JP5724564B2 - Mask case, mask unit, exposure apparatus, substrate processing apparatus, and device manufacturing method - Google Patents

Description

  The present invention relates to a mask case, a mask unit, an exposure apparatus, a substrate processing apparatus, and a device manufacturing method.

  In an exposure apparatus used in a photolithography process, an exposure apparatus that exposes a pattern on a substrate using a mask having a cylindrical pattern surface (hereinafter referred to as a drum-type mask) is known (for example, Patent Documents). 1).

JP 2008-76650 A JP 2008-304840 A

  By the way, in a mask used for an exposure apparatus, it is necessary to protect the pattern surface so that foreign matters are not attached to or scratched on the pattern surface of the mask (the mask surface provided with the pattern) (for example, Patent Document 2). Also in the above-described drum type mask, it is necessary to protect the pattern surface as in the flat mask disclosed in Patent Document 2.

Therefore, an aspect of the present invention is to provide a mask case, a mask unit, an exposure apparatus, a substrate processing apparatus, and a device manufacturing method that can protect a pattern surface of a mask having a cylindrical pattern surface. .

  According to the first aspect of the present invention, there is provided a mask case for accommodating a mask having a pattern surface formed in a cylindrical surface around a predetermined central axis, wherein an accommodation space for accommodating the mask is formed, and the accommodation is performed. A case main body provided with a window portion facing the pattern surface of the mask accommodated in the space; and a limiting portion for restricting movement of the mask so that the pattern surface does not contact the case main body. A mask case is provided.

  According to a second aspect of the present invention, there is provided a mask provided with a pattern surface in a cylindrical surface around a predetermined central axis, and a mask case according to the first aspect of the present invention that accommodates the mask. A mask unit is provided.

  According to a third aspect of the present invention, there is provided an exposure apparatus that exposes a substrate by projecting an image of a mask pattern having a cylindrical pattern surface around a predetermined central axis onto the substrate. A support part for supporting the mask case according to the first aspect of the present invention, which accommodates the mask, and a rotation drive part for rotating the mask in the mask case supported by the support part around the central axis. An exposure apparatus is provided.

  According to a fourth aspect of the present invention, there is provided an exposure apparatus that exposes a substrate by projecting an image of a mask pattern provided with a pattern surface in a cylindrical surface around a predetermined central axis onto the substrate. A support unit that supports the mask unit according to the second aspect of the present invention including a mask, and a rotation drive unit that rotates the mask included in the mask unit supported by the support unit around the central axis. An exposure apparatus is provided.

  According to a fifth aspect of the present invention, there is provided a substrate processing apparatus for processing a strip-shaped substrate, wherein the substrate transport unit transports the substrate in the longitudinal direction of the substrate, and the transport path of the substrate by the substrate transport unit. And a substrate processing unit that performs processing on the substrate transported along the transport path, wherein the substrate processing unit exposes the substrate. A substrate processing apparatus including the exposure apparatus according to the above aspect is provided.

  According to a sixth aspect of the present invention, there is provided a device manufacturing method for manufacturing a device by processing a substrate, wherein a pattern is formed on the substrate using the exposure apparatus according to the third or fourth aspect of the present invention. There is provided a device manufacturing method including transferring, and processing the substrate on which the pattern is transferred based on the pattern.

  According to the aspect of the present invention, it is possible to protect the pattern surface of a mask having a cylindrical pattern surface.

Schematic which shows the structure which concerns on one Embodiment of a substrate processing apparatus. Schematic which shows the structure of exposure apparatus. The perspective view which shows schematic structure of a mask. The figure which shows the positional relationship of a mask and some structures of an optical system. (A), (b) is a figure which shows the structure of a mask unit. The figure which shows the structure of the support mechanism which supports a mask. The figure for demonstrating the attachment operation | movement of a mask unit. The figure for demonstrating the exposure process by exposure apparatus. The perspective block diagram of the mask unit which concerns on 2nd embodiment. The side view of the mask unit which concerns on this embodiment. Explanatory drawing of the attachment operation | movement of the mask unit which concerns on this embodiment. Explanatory drawing of the structure which concerns on the modification of the support mechanism which concerns on this embodiment. Process explanatory drawing of a device manufacturing method.

Embodiments of the present invention will be described below with reference to the drawings.
(First embodiment)
FIG. 1 is a diagram showing a configuration of a substrate processing apparatus FPA according to the first embodiment of the present invention.
As shown in FIG. 1, the substrate processing apparatus FPA is a substrate supply unit SU that supplies a band-shaped substrate (for example, a band-shaped film member) FB, and a substrate process that performs processing on the surface (surface to be processed) of the substrate FB. The part PR, the substrate recovery part CL for recovering the substrate FB, and the control part CONT for controlling these parts are provided.

  In this embodiment, an XYZ coordinate system is set as shown in FIG. 1, and the following description will be given using this XYZ coordinate system as appropriate. In the XYZ coordinate system, for example, the X axis and the Y axis are set along the horizontal plane, and the Z axis is set upward along the vertical direction. The substrate processing apparatus FPA transports the substrate FB from the minus side (− side) to the plus side (+ side) along the X axis as a whole. At that time, the width direction (short direction) of the belt-like substrate FB is set to the Y-axis direction.

  The substrate processing apparatus FPA is an apparatus that performs various processes on the surface of the substrate FB after the substrate FB is sent out from the substrate supply unit SU until the substrate FB is recovered by the substrate recovery unit CL. The substrate processing apparatus FPA can be used when a display element (electronic device) such as an organic EL element or a liquid crystal display element is formed on the substrate FB.

  As the substrate FB to be processed in the substrate processing apparatus FPA, for example, a foil (foil) such as a resin film or stainless steel can be used. For example, the resin film is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used.

  The sheet substrate FB preferably has a smaller coefficient of thermal expansion so that, for example, the size does not change even when the sheet substrate FB receives heat of about 200 ° C. For example, an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.

