PBS1.By the 1st polarised light parting surface P10 S-polarization light reflected 1st projected light beam EL2a is penetrated from 1/2 wave plate 104.The 1st projected light beam EL2a penetrated from 1/2 wave plate 104 is converted to P polarization After light, it is incident to the 1st lens group 71.The 1st projected light beam EL2a of the 1st lens group 71 is incident to from comprising refractor 71a's After multiple lenticular units pass through, it is incident to the 1st concave mirror 72.At this moment, the 1st projected light beam EL2a is in the 1st lens group 71, from folding The field of view (the 1st incident visual field) for penetrating the upper side of lens 71a passes through.It is incident to the 1st projected light beam of the 1st concave mirror 72 EL2a is reflected by the 1st concave mirror 72.The 1st projected light beam EL2a reflected by the 1st concave mirror 72 is incident to the 1st lens group 71, from Including after multiple lenticular units of refractor 71a pass through, projected from the 1st lens group 71.At this moment, the 1st projected light beam EL2a exists In 1st lens group 71, pass through from the field of view (the 1st outgoing visual field) of the lower side of refractor 71a.From the 1st lens group 71 The 1st projected light beam EL2a projected is incident to the 2nd polarising beam splitter PBS2.The P for being incident to the 2nd polarising beam splitter PBS2 is inclined The 1st projected light beam EL2a of light of shaking is penetrated from the 2nd polarised light parting surface P11.It throws the 1st penetrated from the 2nd polarised light parting surface P11 Shadow light beam EL2 is incident to the 1st deflection component 105, by the 1st reflecting surface P12 reflections of the 1st deflection component 105.By the 1st reflecting surface 1st projected light beam EL2a of P12 reflections is incident to perspective view diaphragm 63.It is incident to the 1st projected light of perspective view diaphragm 63 Beam EL2a is formed into the intermediary image of the inverted image of the mask pattern in illumination region IR.
The 2nd projected light beam EL2b from perspective view diaphragm 63 is anti-by the 2nd reflecting surface P13 of the 2nd deflection component 106 It penetrates.1st polarising beam splitter PBS1 is incident to by the 2nd projected light beam EL2b of the 2nd reflecting surface P13 reflections.It is incident to the 1st polarization 2nd projected light beam EL2b of the P polarization light of beam splitter PBS1 is penetrated from the 1st polarised light parting surface P10.From the 1st polarised light point The 2nd projected light beam EL2b from the face P10 P polarization light penetrated is penetrated from 1/2 wave plate 104.It throws the 2nd penetrated from 1/2 wave plate 104 After shadow light beam EL2b is converted to S-polarization light, it is incident to the 1st lens group 71.It is incident to the 2nd projected light beam of the 1st lens group 71 EL2b is incident to the 1st concave mirror 72 after multiple lenticular units comprising refractor 71a pass through.At this moment, the 2nd projected light beam EL2b passes through in the 1st lens group 71 from the field of view (the 2nd incident visual field) of the upper side of refractor 71a.It is incident to 2nd projected light beam EL2b of 1 concave mirror 72 is reflected by the 1st concave mirror 72.The 2nd projected light beam reflected by the 1st concave mirror 72 EL2b is incident to the 1st lens group 71, after multiple lenticular units comprising refractor 71a pass through, is penetrated from the 1st lens group 71 Go out.At this moment, the 2nd projected light beam EL2b is in the 1st lens group 71, and from the field of view of the lower side of refractor 71a, (the 2nd goes out Penetrate visual field) pass through.The 2nd projected light beam EL2b projected from the 1st lens group 71 is incident to the 2nd polarising beam splitter PBS2.It is incident The 2nd projected light beam EL2b to the S-polarization light of the 2nd polarising beam splitter PBS2 is reflected by the 2nd polarised light parting surface P11.By the 2nd 2nd projected light beam EL2b of polarised light parting surface P11 reflections corrects optical component 64 and multiplying power amendment optical component from focus 66 pass through, the view field PA being projected in substrate P.The 2nd projected light beam EL2b for being projected to view field PA is formed into photograph The projection image of the erect image of mask pattern in the IR of area pellucida domain.At this moment, the picture of the mask pattern in illumination region IR with equimultiple (× 1) it projects to view field PA.
Here, the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the 1st deflection component 105 and the 2nd deflect Component 106 be configured to make by the projection images formed of the 2nd projected light beam EL2b by the 2nd polarising beam splitter PBS2 reflections at What the leak light of image position and a part as the 1st projected light beam EL2a by the 2nd polarising beam splitter PBS2 reflection was formed The image space of bad picture is different on the scanning direction of substrate P.Specifically, so that relative to the 1st polarising beam splitter The 1st polarised light parting surface P10 of PBS1, the incoming position of the incoming position and the 2nd projected light beam EL2b of the 1st projected light beam EL2a Different modes configures the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the deflection of the 1st deflection component 105 and the 2nd Component 106.By being set as such configuration, can relative to the 2nd polarised light parting surface P11 of the 2nd polarising beam splitter PBS2, The incoming position of the incoming position and the 1st projected light beam EL2a that make the 2nd projected light beam EL2b is different.Therefore, it is possible to make by the 2nd partially Shake light parting surface P11 reflection the 2nd projected light beam EL2b projection image image space and as by the 2nd polarised light parting surface The image space of the bad picture of the leak light of a part of 1st projected light beam EL2a of P11 reflections is on the scanning direction of substrate P It is different.