  The dimension in the width direction (short direction) of the substrate FB is, for example, about 1 m to 2 m, and the dimension in the length direction (long direction) is, for example, 10 m or more. Of course, this dimension is only an example and is not limited thereto. For example, the dimension in the Y direction of the substrate FB may be 50 cm or less, or 2 m or more. Moreover, the dimension of the X direction of the board | substrate FB may be 10 m or less.

  The substrate FB is formed to have flexibility. Here, the term “flexibility” refers to the property that the substrate can be bent without being broken or broken even if a force of its own weight is applied to the substrate. In addition, the property of bending by the force of the above-mentioned weight is included in flexibility. The flexibility varies depending on the material, size, thickness, environment such as temperature, etc. of the substrate. As the substrate FB, a single strip-shaped substrate may be used, but a plurality of unit substrates may be connected to be formed in a strip shape.

  The substrate supply unit SU sends out and supplies the substrate FB wound in a roll shape to the substrate processing unit PR, for example. In this case, the substrate supply unit SU is provided with a shaft around which the substrate FB is wound, a rotation drive device that rotates the shaft, and the like. In addition, for example, a configuration in which a cover portion that covers the substrate FB wound in a roll shape or the like may be provided. Note that the substrate supply unit SU is not limited to a mechanism that sends out the substrate FB wound in a roll shape, and may be any device that includes a mechanism that sequentially sends the belt-like substrate FB in the length direction thereof.

  The substrate collection unit CL collects the substrate FB from the substrate processing unit PR in a roll shape, for example. Similar to the substrate supply unit SU, the substrate recovery unit CL is provided with a shaft for winding the substrate FB, a rotational drive source for rotating the shaft, a cover for covering the recovered substrate FB, and the like. When the substrate FB is cut into a panel shape in the substrate processing unit PR, the substrate FB is recovered in a state different from the state wound in a roll shape, for example, the substrate FB is recovered in an overlapped state. It does not matter.

  The substrate processing unit PR transports the substrate FB supplied from the substrate supply unit SU to the substrate recovery unit CL, and performs processing on the processing surface Fp of the substrate FB in the course of transport. The substrate processing unit PR includes, for example, a processing apparatus 10, a transfer apparatus 30, and an alignment apparatus 50.

  The processing apparatus 10 includes various apparatuses for forming, for example, organic EL elements on the processing surface Fp of the substrate FB. Examples of such an apparatus include a partition wall forming apparatus for forming a partition wall on the processing surface Fp, an electrode forming apparatus for forming an electrode, and a light emitting layer forming apparatus for forming a light emitting layer. More specifically, a droplet coating apparatus (for example, an ink jet type coating apparatus, a spin coating type coating apparatus), a film forming apparatus (for example, a vapor deposition apparatus, a sputtering apparatus), an exposure apparatus, a developing apparatus, a surface modification apparatus, a cleaning apparatus, etc. Is mentioned. Each of these apparatuses is appropriately provided along the transport path of the substrate FB. In the present embodiment, an exposure apparatus is provided as the processing apparatus 10.

  The transport device 30 includes a roller device R that transports the substrate FB to the substrate recovery unit CL in the substrate processing unit PR. A plurality of roller devices R are provided along the transport path of the substrate FB. A drive mechanism (not shown) is attached to at least some of the plurality of roller devices R. By rotating such a roller device R, the substrate FB is transported in the X-axis direction. A configuration may be adopted in which some of the plurality of roller devices R are movable in a direction intersecting the surface of the substrate FB.

  The alignment apparatus 50 performs an alignment operation on the substrate FB. The alignment apparatus 50 includes an alignment camera 51 that detects the position of the substrate FB, and an adjustment device 52 that adjusts at least one of the position and orientation of the substrate FB based on the detection result of the alignment camera 51.

  For example, the alignment camera 51 detects an alignment mark formed on the substrate FB, and transmits the detection result to the control unit CONT. The control unit CONT obtains the position information of the substrate FB based on the detection result, and controls the adjustment amount by the adjusting device 52 based on the position information.

FIG. 2 is a view showing a configuration of an exposure apparatus EX used as the processing apparatus 10. FIG. 3 is a perspective view showing a schematic configuration of a mask M used in the exposure apparatus EX.
As shown in FIG. 2, the exposure apparatus EX is an apparatus that exposes the substrate FB by projecting an image of the pattern Pm formed on the mask M onto the substrate FB. The exposure apparatus EX includes an illumination apparatus IU that supplies exposure light ELI for illuminating the mask M, a drive apparatus ACM that moves and rotates the mask M provided in the mask unit 100, and a substrate guide that guides the substrate FB. An apparatus FST, an optical system 110 that irradiates the mask M with exposure light supplied from the illumination apparatus IU and projects an image of the pattern Pm formed on the mask M onto the substrate FB, and detection for acquiring position information of the mask M It has the system 170 and the support part 500 (refer FIG. 7) which supports the mask unit 100 so that attachment or detachment is possible.

  As shown in FIG. 3, the mask M is formed on a cylindrical or columnar substrate surface formed of a glass material such as quartz, metal, ceramics, or the like using a metal film such as chromium (Cr), for example. A pattern Pm is formed. The pattern Pm is formed in a cylindrical pattern forming surface FM having the axis J as the central axis on the substrate surface. In addition, as a base material of the mask M, it is preferable to use a low thermal expansion material.

  The illumination device IU includes a light source device 20 and an irradiation optical system 21 as shown in FIG. The exposure light ELI emitted from the light source device 20 is irradiated onto the mask M from, for example, a plurality of directions via the irradiation optical system 21 and the optical system 100. The irradiation optical system 21 is shown in a simplified manner in FIG. 2, but actually includes a plurality of optical elements that guide the exposure light ELI.

  The exposure light ELI emitted from the light source device 20 includes, for example, bright lines (g-line, h-line, i-line) emitted from a mercury lamp, a third harmonic of a YAG laser (wavelength 355 nm), KrF excimer laser light (wavelength 248 nm), ArF excimer laser light (wavelength 193 nm), F2 laser light (wavelength 157 nm), or the like. In the present embodiment, ArF excimer laser light is used as an example.

  The optical system 110 performs predetermined projection on the substrate FB with the illumination optical system 111 that guides the exposure light ELI supplied from the illumination device IU through the irradiation optical system 21 to the mask M, and the pattern Pm formed on the mask M. A projection optical system 112 that projects at a magnification. The illumination optical system 111 and the projection optical system 112 include a beam splitter 115 that separates the optical path of the exposure light ELI irradiated on the mask M and the optical path of the exposure light ELI reflected by the mask M. Note that a polarizing beam splitter can be used as the beam splitter 115. In this case, the projection optical system 112 reciprocates the polarization plane (polarization direction) of the exposure light ELI in the optical path between the beam splitter 115 and the mask M. It is preferable to provide a birefringent element (for example, a quarter wavelength plate) that is rotated by 90 °.

  A plurality of optical systems 110 are provided for the mask M. A part of the plurality of optical systems 110 is arranged on the upstream side (−X side) of the substrate FB with respect to the mask M, and an image of the pattern Pm arranged on the + X side of the mask M is more than the mask M. Projection is performed on the substrate FB located on the −X side. The other part of the plurality of optical systems 110 is arranged on the downstream side (+ X side) of the substrate FB with respect to the mask M, and an image of the pattern Pm arranged on the −X side of the mask M Projection is performed on the substrate FB located on the + X side of the mask M. In the present embodiment, the projection optical system 112 has an enlargement magnification as the projection magnification, and projects an enlarged image of the pattern Pm. However, the projection optical system 112 is not limited to the enlargement magnification, and may have a projection magnification of equal or reduced magnification.

  The mask unit 100 includes a mask M and a mask case 101 that forms a space SP that accommodates the mask M. The mask case 101 is mainly composed of a case main body 101a. The case main body 101a includes exposure light ELI emitted from the illumination optical system 111 to the mask M and exposure light via a pattern Pm formed on the mask M. A transmission window 102 that transmits ELI (reflected light) is formed at a position facing the pattern Pm. The mask unit 100 is supported by the support unit 500 so that the axis J is substantially parallel to the Y axis (see FIG. 7).

  The detection system 170 detects the position information of the mask M (and thus the position information of the pattern Pm). This position information includes position information regarding at least one of the X axis, the Y axis, the Z axis, and the rotational directions around the respective axes (that is, directions with six degrees of freedom). Specifically, the detection system 170 detects the position information of the mask M in the circumferential direction of the pattern forming surface MF of the mask M (that is, the rotational direction around the axis J) and the mask M in the axis J direction (Y-axis direction). An encoder system capable of acquiring position information of at least one of the position information; and a detection system capable of acquiring position information of the mask M in a direction perpendicular to the axis J (X-axis direction and Z-axis direction). The control unit CONT drives the driving device ACM based on the detection result of the detection system 170 and controls the position of the mask M. The driving device ACM can move the mask M in the mask unit 100 in the direction of the six degrees of freedom described above.

  Substrate guide device FST guides substrate FB so as to pass through projection area PA on which an image of pattern Pm is projected by projection optical system 112. The substrate guide device FST includes a guide unit 80, an upstream roller 81, a downstream roller 82, and a driving device ACF. The guide unit 80 is disposed at a position corresponding to the projection area PA of the projection optical system 112 disposed on the + X side of the mask M and the projection area PA of the projection optical system 112 disposed on the −X side. The guide portion 80 is provided with an air bearing mechanism (not shown), and the air bearing mechanism can support the substrate FB on the surface (upper surface) of the guide portion 80 in a non-contact manner.

  The upstream roller 81 carries the substrate FB into the guide unit 80. The downstream roller 82 carries the substrate FB out of the guide unit 80. The upstream roller 81 and the downstream roller 82 transport the substrate FB at a predetermined transport speed, for example. The driving device ACF adjusts the rotation speeds of the upstream roller 81 and the downstream roller 82.

  The driving device ACF adjusts the transport speed of the substrate FB by rotating the upstream roller 81 and the downstream roller 82 based on a control signal from the control unit CONT. The controller CONT controls the driving of the driving device ACM and the driving of the driving device ACF so that the substrate FB is transported at a transport speed corresponding to the rotational speed of the mask M. Specifically, the control unit CONT performs a conveyance speed in the length direction of the substrate FB (that is, the substrate) with respect to the moving speed (peripheral speed) of the pattern Pm along the surface of the mask M (that is, the pattern formation surface MF). The driving of the driving device ACM and the driving device ACF is controlled so that the ratio of the moving speed of the surface of the FB becomes equal to the projection magnification of the projection optical system 112.

  As shown in FIG. 3, the mask M has a shaft portion 108 connected to the driving device ACM. The shaft portion 108 is provided integrally with the base material of the mask M with the axis J as the central axis. As a result, the mask M can be rotated around the axis J by the driving device ACM with the shaft portion 108 as a rotation axis.

  On the pattern formation surface FM, a plurality of pattern formation regions MA are provided side by side in the axis J direction. In the present embodiment, four pattern formation areas MAa, MAb, MAc, and MAd are arranged in this order in the axis J direction as the plurality of pattern formation areas MA. The pattern Pm is divided and formed in the pattern formation regions MAa to MAd.

The pattern formation regions MAa and MAc and the pattern formation regions MAb and MAc are arranged so as to be shifted from each other in the circumferential direction of the pattern formation surface MF. In the present embodiment, the mutual shift amount S, the diameter D of the cylindrical pattern formation surface MF, and the X-axis direction of the projection area PA on the −X side and the projection area PA on the + X side with respect to the mask M (Ie, the distance in the X-axis direction between the optical axis of the projection optical system 112 on the −X side and the optical axis of the projection optical system 112 on the + X side) L with respect to the mask M, and the projection magnification of the projection optical system 112 β is set so as to satisfy the following equation.
S = πD / 2−L / β (where L <β × πD / 2)

  A mark MB that can be detected by the detection system 170 is arranged outside the pattern formation area MA on one end side (+ Y side) and the other end side (−Y side) in the axis J direction (Y-axis direction) of the mask M. Has been. The mark MB is formed around the axis J along the outer peripheral surface of the mask M. The detection system 170 detects the position information of the mask M and thus the position information of the pattern Pm by detecting the mark MB.