In this case, the 1st barn door 111 is set to the leakage blocked from the 2nd polarising beam splitter PBS2 towards substrate P The position of light.Therefore, the 1st barn door 111 allows the 2nd projected light beam EL2b from the 2nd polarising beam splitter PBS2 towards substrate P The projection to substrate P, and block the leak light from the 2nd polarising beam splitter PBS2 towards substrate P.
Like this, the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the deflection of the 1st deflection component the 105, the 2nd Component 106 and the 1st barn door 111 make the image space of the image space and bad picture of projection image on the scanning direction of substrate P Difference blocks leak light by the 1st barn door 111.Therefore, reflective optics 100 is as the leakage that will be projected in substrate P The light quantity reduction portion of the light quantity reduction of light and play a role.
In addition, the incidence of the 1st projected light beam EL2a in the 1st polarised light parting surface P10 of the 1st polarising beam splitter PBS1 The incoming position of the 1st projected light beam EL2a in the 2nd polarised light parting surface P11 of position and the 2nd polarising beam splitter PBS2 at To clip the 2nd symmetrical positions optical axis BX2.In addition, in the 1st polarised light parting surface P10 of the 1st polarising beam splitter PBS1 The 2nd projected light in the incoming position of 2 projected light beam EL2b and the 2nd polarised light parting surface P11 of the 2nd polarising beam splitter PBS2 The incoming position of beam EL2b, which becomes, clips the 2nd symmetrical positions optical axis BX2.In other words, the 1st of the 1st polarising beam splitter PBS1 2nd polarised light of the incoming position and the 2nd polarising beam splitter PBS2 of the 1st projected light beam EL2a in polarised light parting surface P10 The incoming position of the 2nd projected light beam EL2b in parting surface P11, which becomes, clips the 2nd asymmetrical positions optical axis BX2.
The incoming position and the 2nd polarised light parting surface P11 of the 1st projected light beam EL2a in the 1st polarised light parting surface P10 In the 2nd projected light beam EL2b incoming position become clip the 2nd asymmetrical positions optical axis BX2 in the case of, view field PA becomes relative to the positions that (the 2nd optical axis direction) deviates in X direction illumination region IR.In this case, in order to make from light Cover M on illumination region IR1 (and IR3, IR5) central point to illumination region IR2 (and IR4, IR6) central point perimeter with From the central point of the view field PA1 (and PA3, PA5) in substrate P to the central point of the 2nd view field PA2 (and PA4, PA6) Perimeter be set as identical length, make the 1st projection optical system PL1 (and PL3, PL5) and the 2nd projection optical system PL2 (and PL4, PL6) it is set as the different composition in part.
1st projection optical system PL1 (and PL3, PL5) of odd number (left side of Fig. 7) is so that in the 1st polarized light beam splitting In the 1st polarised light parting surface P10 of device PBS1, the incidence of the incoming position and the 2nd projected light beam EL2b of the 1st projected light beam EL2a Position compare positioned at Z-direction upper side and positioned at X-direction central side mode, configured with the 1st polarising beam splitter PBS1, 2nd polarising beam splitter PBS2, the 1st deflection component 105 and the 2nd deflection component 106.Therefore, in the 2nd polarising beam splitter PBS2 The 2nd polarised light parting surface P11 in, the incoming position phase of the incoming position and the 1st projected light beam EL2a of the 2nd projected light beam EL2b Than being located at the upper side of Z-direction and the outside positioned at X-direction.
That is, the 1st projection optical system PL1 is in z-direction, become the 1st polarising beam splitter PBS1 reflective portion, the 2nd The reflective portion of deflection component 106, the reflective portion of the 2nd polarising beam splitter PBS2, the 1st deflection component 105 reflective portion Sequence.Therefore, as shown in fig. 7, the 2nd deflection component 106 is configured at about along the direction (Z-direction) of full imaging viewing field CIF Between the reflective portion and the reflective portion of the 2nd polarising beam splitter PBS2 of 1 polarising beam splitter PBS1.In addition, in the 1st projection In optical system PL1, the position of the reflective portion of the 1st polarising beam splitter PBS1 and the 2nd polarising beam splitter PBS2 and the 1st is partially The position of rotation member 105 and the 2nd deflection component 106 becomes different location about the direction of the 2nd optical axis BX2.