  FIG. 4 is a diagram illustrating a positional relationship between the mask M and the optical system 110. In FIG. 4, the mask case 101 is not shown. As shown in FIG. 4, the optical system 110 is provided with four optical systems 110a, 110b, 110c, and 110d corresponding to the four pattern formation regions MA provided on the mask M, respectively. The optical systems 110a to 110d have illumination optical systems 111a to 111d and projection optical systems 112a to 112b, respectively.

The optical systems 110 a and 110 c are arranged on the −X side of the mask unit 100.
The optical systems 110 b and 110 d are arranged on the + X side of the mask unit 100. The optical systems 110a to 110d are arranged in the Y direction at a pitch corresponding to the pitch of the pattern formation regions MAa to MAd (that is, adjacent intervals).

  The illumination optical system 111a irradiates the pattern formation region MAa with the exposure light ELI, and the projection optical system 112a projects the image of the pattern Pm in the pattern formation region MAa on the −X side of the mask unit 100. Projecting onto the substrate FB in the area PAa. The illumination optical system 111b irradiates the pattern formation region MAb with the exposure light ELI, and the projection optical system 112b projects the image of the pattern Pm in the pattern formation region MAb on the + X side of the mask unit 100. Project onto the substrate FB in PAb. The illumination optical system 111c irradiates the pattern formation region MAc with the exposure light ELI, and the projection optical system 112c projects the image of the pattern Pm in the pattern formation region MAc on the −X side of the mask unit 100. Projecting onto the substrate FB in the area PAc. The illumination optical system 111d irradiates the pattern formation region MAd with the exposure light ELI, and the projection optical system 112d projects the image of the pattern Pm in the pattern formation region MAd on the + X side of the mask unit 100. Project to the substrate FB in the PAd.

FIG. 5A is a perspective view illustrating a schematic configuration of the mask unit 100, and FIG. 5B is a perspective view of the mask unit 100 viewed from below (−Z axis direction). As shown in FIG. 5A, in the case main body 101a, in addition to the transmission window 102 described above, a mark detection provided to face the mark MB so that the mark MB can be observed from the outside of the case main body 101a. A window 103 and a support mechanism 130 that supports the mask M and restricts the movement of the mask M are provided.
The support mechanism 130 supports the shaft portion 108 so that the pattern formation region MA does not contact the mask case 101 (for example, the inner surface of the case main body 101a). The shaft portion 108 protrudes from the end portion of the case main body 101a via the support mechanism 130.

  The transmission window 102 and the mark detection window 103 have a pellicle film stretched over an opening formed in the case body 101a so as to face the pattern formation surface MF. Therefore, the mask case 101 can protect the pattern formation surface MF by suppressing the adhesion of foreign matters to the pattern formation surface MF while securing the optical path of the exposure light ELI with respect to the pattern formation surface MF. The member (cover member) provided in the opening facing the pattern formation surface MF and closing the opening is not limited to the pellicle film, and may be a light transmissive member that transmits the exposure light ELI. That's fine. Such a member includes, for example, thin glass or plastic.

  The mask case 101 is sealed inside. A gas supply port 105 for supplying a cooling gas for cooling the mask M in the case main body 101a is provided on the end surface in the axis J direction of the case main body 101a. The gas supply port 105 is connected to a gas supply pipe (not shown) provided in the exposure apparatus EX so that a cooling gas can be supplied into the case main body 101a. An opening / closing mechanism (not shown) that closes the gas supply port 105 when the gas supply pipe is not connected is provided in the vicinity of the gas supply port 105.

  As shown in FIG. 5B, the mask case 101 has an attachment portion 106 when the mask unit 100 is attached to the exposure apparatus EX. In the present embodiment, the attachment portion 106 is provided on the lower surface side (−Z axis direction) of the case main body 101a. The attachment portion 106 is configured by forming a part of the outer peripheral surface of the mask case 101 as a flat surface and providing a seating surface (contact surface) on the flat surface. The mask case 101 is fixed to the exposure apparatus EX, for example, when the mounting portion 106 is attracted to the support portion 500. Note that the configuration of the attachment portion 106 is not limited to a flat surface, and may be configured by a fitting structure that is fitted to the support portion 500, for example.

  A gas exhaust port 107 for exhausting the cooling gas supplied from the gas supply port 105 into the case main body 101a is provided on the outer peripheral surface of the mask case 101 where the attachment portion 106 is formed. . The gas exhaust port 107 allows a cooling gas to be exhausted from the case main body 101a by connecting a gas exhaust pipe (not shown) provided in the exposure apparatus EX. An opening / closing mechanism (not shown) that closes the gas exhaust port 107 when the gas exhaust pipe is not connected is provided near the gas exhaust port 107.

  The case main body 101a includes a shutter 104 that covers the transmission window 102 and the mark detection window 103 so as to be opened and closed. The shutter 104 may be configured to individually cover the transmission window 102 and the mark detection window 103.

  FIG. 6 is a diagram showing the configuration of the support mechanism 130. FIG. 6A is a plan view showing a main part of the support mechanism 130, and FIG. 6B is a view showing a cross-sectional structure of the support mechanism 130. 6 shows only one end side (+ Y axis side) of the mask unit 100, the support mechanism 130 is also provided on the other end side (−Y axis side).

  The support mechanism 130 includes a bearing board 162 and a bearing 161. On the other hand, substantially elongated openings 160 are formed on both side surfaces in the axis J direction (Y-axis direction) of the case body 101a. The bearing board 162 is fitted into the opening 160, whereby the support mechanism 130 is attached to the case main body 101a.