2nd projection optical system PL2 (and PL4, PL6) of even number (right side of Fig. 7) is so that in the 1st polarized light beam splitting In the 1st polarised light parting surface P10 of device PBS1, the incidence of the incoming position and the 2nd projected light beam EL2b of the 1st projected light beam EL2a The lower side positioned at Z-direction and the mode in the outside positioned at X-direction are compared in position, configured with the 1st polarising beam splitter PBS1, the 2 polarising beam splitter PBS2, the 1st deflection component 105 and the 2nd deflection component 106.Therefore, the 2nd polarising beam splitter PBS2's In 2nd polarised light parting surface P11, become the incoming position of the incoming position and the 1st projected light beam EL2a of the 2nd projected light beam EL2b It compares, is located at the lower side of Z-direction and the central side positioned at X-direction.
That is, the 2nd projection optical system PL2 in Z-direction, becomes reflective portion, the 1st polarised light of the 2nd deflection component 106 The reflective portion of beam splitter PBS1, the reflective portion of the 1st deflection component 105, the 2nd polarising beam splitter PBS2 reflective portion Sequentially.Therefore, as shown in fig. 7, the 1st deflection component 105 is configured at the 1st about along the direction (Z-direction) of full imaging viewing field CIF Between the reflective portion of polarising beam splitter PBS1 and the reflective portion of the 2nd polarising beam splitter PBS2.In addition, in the 2nd projection In optical system PL2, in the same manner as the 1st projection optical system PL1, the 1st polarising beam splitter PBS1 and the 2nd polarising beam splitter Side of the position of the reflective portion of PBS2 with the position of the 1st deflection component 105 and the 2nd deflection component 106 about the 2nd optical axis BX2 To as different location.
Moreover, the reflective portion of the 1st polarising beam splitter PBS1, the reflective portion of the 2nd polarising beam splitter PBS2, the 1st Deflection component 105 and the 2nd deflection component 106 are formed as regarding with the 1st incident visual field, the 1st outgoing visual field, the 2nd incidence of slit-shaped And either one or two of the 2nd outgoing visual field this 4 visual field (being equivalent to IR, Img1, Img2, PA shown in Fig. 5) it is corresponding rectangular Shape, and the width direction (Z-direction) about the slit along full imaging viewing field CIF is separately from each other.In addition, in Figure 5, the The case where the 1st projection optical system PL1 (and PL3, PL5) of odd number is in order from the top of Z-direction, to become lighting area Domain IR, intermediary image Img2, view field PA, intermediary image Img1.On the other hand, the 2nd projection optical system PL2 of even number The case where (and PL4, PL6) is, become in order from the top of Z-direction intermediary image Img2, illumination region IR, intermediary image Img1, View field PA.
As described above, make the 1st projection optical system PL1 (and PL3, PL5) and the 2nd projection optical system PL2 (and PL4, PL6) be set as the different composition in part, so as to make from the central point of the illumination region IR1 (and IR3, IR5) on light shield M to The perimeter Δ Dm of the central point of illumination region IR2 (and IR4, IR6) and from the view field PA1's (and PA3, PA5) in substrate P The perimeter Δ Ds of central point to the central point of the 2nd view field PA2 (and PA4, PA6) is identical length.At this moment, due to projection Region PA is the position relative to illumination region IR (the 2nd directions optical axis BX2) offsets in X direction, so light shield holding cylinder 21 2nd axis AX2 of the 1st axis AX1 and substrate supporting cylinder 25 and offsets of the view field PA relative to illumination region IR in the circumferential Correspondingly deviated along the 2nd directions optical axis BX2.
More than, the 2nd embodiment is to make the projection formed by the 2nd projected light beam EL2b in reflective optics 100 The image space of the image space of picture and the bad picture formed by the leak light from the 1st projected light beam EL2a is in substrate P It is different on scanning direction, so as to block leak light by the 1st barn door 111.Therefore, reflective optics 100 can hide Gear is projected to the leak light in substrate P, so projection image can be made suitably to project in substrate P.
In addition, the 2nd embodiment is in reflective optics 100, it can both be partitioned into the 1st projected light beam EL2a and The visual field of 2 projected light beam EL2b, that is, the 1st incident visual field, the 1st outgoing visual field, the 2nd incident visual field and the 2nd outgoing visual field also may be used It is repeated with a part.That is, the 2nd embodiment is, due to that need not make the 1st projected light beam EL2a's and the 2nd projected light beam EL2b Visual field is detached as the 1st embodiment, so the configuration phase with the various optical components of reflective optics 100 can be improved The degree of freedom of pass.
In addition, in the 2nd embodiment, 1/2 wave is equipped between the 1st polarising beam splitter PBS1 and refractor 71a Piece 104, but it is not limited to this composition.For example, it is also possible to which the 1st is arranged between the 1st polarising beam splitter PBS1 and refractor 71a A quarter wave plate, and the 2nd quarter wave plate is set between the 2nd polarising beam splitter PBS2 and refractor 71a.In such case Under, the 1st quarter wave plate and the 2nd quarter wave plate integration can also be made.