  The opening 160 has a pair of straight portions 160a that are parallel to each other, and a curved portion 160b that connects the ends of these straight portions. The bearing board 162 includes a cylindrical base portion 163 and a first rising portion 162a and a second rising portion 162b provided at both ends of the base portion 163 in the axis J direction.

  The bearing 161 is formed in a ring shape and is attached to the inner peripheral portion 162 c of the base portion 162. The shaft portion 108 of the mask M is fitted in the central opening of the bearing 161. Thereby, when the mask M is rotated by the drive device ACM as will be described later, the shaft portion 108 is rotated by the action of the bearing 161 without the bearing disc 162 rotating. In this way, the mask M is supported by the bearing board 162 and can move together with the bearing board 162.

The outer shape of the base portion 163 is set to be equal to or slightly smaller than the width of the opening 160 in the short direction (that is, the interval between the two straight portions 160a). The first rising portion 162a and the second rising portion 162b are substantially ring-shaped frame members in a plan view state (viewed from the Y-axis direction), and each is set to be larger than the opening 160. The second rising portion 162b is set larger than the first rising portion 162a in a plan view. That is, the bearing board 162 is in a state in which the first rising portion 162a and the second rising portion 162b sandwich the edge of the opening 160 in a plan view. The distance between the two curved portions 160b of the opening 160 is such that the pattern forming surface MF of the mask M does not contact the case body 101a even when the bearing board 162 is close to one end of the opening 160 along the straight portion 160a. Is set to The outer diameter of the second rising portion 162b is set to a size that allows the opening 160 to be closed even when the bearing board 162 is close to one end of the opening 160.

  A sealing material 164 is disposed at a position facing the inner edge portion of the opening 160 in the second rising portion 162b. The bearing board 162 seals the opening 160 with a sealing material 164, whereby the inside of the case body 101a is kept sealed.

  Based on such a configuration, the mask M can move in the longitudinal direction (Z-axis direction) of the opening 160 together with the bearing board 162. When the mask unit 100 is transported, the mask M rotates about the axis J in the case main body 101a, but the movement is restricted so that the pattern forming surface MF of the mask M does not contact the case main body 101a. The bearing board 162 may include a lock mechanism (not shown) that restricts the rotation of the mask M. Thereby, it is possible to prevent the mask M from rotating in the case main body 101a when the mask unit 100 is conveyed, and it is possible to suppress wear of the bearing 161 and the like.

Subsequently, an operation of attaching the mask unit 100 to the exposure apparatus EX will be described. FIG. 7 is a view for explaining the attaching operation of the mask unit 100.
First, as shown in FIG. 7A, the attachment portion 106 of the mask unit 100 is attached (placed) to the support portion 500 of the exposure apparatus EX, and is fixed (adsorbed) to the support portion 500. Thereafter, by opening the shutter 104, the transmission window 102 and the mark detection window 103 appear on the outer peripheral surface of the case main body 101a (see FIG. 7B). Further, a gas supply pipe and a gas exhaust pipe (not shown) are connected to the gas supply port 105 and the gas exhaust port 107 provided in the case main body 101a, respectively.

  Subsequently, based on a control signal from the control unit CONT, the rotational drive unit ACM1 which is a part of the drive device ACM is driven. The rotation drive unit ACM1 is formed with a recess 501 that is connected (engaged) with the shaft 108 protruding from the mask case 101. The rotational drive unit ACM1 aligns the concave portion 501 and the shaft portion 108, and then connects the concave portion 501 and the shaft portion 108 as shown in FIG. 7B. When the support mechanism 130 includes a lock mechanism that restricts the rotation of the mask M, the lock is released.

  Thereafter, the mask M can be rotated in the case main body 101a by rotating the rotation driving unit ACM1 about the axis J.

  The projection areas PAa to PAd by the exposure apparatus EX in the present embodiment are formed in areas arranged on the guide unit 80 in the substrate FB as shown in FIG. In FIG. 8, only the projection optical system 112 of the optical system 110 is shown in order to make the drawing easier to see.

  First, the control unit CONT performs an exposure process on the upstream side (−X side) from the mask unit 100. The controller CONT irradiates the pattern formation areas MAa and MAc of the mask M with the exposure light ELI from the illumination optical systems 111a and 111c, respectively.

Reflected light from each pattern Pm in the pattern formation areas MAa and MAc is irradiated to the projection areas PAa and PAc via the projection optical systems 112a and 112c, respectively. With this operation, images (enlarged images) of the corresponding patterns Pm are projected onto the projection areas PAa and PAc, respectively. In this state, the control unit CONT transports the substrate FB in the + X direction while rotating the rotation driving unit ACM1. As a result, two regions of the substrate FB that are separated from each other in the Y direction are sequentially exposed from the + X side to the −X side by the image of the pattern Pm projected onto the projection regions PAa and PAc. Exposure regions PBa and PBc are formed on the substrate FB.
At this time, the control unit CONT adjusts the rotation speed of the rotation drive unit ACM1 and the movement speed of the substrate FB, and moves the pattern formation surface MF along the surface of the mask M (that is, the pattern formation surface MF). Control is performed so that the ratio of the moving speed in the length direction of the substrate FB to the (speed) becomes equal to the projection magnification (enlargement magnification) of the projection optical system 112. The detection system 170 can read the mark MB through the mark detection window 103 provided in the mask case 101.

  Subsequently, when the + X side end of the exposure areas PBa and PBc reaches the projection areas PAb and PAd as the substrate FB moves, the control unit CONT performs an exposure process on the downstream side (+ X side) from the mask unit 100. Make it. The controller CONT irradiates the pattern formation areas MAc and MAd of the mask M with the exposure light ELI from the illumination optical systems 111b and 111d, respectively. Reflected light from the patterns Pm in the pattern formation areas MAb and MAd is irradiated onto the projection areas PAb and PAd via the projection optical systems 112c and 112d, respectively.