[the 3rd embodiment]
Next, with reference to Fig. 8, the exposure device U3 of the 3rd embodiment is illustrated.In addition, in the 3rd embodiment In, in order to avoid the record repeated with the 2nd embodiment, and only the part different from the 2nd embodiment is illustrated, For inscape identical with the 2nd embodiment, marks reference numeral identical with the 2nd embodiment and illustrate.Fig. 8 is Indicate the figure of the composition of the projection optical system of the exposure device of the 3rd embodiment.The exposure device U3 of 2nd embodiment is being thrown In the reflective optics 100 of shadow optical system PL, make through the image spaces of the 2nd projected light beam EL2b projection images formed and The image space of the bad picture formed by leak light is different on the scanning direction of substrate P.The exposure device of 3rd embodiment U3 makes the image space by the projected light beam EL2 projection images formed in the reflective optics 130 of projection optical system PL Image space with the bad picture formed by leak light is in depth direction (focus direction) difference.In addition, in fig. 8, in order to Simplify the explanation in the 3rd embodiment, only depicted portion optical system 131 and reflective optics 130.In addition, in fig. 8, Light shield face P1 and substrate P are parallelly configured along the faces XY, make the chief ray and XY of the 1st projected light beam EL2a from light shield face P1 Face is vertical, keeps the chief ray to the 2nd projected light beam EL2b of substrate P vertical with the faces XY.
In the projection optical system PL of the 3rd embodiment, partial optical system 131 has refractor 71a and the 1st recessed Face mirror 72.In addition, since refractor 71a and the 1st concave mirror 72 are structures identical with the 1st embodiment and the 2nd embodiment At so omitting the description.In addition, in partial optical system 131, it is identical as the 2nd embodiment, it can also be in refractor Multiple lenticular units are configured between 71a and the 1st concave mirror 72.
Reflective optics 130 has the 1st polarising beam splitter (the 1st reflection component) PBS1, the 2nd polarising beam splitter (the 2nd reflection component) PBS2,1/2 wave plate 104, the 1st deflection component (the 1st optical component and the 3rd reflecting part) the 105 and the 2nd deflect Component (the 2nd optical component and the 4th reflecting part) 106.In addition, the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, Although 1/2 wave plate 104, the 1st deflection component 105 and the 2nd deflection component 106 are different from the 2nd a part of angle of embodiment etc., Due to being roughly the same composition so omitting the description.
Here, in fig. 8, it is illustrated that send as an envoy to and be incident to the 1st projected light beam of the 1st polarising beam splitter PBS1 from light shield face P1 EL2a centered on the 1st polarised light parting surface P10 of the 1st polarising beam splitter PBS1 and face symmetrically obtains the virtual 1st throws Shadow light beam EL3.At this moment, being imaged out the face of the 1st virtual projected light beam EL3 becomes imaginary light shield face P15.In addition, in Fig. 8 In, it is illustrated that sening as an envoy to, it is inclined with the 1st to be incident to the 1st projected light beam EL2a of the 1st deflection component 105 from the 2nd polarising beam splitter PBS2 Face symmetrically obtains virtual the 1st projected light beam EL4 centered on 1st reflecting surface P12 of rotation member 105.At this moment, it is imaged out void The face of the 1st quasi- projected light beam EL4 becomes imaginary intermediate image plane P16.
1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the 1st deflection component 105 and the 2nd deflection component 106 are configured to：By by the 2nd polarising beam splitter PBS2 reflection the 2nd projected light beam EL2b by the imaging of projection image that is formed Position and the shape by leak light of the part as the 1st projected light beam EL2a by the 2nd polarising beam splitter PBS2 reflections At bad picture image space it is different in the depth direction (that is, along direction of the chief ray of imaging beam) of focus.It is specific next It says, so that the image space of the projection image in the virtual light shield face P15 of the 1st virtual projected light beam EL3 is in the depth direction It deepens, makes the image space of the bad picture in the virtual intermediate image plane P16 of the 1st virtual projected light beam EL4 in depth direction On the mode that shoals configure the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the 1st deflection component the 105 and the 2nd partially Rotation member 106.
By being set as such configuration, pass through the 2nd polarised light parting surface P11 reflections by the 2nd polarising beam splitter PBS2 The 2nd projected light beam EL2b, good projection image is formed in substrate P.In addition, as by the 2nd polarising beam splitter PBS2's The leak light of a part of 1st projected light beam EL2a of the 2nd polarised light parting surface P11 reflections forms light in the nearby side of substrate P The bad picture of cover pattern.That is, becoming the projection in substrate P by the image space of the 2nd projected light beam EL2b projection images formed Region PA, the image space of the bad picture formed by leak light become the position between the 2nd polarising beam splitter PBS2 and substrate P It sets.Therefore, because the image space of bad picture is between the 2nd polarising beam splitter PBS2 and substrate P, so by being projected to The bad picture of leakage photogenerated in substrate P becomes extremely unsharp state.
Like this, due to the 1st polarising beam splitter PBS1, the 2nd polarising beam splitter PBS2, the 1st deflection component the 105, the 2nd In the depth direction, the image space for making projection image is different with the image space of bad picture for deflection component 106, so reflection optics System 130 plays a role as the light quantity reduction portion for the light quantity for reducing the leak light being projected in substrate P.
In addition, making the image space of the projection image in the virtual light shield face P15 of the 1st virtual projected light beam EL3 in depth Degree deepens on direction, and the image space of the bad picture in the virtual intermediate image plane P16 of the 1st virtual projected light beam EL4 is made to exist It shoals on depth direction, to extend from light shield face P1 to the light path of the 1st polarising beam splitter PBS1, shortens from the 2nd polarised light The light path of beam splitter PBS2 to intermediate image plane P7.Therefore, it is possible to shorten from the 2nd polarising beam splitter PBS2 via intermediate image plane P7 The light path turned back to the 1st polarising beam splitter PBS1.
More than, the 3rd embodiment can make the throwing formed by the 2nd projected light beam EL2b in reflective optics 130 The image space of the image space of image and the bad picture formed by the leak light from the 1st projected light beam EL2a is in focus depth The direction (along direction of the chief ray of imaging beam) of degree is different.Therefore, because reflective optics 130 can make to be projected to base Leak light on plate P becomes extremely unsharp state, so the light quantity for being projected to the leak light in substrate P can be reduced, it can Reduce the influence brought to the projection image being projected in substrate P.
In addition, since the 3rd embodiment need not detach visual field as the 1st embodiment, or such as the 2nd embodiment Make the incoming position to the 2nd polarised light parting surface P11 different like that, so can further increase in reflective optics 130 Design degree of freedom.
[the 4th embodiment]
Next, with reference to Fig. 9, the exposure device U3 about the 4th embodiment is illustrated.In addition, in the 4th embodiment In, in order to avoid the record repeated, and only the part different from the 1st embodiment is illustrated, for implementing with the 1st The identical inscape of mode marks reference numeral identical with the 1st embodiment and illustrates.Fig. 9 is to indicate the 4th embodiment party The figure of the overall structure of the exposure device (substrate board treatment) of formula.The exposure device U3 of 1st embodiment is to make substrate P by having There is the composition that the substrate supporting cylinder 25 of the bearing surface P2 as periphery supports, but the exposure device U3 of the 4th embodiment becomes It is planar composition by substrate P bearing.
In the exposure device U3 of the 4th embodiment, base supporting mechanism 150 has a pair of of driving that substrate P is set up Roller 151.A pair of of driven roller 151 is rotated by the 2nd driving portion 26, to make substrate P be moved along scanning direction.
Therefore, base supporting mechanism 150 make from the substrate P that driven roller R4 is moved from the driven roller 151 of a side guiding to The driven roller 151 of another party, to make substrate P ride upon in a pair of of driven roller 151.Base supporting mechanism 150 passes through the 2nd driving Portion 26 makes a pair of of driven roller 151 rotate, and is guided to driven roller R5 to make to ride upon the substrate P in a pair of of driven roller 151.
At this moment, since the substrate P of Fig. 9 becomes plane substantially parallel with the faces XY, so being projected to the 2nd in substrate P The chief ray of projected light beam EL2b becomes vertical with the faces XY.The chief ray for the 2nd projected light beam EL2b being projected in substrate P becomes In the case of vertical with the faces XY, correspondingly with the chief ray of the 2nd projected light beam EL2b, the 2nd polarised light of projection optical system PL Angle in the 2nd polarised light parting surface P11 of beam splitter PBS2 is also suitably changed.
It is also identical as Fig. 2 before in addition, in the 4th embodiment, when being observed in the faces XZ, on light shield M from illumination The perimeter of the central point of region IR1 (and IR3, IR5) to the central point of illumination region IR2 (and IR4, IR6) be set as with along The central point from view field PA1 (and PA3, PA5) in the substrate P of bearing surface P2 to the 2nd view field PA2 (and PA4, PA6 the perimeter of central point) is substantially equal.
In the exposure device U3 of Fig. 9, make light shield holding cylinder 21 and a pair of of driven roller 151 also by slave control device 16 With defined rotary speed than synchronous rotary, make the picture of the mask pattern being formed on the light shield face P1 of light shield M continuously repeatedly The surface of substrate P of the projection exposure on riding upon a pair of of driven roller 151.
More than, in the 4th embodiment, even if substrate P be supported to it is planar in the case of, since leak light can be reduced To being formed in the influence of the projection image in substrate P, so also projection image suitably can be projected to substrate P.
In addition, in above each embodiment, reflection-type is used as cylindric light shield M, can also be Cross the cylinder light shield of type.In this case, if on peripheral surface of certain wall thickness through cylinder (quartz ampoule etc.) shape At the pattern based on photomask, by such multiple photographs shown in the left side from the inside through cylinder towards peripheral surface to Fig. 3 Area pellucida domain IR1~IR6 distinguishes the lamp optical system of projection illumination light and light source portion is set to the inside for penetrating cylinder.Into In the case of the such a transmission illumination of row, Fig. 2, Fig. 4, deflection polarising beam splitter PBS and 1/4 shown in Fig. 7 can be omitted Wave plate 41 etc..