  With this operation, images (enlarged images) of the corresponding patterns Pm are projected onto the projection areas PAb and PAd, respectively. As a result, two regions of the substrate FB that are separated from each other in the Y direction are sequentially exposed from the + X side to the −X side by the image of the pattern Pm projected onto the projection regions PAb and PAd, and are strip-shaped along the X-axis direction. Exposure regions PBb and PBd are formed on the substrate FB. At this time, the −Y side end and the + Y side end of the exposure area PBb are exposed in a state where they overlap the + Y side end of the exposure area PBa and the −Y side end of the exposure area PBc, respectively. The exposure area PBd is exposed in a state where the end on the −Y side of the exposure area PBd overlaps the end on the + Y side of the exposure area PBc. The control unit CONT can adjust the rotation speed of the rotation drive unit ACM1 and the movement speed of the substrate FB based on the detection result of the detection system 170.

  In the present embodiment, on the substrate FB, a portion exposed by only a single image projected onto the projection areas PAa to PAd, a part of the image projected onto the projection area PAa, and a projection area PAb are projected. A portion exposed by a portion of the image, a portion exposed by a portion of the image projected on the projection region PAb and a portion of the image projected on the projection region PAc, and the portion projected by the projection region PAc A part to be exposed is formed by a part of the image and a part of the image projected onto the projection area PAd. By performing the exposure operation in this way, an exposure pattern Pf corresponding to an enlarged image of a pattern obtained by combining the patterns Pm of the pattern formation regions MAa to MAd in the Y-axis direction is formed on the substrate FB. .

  As described above, according to this embodiment, since the mask unit 100 in which the mask M is accommodated in the mask case 101 is provided, the mask M can be easily replaced, attached, and removed. In addition, since the pattern formation surface MF of the mask M is accommodated in the mask case 101, it is possible to prevent dust, foreign matter, and the like from being attached to the pattern Pm and being damaged. Further, since the mask M is supported by the support mechanism 130 so that the pattern formation surface MF does not come into contact with the mask case 101, the mask case 101 can prevent the pattern Pm of the mask M from being damaged. As a result, it is possible to provide the mask unit 100 excellent in maintainability that can easily handle the mask M without damaging the pattern formation surface FM of the mask M.

  Further, according to the present embodiment, since the shutter 104 that covers the transmission window 102 and the mark detection window 103 of the mask case 101 so as to be opened and closed is provided, the transmission window 102 and the mark detection window are carried when the mask unit 100 is carried. 103 can be prevented from being damaged. Further, since the shaft portion 108 of the mask M is supported by the bearing board 162 via the bearing 161 and protrudes from the mask case 101, the mask unit 100 is mounted from the outside of the mask case 101 with the mask unit 100 mounted on the exposure apparatus EX. The portion 108 and thus the mask M can be rotated around the axis J, and the optical path of the exposure light ELI with respect to the pattern formation surface FM can be secured by the transmission window 102, so that the exposure process can be performed without taking out the mask M from the mask case 101. Thus, a highly reliable exposure process can be realized.

(Second Embodiment)
Next, the configuration according to the second embodiment of the mask unit will be described. FIG. 9 is a perspective view showing a configuration of the mask unit 200 according to the second embodiment, and FIG. 10 is a view showing a side configuration of the mask unit 200. As shown in FIGS. 9 and 10, the mask unit 200 includes a mask case 201 having a quadrangular shape in a cross section orthogonal to the axis J, a mask M2 accommodated in the mask case 201, and the mask case 201. And a support mechanism 207 for supporting the mask M2.

The mask case 201 is mainly composed of a case main body 201a, and a transmission window 202, a mark detection window 203, a gas supply port 208, and a gas exhaust port are formed on the outer peripheral surface of the case main body 201a as in the first embodiment. 209 is formed. The case body 201a is kept sealed. The case body 201a has an opening 210a formed on a surface that intersects the axis J direction (Y-axis direction in FIG. 9) of the mask M2, and a shutter 210 that can be opened and closed is provided in the opening 210a. . As will be described later, the opening 210a is for inserting the driving device ACM of the exposure apparatus EX into the case main body 201a.

  The case main body 201a includes a shutter 204 that covers the transmission window 202 so that it can be opened and closed, and a shutter 211 that covers the mark detection window 203 so that it can be opened and closed. An attachment portion 216 (see FIG. 11) attached to the support portion 500 of the exposure apparatus EX is provided on the lower surface (the outer peripheral surface on the −Z side) of the case main body 201a.

  The mask M2 has a shaft portion 206 instead of the shaft portion 108 based on the configuration of the mask M of the first embodiment. Other configurations are the same as those of the mask M. The shaft portion 206 is provided with the axis line J as the central axis, and the axis line J is set parallel to the Y axis in the drawing. The shaft portion 206 is in a state of being accommodated in the case main body 201a without protruding from the case main body 201a. The shaft portion 206 is formed with an engaging recess 206c for engaging a driving device ACM of the exposure apparatus EX described later. The engaging recess 206c includes a circular portion 206a having a substantially circular shape in plan view, and a key groove portion 206b formed at one end of the circular portion 206a.

The support mechanism 207 has a support portion 207a that supports the shaft portion 206 of the mask M2.
The lower surface side (−Z side) of the support portion 207a is fixed to the case body 201a, and a V-groove 217 is formed on the upper surface side (+ Z side). The mask M2 in which the shaft portion 206 is supported by the V-groove 217 is held in the mask case 201 with the pattern forming surface MF not in contact with the case main body 201a. In the present embodiment, the mask unit 200 is transported with the support mechanism 207 positioned on the lower side in the vertical direction. In this state, the movement of the mask M2 is restricted so that the pattern formation surface FM does not contact the case body 201a.

  The support mechanism 207 can adopt a configuration in which, for example, the M2 shaft portion 206 is sandwiched between a plurality of support portions instead of the support portion 207a. According to this, even when the mask unit 200 is conveyed in various postures, the pattern formation surface MF of the mask M2 can be prevented from coming into contact with the mask case 201.