Although moreover, having used cylindric light shield M but it is also possible to be typical plane light shield in various embodiments. In this case, it is believed that the radius Rm for the cylindric light shield M being illustrated in Figure 2 is infinitely great, as long as so as to coming from mask pattern Chief ray and the light shield face of imaging beam become the reflecting surface that vertical mode sets the 1st deflection component 76 in such as Fig. 2 The angle of P3.
In addition, in above each embodiment, used be formed with it is corresponding with the pattern that project to substrate P The light shield (hard light shield) of static pattern is but it is also possible to be as follows without light shield Exposure mode：Multiple Projection optics PL1~ Configuration is by multiple movable pettiness mirrors on the position (the object plane positions of each Projection optics) of each illumination region IR1~IR6 of PL6 DMD (Micro Mirror Device) of composition and/or SLM (spatial optical modulation element) etc. is moved with the conveyance of substrate P on one side It is dynamic that dynamic pattern light is synchronously generated by DMD or SLM, pattern is transferred to substrate P on one side.In this case, it generates dynamic The DMD and SLM of state pattern are equivalent to light shield component.
Reference sign
1 device inspection apparatus
2 substrate feeding devices
4 substrate retracting devices
5 host control devices
11 light shield holding mechanisms
12 base supporting mechanisms
13 light supply apparatus
16 slave control devices
21 light shield holding cylinder
25 substrate supporting cylinders
31 light source portions
32 light guide members
41 quarter wave plates
51 collimation lenses
52 fly's-eye lenses
53 collector lenses
54 cylindrical lenses
55 illuminated field diaphragms
56 relay lens
61 partial optical systems
62 reflective optics
63 perspective view diaphragms
64 focuses correct optical component
65 as offset optical component
66 multiplying power amendment optical components
67 rotation correction mechanisms
68 polarised light adjustment mechanisms
71 the 1st lens groups
72 the 1st concave mirrors
76 the 1st deflection components
77 the 2nd deflection components
78 the 3rd deflection components
79 the 4th deflection components
91 the 1st prisms
92 the 2nd prisms
93 polarised light parting surfaces
100 reflective optics (the 2nd embodiment)
104 1/2 wave plates (the 2nd embodiment)
105 the 1st deflection components (the 2nd embodiment)
106 the 2nd deflection components (the 2nd embodiment)
107 1/2 wave plates (the 2nd embodiment)
111 the 1st barn doors (the 2nd embodiment)
112 the 2nd barn doors (the 2nd embodiment)
130 reflective optics (the 3rd embodiment)
131 partial optical systems (the 3rd embodiment)
150 base supporting mechanisms (the 4th embodiment)
151 driven rollers (the 4th embodiment)
P substrates
FR1 supply rollers
FR2 recycling rollers
U1~Un processing units
U3 exposure devices (substrate board treatment)
M light shields
The 1st axis of AX1
The 2nd axis of AX2
P1 light shields face
P2 bearing surfaces
The 1st reflectings surface of P3
The 2nd reflectings surface of P4
The 3rd reflectings surface of P5
The 4th reflectings surface of P6
P7 intermediate image planes
The 1st polarised light parting surfaces of P10 (the 2nd embodiment)
The 2nd polarised light parting surfaces of P11 (the 2nd embodiment)
The 1st reflectings surface of P12 (the 2nd embodiment)
The 2nd reflectings surface of P13 (the 2nd embodiment)
Light shield face (the 3rd embodiment) virtual P15
Intermediate image plane (the 3rd embodiment) virtual P16
EL1 illuminating bundles
The 1st projected light beams of EL2a
The 2nd projected light beams of EL2b
The 1st projected light beam (the 3rd embodiment) virtual EL3
The 1st projected light beam (the 3rd embodiment) virtual EL4
Rm radius of curvature
Rfa radius of curvature
CL median planes
PBS polarising beam splitters
The 1st polarising beam splitters of PBS1 (the 2nd embodiment)
The 2nd polarising beam splitters of PBS2 (the 2nd embodiment)
IR1~IR6 illumination regions
IL1~IL6 lamp optical systems
ILM illumination optics
PA1~PA6 view fields
PL1~PL6 projection optical systems
PLM Projection optics
The 1st optical axises of BX1
The 2nd optical axises of BX2

Claims (19)

1. a kind of exposure device, projection exposure light exit cover pattern, has on the substrate of flexible strip：
Light shield holding cylinder, be arranged to around the 1st axis rotate, and along relative to the 1st axis with certain radius of curvature Made of cylindric pattern plane keep the mask pattern；
Substrate supporting cylinder is arranged to rotate around 2nd axis parallel with the 1st axis, by relative to the 2nd axis with A part for cylindric bearing surface made of certain radius of curvature supports the substrate, and makes the substrate along strip Direction is moved,
The exposure device is characterized in that, is additionally provided with：
Projection optical system, with partial optical system and light guide optical system, which comes from and is protected The 1st projected light of the mask pattern in the light shield holding cylinder is held, and forms the light in defined intermediate image plane The intermediary image of cover pattern, the light guide optical system guide the 1st projected light projected from the partial optical system to institute State intermediate image plane, and using the 1st projected light after the intermediate image plane as being redirected to institute by the 2nd projected light Partial optical system is stated, by the partial optical system of incident 2nd projected light is by the intermediary image re-imaging Obtained projection image projects on the substrate supported by the substrate supporting cylinder；And
Light quantity reduction portion, in order to be projected to the light on the substrate using a part for the 1st projected light as leak light Amount is reduced, one for making the image space of the projection image formed by the 2nd projected light and passing through the 1st projected light Point leak light and the image space of bad picture that is formed is different.
2. exposure device according to claim 1, wherein
The partial optical system includes：Lenticular unit for the 1st projected light and the 2nd projected light incidence and it will lead to The 1st projected light of the lenticular unit and the reflection optics of the 2nd projection light reflection have been crossed,
The 1st projected light from the mask pattern is incident to the lenticular unit, is reflected by the reflection optics Afterwards, it is projected from the lenticular unit, and reaches the intermediate image plane,
The 2nd projected light from the intermediate image plane is incident on the lenticular unit, is reflected by the reflection optics Afterwards, it projects, and is reached on the substrate from the lenticular unit.
3. exposure device according to claim 2, wherein
Light quantity reduction portion is configured to the light guide optical system,
Light quantity reduction portion includes：
1st polarising beam splitter, the 1st polarising beam splitter make from the mask pattern it is described 1st projection light reflection and It is incident to the lenticular unit, and the 2nd projected light from the intermediate image plane is made to penetrate and be incident to the lens section Part；
Wave plate, the wave plate make the 1st projected light projected from the 1st polarising beam splitter and the 2nd projection light polarization；
2nd polarising beam splitter, the 2nd polarising beam splitter make the institute that the wave plate is projected and passed through from the lenticular unit It states the 1st projected light to penetrate and be incident to the intermediate image plane, and makes that the wave plate is projected and passed through from the lenticular unit The 2nd projection light reflection and towards on the substrate；
1st optical component, the 1st optical component make the 1st projected light for having penetrated the 2nd polarising beam splitter be incident to The intermediate image plane；And
2nd optical component, the 2nd optical component make the 2nd projected light from the intermediate image plane be incident to the described 1st partially Shake beam splitter.
4. exposure device according to claim 3, wherein
Light quantity reduction portion includes the 1st barn door, and the 1st barn door is set to the 2nd polarising beam splitter and the substrate Between,
Light quantity reduction portion is formed in by make the 2nd projected light by being reflected by the 2nd polarising beam splitter described Direction of the image space of the image space of the projection image on substrate and the bad picture on the surface along the substrate Upper difference, it is described it is bad seem by from the 2nd polarising beam splitter through by by the 2nd polarising beam splitter reflect A part of leak light of the 1st projected light form picture on the substrate,
1st barn door is set to will be from the position that the leak light of the 2nd polarising beam splitter towards the substrate is blocked It sets.
5. exposure device according to claim 4, wherein
Light quantity reduction portion also includes the 2nd barn door, and the 2nd barn door is blocked from the 1st polarising beam splitter towards institute State the leak light of the 2nd polarising beam splitter.
6. exposure device according to claim 3, wherein
Light quantity reduction portion is formed in by make the 2nd projected light by being reflected by the 2nd polarising beam splitter described The image space of the projection image on substrate and the image space of the bad picture are different on the direction of the depth of focus, described Bad seems the 1st throwing reflected by the 2nd polarising beam splitter by not penetrated from the 2nd polarising beam splitter A part of leak light of shadow light is formed by picture.
7. exposure device according to claim 6, wherein
From the mask pattern to the light path ratio of the 1st projected light of the 1st polarising beam splitter from the 2nd polarised light Optical path length of the beam splitter to the 1st projected light of the intermediate image plane.
8. exposure device according to any one of claim 1 to 7, wherein
The substrate is scanned relative to the projection image by rotation of the substrate supporting cylinder,
The projection image is restricted to the length for making the scanning direction of the substrate scanning and the width for being orthogonal to the scanning direction The length of the length ratio, i.e. the length/width direction of scanning direction of spending direction is 1/4 or less such elongated region.
9. exposure device according to any one of claim 1 to 7, wherein
The photograph that laser also with self-excitation light source in future is guided as illumination light and to the pattern plane of the light shield holding cylinder Bright optical system.
10. exposure device according to any one of claim 1 to 7, wherein
Multiple illumination regions of the projection optical system and the pattern plane for being configured at the light shield holding cylinder are accordingly set Have it is multiple,
Multiple projection optical systems are by multiple 1st projected lights of multiple illumination regions from the pattern plane It is guided to multiple intermediate image planes, by multiple 2nd projected lights from multiple intermediate image planes to configuration described Multiple view fields guiding on substrate.