Next, an operation for mounting the mask unit 200 in the exposure apparatus EX will be described.
FIG. 11 is a view for explaining the mounting operation of the mask unit 200. First, as shown in FIG. 11A, the attachment portion 216 of the mask unit 200 is attached (placed) to the support portion 500 of the exposure apparatus EX, and is fixed (adsorbed) to the support portion 500. Thereafter, the shutters 204 and 211 are opened to cause the transmission window 202 and the mark detection window 203 to appear on the outer peripheral surface of the case body 201a (see FIG. 11B).

  Subsequently, based on a control signal from the control unit CONT, the rotary drive unit ACM2 which is a part of the drive device ACM is driven. At this time, the opening 210a appears on both side surfaces of the case body 201a by opening the shutter 210 provided on the case body 201a. The rotation drive unit ACM2 is inserted into the case main body 201a through the opening 210a. Then, the distal end portion 208 of the rotation drive unit ACM2 is inserted (engaged) into an engagement recess 206c formed in the shaft portion 206 of the mask M2. The outer peripheral surface of the front end portion 208 is a tapered surface, and the inner side surface of the engaging recess 206c has a tapered shape corresponding to the tapered surface. Further, the front end portion 208 is provided with a convex portion 208a that can be inserted into the key groove portion 206b. Based on this configuration, the distal end portion 208 of the rotation drive unit ACM2 is inserted into the engagement recess 206c along the taper surface, so that the shaft unit 206 and the rotation drive unit ACM2 (that is, the axis J of the mask M2 and the rotation drive unit). The rotation axis of the ACM 2) can be reliably aligned coaxially.

  Subsequently, the rotational drive unit ACM2 is raised to a predetermined position while being connected to the shaft portion 206 of the mask M2. As a result, the mask M2 in the mask unit 200 is separated from the support mechanism 207, and the support state of the mask M2 by the support mechanism 207 is released. When the rotation drive unit ACM2 and the shaft unit 206 are connected, the shutter 210 of the mask case 201 is open. In this embodiment, the inside of the mask case 201 can be held in a sealed state by pressing the sealing plate 205 provided in the driving device ACM against the side surface of the mask case 201 and closing the opening 210a.

  As a result, the mask M2 of the mask unit 200 is rotated around the axis J from the outside of the mask case 201 with the mask unit 100 mounted on the exposure apparatus EX, as in the first embodiment. In addition, since the optical path of the exposure light ELI with respect to the pattern formation surface FM can be secured by the transmission window 202, the exposure process can be performed without taking out the mask M2 from the mask case 201.

  In the above description, when the mask M2 is separated from the support mechanism 207, the rotational drive unit ACM2 raises the mask M2, but the support mechanism 207 may be driven away from the mask M2. . In this configuration, as shown in FIG. 12, the support mechanism 207 includes a drive unit 207b that moves the support unit 207a up and down. Based on a control signal from the control unit CONT, the support mechanism 207 lowers the support unit 207a when the rotational drive unit ACM2 is connected to the mask M2, and releases the support state of the mask M2 by the support mechanism 207.

  According to this embodiment, since the mask unit 200 in which the mask M2 is accommodated is provided in the mask case 201, the mask M2 is not damaged without damaging the pattern formation surface FM of the mask M2, as in the first embodiment. The mask unit 200 excellent in maintainability that can be easily handled can be provided.

  The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention. For example, in the above embodiment, the masks M and M2 in which the four pattern formation areas MA are formed are used. However, the present invention is not limited to this, and the mask in which a larger number of pattern formation areas MA is formed. A configuration using M and M2 may be used.

  In the above embodiment, the mask cases 101 and 201 have the transmission windows 102 and 202 at two locations on the outer peripheral surfaces of the case bodies 101a and 201a, respectively. You may make it have a transmission window in three or more places. In addition, the mask cases 101 and 201 have two transmission windows at positions facing each other on the outer peripheral surfaces of the case bodies 101a and 201a. However, the two transmission windows are arranged at positions facing each other. It is not limited. The illumination optical system 111 and the projection optical system 112 may be appropriately arranged in accordance with the arrangement of the transmission windows in the case body.

  In each of the above-described embodiments, the imaging characteristics (optical characteristics) of the projection optical system 112 may be adjusted according to the curvatures of the cylindrical masks M and M2.

  Further, in each of the above-described embodiments, the masks M and M2 are formed such that the pattern Pm is formed on the cylindrical or columnar base material surface (cylindrical pattern forming surface FM), but is not limited thereto. Alternatively, for example, a thin plate-like base material on which the pattern Pm is formed may be arranged along a predetermined cylindrical surface around the axis J. In this case, the thin plate-like base material may be individual for each of the pattern formation regions MAa to MAd, or may be integrated.

  In the above embodiment, the case where the substrate FB is exposed has been described. However, as the exposure target medium, in addition to a glass substrate for a display device, a semiconductor wafer for manufacturing a semiconductor device, a ceramic wafer for a thin film magnetic head, or A mask or reticle master (synthetic quartz, silicon wafer) or the like used in the exposure apparatus is applied.

  The types of exposure apparatus EX include: an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on a substrate; an exposure apparatus for manufacturing a liquid crystal display element or a display; a thin film magnetic head; an image sensor (CCD); , MEMS, DNA chips, or exposure apparatuses for manufacturing reticles or masks can be widely applied.

  As shown in FIG. 13, a microdevice such as a semiconductor device includes a step 301 for designing a function / performance of the microdevice, a step 302 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Manufacturing step 303, including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate (photosensitive agent) according to the above-described embodiment It is manufactured through a substrate processing step 304, a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 305, an inspection step 306, and the like. In step 304, the photosensitive agent is developed to form an exposure pattern layer (developd photosensitive agent layer) corresponding to the mask pattern, and the substrate is processed through the exposure pattern layer. It is.

  Note that the requirements of the above-described embodiments and modifications can be combined as appropriate. Some components may not be used.