11. exposure device according to claim 10, wherein
The light shield holding cylinder and the substrate supporting cylinder are configured to：It is protected along the light shield in multiple projection optical systems The circumferential direction for holding the pattern plane of cylinder is configured to the projection of substrate described in 2 row and each projection optical system side by side Region relative to the pattern plane the illumination region in the case of circumferential offset, the light shield holding cylinder and the substrate It supports in cylinder, the 2nd axis becomes relative to the position of the 1st axis to exist with the view field relative to the illumination region Offset in circumferential direction correspondingly different position,
The projection optics system is arranged by the center of the illumination region corresponding with the 1st row projection optical system and with the 2nd The perimeter that the center for the corresponding illumination region of uniting circumferentially links up in the pattern plane of the light shield holding cylinder, With arranging the projection optical system by the center of the view field corresponding with the 1st row projection optical system and with the 2nd The center of the corresponding view field on by the substrate of the bearing surface bearing of the substrate supporting cylinder circumferentially The perimeter linked up is set as identical length.
12. a kind of exposure device, projection exposure light exit cover pattern, has on the substrate of flexible strip：
Light shield holding cylinder, be arranged to around the 1st axis rotate, and along relative to the 1st axis with certain radius of curvature Made of cylindric pattern plane keep the mask pattern；
Substrate supporting cylinder is arranged to rotate around 2nd axis parallel with the 1st axis, by relative to the 2nd axis with A part for cylindric bearing surface made of certain radius of curvature supports the substrate, and makes the substrate along strip Direction is moved,
The exposure device is characterized in that, is additionally provided with：
Projection optical system, it includes：Imaging lens group, the imaging lens group make the light of the pattern in field of view Beam is incident, the field of view is parallel with the 1st axis and slit-shaped in the pattern plane of the light shield holding cylinder；With It is configured at the pupil plane of the imaging lens group or the speculum of pupil plane neighbouring position, makes to come from institute by the speculum The light beam for stating field of view is reflected towards the imaging lens group, is formed in the pattern surface side and is conjugated with the field of view Image planes；And
Folding mirrors, by the field of view configuration along comprising the pattern plane or the image planes and with the projected light 1st position of the reference plane that the optical axis of system intersects, makes the visual field area being initially imaged by the projection optical system The intermediary image of the slit-shaped in domain is configured about the width direction that the long side direction along the reference plane and the slit intersects 2nd position different from the 1st position makes the light beam of the generation intermediary image with from about along the described narrow of the reference plane The width direction of seam 3rd position all different from either one or two of the 1st position and the 2nd position and towards the projected light The mode that system is turned back reflects,
It is set as on by the substrate of the bearing surface bearing of the substrate supporting cylinder by the projection optical system and institute State the projection image for being formed in the view field of the 2nd parallel slit-shaped of axis and being optically conjugated with the intermediary image.
13. exposure device according to claim 12, wherein
The projection optical system includes：1st reflection component, the 1st reflection component make the slit-shaped in the pattern plane The field of view in pattern the 1st light beam reflection and be incident to the imaging lens group；2nd reflection component, the 2nd Reflection component makes the 2nd light beam court projected from the projection optical system to generate the projection image on the substrate It is reflected on the substrate,
The reflective portion of the 1st light beam of 1st reflection component and the 2nd light beam of the 2nd reflection component it is anti- Part is penetrated discretely to configure in the width direction along the slit of the reference plane.
14. exposure device according to claim 13, wherein
The folding mirrors have：3rd reflecting part, the 3rd reflecting part make to generate the intermediary image from the projection The light beam that optical system projects is reflected along the direction of the reference plane；4th reflecting part, the 4th reflecting part make anti-by the 3rd The light beam for penetrating portion's reflection is reflected towards the projection optical system,
Either one of 3rd reflecting part and the 4th reflecting part are configured at the described 1st about the direction along the reference plane Between the reflective portion of reflection component and the reflective portion of the 2nd reflection component.
15. exposure device according to claim 14, wherein
Make the institute of the position and the folding mirrors of each reflective portion of the 1st reflection component and the 2nd reflection component The direction for stating optical axis of each position of the 3rd reflecting part and the 4th reflecting part about the projection optical system is different.
16. the exposure device according to any one of claim 13 to 15, wherein
1st reflection component and the 2nd reflection component are made of polarising beam splitter.
17. the exposure device according to claims 14 or 15, wherein
Reflective portion, the reflective portion of the 2nd reflection component and the institute of the folding mirrors of 1st reflection component It states the 3rd reflecting part and the 4th reflecting part is all formed as such rectangle corresponding with the field of view of the slit-shaped, And the width direction about the slit along the reference plane configures separated from each other.
18. a kind of device inspection apparatus, has：
Exposure device described in any one of claim 1 to 17；And
The substrate feeding device of the substrate is supplied to the exposure device by roller mode.
19. a kind of device making method, including：
Go out the mask pattern in the substrate projection exposure using the exposure device described in any one of claim 1 to 17；
Device corresponding with the mask pattern is formed by handling the substrate through projection exposure.
CN201710421666.8A 2012-12-18 2013-11-29 Exposure device, device inspection apparatus and device making method Active CN107247388B (en)

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TWI639896B (en) 2018-11-01
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