EX ... exposure apparatus, M ... mask, Pm ... pattern, PM ... pattern forming surface, ELI ... exposure light, ACM1, ACM2 ... rotation drive unit, CONT ... control unit, 100,200 ... mask unit, 101,201 ... mask case 101a, 201a ... case body, 102 ... transmission window, 103 ... mark detection window, 104,204,210 ... shutter, 105 ... gas supply port, 107 ... gas exhaust port, 108,206 ... shaft, 111a- 111d ... illumination optical system, 112a to 112d ... projection optical system, 106, 216 ... mounting portion, 500 ... support portion

Claims (24)

Cylindrical surface on the pattern surface is provided et been around a predetermined central axis, the mask to accommodate the cylindrical or columnar mask having a shaft portion which is provided integrally with the pattern surface along said central axis A case,
A case main body provided with a window portion that forms an accommodating space for accommodating the mask and is opposed to the pattern surface of the mask accommodated in the accommodating space;
A restricting portion that restricts movement of the mask by supporting at least a part of the shaft portion around the central axis so that the pattern surface does not contact the case body;
Mask case with The case body is provided with a first opening facing the pattern surface of the mask housed in the housing space,
2. The mask case according to claim 1, wherein the window includes a cover mechanism that has a light transmission property that transmits light through the pattern surface and closes the first opening. The first opening is provided with a plurality of openings respectively facing a plurality of regions in the circumferential direction of the pattern surface of the pattern surface of the mask accommodated in the accommodation space;
The mask case according to claim 2, wherein the cover mechanism includes a plurality of cover members that have the light transmittance and close the plurality of openings.   The said case main body is a mask case as described in any one of Claims 1-3 in which the 2nd opening part which cross | intersects the said central axis line is provided in the state in which the said mask was accommodated in the said accommodation space.   The mask case according to claim 4, wherein the case body has an opening / closing mechanism that closes the second opening so as to be opened and closed.   The said case main body is a mask case as described in any one of Claims 1-5 which has a shutter mechanism which covers the said window part so that opening and closing is possible.   The mask case according to claim 1, wherein the case body is provided with at least one of an exhaust port and an air supply port with respect to the accommodation space. The limiting unit, mask case according to any one of claims 1 to 7, wherein the shaft portion supports the shaft portion in a rotatable state to the central axis. The mask case according to claim 8 , wherein the restricting portion has a bearing mechanism formed in a ring shape, and supports the shaft portion in a state where the shaft portion is inserted through the bearing mechanism. The shaft portion has a bearing mechanism that can rotate around the predetermined axis with respect to the shaft portion;
The mask case according to claim 8 , wherein the limiting portion supports the shaft portion via the bearing mechanism. The mask case according to any one of claims 8 to 10 , wherein the restricting portion includes an advance / retreat driving portion that moves the restricting portion forward / backward with respect to the shaft portion. The mask has a mark provided integrally with the pattern surface,
The said case main body is a mask case as described in any one of Claims 1-11 which has the mark window part facing the said mark of the said mask accommodated in the said accommodating space. The mark is disposed along an outer peripheral surface on an axial end side of the shaft portion of the mask, and is formed so as to be detected by an encoder system through the mark window portion.
The mask case according to claim 12 . A cylindrical or cylindrical mask having a pattern surface provided in a cylindrical surface around a predetermined central axis, and having a shaft portion provided integrally with the pattern surface along the central axis ,
The mask case according to any one of claims 1 to 13 , which accommodates the mask;
A mask unit comprising: An image of a cylindrical or columnar mask pattern having a pattern surface in a cylindrical shape around a predetermined central axis and having a shaft portion provided integrally with the pattern surface along the central axis. an exposure apparatus for exposure light on a substrate,
The support part which supports the mask case as described in any one of Claims 1-13 which accommodated the said mask,
A rotation drive unit that rotates the mask in the mask case supported by the support unit around the central axis;
An exposure apparatus comprising: An image of a cylindrical or columnar mask pattern having a pattern surface in a cylindrical shape around a predetermined central axis and having a shaft portion provided integrally with the pattern surface along the central axis. An exposure apparatus that exposes a substrate,
The support part which supports the mask unit according to claim 14 including the mask,
A rotation drive unit that rotates the mask provided in the mask unit supported by the support unit around the central axis;
An exposure apparatus comprising: The mask has a first engagement portion provided integrally with the pattern surface,
17. The exposure according to claim 15 , wherein the rotation driving unit has a second engagement part that detachably engages with the first engagement part and rotates the first engagement part around the central axis. apparatus. The exposure apparatus according to claim 17 , wherein the second engaging portion is fitted to the first engaging portion. The exposure apparatus according to claim 18 , wherein the second engagement portion has a tapered surface inclined with respect to a direction in which the second engagement portion is engaged with the first engagement portion. The exposure apparatus according to claim 17 , wherein the rotation driving unit includes a driving unit that moves the second engagement unit forward and backward with respect to the first engagement unit. 21. The exposure apparatus according to any one of claims 15 to 20 , wherein the rotation drive unit includes a drive unit that moves the mask forward and backward relative to the restriction unit. A substrate transport section for transporting the substrate so as to pass through an exposure area of the image of the pattern;
A control unit that controls driving of the rotation driving unit and the substrate transport unit,
The control unit controls a ratio between a movement speed of the mask along the circumferential direction of the pattern surface and a movement speed of the substrate in the projection area based on a magnification at the time of exposure of the image of the pattern. The exposure apparatus according to any one of 15 to 21 . A substrate processing apparatus for processing a strip-shaped sheet substrate,
A substrate conveying portion for conveying the sheet substrate in the longitudinal direction of the sheet substrate,
A substrate processing unit that is provided along a transport path of the sheet substrate by the substrate transport unit and that performs processing on the sheet substrate transported along the transport path;
The substrate processing apparatus including the exposure apparatus according to any one of claims 15 to 22 , wherein the substrate processing unit exposes the sheet substrate. A device manufacturing method for manufacturing a device by processing a substrate,
Transferring a pattern to the substrate using the exposure apparatus according to any one of claims 15 to 22 ,
Processing the substrate to which the pattern is transferred based on the pattern;
A device manufacturing method including:

Images